369results about How to "Implement encapsulation" patented technology

The invention discloses packaging equipment for a micro atomic gas chamber and a process technology method thereof. The equipment comprises a sample chamber, a pressure bar, a sample wafer, a sample stage, a heating wire, a temperature measurement probe, a vacuum pump connector, an inflation inlet, a direct-current high-voltage power supply, a voltmeter, a resistor, and other measurement and control devices. The method comprises: step 1, the selection of materials; step 2, the processing of the materials; step 3, the washing of the sample wafer; step 4, the bonding of a first surface; step 5, the bonding of a second surface; and step 6, the detection of a sample, and is a method which closes metal rubidium generated by adopting an in-situ chemical reaction method in a micro gas chamber. The method has the advantages that the special equipment is a common high vacuum system which is based on an anode bonding technology principle and adopts a relatively cheap mechanical pump, namely molecular pump air-bleed set; at the same time, inert gas is used to take measures such as the repeated inflation to the vacuum system to clean, the high temperature baking to the local sample wafer to remove gas and so on, to lighten the influence of residual gas and adsorbed gas as far as possible, particularly lighten the oxidation of rubidium.

The invention discloses an embedded fan-out type silicon pinboard applied to three-dimensional system-level packaging. The front side of a silicon substrate is provided with a concave cavity whose side wall has certain gradient, the reverse side is provided with a vertical interconnection structure extending to the bottom of the concave cavity, and the vertical interconnection structure includes a plurality of mutually independent conductive columns; the front side of the silicon substrate and the side wall and the bottom of the concave cavity are provided with first metal interconnection layers used for being connected with a microelectronic chip bonding pad placed in the concave cavity and manufacturing a front side leading-out end; and the reverse side of the silicon substrate is provided with a second metal interconnection layer to be used for manufacturing a reverse side leading-out end, the first metal interconnection layers and the second metal interconnection layer are insulated from the silicon substrate, and the conductive columns are electrically connected with the first metal interconnection layers and the second metal interconnection layer. The invention also discloses a manufacturing method of the embedded fan-out type silicon pinboard and application to packaging, by use of the concave cavity combined with the vertical interconnection structure, application to three-dimensional system packaging is further realized on the basis of meeting requirements of high density, small size and low cost, thereby improving product performance.

The invention relates to a network block device storage system and method for a virtual machine. The method includes the steps that responses to execution conducted by users to application programs are made and a virtual machine operation system calls a virtual disk interface to send virtual disk reading and writing requests; the virtual disk interface transmits the reading and writing requests to a virtual block device drive unit; the virtual block device drive unit dispatches the reading and writing requests according to the I/O request types; according to the dispatching sequence, the reading and writing requests are packaged into network messages and the network messages are sent to a server through a storage communication protocol; the server receives the network messages sent by the multiple users, wherein the network messages carry IP addresses distributed to the users; parameters in the network messages are extracted and according to the extracted parameters, corresponding VSI serial numbers are searched for; through a file system and the corresponding VSI serial numbers, reading or writing operation is conducted on a corresponding region on a physical disk of the server. By the adoption of the network block device storage system and method for the virtual machine, packaging of intra-kernel services of the virtual machine is provided for the users and meanwhile network block device storage of the multiple users is supported.

The invention discloses a calcium alginate fiber and a preparation method thereof. The fiber is calcium alginate hydrogel with a porous structure, a rodlike structure or a rodlike and porous compound structure; the diameter of the fiber is 100-500mu m. According to the preparation method, on the basis of the action of hydrodynamics and by use of the chemical principle that sodium alginate reacts with calciumchloride to generate the calcium alginate hydrogel and the design of a microfluid device, sodium alginate solution and calciumchloride solution are mixed to generate gelation reaction; fibers with different structures and different sizes are generated by adjusting the flow velocity of internal-phase fluid. The preparation method disclosed by the invention has the advantages of simplicity, safety, lower cost and strong experimental repeatability; in the preparation process, a high-voltage electric field is not mentioned, so that the damage to cells is avoided and cell encapsulation can be realized. The prepared fiber structure has the advantages of uniformity, size controllability, good biocompatibility and broad application prospect; the prepared fiber structure can be directly applied to the fields of biomedicines such as cell culture and drug delivery.

