26 results about "QSFP" patented technology

The utility model provides a novel QSFP-DD packaging optical module comprising a pedestal, the left side of the pedestal is detachably connected with a reset pull ring, and the interior of the pedestal is fixedly connected with a PCB device group. According to the novel QSFP-DD packaging optical module, the base, the reset pull ring, the upper cover, the heat dissipation teeth, the heat dissipation cover and other structures are arranged, the base serves as a core support, the PCB device set, the reset pull ring and the reset spring are accurately positioned and stably installed through a limiting groove, an installation cavity and a spring groove in the base, cooperative work is ensured, the reset pull ring is installed on the left side of the base, and the upper cover is arranged on the left side of the base. The state of the reset spring can be mastered in real time through the observation groove; the upper cover and the base are tightly connected through screws, internal components are covered and protected, external adverse factors are resisted; assembly and maintenance are also facilitated through screw connection; the heat dissipation teeth and the heat dissipation cover construct an efficient heat dissipation system, and heat dissipation is rapid; influence of over-high temperature on performance is avoided, and stability, reliability and service life of the optical module are improved.

The invention discloses an ultra-wideband transient multi-electromagnetic physical quantity synchronous measurement method and system, and the method comprises the steps: designing an electric field sensor based on a monopole rod-shaped electrically small antenna principle, and designing a magnetic field sensor based on a Faraday's law of electromagnetic induction; designing a voltage sensor based on a self-integration mode, and designing a current sensor based on a broadband Rogowski coil; based on a digital sampling technology of an FPGA, a digital processor is designed, sampling data collected by an electric field sensor, a magnetic field sensor, a voltage sensor and a current sensor are collected through the digital processor, the sampling data are transmitted to an upper computer through a QSFP module, and the sampling data are processed and displayed through the upper computer. The scheme can be effectively applied to application scenes of transient electromagnetic environment online monitoring, fault diagnosis, radiation source accurate positioning and the like of high-voltage power equipment.

The utility model relates to a kind of QSFP Bidi optical device for enterprise network, the transmission light wavelength range of TX end is different and not overlapped with the receiving light wavelength range of RX end;TX optical fiber between TX end and LC adapter is coupled with a narrowband filter, RX optical fiber between RX end and narrowband filter is coupled with a reflection prism, narrowband filter transmits the transmission light of TX end;Narrowband filter total reflection is received to the receiving light emitted from LC adapter, and let receiving light be coupled into the RX optical fiber of RX end by reflection prism reflection.A kind of enterprise network optical communication system, LC adapter in QSFP Bidi optical device is coupled with optical distribution unit by single-fiber bidirectional optical fiber, and optical distribution unit is coupled with multiple SFP optical devices respectively.Affirmative effect is that: cheap narrowband filter+reflection prism can be used to replace expensive optical circulator, effectively reduce cost, performance is promoted, it is easy to package into module, optical insertion loss is small.

The utility model discloses a QSFP + 40GPSM4 optical transceiver module meeting industrial grade temperature, which comprises a base, a circuit board, a coupling receiving amplifier and an upper cover, the top of the circuit board comprises a fixed seat, an FPC (Flexible Printed Circuit), an optical fiber connector, an interface, a laser transmitter, a receiving amplifier and a photoelectric detector, and the interface is arranged at the middle position of the circuit board; according to the utility model, after optical signals needing to be received pass through the optical fiber connector, light is received by the photoelectric detector and converted into electric signals, and then the signals are amplified by the amplifier, so that the problems of high-speed signal stability of the module and errors of received signals after the signals are converted into the optical signals in an outdoor severe high and low temperature environment are solved; practical functions of the industrial-grade temperature GPSM optical transceiver module are realized, power consumption is reduced, performance and stability are enhanced, a QSFP + module supporting high-speed industrial-grade temperature is realized, KM long-distance transmission is supported, power consumption is low, stability is high, and reliability is high.

The utility model discloses a kind of electromagnetic shielding box for optical module test, including shielding shell and test platform;The shielding shell is made of multiple metal material plate bodies and is sequentially enclosed and spliced, and electrically-conductive gasket is equipped at the joint between two adjacent plate bodies;Test port is provided on the shielding shell, and the outer end of the test port is connected with the optical module to be tested;The test platform is fixed in the shielding shell, and the test platform is connected with the inner end of the test port;The test port has two, and they are OSFP optical module test port and QSFP-DD optical module test port respectively.The utility model has the beneficial effects that: shielding shell is made of metal material, electrically-conductive gasket is equipped at the joint between shielding shell plate bodies, and they form integrated shielding, greatly improve electromagnetic shielding efficiency, reduce external electromagnetic interference, meet high-speed optical module test requirements.

