48 results about "Optical packaging" patented technology

Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and / or packaging of optical systems and / or components with electrical systems and / or components.

Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and / or packaging of optical systems and / or components with electrical systems and / or components.

Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and / or packaging of optical systems and / or components with electrical systems and / or components.

The utility model discloses an optical packaging structure, which mainly provides a first optical packaging unit and a second optical packaging unit, and is in signal connection with the first optical packaging unit and the second optical packaging unit through an optical transmission element, so that the signal communication efficiency is improved.

The invention provides a Mini LED display screen optical packaging method and system based on AI algorithm optimization. Belongs to the technical field of display screens. The method comprises the following steps: acquiring various data in a MiniLED chip packaging process in real time; historical packaging data of the MiniLED chip are obtained, and an AI algorithm model is constructed based on a machine learning algorithm; in the packaging process, the AI algorithm processing system optimizes packaging parameters in real time according to data collected in real time in combination with the trained AI algorithm model; based on a feedback control system, packaging parameters optimized by the AI algorithm are fed back to packaging equipment in real time; and detecting the packaged display screen in real time through a feedback control system. Different types of data are collected through multiple sensors, multi-dimensional capture of information is achieved through feature extraction and fusion, and the understanding and precision of the system on the optical packaging process are enhanced.

The invention discloses an optical package structure and a manufacturing method thereof. The optical package structure includes a substrate, an optical element, a spacer, and a package. The substrate has a top surface. The optical element is adjacent to the top surface of the substrate and has a first height H1. The spacer surrounds the optical element and has a top surface. A distance between the top surface of the substrate and the top surface of the spacer is defined as a second height H2. The package is located between the optical element and the spacer and has a third height H3 at a position adjacent to the optical element. The package covers at least a portion of the optical element. The optical element is exposed from the encapsulation, and H2gt; h1 > = H3.

A pluggable optical packaging structure is provided, including: a substrate, a carrier ring, at least one optical connection assembly and a cover plate; the substrate includes at least one electronic integrated circuit (EIC) and at least one photonic integrated circuit (PIC); the carrier ring is located on the substrate, and the EIC and PIC are enclosed by the carrier ring; the optical connection assembly includes at least one socket, at least one connector, a plurality of optical fibers and at least one optical fiber array connector, the socket is located in a partial section of the carrier ring, the connector is in the socket, the optical fibers has one end coupled to the connector, the other end coupled to the fiber array connector, and is coupled to the PIC through the fiber array connector; the cover plate is located on the carrier ring and extends inwardly to above the PIC.

An optical package with increased mechanical stability of co-packaged optic components is described. The optical package includes an electronic mold compound (EMC) layer with copper pillars formed through the EMC layer. The optical package also includes a silicon interposer layer with through silicon vias (TSVs) and positioned on the EMC layer. A combined thickness of the EMC layer and the silicon interposer layer provide a combined mechanical coupling thickness for a connection component on a smooth diced edge side of the EMC layer and the silicon interposer layer. The optical package also includes devices attached to the silicon interposer layer.

The utility model belongs to the technical field of panel display, and particularly relates to a high-temperature-resistant optical packaging film which comprises a protective layer and an optical PET base film which are sequentially arranged from top to bottom, a packaging adhesive layer is further arranged on the side face, away from the protective layer, of the optical PET base film, and the packaging adhesive layer is used for being bonded with an external LED chip. And the packaging adhesive layer is made of high-temperature-resistant optical adhesive. The high-temperature-resistant anti-aging plastic has the effects of high temperature resistance and aging resistance.

The invention discloses a self-adaptive self-repairing optical packaging film material, a preparation method thereof and an MLED packaging method, and belongs to flip chip COB packaging. The membrane material comprises the following components: an SEBS / TPU composite elastomer matrix, a surface-modified boron nitride nanosheet, a dynamic acylhydrazone bond microcapsule and a fluorine-containing siloxane oligomer. Mixing the SEBS / TPU composite elastomer matrix solution, the surface-modified boron nitride nanosheet, the dynamic acylhydrazone bond microcapsule and the fluorine-containing siloxane oligomer in proportion, carrying out planetary stirring and vacuum defoaming, and carrying out tape casting and curing to form a film; according to the invention, synergism and balance of mechanical self-adaption, self-repairing and high optical performance are realized, and the requirement of photoelectric packaging on the comprehensive performance of the material can be met; the problem that the performance of an optical packaging film material cannot be considered at present is solved.

