435 results about "Photonic Chip" patented technology

A cryogenic structure can include a cryogenic chamber that houses a plurality of circuits that operate and cryogenic temperatures, and a room temperature portion that houses a plurality of circuits that operate at non-cryogenic temperatures. The circuits can include computer chips, such as electrical or photonic chips, that are housed on movable structures that insertable into the cryogenic structure.

The invention provides a light beam scanning device of an integrated photonics chip and a test method. The light beam scanning device of the integrated photonics chip comprises a chip sample table, a chip sample table base, a light beam receiver connected with a lens cone and a horizontally arranged turntable base, the lens barrel is arranged above the turntable base, and a diaphragm adjusting structure and at least four lens groups are arranged in the lens barrel; the central point of the chip sample table base is overlapped with the central point of the turntable base, the chip sample table base is positioned above the turntable base, and the chip sample table is vertically arranged at the central point of the chip sample table base. Through switching of different lens groups in the lens cone, measurement of far and near fields of the to-be-tested chip is realized by using the same lens cone, the lens cone is arranged on the turntable base, and the test angle range can be adjusted according to specific test requirements so that various chip test requirements can be met.

A co-packaged electro-optical module includes: a first planar light circuit (PLC) block; a silicon photonics chip electrically coupled to one or more chips; a splitter embedded in the first PLC block and to receive laser light from an optical fiber, to split the laser light into two portions, and to provide respective portions of the laser light to two planar waveguides; a planar surface of the silicon photonics chip to receive the portions of the laser light from the two planar waveguides in a direction perpendicular to the planar surface; modulators embedded in the silicon photonics chip and to modulate the portions of the laser light; a side edge of the silicon photonics chip extending perpendicular to the planar surface and to output the modulated portions of the laser light; and a second PLC block coupled to the side edge and to transmit the modulated portions of the laser light.

Laser-scanning systems for augmented reality glasses displays and LiDAR (light detection and ranging) use photonic integrated circuits to generate multiple collimated (or low-divergence) modulated laser beams. Laser light is guided on the photonic chip, expanded, and emitted from the surface of the chip (using grating coupler devices) as one or more large-diameter (e.g., millimeter-scale), collimated or low-divergence beams. These gratings may be integrated onto movable microelectromechanical systems (MEMS) plates to steer the beam along two angular axes. Alternatively, the beam(s) from the grating(s) may be steered by a separate MEMS mirror integrated onto the photonic chip or on another chip. Such systems enable multi-beam laser scanning systems without collimation lenses, reducing the size and packaging complexity of high-performance laser scanning systems for augmented reality glasses and LiDAR.

The invention relates to a DR4 silicon optical chip, which is characterized in that one side surface of a chip main body is an optical surface inclined by 8 + / -0.1 degrees, four output waveguides which are perpendicular to and intersect with the optical surface are arranged on the chip main body side by side, and an input waveguide which intersects with the optical surface is arranged on the chip main body. According to the 400G silicon optical engine, the end face of a multi-channel optical fiber array is a 0-degree face, the 0-degree face of the multi-channel optical fiber array is attached to the optical face of a DR4 silicon optical chip, and the multi-channel optical fiber array is coupled with four output waveguides on the DR4 silicon optical chip. The beneficial effects are that the DR4 silicon optical chip is provided with an optical surface with an inclination of 8 + / -0.1 degree, and the output waveguide is perpendicular to and intersects with the optical surface, so when the DR4 silicon optical chip is applied to a 400G silicon optical engine, the end surface of the selected multichannel optical fiber array can be a 0-degree surface, the grinding efficiency of the multichannel optical fiber array is effectively improved, the angle error is reduced, and the grinding precision is improved. The coupling efficiency is improved.

Embodiments of this application provide a laser beam machining method targeted at chalcogenide materials and an integrated photonic device, relating to the technical fields of integrated photonic chip machining. The laser beam machining method targeted at chalcogenide materials includes: acquiring a dielectric substrate with a preset size, and cleaning the dielectric substrate; preparing a uniform and dense sulfide film on a surface of the dielectric substrate; obtaining a laser spot with a preset energy distribution pattern according to a preset machining pattern; generating laser spot scanning parameters according to the preset machining pattern; and carrying out etching-free laser oxidation machining on the sulfide film through the laser spot according to the spot scanning parameters to obtain a chalcogenide integrated photonic device. The laser beam machining method targeted at chalcogenide materials can significantly simplify the machining flow of integrated photonic chips and improve the machining efficiency of photonic chips.

