52 results about "Optical packaging" patented technology

A high speed non-contact beam scanning device sized and shaped to provide the ergonomic benefits of a pen or wand, yet can scan a wide angle moving beam across an information-bearing target in one or two dimensional scan patterns such as lines, rasters or other patterns in order to read information therefrom. The device is well suited for reading one or two dimensional bar-code or other printed matter. In order to achieve the high density optical packaging necessary for its high performance to size benefits the device employs a novel in-line or "axial" gyrating, or "axial" scan element. The axial scan element can accept an input light beam at one end and cause it to emerge from its opposite end as a scanned beam, propagating in the same general forward direction it had upon entering the element. Reflected light, which carries information contained on the target, is collected by an internal non-imaging light collector and is processed by signal processing electronics. All components are integrated into a thin low mass module small enough to fit in a pen. Communication from the device is achievable by a cable or by wireless means.

To provide to a resin composition for an optical packaging material having a coefficient of thermal expansion approximately same as that of quartz and Pyrex (registered trade name) and capable of providing an optical packaging material exhibiting excellent flame retardancy and an optical packaging component, and an optical module and its production method. A molded body, an optical packaging component and an optical module having a low coefficient of thermal expansion and excellent flame retardancy can be obtained using a resin composition for an optical packaging material comprising a resin and inorganic fine particles which are made of a hydrolyzed condensate compound of an alkoxide compound and/or a carboxylic acid salt compound and have an average radius of gyration of 50 nm or smaller.

A method for aligning at least two photonic components over an interposer, and an optical package that may align such components. The method may include providing an interposer; fabricating electrical conductors passing from one surface of the interposer to an opposite surface of the interposer at selected contact positions; soldering the photonic components over the selected contact positions on the first surface, while allowing solder self-alignment. Other embodiments are described and claimed.

The invention discloses an optical package, a method of manufacturing the same, a backlight, and a liquid crystal display. The optical package includes one or two or more film-like or sheet-like optical elements, a plate-like support which supports the one or two or more optical elements, and a film-like or sheet-like packaging member which covers the one or two or more optical elements and the support. The one or two or more optical elements and the support form a stack, the stack and the packaging member are in close contact with each other, and the packaging member has a shrinkage property or a stretching property and contains voids and a filler disposed in the voids.

The invention relates to a parallel optical transceiver module used for broadband high-speed transmission. A signal input port of a gold-plated plugboard structure is formed at one end of a first printed circuit board, and a trans-impedance amplifier (TIA), a laser driving chip, a photoelectric detector (PD) array, a vertical cavity surface emitting laser (VCSEL) array and a spacer are arranged on the surface of a second printed circuit board. The front end of a fiber array is arranged in a fiber fixing component, and the fiber array is aligned to the PD array and the VCSEL array in a coupled mode. The fiber fixing component comprises a fiber orientation conversion piece bottom board, a covering board and fastening bolts, a V-shaped groove is carved in the surface of the fiber orientation conversion piece bottom board, bare fibers of the fiber array are placed in the V-shaped groove, the covering board covers the V-shaped groove, and holes matched with the fastening bolts are formed in the fiber orientation conversion piece bottom board, the spacer and the second printed circuit board. The parallel optical transceiver module used for broadband high-speed transmission achieves optical packaging with high coupling efficiency, and reduces stick-mounting accuracy of the photoelectric component arrays and technological difficulty of connection of the photoelectric components and the fibers.

The invention relates to the field of optical packaging, and provides a packaging structure of an optical receiving module. The packaging structure comprises a tube shell. The tube shell comprises a flat board. One end of the flat board is vertically connected with a connecting board. The connecting board is provided with a circular adapter locating hole. One surface, which is far from the flat board, of the connecting board is provided with an annular welding boss around the adapter locating hole. The flat board is provided with an optical demultiplexing locating recessed trough, supporting bosses and a flexible circuit board locating recessed trough, wherein the optical demultiplexing locating recessed trough, the supporting bosses and the flexible circuit board locating recessed trough are successively arranged in a direction of separating from the connecting board. The sidewall of the optical demultiplexing locating recessed trough is provided with a projected alignment boss. Two supporting bosses are arranged. The packaging structure of the optical receiving module is a multi-component assembly which is machined through a precise machinery. According to the packaging structure and the packaging method, corresponding optical packaging can be finished through one-time multichannel light beam quality analysis and one-time active optical coupling alignment process, thereby greatly simplifying an optical coupling alignment process.