The present invention provides an integrated platform for exciting a molecular fluorescence signal, a detection chip, and an optical packaging structure. The integrated platform for exciting the molecular fluorescence signal comprises, arranged in sequence: an input optical coupling structure (1), a first filtering structure (2), an optical beam-splitter tree structure (3), a filtering structure array (4), a fluorescence excitation structure array (5), and an optical coupling-out structure array (6). The detection chip is used for detecting molecular fluorescence and comprises, arranged from bottom to top in sequence: a fluorescence detection layer (103'), a fluorescence collection layer (102'), and a fluorescence excitation layer (101'). The fluorescence excitation layer (101') comprises, arranged in sequence: an input optical coupling structure (1011'), an optical beam-splitter tree structure (1013'), a fluorescence excitation structure array (1014'), and an optical coupling-out structure array (1015'). The fluorescence excitation layer is further provided with an optical feedback structure (1012'), wherein an input end of the optical feedback structure (1012') is connected to a first output end of one branch of the optical beam-splitter tree structure (1013'). The optical packaging structure comprises an optical fiber module (2') and the detection chip (1'). The integrated platform in the present invention incorporates on-chip filters, providing an integrated fluorescence excitation solution capable of suppressing broadband background light arising from spontaneous fluorescence of lasers or waveguides, thereby improving a signal-to-noise ratio. The detection chip and the optical fiber module in the optical packaging structure in the present invention employ a passive optical coupling scheme, thereby facilitating stability of fluorescence signals and reducing complexity of external device optical paths.

The invention discloses a rear clay sculpture dimension-increasing stereograph based on a traditional Chinese painting finished product and a manufacturing method of the rear clay sculpture dimension-increasing stereograph, and relates to the technical field of painting art creation.The manufacturing method comprises the steps that carrier pretreatment is conducted, specifically, nanometer silica sol spraying treatment is conducted on a to-be-dimension-increasing area of a two-dimensional painting carrier, and an adhesive force enhancing layer is formed; low-temperature clay sculpture construction: accumulating low-temperature solidified mineral mud in the area to be subjected to dimension increase to form a three-dimensional layer; pen and ink fusion treatment: performing ink color treatment when the three-dimensional layer is in a half-dry state; and optical packaging treatment: carrying out surface packaging on the stereograph subjected to ink color treatment. According to the invention, the picture is upgraded to a three-dimensional shape with perceivable depth from plane vision, the light reflectivity is improved compared with that of a traditional Chinese painting, audiences can observe the flow of light and shadow with light and shade changes through different visual angles, the limitation that plane painting depends on a fixed visual angle is broken through, and the work is upgraded to an art carrier with dynamic perception from static viewing.

The application discloses an optical packaging structure with a multifunctional transparent substrate cover, which comprises a transparent substrate cover (1), a light-blocking layer (2) and a substrate (3). The transparent substrate cover (1) is made of transparent glass, and comprises a transparent shell (102) and a transparent cover (103). A circuit (101) is integrated on the inner wall of the transparent shell (102), the bottom of the transparent shell (102) is packaged on the substrate (3), and the transparent cover (103) covers the top of the transparent shell (102). An ASIC chip (4) is located in the transparent shell (102) and is electrically connected to the substrate (3), and a plurality of first components (5) are respectively and separately arranged on the inner wall of the transparent shell (102) and are electrically connected to the circuit (101). The light-blocking layer (2) is arranged on the outer wall of the transparent shell (102), so that the transparent shell (102) forms a light-proof shell.

The utility model provides an optical packaging structure, comprising an active device which is provided with an active surface and a passive surface which are oppositely arranged; a light sensor bonded to the passive surface of the active device; and the spacer is located on the passive surface of the active device, and the light sensor is located in a space defined by the spacer and the active device. The utility model aims to provide an optical packaging structure so as to improve the sensing accuracy of the optical packaging structure and reduce the size of the optical packaging structure.

An optical packaging structure is mainly characterized in that an electronic component is arranged in a groove of a circuit board, a semiconductor component is stacked on the electronic component, an optical component is connected to the semiconductor component, the electronic component is provided with a plurality of conductive through holes, and the conductive through holes are communicated with the optical component. Therefore, the semiconductor element and the optical element are electrically connected with the circuit board through the plurality of conductive through holes, and the path of electric transmission is shortened.

An optical package module and a photonic wafer thereof wherein the optical package module comprises a bearing structure, a photonic wafer disposed on the bearing structure, and a filling layer filled between the bearing structure and the photonic wafer, and the photonic wafer comprises a wafer body and a plurality of stoppers formed on two opposite sides of the wafer body, and the overflow distance of the filling layer is shortened through the plurality of stop dogs.