The invention provides a coupling system for an on-chip light source and a photon chip. The coupling system comprises an input light source, a collimating lens, a focusing lens, a reflecting prism and an on-chip grating which are sequentially arranged in the direction of a light path, and an optical waveguide located on the side face of the on-chip grating. The collimating lens is used for primarily shaping emergent light of an input light source into a collimated light beam, the focusing lens is used for focusing the collimated light beam to the on-chip grating, and the collimating lens and the focusing lens are both aspheric plano-convex lenses. According to the system, non-uniformity caused by a large divergence angle of the semiconductor laser is effectively corrected through the aspheric micro lens, output of approximately parallel light beams is achieved, the light beams are accurately focused to the photon chip grating through the aspheric focusing lens subsequently, the coupling efficiency of light energy is greatly improved, and compared with two cylindrical lenses in the prior art, the coupling efficiency of light energy is greatly improved. The design of the focusing lens and the reflector is added, so that the number of optical elements is reduced, and error accumulation is reduced.

The present invention discloses a microwave topological photonic crystal metasurface antenna, which belongs to the field of communication technology. The present invention adopts a layered structure similar to a patch antenna, including a ground plate, a dielectric layer, a topological photonic crystal, a rectangular metal frame, and a microstrip feeder arranged from bottom to top. The topological photonic crystal is arranged above the dielectric layer, the rectangular metal frame is coated on the periphery of the topological photonic crystal, and the microstrip feeder is connected to the rectangular metal frame. The present invention can achieve multi-band characteristics and extended bandwidth. In addition, most of the electromagnetic waves propagated by the antenna within the band gap range are suppressed, and only electromagnetic waves of the angular state frequency can propagate, with smaller return loss, and the topological angular state can achieve unidirectional radiation, with better directivity at high frequencies. As a result, the antenna performance is greatly improved, which is very suitable for on-chip optical interconnection and photonic chip integration, and meets the needs of 5G / 6G communications, quantum computing, etc. for miniaturized devices.

The invention discloses an optical engine and an optical module based on a silicon optical chip. The optical engine comprises a PCB (Printed Circuit Board); the optical assembly substrate is arranged on the PCB; the optical transmitting assembly is arranged on the optical assembly substrate, the optical transmitting assembly comprises a COC, a transmitting end silicon optical chip and a transmitting end optical fiber array unit which are sequentially arranged along an optical path, the COC is used for generating signal light, the signal light is coupled to enter an optical inlet waveguide of the transmitting end silicon optical chip, and the transmitting end optical fiber array unit is coupled with an optical outlet waveguide of the transmitting end silicon optical chip; the optical receiving assembly is arranged on the optical assembly substrate, the optical receiving assembly comprises a receiving end optical fiber array unit and a receiving end silicon optical chip which are sequentially arranged along an optical path, and the receiving end optical fiber array unit is coupled with an incident waveguide of the receiving end silicon optical chip; and the connector is connected with the transmitting end optical fiber array unit and the receiving end optical fiber array unit. The number of used optical elements is reduced, the structural layout of the optical assembly is optimized, and therefore the technological process of the optical assembly is effectively simplified.

Systems and methods described herein relate to fabricating photonic chip-to-chip couplings. In one embodiment, a system for fabricating a photonic chip-to-chip coupling bonds a substrate to first and second photonic chips. The system also generates, based on images of the bonded substrate and the first and second photonic chips captured by an imaging system, an initial optimum design for a waveguide within the substrate to optically couple the first and second photonic chips. The system also etches a first portion of the waveguide in accordance with the initial optimum design using a laser that polymerizes regions of the substrate. The system also monitors the etching of the first portion of the waveguide via the imaging system and generates an updated optimum design for a second portion of the waveguide that compensates for detected error in the first portion of the waveguide.

