33 results about "Optical packaging" patented technology

Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and / or packaging of optical systems and / or components with electrical systems and / or components.

Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and / or packaging of optical systems and / or components with electrical systems and / or components.

Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and / or packaging of optical systems and / or components with electrical systems and / or components.

The utility model discloses an optical packaging structure, which mainly provides a first optical packaging unit and a second optical packaging unit, and is in signal connection with the first optical packaging unit and the second optical packaging unit through an optical transmission element, so that the signal communication efficiency is improved.

The invention discloses an optical package structure and a manufacturing method thereof. The optical package structure includes a substrate, an optical element, a spacer, and a package. The substrate has a top surface. The optical element is adjacent to the top surface of the substrate and has a first height H1. The spacer surrounds the optical element and has a top surface. A distance between the top surface of the substrate and the top surface of the spacer is defined as a second height H2. The package is located between the optical element and the spacer and has a third height H3 at a position adjacent to the optical element. The package covers at least a portion of the optical element. The optical element is exposed from the encapsulation, and H2gt; h1 > = H3.

The invention discloses a self-adaptive self-repairing optical packaging film material, a preparation method thereof and an MLED packaging method, and belongs to flip chip COB packaging. The membrane material comprises the following components: an SEBS / TPU composite elastomer matrix, a surface-modified boron nitride nanosheet, a dynamic acylhydrazone bond microcapsule and a fluorine-containing siloxane oligomer. Mixing the SEBS / TPU composite elastomer matrix solution, the surface-modified boron nitride nanosheet, the dynamic acylhydrazone bond microcapsule and the fluorine-containing siloxane oligomer in proportion, carrying out planetary stirring and vacuum defoaming, and carrying out tape casting and curing to form a film; according to the invention, synergism and balance of mechanical self-adaption, self-repairing and high optical performance are realized, and the requirement of photoelectric packaging on the comprehensive performance of the material can be met; the problem that the performance of an optical packaging film material cannot be considered at present is solved.

The present invention provides an integrated platform for exciting a molecular fluorescence signal, a detection chip, and an optical packaging structure. The integrated platform for exciting the molecular fluorescence signal comprises, arranged in sequence: an input optical coupling structure (1), a first filtering structure (2), an optical beam-splitter tree structure (3), a filtering structure array (4), a fluorescence excitation structure array (5), and an optical coupling-out structure array (6). The detection chip is used for detecting molecular fluorescence and comprises, arranged from bottom to top in sequence: a fluorescence detection layer (103'), a fluorescence collection layer (102'), and a fluorescence excitation layer (101'). The fluorescence excitation layer (101') comprises, arranged in sequence: an input optical coupling structure (1011'), an optical beam-splitter tree structure (1013'), a fluorescence excitation structure array (1014'), and an optical coupling-out structure array (1015'). The fluorescence excitation layer is further provided with an optical feedback structure (1012'), wherein an input end of the optical feedback structure (1012') is connected to a first output end of one branch of the optical beam-splitter tree structure (1013'). The optical packaging structure comprises an optical fiber module (2') and the detection chip (1'). The integrated platform in the present invention incorporates on-chip filters, providing an integrated fluorescence excitation solution capable of suppressing broadband background light arising from spontaneous fluorescence of lasers or waveguides, thereby improving a signal-to-noise ratio. The detection chip and the optical fiber module in the optical packaging structure in the present invention employ a passive optical coupling scheme, thereby facilitating stability of fluorescence signals and reducing complexity of external device optical paths.

An optical packaging structure is mainly characterized in that an electronic component is arranged in a groove of a circuit board, a semiconductor component is stacked on the electronic component, an optical component is connected to the semiconductor component, the electronic component is provided with a plurality of conductive through holes, and the conductive through holes are communicated with the optical component. Therefore, the semiconductor element and the optical element are electrically connected with the circuit board through the plurality of conductive through holes, and the path of electric transmission is shortened.

