Organic silicon modified epoxy resin optical packaging material composition

A technology of epoxy resin and encapsulation material, which is used in electrical components, circuits, semiconductor devices, etc.

Active Publication Date: 2017-05-31
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This epoxy resin encapsulation material can well improve UV resistance and high temperature ye

Method used

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  • Organic silicon modified epoxy resin optical packaging material composition
  • Organic silicon modified epoxy resin optical packaging material composition
  • Organic silicon modified epoxy resin optical packaging material composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] By weight, get organosilicon modified epoxy A (structural formula 1, wherein n=5) 200g, organosilicon modified epoxy resin B (structural formula 4, wherein a / b=0.7, R is structural formula 5) 300g, resist Add 0.2 g of oxidant (β-(3,5-di-tert-butyl-4-hydroxyphenyl) octadecyl propionate) into the stirring tank, raise the temperature to 60°C, stir for 1 hour, and then cool with cooling water To 20° C., add 500 g of silicone-modified anhydride (structural formula 7, where n=1), 0.2 g of curing accelerator (triphenylphosphine), and stir evenly to obtain an epoxy resin mixture for optical encapsulation.

Embodiment 2

[0022] By weight, get organosilicon modified epoxy A (structural formula 2, wherein n=8) 300g, organosilicon modified epoxy resin B (structural formula 4, wherein a / b=1.5, R is structural formula 6) 350g, resist Add 0.4g of oxidizing agent (β-(3,5-di-tert-butyl-4-hydroxyphenyl) octadecyl propionate) into the stirring tank, raise the temperature to 60°C, stir for 1 hour, then pass cooling water to cool To 20° C., add 500 g of silicone-modified anhydride (structural formula 7, where n=10), 0.3 g of curing accelerator (triphenylphosphine), and stir evenly to obtain an epoxy resin mixture for optical encapsulation.

Embodiment 3

[0024] By weight, get organosilicon modified epoxy A (structural formula 3, wherein n=10) 250g, organosilicon modified epoxy resin B (structural formula 4, wherein a / b=1.2, R is structural formula 5) 400g, resist Oxidant (butyryl toluate) 0.2g, put into the stirring tank, heat up to 60°C, stir for 1 hour, cool to 20°C with cooling water, add 700g of organosilicon-modified acid anhydride (structural formula 7, wherein n=15 ), 0.4 g of a curing accelerator (triphenylphosphine), and stir evenly to obtain an epoxy resin mixture for optical encapsulation.

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PUM

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Abstract

The invention relates to an organic silicon modified epoxy resin optical packaging material composition. The organic silicon modified epoxy resin optical packaging material composition is prepared from the following raw materials in parts by weight: 20 to 30 parts of organic silicon modified epoxy resin A, 30 to 40 parts of organic silicon modified epoxy resin B, 0.01 to 0.04 part of an antioxidant, 50 to 70 parts of organic silicon modified acid anhydride and 0.01 to 0.06 part of a curing accelerator. The epoxy resin optical packaging material can be used for improving the problems of UV (Ultraviolet) resistance, high-temperature yellowing and the like very well, and can meet white-light, blue-light LED (Light Emitting Diode) package and outdoor RGB (Red, Green and Blue) package.

Description

technical field [0001] The invention relates to a packaging material applied to LEDs, in particular to an organic silicon modified epoxy resin optical packaging material and a preparation method thereof. Background technique [0002] Epoxy packaging materials are widely used in the packaging of optical materials due to their excellent mechanical properties, electrical properties, adhesive properties and good airtightness, which can effectively prevent the blackening of the silver plating layer. Aspects (UV resistance) are slightly insufficient, and there are problems such as easy yellowing during use, which affects the service life. Contents of the invention [0003] The present invention uses 20-30 parts of organosilicon-modified epoxy resin A, 30-40 parts of organosilicon-modified epoxy resin B, 0.01-0.06 parts of antioxidant, and 50-70 parts of organosilicon-modified anhydride as raw materials. Then use raw materials containing benzene rings, which have been proven to ...

Claims

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Application Information

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IPC IPC(8): C08L83/06C08L63/00C08K5/5435C08K5/134C08G59/42H01L33/56
Inventor 徐庆锟陈维
Owner YANTAI DARBOND TECH
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