The invention relates to the technical field of coating preparation, in particular to an inorganic hybrid ultraviolet barrier coating and a preparation method thereof. According to the coating, inorganic cerium oxide particles are utilized to form a stable ultraviolet absorption and scattering center, multi-point anchoring is combined with a polymer containing phosphonic acid and catechol-epoxy side groups, colloidal silicon dioxide which is diluted by ethanol / water and stably dispersed by regulating the pH is introduced, and finally, after damp-heat re-curing treatment, organic-inorganic phase interface cross-linking integrity is formed, so that the coating is formed. Internal stress and microcracks are remarkably eliminated, so that the surface of the film layer is smoother, the gloss is higher, and the interface bonding is firmer. The obtained coating has high light transmittance, low haze and excellent ultraviolet barrier and adhesion properties, is suitable for flexible display protective films, touch screen cover films and high-barrier optical packaging materials, and has good industrial application value.

An optical packaging structure includes a slotted substrate, a photonic element with an optical region, an electronic component, and a reinforcement member. The photonic element and the electronic component are both disposed on the substrate and electrically connected to each other. Furthermore, the reinforcement member is fixed to the substrate, with a portion of the reinforcement member and the optical region of the photonic element corresponding to the slot in the substrate. The optical region of the photonic element is exposed outside the slot in the substrate, allowing an optical fiber or fiber optic array unit to connect to the optical region of the photonic element through the slot in the substrate. Therefore, this application can improve the warpage problem of the optical packaging structure through the reinforcement member and also allows the optical fiber or fiber optic array unit to be easily connected to the optical region of the photonic element through the slot in the substrate.

The invention discloses a preparation method of a defective pixel repairable composite material optical packaging film for an MLED, a packaging film, an MLED packaging method and a defective pixel repairing method, and belongs to the field of miniature light-emitting diodes. The problem that defective pixels are difficult to repair after an existing MLED display module is packaged is solved. According to the technical scheme, the method comprises the steps that a black protection solution is prepared, a release film is coated with the black protection solution to form a black protection layer, the black protection layer is coated with a thermal response bonding solution, a thermal response bonding layer is formed on the black protection layer after drying and curing treatment, and an optical regulation and control layer is prepared. The optical control layer forms a microstructure on the surface of the optical control layer through a surface processing technology, the optical control layer is attached to the thermal response bonding layer, the optical control layer and the thermal response bonding layer are compounded through hot pressing, and breakthrough improvement of repairability and optical performance of the packaging film is achieved through a material system and technology innovation of the black protection layer and the thermal response bonding layer; the invention is applied to the MLED.

The invention discloses a high-black matte optical packaging film, a preparation method of the high-black matte optical packaging film and an MLED display device, and belongs to the technical field of optical thin film materials. The packaging film comprises a base material layer and an optical adhesive layer arranged on the surface of the base material layer, and non-absorption type light scattering particles and light absorption substances are compounded in the optical adhesive layer at the same time. In the direction from the base material layer to the optical adhesive layer, the concentration of the non-absorption type light scattering particles is gradually increased, and the concentration of the light absorption substance is gradually reduced; appropriate component mutual diffusion occurs at the interface of the two layers by controlling process conditions, and finally a gradient functional layer with continuously changed components is formed; according to the invention, excellent optical performance is realized through a scattering-absorption synergistic system and a gradient distribution structure in the adhesive layer; the problem that an existing optical packaging film cannot give consideration to the extreme blackness and the high-grade matte texture at the same time is solved.

The utility model discloses a mould-proof adhesive film, which belongs to the field of packaging materials and comprises a peelable temporary protective layer, an adhesive film base layer arranged inside the peelable temporary protective layer, a mould-proof layer arranged at the top of the adhesive film base layer and a damp-proof layer arranged at the bottom of the adhesive film base layer. The adhesive film base layer is composed of a first adhesive layer, a second adhesive layer and a third adhesive layer, the third adhesive layer is arranged at the bottom of the first adhesive layer, the damp-proof layer is arranged at the bottom of the third adhesive layer, a plurality of electrostatic repulsion columns are fixed in the second adhesive layer, the tops of the electrostatic repulsion columns are connected with the mildew-proof layer, and the bottoms of the electrostatic repulsion columns are connected with the damp-proof layer; the electrostatic repulsion column is a surface ionization treatment column body, achieves efficient mildew-proof and antibacterial effects in a humid environment, delays material aging, effectively inhibits pollutant residues and electrostatic adsorption, reduces micro-plastic release, reduces the weight of the material, improves the anti-deformation capability, and meets the optical packaging requirements.

Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and / or packaging of optical systems and / or components with electrical systems and / or components.

