Packaging structure of multi-mode QSFP (Quad Small Form-factor Pluggable) parallel optical transceiver module

An optical transceiver module and packaging structure technology, applied in the field of optical communication, can solve the problems of signal loss, power dissipation, electromagnetic radiation interference, impedance matching, etc., and achieve the effects of increasing transmission distance, avoiding coupling deviation, and improving efficiency

Active Publication Date: 2012-06-27
HEBEI HYMAX OPTOELECTTRONICS INC
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Problems solved by technology

From the current stage of circuit technology, 40Gbit/s is close to the limit of "electronic bottleneck". If this bottleneck is exceeded...

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  • Packaging structure of multi-mode QSFP (Quad Small Form-factor Pluggable) parallel optical transceiver module
  • Packaging structure of multi-mode QSFP (Quad Small Form-factor Pluggable) parallel optical transceiver module
  • Packaging structure of multi-mode QSFP (Quad Small Form-factor Pluggable) parallel optical transceiver module

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Embodiment Construction

[0053] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be noted that the embodiments described here are for illustration only, and are not intended to limit the present invention. In addition, the scale relationship among the various drawings is not consistent, so as to clearly show the structures of the embodiments.

[0054] Embodiments of the present invention propose a package structure of a multi-mode QSFP parallel optical transceiver module, which is composed of five parts such as a chipset, a circuit board 200, a spacer 300, an optical assembly and a casing, figure 1 It is an exploded schematic diagram of an embodiment of the packaging structure of the multi-mode QSFP parallel optical transceiver module of the present invention, as shown in the figure, wherein the chip set includes a photoelectric conversion array chip set 101, a functional circuit chip set 102 and a microcontroller ...

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Abstract

The invention discloses a packaging structure of a multi-mode QSFP (Quad Small Form-factor Pluggable) parallel optical transceiver module, which comprises a chip group, optical components, a circuit board, a gasket and a tube shell. In the packaging structure of the multi-mode QSFP parallel optical transceiver module, the fixed connection is realized among all the optical components as well as between the optical components and the circuit board through positioning circular holes and positioning cylinders which are matched with each other, so that the flexible adjustment when optical paths are actively coupled is facilitated, and the optical path reasonable conversion among the optical components is ensured, thereby the coupling efficiency of the optical paths is improved, and the transmission distance of data signals is increased; and in addition, an array lens frame is tightly jointed with the end surface of an adapter in an optical fiber connector and is simultaneously clamped between a base of the tube shell and a clamping groove of an upper cover so as to avoid the coupling deviation caused due to stress generated by the plug-in and the pull-out of an external optical fiber ribbon to the optical components.

Description

technical field [0001] The invention relates to the technical field of optical communication, in particular to a package structure of a multi-mode QSFP (Quad Small Form-factor Pluggable, four-channel small form-factor pluggable, hot-swappable) parallel optical transceiver module. Background technique [0002] The continuous expansion of the transmission capacity and the continuous improvement of the transmission rate of the main line of the communication network make optical fiber communication the main transmission means of the modern information network. For the existing optical communication network, such as wide area network (WAN), metropolitan area network (MAN), local area network ( LAN), etc., the types of optical transceiver modules required as one of the core optoelectronic devices are increasing, the requirements are getting higher and higher, and the complexity is developing at an alarming speed. Optical transceiver modules currently on the market include "1×9", S...

Claims

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Application Information

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IPC IPC(8): G02B6/42
Inventor 刘超
Owner HEBEI HYMAX OPTOELECTTRONICS INC
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