The invention discloses a substrate integrated waveguide microwave tunable filter based on a liquid crystal material, wherein the substrate integrated waveguide microwave tunable filter belongs to the technical fields of wireless communication, satellite communication, radar system, etc. Particularly the invention relates to a filter based on the liquid crystal material. The filter settles a problem of liquid crystal material leakage in an existing packaging process. The filter settles a problem of impedance mismatch in manners of interlayer through hole interconnection and strip line stepped impedance transformation. A modulating voltage is added through direct contact type feeding. A bandpass filter is realized through etching an open resonance ring structure on an upper-surface metal layer of a substrate integrated waveguide. The upper-surface metal layer of the substrate integrated waveguide is reversed for contacting with the liquid crystal material, thereby forming the substrate integrated waveguide tunable filter based on the liquid crystal material. The substrate integrated waveguide microwave tunable filter settles the problem of liquid crystal leakage in a traditional packaging method and has effects of impedance matching and continuous adjustable frequency response of the filter.

The invention provides a manufacturing method of a flexible display device. In the manufacturing method, a water and oxygen barrier layer is directly arranged on a flexible polymer substrate, and then arranged on an organic light-emitting diode in a bonding manner, so that the film-forming compactness of the inorganic barrier layer can be improved, and accordingly the water vapor and oxygen permeation preventing capability of the water and oxygen barrier layer is improved, degradation and deterioration of various materials in the organic light-emitting diode are prevented and the service life of the flexible display device is prolonged; the manufacturing process of the organic light-emitting diode and the manufacturing process of the water and oxygen barrier layer are not required to be sequentially carried out, the water and oxygen barrier layers on a first flexible polymer substrate and a second flexible polymer substrate can be manufactured synchronously or manufactured on the same flexible polymer substrate, and a cutting process is performed as required, so that a production process can be simplified and purposes of improving the production efficiency and reducing the cost are achieved. The invention further provides the flexible display device manufactured by the manufacturing method. The flexible display device is relatively long in service life.

The invention provides an integration method and an integrated chip for a micro-electronic-mechanical-system device and an integrated circuit. The method comprises the following steps of: firstly, providing a first chip provided with a first electric connection point and the MEMS device, and a second chip provided with a second electric connection point and the integrated circuit; then, generating a first additional conductive point on the first electric connection point, and simultaneously generating a first package ring surrounding the MEMS device; generating a second additional conductive point on the second electric connection point, and simultaneously generating a second package ring on the second chip; finally, leading the first chip and the second chip in abutting joint, leading the first additional conductive point and the second additional conductive point to be fused in abutting joint to complete the electric connection of the MEMS device and the integrated circuit, simultaneously, leading the first package ring and the second package ring to be fused in abutting joint to package the MEMS device in the ring, thereby reducing the package cost, simultaneously shortening the electric connection route between the MEMS device and the integrated circuit, and effectively reducing stray capacitance and coupling inductance.

The invention provides a stable-switching ball screw type inerter device. The stable-switching ball screw type inerter device comprises a first mounting part, a second mounting part, a first cylinderbarrel, a second cylinder barrel, a screw nut, a screw, a flywheel A, a flywheel B, a one-way clutch A and a one-way clutch B and is characterized in that the screw is mounted between the first cylinder barrel and the second cylinder barrel in a penetrating manner, one end of the screw is rotatably mounted in the first cylinder barrel, and the other end of the screw penetrates the screw nut fixedly mounted on the second cylinder barrel and is coordinated with the screw; the first mounting part is mounted at the left end of the first cylinder barrel, and the second mounting part is fixedly mounted at the right end of the second cylinder barrel; when the motion direction of the nut instantly changes, only one of the two flywheels synchronously rotates along with the screw, flywheel impact, caused by rotation direction change, on the screw during switching is avoided effectively, stable switching is achieved, influence of nonlinear factors is small, and the performance of the inerter device is improved effectively.