Structures including a light source and an edge coupler, and methods of forming and using such structures. The structure comprises a semiconductor substrate and a back-end-of-line stack on the semiconductor substrate. The back-end-of-line stack includes a first dielectric layer, a first plurality of metal features in the first dielectric layer, a second dielectric layer on the first dielectric layer, and a second plurality of metal features in the second dielectric layer. The second plurality of metal features have a non-overlapping relationship with the first plurality of metal features. The structure further comprises an edge coupler adjacent to the first plurality of metal features and the second plurality of metal features.

The invention discloses a self-reference three-phase polarization imaging system and method based on an integrated photon neural network, and the method comprises the steps: setting a fixed phase difference in a silicon-based photon chip to achieve three-phase projection and single-port reading, outputting a three-phase interference signal at the same time, obtaining all phase and polarization information in one-time imaging to achieve full-polarization measurement, and carrying out the single-port reading of the silicon-based photon chip; according to the invention, the effective resolution ratio is consistent with that of an original detection array, power and temperature drift is eliminated, single-frame acquisition has no time sequence error and motion artifact, a stable and compact single-port self-reference reading mode is realized through a three-phase interference measurement architecture constructed on a chip in combination with channel normalization and rotation correction, and complete Stokes parameters and polarization information can be measured. According to the system provided by the invention, the MZI is adopted, so that the phase bias can be flexibly adjusted, and different bandwidth requirements can be met by adjusting an interference path. The silicon-based photon platform has a broadband response characteristic and can cover a visible wave band, so that the device can keep stable interference performance in a communication wave band.

The present application provides a heterogeneously integrated photonic chip, a heterogeneous integration method, a system, and an optical communication device. The heterogeneously integrated photonic chip comprises a first wafer and a second wafer, wherein: the second wafer is integrated above the first wafer; the first wafer comprises a first substrate layer and an electro-optic material layer disposed on one side of the first substrate layer; and the second wafer comprises a silicon base layer arranged on the side of the electro-optic material layer away from the first substrate layer. In the present application, by integrating the second wafer above the first wafer, with the first wafer comprising an electro-optic material layer, and the second wafer comprising a silicon base layer, the integration of two heterogeneous materials, the electro-optic material layer and the silicon base layer, on a single chip is achieved. This heterogeneously integrated photonic chip has the advantage of high integration. Additionally, the electro-optic material layer can form a high-speed electro-optic modulator, and silicon materials have well-established device integration technologies in the semiconductor field. By integrating the electro-optic material layer and the silicon base layer in this heterogeneously integrated chip, the performance of the heterogeneously integrated chip can be improved.

The invention relates to the related technical field of silicon photon chips, in particular to a high-speed silicon optical engine method and device for a silicon optical module, and the method comprises the steps: obtaining basic technical parameters of an optical fiber connection product with the silicon optical module; the refractive index distribution and the waveguide section size of the silicon optical waveguide are configured, and a multi-mode waveguide array is constructed; an electro-optical modulator array is integrated in a multi-mode waveguide array, and the coupling efficiency of waveguides and optical fibers is adjusted in real time through dynamic impedance matching; meanwhile, the high-speed electric drive circuit is used for driving the electro-optical modulator array and optimizing rising edge characteristics / falling edge characteristics of signals, and power consumption adjustment is carried out on the high-speed electric drive circuit. The technical problem that the optical signal quality is reduced due to the fact that the silicon optical waveguide design mostly adopts fixed parameters and mode crosstalk is prone to occurring in a high-speed transmission scene is solved, and the technical effects that the waveguide refractive index is dynamically configured, the multi-mode waveguide array is constructed, the mode crosstalk is effectively reduced, the transmission loss is reduced, and the optical signal transmission quality is improved are achieved.

The invention discloses a method and device for regulating and controlling the nonvolatile and reversible refractive index of a silicon nitride optical waveguide, and the method comprises the steps: carrying out the local irradiation of a to-be-regulated and controlled silicon nitride optical waveguide in a silicon nitride photon chip through an optical system, and forming a quasi-circular light spot or a quasi-rectangular light spot; moving the quasi-circular light spot or the quasi-rectangular light spot along the silicon nitride optical waveguide to be regulated and controlled; and the length and the amplitude of the refractive index change of the silicon nitride optical waveguide are regulated and controlled by utilizing the moving distance of the light spot and the irradiation dose. The refractive index of the silicon nitride optical waveguide is regulated and controlled through an optical means, additional blanking, metal connection and shielding design are not needed, additional loss caused by phase change materials, metal and the like is avoided, the cost is reduced to a certain extent, and the method has high adaptability and economical efficiency.