An optical package module and a photonic wafer thereof wherein the optical package module comprises a bearing structure, a photonic wafer disposed on the bearing structure, and a filling layer filled between the bearing structure and the photonic wafer, and the photonic wafer comprises a wafer body and a plurality of stoppers formed on two opposite sides of the wafer body, and the overflow distance of the filling layer is shortened through the plurality of stop dogs.

The invention relates to the technical field of coating preparation, in particular to an inorganic hybrid ultraviolet barrier coating and a preparation method thereof. According to the coating, inorganic cerium oxide particles are utilized to form a stable ultraviolet absorption and scattering center, multi-point anchoring is combined with a polymer containing phosphonic acid and catechol-epoxy side groups, colloidal silicon dioxide which is diluted by ethanol / water and stably dispersed by regulating the pH is introduced, and finally, after damp-heat re-curing treatment, organic-inorganic phase interface cross-linking integrity is formed, so that the coating is formed. Internal stress and microcracks are remarkably eliminated, so that the surface of the film layer is smoother, the gloss is higher, and the interface bonding is firmer. The obtained coating has high light transmittance, low haze and excellent ultraviolet barrier and adhesion properties, is suitable for flexible display protective films, touch screen cover films and high-barrier optical packaging materials, and has good industrial application value.

An optical packaging structure includes a slotted substrate, a photonic element with an optical region, an electronic component, and a reinforcement member. The photonic element and the electronic component are both disposed on the substrate and electrically connected to each other. Furthermore, the reinforcement member is fixed to the substrate, with a portion of the reinforcement member and the optical region of the photonic element corresponding to the slot in the substrate. The optical region of the photonic element is exposed outside the slot in the substrate, allowing an optical fiber or fiber optic array unit to connect to the optical region of the photonic element through the slot in the substrate. Therefore, this application can improve the warpage problem of the optical packaging structure through the reinforcement member and also allows the optical fiber or fiber optic array unit to be easily connected to the optical region of the photonic element through the slot in the substrate.

The invention discloses a high-black matte optical packaging film, a preparation method of the high-black matte optical packaging film and an MLED display device, and belongs to the technical field of optical thin film materials. The packaging film comprises a base material layer and an optical adhesive layer arranged on the surface of the base material layer, and non-absorption type light scattering particles and light absorption substances are compounded in the optical adhesive layer at the same time. In the direction from the base material layer to the optical adhesive layer, the concentration of the non-absorption type light scattering particles is gradually increased, and the concentration of the light absorption substance is gradually reduced; appropriate component mutual diffusion occurs at the interface of the two layers by controlling process conditions, and finally a gradient functional layer with continuously changed components is formed; according to the invention, excellent optical performance is realized through a scattering-absorption synergistic system and a gradient distribution structure in the adhesive layer; the problem that an existing optical packaging film cannot give consideration to the extreme blackness and the high-grade matte texture at the same time is solved.

The utility model discloses a mould-proof adhesive film, which belongs to the field of packaging materials and comprises a peelable temporary protective layer, an adhesive film base layer arranged inside the peelable temporary protective layer, a mould-proof layer arranged at the top of the adhesive film base layer and a damp-proof layer arranged at the bottom of the adhesive film base layer. The adhesive film base layer is composed of a first adhesive layer, a second adhesive layer and a third adhesive layer, the third adhesive layer is arranged at the bottom of the first adhesive layer, the damp-proof layer is arranged at the bottom of the third adhesive layer, a plurality of electrostatic repulsion columns are fixed in the second adhesive layer, the tops of the electrostatic repulsion columns are connected with the mildew-proof layer, and the bottoms of the electrostatic repulsion columns are connected with the damp-proof layer; the electrostatic repulsion column is a surface ionization treatment column body, achieves efficient mildew-proof and antibacterial effects in a humid environment, delays material aging, effectively inhibits pollutant residues and electrostatic adsorption, reduces micro-plastic release, reduces the weight of the material, improves the anti-deformation capability, and meets the optical packaging requirements.

Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and / or packaging of optical systems and / or components with electrical systems and / or components.

