148 results about "QSFP" patented technology

Integrated performance monitoring (PM); optical layer operations, administration, maintenance, and provisioning (OAM&P); alarming; amplification, and the like is described in optical transceivers, such as multi-source agreement (MSA)-defined modules. An optical transceiver defined by an MSA agreement can include advanced integrated functions for carrier-grade operation which preserves the existing MSA specifications allowing the optical transceiver to operate with any compliant MSA host device with advanced features and functionality. The optical transceiver can include CFP and variants thereof (e.g., CFP2, CDFP, CXP), OIF-MSA-100GLH-EM-01.0, CCRx (Compact Coherent Receiver), Quad Small Form-factor Pluggable (QSFP) and variants thereof (e.g., QSFP+, QSFP2), 10X10 MSA, XFP, XPAK, XENPAK, X2, XFP-E, SFP, SFP+, 300-pin, and the like.

Fiber adapter modules for use as interfaces at both ends of multi-fiber trunk cables position the channels of plural fiber optic transceivers onto fibers of the trunk cables in an efficient manner, such that normally dark fibers of a trunk cables are utilized. The fiber adapter modules include trunk-side ports for receiving adapters of multi-fiber trunk cables and transceiver-side ports for receiving adapters carrying both transmit channels and receive channels of fiber optic transceivers. Optical interconnections are provided within the fiber adapter modules to place at least one transmit channel or at least one receive channel of a first fiber optic transceiver at a first trunk-side port and to place at least one transmit channel or at least one receive channel of a second fiber optic transceiver at the first trunk-side port.

The invention discloses a packaging structure of a multi-mode QSFP (Quad Small Form-factor Pluggable) parallel optical transceiver module, which comprises a chip group, optical components, a circuit board, a gasket and a tube shell. In the packaging structure of the multi-mode QSFP parallel optical transceiver module, the fixed connection is realized among all the optical components as well as between the optical components and the circuit board through positioning circular holes and positioning cylinders which are matched with each other, so that the flexible adjustment when optical paths are actively coupled is facilitated, and the optical path reasonable conversion among the optical components is ensured, thereby the coupling efficiency of the optical paths is improved, and the transmission distance of data signals is increased; and in addition, an array lens frame is tightly jointed with the end surface of an adapter in an optical fiber connector and is simultaneously clamped between a base of the tube shell and a clamping groove of an upper cover so as to avoid the coupling deviation caused due to stress generated by the plug-in and the pull-out of an external optical fiber ribbon to the optical components.

An active optical cable is provided that is well suited for consumer applications. In contrast to known Quad Small Form-Factor Pluggable (QSFP) active optical cables, the active optical cable incorporates at least one consumer input / output (CIO) optical transceiver module that is well suited for consumer applications. The plug housing of the known QSFP active optical cable has been modified to house at least one CIO optical transceiver module that utilizes laser diode and photodiode singlets, rather than the parallel laser diode and photodiode arrays used in the known QSFP active optical cables. These features reduce the overall cost of the active optical cable and make it well suited for consumer applications.

A photonic transceiver apparatus in Quad Small Form-factor Pluggable (QSFP) package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a printed circuit board (PCB), installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input / output ports being back connected to the fiber-to-silicon attachment module.

An optical connector holding two or more LC-type optical ferrules is provided. The optical connector includes an outer body, an inner front body accommodating the two or more LC-type optical ferrules, ferrule springs for urging the optical ferrules towards a mating receptacle, and a back body for supporting the ferrule springs. The outer body and the inner front body are configured such that four LC-type optical ferrules are accommodated in a small form-factor pluggable (SFP) transceiver footprint or eight LC-type optical ferrules are accommodated in a quad small form-factor pluggable (QSFP) transceiver footprint. A connector is released by pulling distally on boot assembly until receptacle hook is displaced from receptacle hook recess at a proximal end of connector.