The application provides a silicon optical packaging device and a preparation method thereof. The silicon optical packaging device comprises a light guide structure, a heat dissipation structure, a plastic sealing layer, a first structure and a second structure. The light guide structure is a right trapezoidal structure. A surface where a non-right waist of the light guide structure is located is a total reflection surface. Light signals entering the light guide structure from a direction parallel to a bottom side of the surface where the right waist is located can be totally reflected to a plane where a front surface of the plastic sealing layer is located. The heat dissipation structure is arranged in a spaced manner with the light guide structure and is embedded in the plastic sealing layer. The light guide structure can greatly reduce transmission loss of the light guide structure in transmitting light signals. The light guide structure and the heat dissipation structure are embedded in the plastic sealing layer, so that the heat dissipation capacity can be improved. The first structure and the second structure are directly formed on two sides of the plastic sealing layer, so that the silicon optical packaging device can replace a PCB substrate and an optical path, and the space utilization rate is improved.

An optical packaging module is mainly characterized in that a photonic element is arranged on an electronic module comprising an electronic element, the photonic element is electrically connected with the electronic element so as to carry out optical signal processing, an electromagnetic shielding layer wrapping the photonic element is formed on the electronic module, the electromagnetic shielding layer is filled with a plurality of magnetic metal particles, and the magnetic metal particles are arranged on the electronic module. Therefore, the photonic element has an anti-electromagnetic wave function.

A light installation process method for improving the temperature characteristic of a high-precision fiber-optic gyroscope comprises the following steps: intercepting the length of a tail fiber according to a design value, and completing the tail fiber distance fixing work of an optical device; carrying out tail fiber welding and torsion release; plane coiling is implemented to form an Archimedes spiral; and plane one-way gluing is implemented, and the optical assembly process is completed. The problem that the temperature performance index is degraded before and after dispensing of the high-precision fiber-optic gyroscope is solved, and the qualified rate of light path assembly of the high-precision fiber-optic gyroscope can be effectively improved.

The invention relates to the field of organic polymer composite materials, in particular to a high-transparency silicone rubber composite material and a preparation method thereof.The high-transparency silicone rubber composite material is prepared from, by mass, 50-55 parts of modified vinyl-terminated polydimethylsiloxane, 40-45 parts of vinyl-terminated polydimethylsiloxane, 3-5 parts of a modified chain extension cross-linking agent and 3-5 parts of a hydrogen-containing silicone oil cross-linking agent, by innovatively adopting the surface-modified organic silicon resin and the modified chain extension cross-linking agent, the technical problem that high filling amount and high transparency are difficult to consider at the same time is successfully solved, and compared with the prior art, the high-transparency organic silicon resin has the advantages of excellent optical transparency and mechanical strength, high transparency and high transparency, and can be used for preparing high-transparency organic silicon resin and high-transparency organic silicon resin composite materials for the high-transparency organic silicon resin composite materials for the high-transparency organic silicon resin composite materials for the high-transparency organic silicon resin composite materials. And an intelligent self-repairing function is also shown, the service life of the product is effectively prolonged, and the method has a wide application prospect in the fields of high-end optical packaging, flexible electronics, medical instruments and the like.

An optical packaging module mainly provides a glass substrate with a first side and a second side which are opposite to each other, a groove is formed in the first side, a plurality of optical engines are arranged in the groove, and an electronic element is arranged on the glass substrate and electrically connected with the glass substrate, so that the bending resistance of the glass substrate is improved, and the bending resistance of the glass substrate is improved. And electrical connection failure caused by warping is avoided.

The embodiment of the utility model relates to a packaging assembly which comprises a semiconductor packaging piece, an optical packaging piece and optical cement. The semiconductor package includes an interposer structure and an overlying photonic structure. The optical package is disposed over the semiconductor package, in which the optical package includes a substrate, a cover, and an optical fiber array unit interposed between the substrate and the cover, and the substrate has at least one light-transmitting region therein. The optical cement is arranged between the photon structure and the at least one light-transmitting area of the substrate and is in contact with the photon structure and the at least one light-transmitting area of the substrate.

An exemplary package includes a photonic die, an electronic die, and a package component. The electronic die has an electronic device layer disposed between a frontside interconnect structure and a backside interconnect structure. The backside interconnect structure is configured to deliver power to the electronic device layer. The photonic die, the electronic die, and the package component are stacked top-to-bottom. The backside interconnect structure of the electronic die is connected to the package component, and the photonic die is connected to the electronic die. In some embodiments, the photonic die and the electronic die are each free of through semiconductor vias, such as through silicon vias. In some embodiments, a frontside interconnect structure of the photonic die is connected to the frontside interconnect structure of the electronic die. In some embodiments, a backside interconnect structure of the photonic die is connected to the frontside interconnect structure of the electronic die.