The application provides a silicon optical packaging device and a preparation method thereof. The silicon optical packaging device comprises a light guide structure, a heat dissipation structure, a plastic sealing layer, a first structure and a second structure. The light guide structure is a right trapezoidal structure. A surface where a non-right waist of the light guide structure is located is a total reflection surface. Light signals entering the light guide structure from a direction parallel to a bottom side of the surface where the right waist is located can be totally reflected to a plane where a front surface of the plastic sealing layer is located. The heat dissipation structure is arranged in a spaced manner with the light guide structure and is embedded in the plastic sealing layer. The light guide structure can greatly reduce transmission loss of the light guide structure in transmitting light signals. The light guide structure and the heat dissipation structure are embedded in the plastic sealing layer, so that the heat dissipation capacity can be improved. The first structure and the second structure are directly formed on two sides of the plastic sealing layer, so that the silicon optical packaging device can replace a PCB substrate and an optical path, and the space utilization rate is improved.

An optical packaging module is mainly characterized in that a photonic element is arranged on an electronic module comprising an electronic element, the photonic element is electrically connected with the electronic element so as to carry out optical signal processing, an electromagnetic shielding layer wrapping the photonic element is formed on the electronic module, the electromagnetic shielding layer is filled with a plurality of magnetic metal particles, and the magnetic metal particles are arranged on the electronic module. Therefore, the photonic element has an anti-electromagnetic wave function.

A light installation process method for improving the temperature characteristic of a high-precision fiber-optic gyroscope comprises the following steps: intercepting the length of a tail fiber according to a design value, and completing the tail fiber distance fixing work of an optical device; carrying out tail fiber welding and torsion release; plane coiling is implemented to form an Archimedes spiral; and plane one-way gluing is implemented, and the optical assembly process is completed. The problem that the temperature performance index is degraded before and after dispensing of the high-precision fiber-optic gyroscope is solved, and the qualified rate of light path assembly of the high-precision fiber-optic gyroscope can be effectively improved.

The invention relates to the field of organic polymer composite materials, in particular to a high-transparency silicone rubber composite material and a preparation method thereof.The high-transparency silicone rubber composite material is prepared from, by mass, 50-55 parts of modified vinyl-terminated polydimethylsiloxane, 40-45 parts of vinyl-terminated polydimethylsiloxane, 3-5 parts of a modified chain extension cross-linking agent and 3-5 parts of a hydrogen-containing silicone oil cross-linking agent, by innovatively adopting the surface-modified organic silicon resin and the modified chain extension cross-linking agent, the technical problem that high filling amount and high transparency are difficult to consider at the same time is successfully solved, and compared with the prior art, the high-transparency organic silicon resin has the advantages of excellent optical transparency and mechanical strength, high transparency and high transparency, and can be used for preparing high-transparency organic silicon resin and high-transparency organic silicon resin composite materials for the high-transparency organic silicon resin composite materials for the high-transparency organic silicon resin composite materials for the high-transparency organic silicon resin composite materials. And an intelligent self-repairing function is also shown, the service life of the product is effectively prolonged, and the method has a wide application prospect in the fields of high-end optical packaging, flexible electronics, medical instruments and the like.

An optical packaging module mainly provides a glass substrate with a first side and a second side which are opposite to each other, a groove is formed in the first side, a plurality of optical engines are arranged in the groove, and an electronic element is arranged on the glass substrate and electrically connected with the glass substrate, so that the bending resistance of the glass substrate is improved, and the bending resistance of the glass substrate is improved. And electrical connection failure caused by warping is avoided.

The invention provides a preparation method of a condenser-solar cell integrated structure. The preparation method comprises the following steps: preparing an LSC substrate; preparing a flexible solar cell and a flexible optical packaging layer on the substrate in sequence; plasma processing is carried out on the surface of the flexible optical packaging layer and the surface of the to-be-bonded edge of the LSC substrate; coating the pretreated surface with a silane coupling agent solution; flexible optical cement with the matched refractive index is evenly coated on any preprocessed surface, then the welt structure and the edge of the waveguide body are precisely aligned and attached, and interface bubbles are removed; and curing the flexible optical cement to obtain the condenser-solar cell integrated structure. According to the preparation method provided by the invention, the flexible thin film is used as the substrate, so that the whole attached cell original part has ductility matched with the flexible LSC body, and interface chemical bonding is combined, so that repeated bending can be borne, and layering is avoided. The invention also provides a condenser-solar cell integrated structure.