An optical connector holding two or more LC-type optical ferrules is provided. The optical connector includes an outer body, an inner front body accommodating the two or more LC-type optical ferrules, ferrule springs for urging the optical ferrules towards a mating receptacle, and a back body for supporting the ferrule springs. The outer body and the inner front body are configured such that four LC-type optical ferrules are accommodated in a small form-factor pluggable (SFP) transceiver footprint or eight LC-type optical ferrules are accommodated in a quad small form-factor pluggable (QSFP) transceiver footprint. A mating receptacle (transceiver or adapter) includes a receptacle hook and a housing with an opening that accommodates the receptacle hook in a flexed position as the optical connector makes connection with the mating receptacle by introducing the receptacle hook into an optical receptacle hook recess.

A QSFP-DD receptacle connector received within a cage includes an insulative housing and a contact module assembly received within the housing. The contact module includes a plurality of horizontal wafers stacked with one another, and each wafer includes an insulator and a plurality of contacts integrally formed therein wherein each contact has a front contact sections extending forwardly into a mating cavity formed in the housing, and a rear connecting section connected to a cable rather than to the printed circuit board. The receptacle connector associated with a cable is attached to a chassis. The cage optionally forms therein two mating spaces respectively receiving two receptacle connectors with the associated cables extending rearwardly.

An optical connector system having a first optical connector, a plurality of second optical connectors, and a mounting system hosting the first optical connector and the second optical connectors. The mounting system can be formed integrally with at least one pluggable optical device. The system also has a mechanism arranged to connect the first optical connector to the second optical connectors. The system also includes at least one further pluggable optical device having at least one optical interface optically coupled to the first optical connector of the at least one pluggable optical device. In one example, the pluggable optical device is a CFP device, and the further pluggable optical device is a QSFP+. With this configuration, the QSFP+ can accommodate at least one of a 40 G and 10 G interface capability. Also provided is a connector system and an apparatus (e.g., pluggable optical device) that enable such a capability.

An optical connector holding two or more LC-type optical ferrules is provided. The optical connector includes an outer body, an inner front body accommodating the two or more LC-type optical ferrules, ferrule springs for urging the optical ferrules towards a mating receptacle, and a back body for supporting the ferrule springs. The outer body and the inner front body are configured such that four LC-type optical ferrules are accommodated in a small form-factor pluggable (SFP) transceiver footprint or eight LC-type optical ferrules are accommodated in a quad small form-factor pluggable (QSFP) transceiver footprint. A mating receptacle (transceiver or adapter) includes internal alignment slots configured to accept a corresponding alignment key on connector outer housing to ensure alignment and orientation for maximum signal transfer between opposing ferrule end faces.

An optical connector holding two or more LC-type optical ferrules is provided. The optical connector includes an outer body, an inner front body accommodating the two or more LC-type optical ferrules, ferrule springs for urging the optical ferrules towards a mating receptacle, and a back body for supporting the ferrule springs. The outer body and the inner front body are configured such that four LC-type optical ferrules are accommodated in a small form-factor pluggable (SFP) transceiver footprint or eight LC-type optical ferrules are accommodated in a quad small form-factor pluggable (QSFP) transceiver footprint. A mating receptacle (transceiver or adapter) includes internal alignment slots configured to accept a corresponding alignment key on connector outer housing to ensure alignment and orientation for maximum signal transfer between opposing ferrule end faces.

A cable assembly comprising a connector with a termination that enables high density and high signal integrity. Shields of cables are terminated to a paddle card via a conductive structure attached to a surface of the paddle card. The signal conductors of the cables are terminated to pads on the paddle card that are exposed within openings of the conductive structure. Such a structure creates a ground structure per cable that provides low insertion loss and low crosstalk, even when multiple cables are aligned side by side and terminated in one or more rows. The cables may be drainless, enabling a large number of cables, such as eight cables, to be packed within the width of a paddle card specified in high density standards such as QSFP-DD or OSFP. The cables may nonetheless have large diameter signal conductors, enabling 2.5 or 3 meter assemblies with less than 17 dB insertion loss.