An electronic package is provided, in which an electronic module including a first electronic element and a second electronic element is disposed on a carrier structure embedded with a third electronic element, and the third electronic element is a photonic chip electrically connected to the electronic module. Therefore, with this configuration, it is beneficial to reduce a layout area of the carrier structure to meet the requirement of miniaturization.

The invention provides an optical frequency comb self-starting device and method. A laser generates a pump light signal; the photon chip outputs an optical frequency comb signal and transmits a pump light signal, the photon chip comprises an optical microresonator and a coupling waveguide, and the optical microresonator and the coupling waveguide are both provided with tuning electrodes; the acquisition system monitors a pump light signal and an optical frequency comb signal in real time; and the control system automatically identifies a mode locking signal according to a monitoring result, judges whether the optical frequency comb reaches a mode locking state or not, adjusts the pumping current and the tuning electrode voltage according to the mode locking signal, and generates a mode locking state optical frequency comb signal of a target wavelength. According to the invention, the mode of the laser and the mode of the micro-resonator can be automatically interlocked, the mode-locked state optical frequency comb can be generated without manual intervention, and the mode-locked state optical frequency comb signal with continuously tunable wavelength can be automatically and controllably generated through the coordinated adjustment of multiple parameters such as tuning electrode voltage and pumping current and the automatic identification of the mode-locked state.

The invention relates to the technical field of co-packaging optics, and discloses a glass-based CPO packaging structure, which comprises a glass substrate, an ASIC chip, an optical engine and an MPO connector, and is characterized in that the ASIC chip and the optical engine are arranged on the glass substrate, and the ASIC chip is electrically connected with the glass substrate; the optical engine comprises a glass substrate, a silicon optical chip and an electric chip, the silicon optical chip and the electric chip are arranged on the upper surface of the glass substrate, the glass substrate is provided with a through hole, the through hole is filled with a conductor, the silicon optical chip and the electric chip are electrically connected with the conductor, and the conductor is electrically connected with the glass substrate; a boss is arranged on the side, close to the edge of the glass substrate, of the glass substrate, the boss and the silicon optical chip are arranged at intervals, and a lens is further arranged at the interval between the silicon optical chip and the boss. A first waveguide is arranged in the boss, and one end of the first waveguide is communicated with the lens light; the side, away from the silicon optical chip, of the boss is further provided with a guide column, the guide column is matched with the MPO connector in an inserted mode, and the other end of the first waveguide is in light conduction with an optical fiber of the MPO connector.

Disclosed is devices and techniques for 3D LiDAR sensing without beam scanning with moving parts or 2D optical imaging based on the combination of a lens' position-to-angle conversion and the wavelength division multiplexing / demultiplexing (WDM) in the output probe light for LiDAR sensing. This 3D LiDAR sensing can be implemented on stacked photonic integrated chips to provide.

The invention discloses a long-distance ranging and imaging integrated single-photon laser radar system and method, and belongs to the technical field of laser radars, a laser, a signal delayer and a single-photon detector are all connected with an upper computer, and the laser, the single-photon detector and the upper computer are all connected with the signal delayer; the laser is arranged outside the optical system and connected with a collimator, the single-photon detector is arranged on a focal plane of the optical system, a laser beam of the laser is parallel to an optical axis of the optical system, and a laser beam transmitting end of the laser faces a measured target; the surface of a photon chip of the single-photon detector is divided into a distance measuring area and an imaging area through coating, the distance measuring area is provided with a distance measuring reading circuit, the imaging area is provided with an imaging reading circuit, and the distance measuring reading circuit and the imaging reading circuit are respectively connected with the upper computer; the laser comprises a first laser and a second laser, the laser beam of the first laser returns to the ranging area, and the laser beam of the second laser returns to the imaging area.