The present invention discloses a quantum dot packaging body which comprises a first packaging medium which is optically transparent and at least two quantum dot glass bodies dispersed in the first packaging medium. Each quantum dot glass body comprises glass located at the outer layer, a second packaging medium which is optically transparent and located at the inner layer, and at least one type of quantum dots dispersed in the second packaging medium. The first packaging medium consists of high polymer materials. By packaging the packaging body quantum dots in the glass body with a certain volume, the fragile disadvantages of glass tubes are avoided, and at the same time, a relative high luminous efficiency is kept. The present invention also discloses a light-emitting device, a backlight module and a display device. The present invention also discloses a preparation method of the quantum dot packaging body.

Provided in an embodiment of the present invention are a method for sending a VxLAN packet, a computer device, and a computer readable medium for resolving a problem in which existing techniques are unable to forward VxLAN packets with network cards. The method for forwarding a VxLAN packet provided in the embodiment of the present invention comprises: after a network card has received a first packet, determining whether encapsulation information for performing VxLAN encapsulation on the first packet is saved in the network card; if so, performing the VxLAN encapsulation on the first packet, and sending the same; and if not, requesting the encapsulation information from a central processing unit, saving the same, and sending a packet obtained after performing the VxLAN encapsulation on the first packet. The invention enables a network card to perform the VxLAN encapsulation on a received packet and send the same.

The invention aims to provide an OLED device structure including a glass substrate arranged in a bottom layer. The OLED device structure is characterized in that an anode layer, a hole transport layer, an organic light emitting layer, an electron injection buffer layer, a cathode layer and an encapsulation thin film layer are arranged in turn on the glass substrate. In the invention, a print head is provided with multiple spray heads for simultaneous printing, three-dimensional models of an OLED device and a package film are pre-designed by a computer, scanning paths of the structure of each layer are positioned precisely on a heating substrate, and then the OLED device is printed, and a heating process is performed by a heating solidification device during printing. The method is simplified as compared with the traditional device printing method, and can be used to carry out the moulding and packaging of the device by one time. The method eliminates troubles of repeatedly filling materials, and reduces greatly working hours. The moulded device rotates 90 degrees as compared with a device traditionally printed layer upon layer, and the film package of the OLED device is realized.

The invention relates to the technical field of packaging box production, in particular to a device used for carton folding and packaging. The device comprises a mounting support, a conveying belt isarranged at the bottom of the mounting support, a carton is placed on the conveying belt, the side wall of the mounting support is fixedly connected with a pair of first electric cylinders, the ends of power rods of the first electric cylinders are connected with a movable plate, the movable plate is in contact with a cover plate on the carton, the top of the mounting support is fixedly connectedwith a second electric cylinder, the end of a power rod of the second electric cylinder is fixedly connected with a pressing plate, the side, away from the second electric cylinder, of the pressing plate is provided with a first roller and a second roller, the first roller and the second roller are connected with adhesive tape in a winding manner, strip through holes are evenly formed in the adhesive tape, and according to the device used for carton folding and packaging, a bonding strip can be automatically pasted on the middle gap. Carton packaging is achieved, compared with an existing manual adhesive tape bonding manner, the efficiency is higher, manual operation is not needed, the packaging cost is reduced, the adhesive tape is accurately aligned with the middle gap of the carton, andthe packaging quality is ensured.