The invention provides a vertical spatial multiplexing packaged array high-frequency optoelectronic device, and relates to the technical field of photoelectrons. The array high-frequency optoelectronic device comprises a packaging tube shell, wherein a plurality of platforms for mounting chips are arranged in the packaging tube shell; the plurality of high-frequency photoelectron chips are mounted on the plurality of platforms; the plurality of high-frequency packaging structures are in one-to-one correspondence with and are connected with the plurality of high-frequency photoelectron chips; the plurality of low-frequency packaging structures are in one-to-one correspondence with and are connected with the plurality of high-frequency photoelectron chips; the plurality of optical packaging structures are in one-to-one correspondence with the plurality of high-frequency optoelectronic chips and are connected with the high-frequency optoelectronic chips; wherein the high-frequency packaging structure and the low-frequency packaging structure are located at different vertical heights in the vertical space. According to the array high-frequency optoelectronic device, the high-frequency circuit and the low-frequency circuit are arranged in a layered mode, the high-frequency circuit and the low-frequency circuit are placed at different vertical positions, spatial multiplexing is achieved, and the problem of spatial interference of the high-frequency circuit, the low-frequency circuit and an optical path of the array high-frequency optoelectronic device can be solved.

The application provides an optical packaging film and a preparation method thereof, and a removal packaging method of an LED module, and belongs to the fields of intelligent polymer materials and advanced optical packaging technologies; the technical problems to be solved are that the existing technologies have complex structures, low repair precision and high risk of thermal damage; the technical scheme for solving the technical problems is that the optical packaging film comprises a base material layer and a functional adhesive layer; the functional adhesive layer is a composite dynamic bonding phase change polymer; the composite dynamic bonding phase change polymer comprises near-infrared light-to-heat conversion particles and at least two different dynamic covalent bond systems; the dynamic covalent bond systems are used for realizing the reversible response characteristics of the functional adhesive layer in a wide temperature range and under multiple conditions; and the near-infrared light-to-heat conversion particles are used for efficient heat generation and participate in dynamic bonding; the application is applied to the advanced packaging and repair of high-precision optoelectronic devices such as Mini / Micro LED and COB.

The utility model relates to an optical packaging module and a wafer group structure thereof, which mainly provides a photoelectric integration photonic wafer and an electronic element arranged on the photoelectric integration photonic wafer, then the photoelectric integration photonic wafer is connected and electrically connected to a bearing structure, and an optical element is arranged on the photoelectric integration photonic wafer so as to increase the signal transmission speed.

The application discloses a device for coupling and packaging of an optical fiber array and an optoelectronic chip, wherein when the device is used, the device and the chip are fixed by point gluing only once when the coupling loss between the optical fiber array and the optoelectronic chip is minimized, and the function of multiple insertion and extraction of the optical fiber array in the whole device and multiple efficient coupling and alignment between the optical fiber array and the optoelectronic chip without the aid of adjusting equipment can be realized, and the device can be directly used for packaging and reinforcing between the optical fiber array and the optoelectronic chip. The application also discloses a method for coupling, testing, packaging of the optical fiber array and the optoelectronic chip, wherein the process of switching the device generally required in the testing and packaging process is omitted, the risk of damage to the stability of the optical fiber array caused by artificial installation and removal of the clamp is avoided, the rapid connection of the processes from the coupling test of the optical fiber array and the optoelectronic chip to the packaging and then to the reinforcement is realized, the optical packaging method of the optical fiber array and the optoelectronic chip is optimized, and the success rate of the optical packaging is greatly improved.