The invention discloses an FMCW laser radar system which comprises a silicon optical chip, a laser generation module, a signal receiving and transmitting module, a signal processing module, a control module and a two-dimensional scanning module. The signal receiving and transmitting module is integrated on the silicon optical chip; the control module is electrically connected with the signal processing module and the two-dimensional scanning module. The laser generation module is used for emitting laser signals; the signal receiving and transmitting module is used for receiving echo signals reflected after the laser signals pass through the two-dimensional scanning module and scan the plane of the target object, and the echo signals and the laser signals form beat frequency signals; the signal processing module is used for collecting beat frequency signals and processing the beat frequency signals to form preprocessed signals; the control module is used for controlling the arrangement mode of the two-dimensional scanning module so as to change the light emitting direction of the laser signal; and obtaining a pre-processing signal, calculating the distance and the speed of the target object according to the pre-processing signal, and generating a multi-dimensional point cloud picture. The system realizes point cloud picture output, and is small in size and easy to integrate.

An optical engine device includes an electronic integrated circuit (EIC) chip, and a photonic chip on the EIC chip, where the PIC chip includes a first photonic chip sidewall, a photonic chip substrate having an inclined upper surface, and a reflective pattern on the inclined upper surface of the photonic chip substrate, and where at least a portion of the reflective pattern is horizontally spaced apart from the first photonic chip sidewall.

The embodiment of the invention provides an on-chip polarization controller and a chip, relates to the technical field of photon integration, and aims to solve the problem of relatively high insertion loss. The on-chip polarization controller comprises an input end device, a first connecting device and an output end device, the input end device comprises a first adjustable wave plate and a first polarization beam splitting rotator, and the first adjustable wave plate is used for receiving the first signal light and adjusting the phase difference between first polarized light and second polarized light in the first signal light. The first polarization beam splitting rotator is used for receiving first signal light output by the first adjustable wave plate; the second signal light and the third signal light are both in a horizontal polarization state. The second signal light and the third signal light are formed by converting part of the first polarized light and part of the second polarized light. The first connecting device is used for adjusting the relative phase between the second signal light and the third signal light; and the output end device is used for coupling and outputting the second signal light and the third signal light. The on-chip polarization controller can be applied to a photon chip.

The invention relates to the field of semiconductor lasers, in particular to a high-power narrow-linewidth hybrid integrated laser, which comprises a wide waveguide laser gain chip and a silicon-based external cavity photon chip, and is characterized in that the silicon-based external cavity photon chip comprises a tip multi-section edge coupler, a bus waveguide, at least three cascaded micro-ring resonators and a feedback assembly; the tip multi-section edge coupler comprises a tip waveguide array and a conical combined waveguide, the tip waveguide array is composed of inverted conical waveguides arranged side by side, and the width of the input end face of each inverted conical waveguide is smaller than that of the output end face of each inverted conical waveguide; and the width of the conical combined waveguide is gradually reduced from the input end to the output end. The invention solves the industrial problem that high power and narrow linewidth are difficult to consider in the hybrid integrated laser, has the advantages of high output power, extremely narrow linewidth, wide tuning range, high coupling efficiency, good process tolerance, high integration level and the like, and provides a high-performance light source for the next generation of coherent optical communication, laser radar and precision measurement system.

The application provides a wavelength division multiplexer and a silicon optical chip, which comprises a first unit and at least one second unit; the first unit is connected with each second unit through a first waveguide; an output port and a plurality of output ports are arranged on the same side of the first unit; the first unit and the plurality of second units are each provided with a wavelength interleaver; the wavelength interleaver comprises a homogeneous waveguide and a heterogeneous waveguide; the heterogeneous waveguide comprises a main body composed of a first material; a gap is arranged in the main body; the gap is filled with a second material; along the propagation direction of input light, the wavelength interleaver is provided with an input section, an input coupling section, a phase difference accumulation section, an output coupling section and an output section; the effective refractive index of the homogeneous waveguide and the effective refractive index of the heterogeneous waveguide in the phase difference accumulation section are different. The wavelength division multiplexer can be applied to the manufacture of optoelectronic devices, such as a silicon optical chip. The first unit and the second unit are in a folded layout, so that the layout of the wavelength division multiplexer on the chip is compact and modular.