Disclosed herein are optical amplifier devices, optical amplifier assembly, and optical amplifier systems. Example embodiments may include: a plurality of input optical ports, each being configured to receive one of a plurality of input optical signals; a plurality of output optical ports, each being configured to output one of a plurality of output optical signals; a plurality of tap photodiodes, each respectively being connected to one of the plurality of input optical ports and the plurality of output optical ports; a wavelength division multiplexer configured to receive the input optical signal from each of the plurality of input optical ports and an optical input from a laser pump device and output a plurality of pumped optical signals; a plurality of erbium-doped fiber coils, each having a first end configured to receive one of the plurality of pumped optical signals and a second end configured to output an amplified optical signal; and an optical isolator configured to receive, for each of the plurality of erbium-doped fiber coils, the amplified optical signal and output the plurality of output optical signals, wherein the plurality of output optical ports are configured to receive one of the plurality of output optical signals.

The invention provides a device for assisting in testing an optical module and a high and low temperature hot and cold impact machine. The device comprises a gas circuit connecting piece and a base, the gas circuit connecting piece is provided with a gas inlet and a gas outlet; the air inlet is configured to be communicated with the cold / hot air output port; a test groove and an air outlet communicated with the test groove are formed in the end part of the bottom side of the air channel connecting piece, and the air outlet is communicated into the test groove; the base is arranged at the bottom of the gas circuit connecting piece; the upper surface of the base is configured to bear the optical module, and the test groove covers the optical module; the high and low temperature cold and hot impact machine comprises the device for assisting in testing the optical module and a heating head. The heating head is movably arranged and is provided with a cold / hot air outlet, and the cold / hot air outlet is detachably connected with the air inlet of the air path connecting piece; according to the application, the high and low temperature cold and hot impact test of the QSFP optical module product can be carried out, whether the tested QSFP optical module product has hidden dangers can be confirmed, and the reliability, the stability and the performance of the QSFP optical module product are ensured.

A method of transmitting one or more radio data packets (40) by a first test device (11, 12, 13), the method comprising the steps of: obtaining, preferably repeatedly, by the first test device (11, 12, 13), a reference timestamp from a reference clock (RT), wherein the reference clock (RT) provides a reference time in a test system (1) comprising the first test device (11, 12, 13), wherein the reference timestamp indicates the reference time, transmitting, by the first test device (1), the one or more radio data packets, preferably sequentially, in accordance with a predetermined start time in the test system (1) on a communication interface (QSFP) for coupling the first test device (11, 12, 13) with a device under test, DUT (10).

The utility model provides a QSFP (Quad Small Form-factor Pluggable) optical module inspection tool, which comprises a positioning seat, an adjustable limiting block is fixedly arranged at the right end of the front surface of the positioning seat, and a fixed limiting block is fixedly arranged at the left end of the front surface of the positioning seat. According to the inspection tool for the QSFP optical module, the base, the adjustable limiting block, the fixed limiting block, the sliding groove channel and other structures are arranged, the adjustable limiting block can be flexibly adjusted according to the product size, the universality of the inspection tool is improved, the inspection tool is suitable for products of various specifications, the fixed limiting block is composed of the left block body and the right block body, and the formed sliding groove channel is convenient to maintain; the base placed at 45 degrees enables the product to automatically slide down for detection, thereby saving manpower, improving detection efficiency, unifying product slide down states, reducing man-made interference, and enabling detection results to be more reliable and accurate.

An optical module includes a housing, an optical subassembly arranged at an angle relative to the housing, and a thermal dissipation structure on the housing. The angled orientation of the optical subassembly improves compliance with fiber bend radius requirements and enables fins of the thermal dissipation structure to be dimensioned in correspondence with the angle to provide increased surface area in regions of higher airflow. In some embodiments, the fins are disposed on a top side of the housing, and in other embodiments, the fins are disposed on a bottom side of the housing. The angled fin configuration enhances convective heat transfer while maintaining compact form factor compliance for pluggable modules such as QSFP-DD and OSFP coherent optics.