The invention relates to an organic silicon modified epoxy resin optical packaging material composition. The organic silicon modified epoxy resin optical packaging material composition is prepared from the following raw materials in parts by weight: 20 to 30 parts of organic silicon modified epoxy resin A, 30 to 40 parts of organic silicon modified epoxy resin B, 0.01 to 0.04 part of an antioxidant, 50 to 70 parts of organic silicon modified acid anhydride and 0.01 to 0.06 part of a curing accelerator. The epoxy resin optical packaging material can be used for improving the problems of UV (Ultraviolet) resistance, high-temperature yellowing and the like very well, and can meet white-light, blue-light LED (Light Emitting Diode) package and outdoor RGB (Red, Green and Blue) package.

The invention relates to an array element of a beam splitting lens. The array element comprises a body, wherein a critical angle formed when incident light with the wavelength of 850nm enters the body to perform total reflection is smaller than 45 degrees. A first lateral surface is provided with a micro lens array A and a micro lens array C, a second lateral surface is provided with a micro lens array B, a third lateral surface is provided with two grooves recessed inwards, and the bottoms surfaces of the grooves are inclined surfaces. A first optical interface and a second optical interface are formed respectively, a 45-degree included angle is formed by the first optical interface and the first lateral surface, a 45-degree included angle is formed by the second optical interface and the first lateral surface, and the first optical interface is perpendicular to the second optical interface. After light penetrating through the micro lens array A is totally reflected by the first optical interface, one part of light enters the micro lens array C after being totally reflected by the second optical interface, the other part of light directly enters the micro lens array B, and the light entering the micro lens array C is used for monitoring backlight. A backlight monitoring function of QSFP and optical packaging can be achieved by means of the array element of the beam splitting lens. The array element of the beam splitting lens is simple in structure and low in cost.

The invention discloses sulphur-containing optical epoxy resin and a preparation method thereof. The method comprises the following steps of: taking 2,5-disulfydryl-1,3,4-DMTD and epoxy chloropropane as reaction raw materials; taking one or more of an alkaline solution, quaternary ammonium salt and triphenylphosphine as catalysts; taking aqueous solution or solid of one or more of sodium hydroxide, lithium hydroxide and potassium hydroxide as reaction raw materials in the second step; taking one or more of methylbenzene, dimethylbenzene, benzene, ethylbenzene, diethylbenzene, carbon tetrachloride, methyl isobutyl ketone and methyl ethyl ketone as solvents; and finally, drying in vacuum at room temperature or under the ultra-low temperature condition to obtain dimercaptothiodiazole glycidyl ether epoxy resin. The prepared epoxy resin has the advantages of being high in epoxy value, low in viscosity, higher in refractive index, better in transparent property and the like. The epoxy resin can be applied to the fields, such as optical packaging, optical adhesive, optical part and the like.

An optical packaging assembly (10) for securing an optical fiber (12) to a heater substrate (30) in optical alignment with an opto-electronic device (14). The opto-electronic device (14) is secured to a device substrate (18) in the packaging assembly (10). The heater substrate (30) includes a conductive region (44), resistive elements (52) and a solder platform (42). The optical fiber (12) and a solder preform (32) are positioned on the solder platform (42). A voltage potential is applied to the conductive region (44) to heat the resistive elements (52) to cause the solder preform (32) to melt and secure the optical fiber (12) to the heater substrate (30) in alignment with the opto-electronic device (14). The resistive elements (52) are symmetrically disposed around the solder platform (42) to minimize translational and rotational shifts of the optical fiber (12) to primarily one translational axis of motion when the solder preform (32) cools.

The invention provides high-refractive-index transparent silica gel. The high-refractive-index transparent silica gel comprises a component A and a component B in a mass ratio of (0.8-1.2): 1, whereinthe component A comprises the following components in parts by weight: 1-100 parts of phenyl vinyl-terminated silicone oil; 1-100 parts by weight of phenyl terminal side chain vinyl silicone oil; and0.01 to 0.3 part by weight of a platinum catalyst; the component B comprises the following components in parts by weight: 1-100 parts of phenyl vinyl-terminated silicone oil; 1-100 parts by weight ofphenyl terminal side chain vinyl silicone oil; 1-60 parts by weight of a biphenyl hydrogen-containing chain extender; 0-5 parts by weight of a phenyl hydrogen-containing cross-linking agent; 0.2-10 parts by weight of a phenyl tackifier; 0-0.4 part by weight of an inhibitor; the phenyl vinyl-terminated silicone oil has a general formula as shown in formula (I), and the phenyl terminal side chain vinyl silicone oil has a general formula shown in formula (II). The high-refractive-index transparent silica gel provided by the invention adopts specific content components to realize better interaction, so that the product refractive index is high, and meanwhile, high refractive index and high temperature stability are achieved, good adhesion performance on various base materials is achieved, andthe high-refractive-index transparent silica gel is suitable for optical packaging and potting in various occasions.