An optical packaging module and its manufacturing method are disclosed. The module mainly forms multiple packaging units on a carrier and provides interconnected cutting channels between the multiple packaging units. Then, grooves are formed by cutting along the cutting channels between the multiple packaging units. The width of the cutting channels is 240 to 720 micrometers so that when optical elements are subsequently placed on the packaging units and a filler material is formed between the optical elements and the packaging units, the filler material can be prevented from contaminating adjacent optical elements.

This invention relates to the field of coating preparation technology, specifically to an inorganic hybrid ultraviolet-blocking coating and its preparation method. The coating utilizes inorganic cerium oxide particles to form stable ultraviolet absorption and scattering centers, combined with multi-point anchoring of a polymer containing phosphonic acid and catechol-epoxy side groups. Simultaneously, colloidal silica, diluted with ethanol / water and with pH adjusted for stable dispersion, is introduced. Finally, after a hydrothermal curing treatment, the organic-inorganic phase interface is fully cross-linked, significantly eliminating internal stress and microcracks, resulting in a smoother film surface, higher gloss, and stronger interfacial bonding. The resulting coating possesses high light transmittance, low haze, and excellent ultraviolet blocking and adhesion properties, making it suitable for flexible display protective films, touch screen cover films, and high-barrier optical packaging materials, demonstrating significant industrial application value.

The utility model provides a CWDM optical packaging module, comprising a housing, the housing comprises an upper housing and a lower housing, a PCB assembly and an optical transmit-receive assembly are arranged in a cavity between the upper housing and the lower housing, and protection units are respectively arranged in cooperation with the PCB assembly and the optical transmit-receive assembly. According to the utility model, dustproof measures are strictly executed; the devices in the shell are strictly positioned, so that mutual influence among the chips or the components is avoided, and the chips are prevented from being scratched; the optical transceiver assembly is fastened, so that the performance of the PCB assembly and the optical transceiver assembly is prevented from being affected by vibration in use, and the anti-vibration performance is improved; electrostatic discharge damage is effectively prevented, and electric devices are isolated; heat production sites of the optical packaging module are analyzed, and efficient heat dissipation is realized by matching with various heat dissipation structures, so that the optical packaging module is also excellent in performance in a high-temperature and high-humidity environment; the optical module is simple in structure, high in product reliability, convenient to realize small-batch production, and capable of being applied to the field of miniaturized optical modules in the market, and realizes the development of the optical module towards miniaturization and high integration.

The application discloses an optical packaging platform and method for a silicon photon chip, and the optical packaging platform comprises a base plate, a gantry, a slide rail, a viewing mirror set, two electrically-controlled displacement tables, a clamp for fixing an optical fiber array, a curved rod and a PCB plate, wherein the gantry and the two electrically-controlled displacement tables are installed on the base plate, the slide rail is installed on the gantry, the viewing mirror set comprises a first optical zoom lens, a second optical zoom lens, a third optical zoom lens and a fourth optical zoom lens, the first optical zoom lens and the fourth optical zoom lens are installed on the slide rail, the second optical zoom lens and the third optical zoom lens are oppositely arranged and installed on the base plate, the curved rod is used for connecting the electrically-controlled displacement tables and the clamp, the PCB plate is installed on the base plate through a support, the PCB plate is installed with a chip, a ceramic sheet and an adapter plate, and the chip is located below the adapter plate. The operation of the application is simpler, the optical packaging process can be more automated and stable, and the packaging time can be shortened.

The application discloses a kind of benzoxazine adhesives and its preparation method and use, it is related to adhesive technical field, the benzoxazine adhesive is according to total amount 100 parts by weight, including 25~30 parts by weight benzoxazine resin, 55~65 parts by weight polar aprotic solvent and 10~15 parts by weight double epoxy auxiliary agent;Wherein benzoxazine resin can be obtained by amine substance, aldehyde substance and phenolic substance reaction;The double epoxy auxiliary agent includes 1,4-((oxirane-2-ylmethoxy) methyl) cyclohexane and / or bisphenol A diglycidyl ether.The adhesive of the application can form a cured film with a uniform surface after curing, and has high optical transmittance in the 450nm-470nm blue light band and resistance to stripping liquid treatment stability, suitable for optical packaging adhesive layer such as Micro-LED.