A QSFP-DD optical transceiver module having more than four optical data ports and more than four electrical data ports is configured for approximately 10 Gb / s bidirectional data communication on each of the data ports, and is further configured to communicatively inter-connect each of the optical data ports thereof to a corresponding one of the electrical data ports thereof. The module may be used with a digital data router or switch having at least one QSFP-DD receptacle with eight electrical data ports and configured for parallel bidirectional communication with the QSFP-DD module plugged therein over at least five of the eight electrical data ports at 10 Gb / s per port and direction.

The invention relates to the technical field of QSFP (Quad Small Form-factor Pluggable) optical modules, in particular to a QSFP optical module structure capable of being quickly locked and packaged and a locking and packaging method thereof, the QSFP optical module structure comprises a shell and a cover plate rotationally connected with the shell, and a circuit board and an optical assembly are arranged in the shell; the fan-shaped piece is arranged on the inner side of the rotating shaft of the cover plate, and an extrusion surface and an arc-shaped surface are formed on the fan-shaped piece; the elastic supporting assembly is arranged on the inner side of the shell and abuts against the extrusion face and the arc-shaped face in a sliding mode, and when the fan-shaped piece rotates by a preset angle, the elastic supporting assembly can be controlled to act or be locked; the downward pressing assembly is connected with the elastic supporting assembly, and the downward pressing assembly can tightly press the circuit board and the optical assembly when the elastic supporting assembly is locked; and the locking assembly is arranged on the shell, and the locking assembly is matched with a convex shaft arranged on the cover plate, so that the shell is locked when the cover plate covers the shell, and the mounting precision and the portability are ensured.

The invention relates to a data conversion module and a data transmission communication system, which are applied to the field of chip verification, and the PIPE and QSFP data conversion module comprises a PIPE-to-QSFP sub-module and a QSFP-to-PIPE sub-module. The PIPE to QSFP sub-module is used for converting the received first PIPE parallel data into first enhanced QSFP serial data; the PIPE to QSFP sub-module comprises a PIPE to Aurora unit and an Aurora to QSFP unit, and the Aurora to QSFP unit is connected with the PIPE to QSFP unit; the QSFP to PIPE sub-module is used for converting the received second enhanced QSFP serial data into second PIPE parallel data; and the QSFP to PIPE sub module comprises a QSFP to Aurora unit and an Aurora to PIPE unit. The technical effects of the present application are that the number of cables for data transmission between the speed reduction bridge and the prototype verification platform is reduced, and the platform construction difficulty is reduced.

The invention discloses a high-speed area-array camera system based on 40G network transmission and an image acquisition and transmission method, and belongs to the technical field of high-speed image acquisition and transmission. The technical problems that a traditional high-speed area-array camera is insufficient in bandwidth, high in system delay and low in multi-camera synchronization precision in a high-resolution and high-frame-rate scene are solved, and the technical scheme is characterized in that the high-speed area-array camera comprises a sensor array, a front-end FPGA module, a rear-end FPGA module and a software deployment end; the sensor array comprises a plurality of groups of image sensors used for collecting original image data and outputting differential data signals, the front-end FPGA module receives the differential data signals, performs image preprocessing and then outputs the signals through a high-speed serial interface, and the rear-end FPGA module performs data analysis and image recombination and then outputs the signals through a QSFP + interface in an optical fiber mode. And the software deployment end receives the image data in parallel through the multi-path optical fiber interface and performs synchronous fusion processing.

This invention relates to a high-speed signal design method and stack-up structure for optical modules. The method includes the following steps: designing high-speed signals for QSFP-DD packaged optical modules according to a 12-layer, 3-order stack-up structure, designing layers 1, 3, 10, and 12 as high-speed differential signal routing layers, and layers 2 and 11 as complete reference ground plane layers; hollowing out the copper pads corresponding to the gold fingers of the TOP layer and BOTTOM layer; performing SI simulation based on various initial dimensions at the gold fingers to adjust the various dimensions at the gold fingers to achieve optimal impedance; hollowing out the anti-pads at the LTX BGA and LRX BGA locations; and performing SI simulation based on the initial dimensions at each location of the LTX BGA and LRX BGA to adjust the dimensions at each location of the LTX BGA and LRX BGA to achieve corresponding optimal impedance. The design method and stack-up structure provided by this invention solve the problems of poor signal transmission quality and eye diagram quality in 800G optical modules designed by existing methods.