The invention discloses a QSFP connector for high-frequency signal transmission. The QSFP connector comprises an insulating body, a terminal module group and a terminal holding member for holding the terminal module in sequence in the insulating body. The terminal module group comprises signal terminal groups consisting of grounding terminals and several signal terminals. The signal terminals comprise contact portions, installation portions, connection contact portions and connecting portions of the installation portions. The grounding terminals comprise substrates, several contact portions formed by folding and extending the lower parts of the left sides of the substrates along the length directions of the substrates and several mounting portions corresponding to the contact portions and formed by folding and extending the lower parts of the right sides of the substrates in the longitudinal directions of the substrates. The mounting portions, the contact portions, the substrates and the other mounting portions form bridge-shaped grounding terminals. Space is arranged between each adjacent two contact portions and space is arranged between each adjacent two mounting portions. Each space is correspondingly provided with one signal terminal group. The beneficial effects of the present invention are that an independent grounding terminal in the prior art is arranged to be a set of grounding terminals, so that the grounding effectiveness of the grounding terminals is raised, and the shielding effect is increased.

An electrical receptacle connector is mounted within a metallic cage for mating with a QSFP module received within the cage. The contacts of the cable receptacle connector are arranged with two groups, of which one are connected to the printed circuit board on which the cage is mounted, and the other are connected to the wires which are further connected to a board-mount receptacle connector mounted on another printed circuit board on which the CPU (Central Processing Unit) socket is mounted. Each board-mount receptacle connector corresponds to more than one cable receptacle connector.

The invention discloses a storage unit based on a PCI-E multi-master share. Based on PCI-E, integration is carried out by combining the PC / IP application mode of a memory host interface protocol. The storage unit mainly comprises a master machine end PCI-E outer connecting unit, a memory end master share unit, a master end visit control isolation; through the master machine end PCI-E outer connecting unit, a signal of a PCI-E plug slot is restored and amplified, and an output interface is transformed to be a QSFP to transmit and define; through the memory end master share unit, the QSFP is transmitted and defined and restore the path to be PCI-E protocol, and connect it to a SAS disk management controller; the SAS controller is virtualized at the memory end, thus a plurality of virtual SAS controllers are virtualized; the virtual SAS address and the master name are bound. The storage unit overcomes the shortcoming of the storage and connection method of the traditional server, and provides a transmission method with high speed rate and low delay; moreover, the equipment cost is reduced.

A QSFP-DD receptacle connector received within a cage includes an insulative housing and a contact module assembly received within the housing. The contact module includes a plurality of horizontal wafers stacked with one another, and each wafer includes an insulator and a plurality of contacts integrally formed therein wherein each contact has a front contact sections extending forwardly into a mating cavity formed in the housing, and a rear connecting section connected to a cable rather than to the printed circuit board. The receptacle connector associated with a cable is attached to a chassis. The cage optionally forms therein two mating spaces respectively receiving two receptacle connectors with the associated cables extending rearwardly.

Provided is a patch panel, comprising: a circuit board; and an SFP, SFP+, or QSFP+ connector connected to a plurality of radio frequency coaxial (RF coaxial) connections via conductive traces of the circuit board, the RF coaxial connections configured to extend functionality of the SFP, SFP+, or QSFP+ socket of a computing device coupled to the patch panel from a rear end of the computing device to a front end of the computing device.

The invention provides a 40G QSFP active optical cable which includes a light transceiver module and an optical cable of at least eight channels. The light transceiver module includes a photoelectric assembly, a module housing and a module locking device. The photoelectric assembly is used to carry out the conversion between an optical signal and an electric signal. The module housing is used to fix the photoelectric assembly so as to protect the photoelectric assembly from outside influences. The module locking device is used to firmly connect the module with an external system, and provides conveniences for the unlocking of the module from the external system. The optical cable of at least eight channels is connected with two light transceiver modules and is used to transmit the optical signal. The QSFP active optical cable can realize a four-channel 10G signal duplex transmission, and has the advantages of light weight, low cost, concise structure, convenient plugging, reliable and stable performance, and strong utility, so the QSFP active optical cable can be applied to high performance computer, data center, etc.