The present application relates to the chip manufacturing technical field, specifically for the photonic chip multilayer overlay precision monitoring and calibration system based on image recognition, including: image acquisition module gathers super-resolution microscopic image, photoetching machine motion parameter, photoetching cavity environmental variable and overlay alignment data;Overlay alignment digital twin module constructs photoetching machine and wafer digital twin, combines chip layout and process parameters, simulates multilayer overlay deviation, exposure distortion and interlayer coupling effect through strict coupling wave analysis and rigid body kinematics algorithm;Overlay deviation intelligent analysis hub adopts YOLO-Transformer model, identifies deviation mode and locates deviation source;Visual calibration strategy generation unit constructs three-dimensional photoetching virtual scene, renders alignment and exposure process and generates calibration strategy;Self-adaptive alignment calibration unit predicts deviation trend according to calibration data, dynamically adjusts photoetching machine parameter. Thus, the problems of calibration inefficiency, insufficient precision and the like in the prior art are solved.

Described herein are pluggable fiber-attach-first techniques and related manufacturing methods for assembling photonic chips according to the fiber-attach-first technique. The techniques may be used in several fields including, but not limited to, 2D, 2.5D, and 3D package architectures, wafer scale packaging technologies, and transceiver technologies. A photonic device comprises a photonic stack (120), a glass substrate (140) and epoxy configured to hold the photonic stack (120) and the glass substrate (140) together. The photonic stack (120) comprises one or more alignment features. The glass substrate comprises one or more alignment features (142) wherein each of the one or more alignment features (142) of the glass substrate (140) engage with a corresponding alignment feature (132) of the photonic stack (120) such that one or more waveguides of the photonic stack are optically coupled with one or more glass waveguides (144) of the glass substrate (140).

The invention discloses a photon neural network based on a time synthesis dimension and a training method thereof, and the photon neural network comprises a light input module which is used for generating a square wave light pulse; the light processing module is connected with the output end of the light input module and is used for regulating and controlling the amplitude and the phase of the square wave light pulse; the optical processing module is arranged based on a coupling optical fiber loop architecture, and an optical path is split into long and short optical fiber loops which are coupled with each other through a variable beam splitter, so that propagation paths of square wave optical pulses in the long and short optical fiber loops equivalently form time synthesis photonic crystals; and the light output module is connected with the output end of the light processing module and is used for detecting the light intensity of the square wave light pulse when the square wave light pulse is propagated in the light processing module. Wherein the optical processing module can be replaced by an integrated photonic chip architecture arrangement, and the optical processing module enables propagation paths of square wave optical pulses in long and short waveguide loops to equivalently form time synthesis photonic crystals through the long and short waveguide loops which are mutually coupled by a 50: 50 beam splitter.

This invention relates to a photonic chip implemented through the combination and interconnection of identically oriented programmable photonic processing blocks, all of which are parallel along their longitudinal axes, implemented on a single photonic chip capable of implementing one or more simultaneous photonic circuits with optical feedback paths and / or linear multiport switching through appropriate programming of its resources and selection of its input and output ports. The invention also relates to a parallel field-programmable photonic array (P-FPPA) comprising at least one programmable circuit block based on an identically oriented / parallel adjustable beamsplitter with independent coupling and phase-shift configurations and a peripheral high-performance architecture.

The invention discloses an optical nonlinear activator chip based on a graphene photoelectric device and a preparation method. Belongs to the technical field of photoelectric devices and optical signal processing. The chip comprises a detector optical path and a modulator optical path, a substrate is made of a standard SOI material, and the chip structurally comprises an optical coupling module, a waveguide, a graphene detector part and a graphene modulator part. The graphene detector and the modulator are integrated on the same chip, the detector is used for converting an input optical signal into a voltage signal, then the voltage signal is input into the modulator to modulate continuous light, and an optical signal after nonlinear conversion is output and used for a nonlinear activation unit of an optical neural network. Compared with a traditional nonlinear activator of a silicon-based integrated photon chip, the method gives full play to the advantages of excellent photoelectric property and easy integration of graphene, has the advantages of high integration level, high speed, low power consumption and the like, and has better compatibility with a silicon-based optoelectronic process.