This invention relates to a QSFP-DD horizontal connector and its assembly process. The connector includes a housing body and multiple terminal assemblies. Each terminal assembly includes multiple terminals, each with a plug end and a solder end. The solder end is fixed within the housing body and located at the lower end of the housing body. The housing body and terminal assemblies are provided with a limiting structure and a corrective structure. The limiting structure includes mutually adaptable limiting blocks, limiting grooves, and limiting holes, used to limit relative movement between terminal assemblies and between terminal assemblies and the housing body. The corrective structure includes multiple sliding blocks, sliding grooves, and hooks. The sliding blocks are equidistant from the solder ends and are neatly arranged within the sliding grooves. The hooks interlock and improve the coplanarity of the terminal assemblies. This invention ensures accurate and fixed installation of the terminal assemblies within the housing body through the limiting structure, effectively improving connection stability. The corrective structure further improves connection stability by enhancing the coplanarity of the solder ends.

The utility model relates to optical module heat dissipation technical field, concretely relates to a QSFP - CWDM heat dissipation structure based on TO - CAN scheme, and this heat dissipation structure includes at least four independent laser components, and each laser component adopts independent TO - CAN package, and the mounting structure for fixing the laser component is used. The utility model aims at solving the problem that the heat is concentrated, the heat crosstalk is serious, the cost is high and the process is complex because of the high integration of laser in the existing QSFP - CWDM optical module, and provides an innovative heat dissipation structure based on standard discrete device, realizes efficient heat dissipation through optimizing space layout.

The application discloses a kind of real-time radar signal processing systems based on high-speed acquisition and isomeric parallel, belong to real-time radar signal processing technical field;Including high-speed data acquisition and analysis module, CPU and GPU isomeric parallel processing module, the high-speed data acquisition and analysis module includes Gigabit fiber optic network card and WinPcap analysis unit, the Gigabit fiber optic network card is connected using QSFP interface with radar digital transceiver board, the WinPcap analysis unit bypasses operating system protocol stack, directly with Gigabit fiber optic network card drive interaction through driver, the high-speed data acquisition and analysis module is connected with CPU and GPU isomeric parallel processing module communication;The CPU and GPU isomeric parallel processing module includes mutually communicating CPU module and GPU module, the real-time radar signal processing system based on high-speed acquisition and isomeric parallel of the application, through the synergistic cooperation of high-speed data acquisition and analysis front end and multilayer parallelization signal processing, realizes the real-time processing requirement from data acquisition to target detection.

The utility model discloses a PCB used for a BTB structure QSFP connector. The PCB comprises a PCB body, a top layer QSFP interface and a bottom layer QSFP interface. The top-layer QSFP interface is installed on the upper surface of the PCB body, the bottom-layer QSFP interface is installed at the position, right facing the top-layer QSFP interface, on the lower surface of the PCB body, bonding pads of the top-layer QSFP interface and the bottom-layer QSFP interface are alternately distributed in a staggered mode in the projection direction of the PCB body, and the two interfaces are each matched with a QSFP optical module; the PCB body is of an N + N structure formed by pressing two PCB daughter boards; an electroplating through hole penetrates through the two PCB daughter boards; the two PCB daughter boards are respectively provided with a mechanical blind hole which extends from the outer layer to the pressing contact layer of the two PCB daughter boards. The mechanical blind hole is punched at the top end of a bonding pad of the PCB daughter board along the pin direction of the QSFP optical module; and high-speed signal fan-out of the top-layer QSFP interface and the bottom-layer QSFP interface is completed by the corresponding PCB daughter boards. According to the utility model, crosstalk between signals is reduced.

The invention discloses a QSFP packaging optical amplifier based on a ceramic substrate wiring heating technology, and relates to the field of QSFP packaging optical amplifiers, a heating module is arranged in a containing cavity of the QSFP packaging optical amplifier, a heating unit in the heating module takes a ceramic substrate as a structural carrier, the mechanical strength is improved, and the heating efficiency is improved. The PCB heating circuit of the grid-shaped circuit topology is formed through the PCB wiring technology to achieve equal-resistance-density heating, and the surface protection layer and the packaging insulation layer on the surface of the circuit can improve the oxidation resistance and the insulation performance. And the heating unit and the gain medium are fitted and assembled together through a heat-conducting silica gel layer. And precise temperature control can be realized by matching with an integrated thermistor, a temperature control chip and a heating sheet driver. The heating module can adapt to packaging space limitation and is high in heating efficiency, good in temperature stability, high in reliability and high in safety, and a QSFP packaging optical amplifier integrated with the heating module also has high stability in a low-temperature or large-temperature-fluctuation working environment.