The invention provides a device and method for automatically adjusting a power level of a QSFP+ optical module. The method comprises the following steps: taking a BMC as a management controller, adopting a set of I2Cs to extend multiple GPIO through PCA9554, and controlling an MODESEL pin of QSFP+ to achieve the function that different QSFP+ optical modules share a set of I2Cs; and meanwhile, controlling an LPMODE pin of QSFP+ by the GPIO to ensure that the state of the LPMODE pin can be real-timely changed according to the power consumption information of the optical modules read by the BMC through the I2Cs. Thereby, the trouble that an REWORK resistor is required when the maximum power consumption is greater than Level 1 can be solved, and the device and method provided by the invention are simple and convenient, and can save manpower and material resources.

A small form factor optical connector holding two or more LC-type optical ferrules is provided. The optical connector includes an outer body, an inner front body accommodating the two or more LC-type optical ferrules, a pair a resilient latches and corresponding recess for the resilient latch, ferrule springs for urging the optical ferrules towards a mating receptacle, and a back body for supporting the ferrule springs. The outer body and the inner front body are configured such that four LC-type optical ferrules are accommodated in a small form-factor pluggable (SFP) transceiver footprint or eight LC-type optical ferrules are accommodated in a quad small form-factor pluggable (QSFP) transceiver footprint. A mating receptacle (transceiver or adapter) includes a receptacle hook and a housing with an opening that accommodates the receptacle hook in a flexed position as the optical connector makes connection with the mating receptacle by introducing the receptacle hook into an optical receptacle hook recess.

The invention relates to a design method for long-distance 40G QSFP communication active copper cable component. The component consists of two electrical transmission modules and a high-frequency communication copper cable with the length of 15 meters; the electrical transmission module comprises a power supply unit, a digital diagnosis and communication unit, a signal transmission unit, a signalreceiving unit and a 38PIN interface unit; the digital diagnosis and communication unit is connected with the signal transmission unit and the signal receiving unit; the power supply unit provides a working power supply; the digital diagnosis and communication unit is communicated with an external system; the signal transmission unit receives the signals of the external system and transmits the processed signals to the high-frequency communication copper cable; the signal receiving unit receives the signals of the high-frequency communication copper cable and transmits the processed signals to the external system; the 38PIN interface unit is connected with the internal electrical transmission module and the external system; and the high-frequency communication copper cable is connected with the two electrical transmission modules. The invention overcomes high-frequency attenuation characteristics, realizes that four pairs of 10G signals carry out 15m full duplex transmission and is used for occasions of high-performance calculation and data centers and the like.

A cage for a stacked I / O connector that provides heat dissipation sufficient to support operation of QSFP-DD transceivers with a conventionally-sized cooling fan. The cage includes a second channel, between a first and a third channel that are sized and positioned adjacent ports of a connector so as to receive two transceivers. A face of the second channel may have a pattern of openings that enables a high airflow yet blocks electromagnetic radiation that would otherwise contribute to EMI. An element, adjacent the channel that similarly has a pattern of holes enabling high airflow, may further block EMI.

The invention relates to an array element of a beam splitting lens. The array element comprises a body, wherein a critical angle formed when incident light with the wavelength of 850nm enters the body to perform total reflection is smaller than 45 degrees. A first lateral surface is provided with a micro lens array A and a micro lens array C, a second lateral surface is provided with a micro lens array B, a third lateral surface is provided with two grooves recessed inwards, and the bottoms surfaces of the grooves are inclined surfaces. A first optical interface and a second optical interface are formed respectively, a 45-degree included angle is formed by the first optical interface and the first lateral surface, a 45-degree included angle is formed by the second optical interface and the first lateral surface, and the first optical interface is perpendicular to the second optical interface. After light penetrating through the micro lens array A is totally reflected by the first optical interface, one part of light enters the micro lens array C after being totally reflected by the second optical interface, the other part of light directly enters the micro lens array B, and the light entering the micro lens array C is used for monitoring backlight. A backlight monitoring function of QSFP and optical packaging can be achieved by means of the array element of the beam splitting lens. The array element of the beam splitting lens is simple in structure and low in cost.