The invention provides an automatic intelligent briefing generation method and discloses a method for automatically generating enterprise analysis reports by an information system. By the method, the capability that a user freely customizes a report as required is realized via free assembly of elements by fully using information services of the conventional service system of an enterprise. The generated time and the generated format of the report can be appointed according to the requirement of the user, so the automatic system generation of the analysis reports of the enterprise is realized; and the working efficiency of enterprise analyzers is improved greatly, and a great amount of labor cost is saved.

The invention relates to a wafer-level chip size encapsulation technology for a GaAs (gallium arsenide) CCD (Charge Coupled Device) image sensor. The technology is characterized by comprising the following steps of: (1) firstly bonding a glass wafer and a GaAs wafer through a resin adhesive so as to protect the active surface of a chip and improve the strength of a chip wafer; (2) manufacturing a trapezoidal-slot structure by a wet corrosion or physical method so as to reduce the lining thickness of a chip interconnection area; (3) manufacturing vertical interconnected through holes by a dry etching technology so as to expose a pad on the active surface of the chip; (4) sputtering seed-layer metal and electroplating, and manufacturing a hole metalizing and RDL layer to realize circuit interconnection from the active surface to the back surface of the chip; (5) manufacturing a passivation layer, a UBM layer and raised points; and (6) finally scribing to form an independent encapsulation chip. As the trapezoidal-slot structure on the back realizes thickness reduction only in the area with the pad, the cost is effectively lowered; and through the interconnection of the vertical through holes, the encapsulation interconnection density can be improved, and the signal transmission path is shortened.

The invention discloses an HLA (Human Leukocyte Antigen)-based Adams simulation model integrated platform, to solve the defect in the prior art that an Adams simulation model is hard to be subjected to HLA integration. The HLA-based Adams simulation model integrated platform comprises a simulation model unit, an adaptor unit and an HLA system, wherein the simulation model unit comprises at least one Adams simulation module; the adaptor unit comprises a user defined module, a shared memory space module and a main body module; and the user defined module comprises an input sub-module and an output sub-module. The invention discloses an HLA-based Adams simulation model integrated method. With the adoption of the HLA-based Adams simulation model integrated method, the advantages of a commercial simulation software solver are maintained, the packaging of an Adams model is realized under the condition that the simulation model needs not to be modified or is slightly configured, and the reusability of the Adams model is greatly improved.

The invention relates to a method for packaging a multi-laminated multi-chip on a flexible circuit board by adopting FUTCP (Flexible Ultra-thin Three-dimensional Chip Package) and a packaging chipset. Two packaging chips are bound on a middle-layer (bottom) flexible circuit terminal, two packaging chips which are bound on the same symmetrical position of an upper-layer (top) flexible circuit terminal are mutually connected through ACAF (Anisotropic Conductive Adhesives and Films), the chips are stacked, mutually connected and packaged by using NCP (Non-conductive paste), and a chip stacking assembly is packaged by adopting a high-frequency LCP (Liquid Crystal Polymer) chip to bond the multilayer chip and simultaneously solidified; the edge bend of each packaging chip which is connected with the upper-layer (top) flexible circuit is connected with the two middle-layer (bottom) packaging chips in the packaging process so as to form a stacking layer, and the four chips are packaged on the flexible circuit board.

Provided are a semiconductor package capable of miniaturization by connecting semiconductor elements without using wire bonding, and a semiconductor module including the semiconductor package. It has: an IGBT element (20), which has an emitter electrode (22), a gate electrode (23), and an emitter electrode on the surface (21a), and has a collector electrode (26) on the back surface (21b); the first electrode plate ( 30), set opposite to the surface (21a) of the IGBT element (20), having a protrusion connected to the emitter (22) by soldering; the second electrode plate (40), and the back surface of the IGBT element (20) (21b) oppositely disposed, having an opposite surface (41b) connected to the collector (26) by brazing; an insulating substrate (50), disposed between the first electrode plate (30) and the IGBT element (20) , with a connection pad connected to the gate electrode (23) and the radiation sensing electrode by soldering.