A shared OTDR resource is disclosed that utilizes a combination of a pluggable OTDR and incorporated 1×N optical switch to allow for OTDR measurement and monitoring functionality to be shared between a plurality of N separate optical fibers that are used as communication paths between a pair of optical nodes (for example, a plurality of individual fiber spans used to interconnect a pair of data centers). The capability to maintain the OTDR functionality within a small form factor pluggable housing (e.g., QSFP, OSFP, or the like) in combination with the switch results in a shared OTDR resource that remains pluggable, and allows for increased flexibility in how this resource is shared among the various fibers.

Disclosed herein are optical amplifier devices, optical amplifier assembly, and optical amplifier systems. Example embodiments may include: a plurality of input optical ports, each being configured to receive one of a plurality of input optical signals; a plurality of output optical ports, each being configured to output one of a plurality of output optical signals; a plurality of tap photodiodes, each respectively being connected to one of the plurality of input optical ports and the plurality of output optical ports; a wavelength division multiplexer configured to receive the input optical signal from each of the plurality of input optical ports and an optical input from a laser pump device and output a plurality of pumped optical signals; a plurality of erbium-doped fiber coils, each having a first end configured to receive one of the plurality of pumped optical signals and a second end configured to output an amplified optical signal; and an optical isolator configured to receive, for each of the plurality of erbium-doped fiber coils, the amplified optical signal and output the plurality of output optical signals, wherein the plurality of output optical ports are configured to receive one of the plurality of output optical signals.

This application relates to a three-transmit, three-receive COMBO PON optical device. The device integrates a transmitting component and a receiving component, which are spatially aligned. The transmitting component contains three lasers and corresponding 45° filters. The receiving component contains a PBS prism, a quarter-wave plate, and multiple bandpass filters, used for beam splitting, polarization control, and selective filtering of downlink optical signals of different wavelengths. These signals are then received by corresponding detectors. By integrating the three transmitted and three received beams into the same device, efficient transmission and reception of COMBO PON optical signals is achieved. This application employs an optical path design of PBS prism + quarter-wave plate + filters + reflective glass, using dual receiving TOs (Transmit Tolerancing Units). This design saves one 1310nm receiving TO, reduces device thickness, and allows placement within SFP-DD and QSFP-DD optical module structures, resulting in a significant thickness reduction compared to previous designs.

1. Name of the product in this design: Transceiver integrated optical module housing (800G QSFP-DD). 2. Purpose of this design: It is used as a housing for an integrated transceiver optical module, accommodating a pluggable optoelectronic conversion module, and serves as the housing for an 800G QSFP-DD packaged optical module. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: 3D view 1.

The utility model relates to a large current PCB via hole structure applied to a QSFP-DD optical module, comprising a via hole body arranged on a PCB, the hole wall of the via hole body is provided with a conductive layer, the conductive layer is used for connecting and conducting a surface layer and an inner layer of the PCB, a conductive column penetrating through two ends of the via hole body is embedded in the via hole body, and the via hole body is provided with a through hole. The column wall of the conductive column is in contact connection with the conductive layer of the via hole body. According to the utility model, the structure that the conductive columns are embedded in the via holes is adopted, so that the cross sectional area of the conductive materials in the via holes is increased, the overcurrent capability of the via holes is improved, the required circuit board area is saved, and the design is optimized.

The invention relates to a rapid and high-compatibility electrical module test system and a test method thereof. The rapid and high-compatibility electrical module test system comprises a presentation layer, an application layer, a process layer and an equipment layer which are connected according to hierarchical logic. The presentation layer is a GUI display layer based on WPF and MaterialDesign, the application layer comprises a test control framework and a data processing module, the equipment layer comprises a DUT interface module, an instrument communication unit and a high-speed signal conditioning module, and the DUT interface module is a universal interface compatible with QSFP, CFP and SFP protocols. Therefore, the problems that an existing testing system is poor in compatibility and needs to replace hardware frequently due to multiple types of DUTs, multiple protocols and different cable lengths are effectively solved. The DUT interface module realizes rapid gating of different protocol pins by means of a relay matrix, and the instrument communication unit can automatically load a corresponding MSA protocol stack according to a DUT model. Meanwhile, according to the design, hardware does not need to be physically replaced or transformed, and mainstream current module models and test scenes can be covered.