The invention discloses a crosslinkable durable scratch-resistant organic silicon master batch and a preparation method thereof. The crosslinkable durable scratch-resistant organic silicon master batch is prepared from the following components: 20 to 77.5 percent of a low-melting-point polyolefin resin, 20 to 77.5 percent of vinyl polysiloxane, 2 to 8 percent of an initiator and 0.1 to 2 percent of a stabilizer. The preparation method comprises the following steps: banburying the raw materials at 60-120 DEG C, and then extruding and granulating by utilizing a double-screw extruder to obtain the durable scratch-resistant organic silicon master batch. The master batch prepared by the invention contains linear vinyl polysiloxane with high molecular weight and a peroxide initiator. In the useprocess, the peroxide initiator is decomposed to generate free radicals, and the polysiloxane with the linear structure is converted into polysiloxane with a cross-linked network structure, so that the polysiloxane is stably anchored in the composite material, and the composite material is endowed with durable and stable scratch resistance. The organic silicon master batch prepared by the method is stable in property, and is particularly suitable for the application fields with high requirements on the surface quality of materials, such as optics, packaging, automotive trim and architectural decoration.

An optical encapsulation assembly comprising a substrate (100), a light-sensing chip (200), and a protection portion; the protection portion and the light sensing chip (200) are fixed on the substrate(100); the light sensing chip (200) is packaged in the protection part, the plane of the light-sensing chip (200) intersects with the plate surface of the substrate (100), and the protection part comprises a light incoming area. The invention also discloses a mobile terminal. The scheme enables the mobile terminal to solve the problem that the screen occupancy of the mobile terminal is small.

The invention provides a light emitting diode applied to parallel light illumination. The light emitting diode comprises a light emitting diode chip, a heat sink and an optical packaging body. The lower surface of the light emitting diode chip contacts the heat sink, and the upper surface and four side surfaces are light emitting surfaces. The light emitting diode chip is coated by the optical packaging. Partial areas of the light emitting surfaces are covered by covering layers for inhibiting optical radiation. According to the light emitting diode, the partial areas of the light emitting surfaces of the light emitting diode chip are covered by the covering layers for inhibiting optical radiation, so the total radiation flux of the light emitting diode is inhibited and the unprocessed light emitting surface areas can obtain great radiant exitance. According to the light source, a divergence angle of parallel light is reduced, and the illumination design of the parallel light is optimized.

A resin composition for optical lenses and optical packaging includes (1) 1 to 99.99 wt % mixture of epoxy, siloxane and epoxy-siloxane copolymers, (2) 0.01 to 5 wt % catalyst and (3) 0 to 40 wt % curing agent. The mixture of epoxy, siloxane and epoxy-siloxane copolymers includes (1) 1 to 85 wt % epoxy and siloxane oligomers, based on total weight of the mixture; (2) 1 to 90 wt % siloxane containing at least one alkoxy group, based on total weight of the mixture; (3) 1 to 80 wt % a epoxy resin having a benzene ring with at least one epoxy group or a hydrogenated benzene ring, or aliphatic epoxy resin, based on total weight of the mixture; (4) 1 to 70 wt % epoxy resin containing at least one hydroxyl group and at least an epoxy group, based on total weight of the mixture.

An optical packing device used in the communication field comprising a cover member and a base which join tightly and form an accommodating space for holding the optical assembly, an opening is arranged on the cover member, a plurality of welding discs are arranged on the upper surface and the lower surface of the base, which are connected electrically by the printed circuit board formed on the base, and at least two welding discs on the lower surface connect each other. The optical packing device can be welded to the circuit board by the surface packing technology, the device is suitable for high density packing and high frequency operation and can facilitate the realization of the small scale packaging.

The invention relates to the technical field of optical communication, in particular to an optical packaging structure which comprises an input port, an output port and a photoelectric structure arranged in a laminated mode. The photoelectric structure comprises a first optical part and a first electrical part which are arranged on a first layer, a second optical part and a second electrical part which are arranged on a second layer, and a refraction component which is arranged between the first layer and the second layer. One part of the optical signal passes through the first optical part and then is subjected to photoelectric conversion at the first electrical part, and the other part of the optical signal passes through the refraction component and the second optical part in sequence and then is subjected to photoelectric conversion at the second electrical part. According to the invention, through the stacked photoelectric structure, the number of channels which can be packaged in the same space is increased, and the purpose of packaging more optical channels under the condition that the size of an optical device is basically unchanged is achieved.