33results about How to "Implement encapsulation" patented technology

According to the chitosan-coated gamma-cyclodextrin metal organic framework delivery system and the preparation method and application thereof, hippophae rhamnoides polyphenol serving as an active component is efficiently loaded through a hydrophobic cavity of the chitosan-coated gamma-cyclodextrin metal organic framework delivery system, and encapsulation and release of the hippophae rhamnoides polyphenol can be achieved through the hydrophilic surface of the chitosan-coated gamma-cyclodextrin metal organic framework delivery system; chitosan is adopted as a protective layer to coat the cyclodextrin metal organic framework and the sea-buckthorn polyphenol, so that the carrier and the active components are prevented from being damaged by gastric acid and small intestine digestive enzymes, and the sea-buckthorn polyphenol can be accurately positioned to the colon part through the targeted positioning effect of the chitosan, so that the treatment on the colitis is realized, and the treatment effect is good. The invention provides a more effective and safer inflammation treatment means.

The invention discloses a cross-system communication method and device, and the method comprises the steps: obtaining first communication data, packaging the first communication data based on a first communication protocol of a first data packaging layer, and obtaining first communication protocol data; packaging the first communication protocol data based on a second communication protocol of a second data packaging layer to obtain second communication protocol data; transmitting the second communication protocol data to a data communication layer of the target communication system, so that a second communication protocol of a second data encapsulation layer of the target communication system de-encapsulates the second communication protocol data to obtain first format data consistent with the first communication protocol data; and decapsulating the first format data by using a first communication protocol of a first data encapsulation layer of the target communication system to obtain second communication data consistent with the first communication data. According to the invention, the difficulty of cross-system interaction and communication is reduced, and the development cost and maintenance difficulty of the vehicle-mounted system are reduced.

The invention discloses a satellite service telemetering analysis system and method based on data recombination, and belongs to the technical field of satellite communication, and the system comprises a disassembling module which is used for disassembling satellite service storage telemetering data of a VCDU data frame structure into complete BPDU data frames with different lengths according to a VCDU data frame structure configuration file; the disassembly comprises the following steps: circularly reading satellite-borne storage telemetry data according to the VCDU length of the satellite-borne storage telemetry data, and circularly inputting each BPDU data field according to a configuration file; and the telemetering frame framing module is used for extracting and recombining the telemetering packets in each BPDU data field according to the telemetering frame structured configuration file and the length of the telemetering packets, packaging the telemetering packets into telemetering frames, and sending the telemetering frames to a ground processing system which needs to process satellite-borne storage telemetering data. According to the method, satellite service storage telemetering downloaded at a high speed is recombined and packaged into a low-speed telemetering frame format in a data recombination mode and is sent to a ground processing system, a channel for entering a ground system of satellite service telemetering downloaded at a high speed is opened, and analysis on high-speed telemetering data by using an existing low-speed system is realized.

The invention provides a wafer-level packaging method adopting a glass cover plate and a wafer-level packaging structure, and relates to the technical field of semiconductor packaging. The packaging method comprises the following steps: providing an assembly of a carrier plate and a glass cover plate layer; a first groove and a second groove are formed in the side, away from the carrier plate, of the glass cover plate layer. A wafer having a plurality of chips is provided. Cutting channels are formed between the adjacent chips; each chip comprises a functional area and a metal interconnection layer. Bonding glue is formed on the glass cover plate layer and / or the chip, so that the glass cover plate layer covers the wafer through the bonding glue; wherein the functional area is located in the first groove; the cutting channel is located in the second groove; the bonding glue is located between the first groove and the second groove and covers part of the metal interconnection layer. Removing the carrier plate; conductive layers are formed on the side wall of the second groove of the glass cover plate layer and the surface of the side, away from the wafer, of the glass cover plate layer, and the conductive layers are electrically connected with the metal interconnection layer. The packaging process is simplified, and the packaging efficiency and the packaging reliability can be improved.

The utility model discloses PCBA board packaging equipment which comprises a workbench, a servo motor is installed in the middle of the lower portion of the workbench, the output end of the servo motor is connected with a rotating disc arranged on the workbench, and a plurality of containing grooves are formed in the rotating disc. Two vertical plates are installed on the workbench, a supporting plate is installed on the two vertical plates, a servo electric cylinder is installed in the middle of the upper portion of the supporting plate, the output end of the servo electric cylinder is connected with a connecting plate, lifting cylinders are arranged on the two sides of the bottom of the connecting plate respectively, and lifting rods are installed in the lifting cylinders through first bolts. And the bottoms of the lifting rods are connected with splayed mounting pieces, and the interiors of the two splayed mounting pieces are each provided with a glue injection head and an air exhaust cover through second bolts. According to the utility model, the servo motor drives the turntable to rotate, so that continuous packaging is realized; stable glue injection and bubble extraction can be realized, and the packaging efficiency and effect are improved.

The invention relates to the field of log monitoring and financial science and technology, and discloses a log unification method, device, equipment and medium based on framework encapsulation, and the method comprises the steps: initializing a log factory, and initializing a financial log object according to the log factory; performing log format packaging on the financial log object to obtain a packaged financial log; performing exception capture and exception information encapsulation on the encapsulated financial log to obtain a captured exception log; performing interface parameter unification on the captured abnormal log to obtain a unified financial log; performing link tracking on the unified financial log to obtain a tracked financial log; and performing log desensitization and super-long log control on the tracking financial log to obtain a standard output log. According to the invention, the efficiency of unifying the micro-service logs of the financial payment system can be improved.

The present invention discloses a parallel seam welding electrode structure with adjustable spacing, which is used to adjust the spacing to achieve the packaging of tube shells of different sizes, and includes a first adjustment device and a second adjustment device, the first adjustment device and the second adjustment device are arranged relatively, and the first adjustment device and the second adjustment device both include an electrode bracket, a sliding electrode seat, an electrode shaft and a roller electrode. The present invention discloses a parallel seam welding electrode structure with adjustable spacing, which is provided with a sliding sliding electrode seat, and the scale on the sliding electrode seat is adjusted to align with the scale indicator mark on the electrode bracket according to the spacing of the roller electrode required by the size of the packaged product, and then the sliding electrode seat is fixed to the electrode bracket with a fixing screw. Each time a product is replaced, it is only necessary to adjust the position of the electrode seat according to the product size.

The invention relates to the technical field of data stream acceleration, and discloses a method and system for realizing data stream acceleration based on an NAT acceleration engine, and the method comprises the steps: deploying a VPN module in a network environment, and building a VPN transmission tunnel of the VPN module based on a preset VPN protocol. And obtaining the target data stream, encapsulating the data packet, and encrypting the encapsulated data packet. And monitoring the network flow, obtaining the encrypted data packet, and analyzing the header information of the obtained data packet. And according to the header information, determining whether the data packet is in an encrypted state, and if the data packet is in the encrypted state, performing special identification. And obtaining a preset routing table, and determining the next hop of the identified data packet according to the preset routing table. And acquiring real-time performance data of the network link when the data packet is forwarded, and adjusting a processing strategy of the data stream according to the real-time performance data. According to the method, the network performance is optimized by monitoring and analyzing the encrypted data packet in real time and dynamically adjusting the data stream processing strategy.

The invention relates to the technical field of couplers, and provides a coupling assembly, a preparation method and a coupler comprising the coupling assembly, the coupler comprises a first grounding plate, the coupling assembly and a second grounding plate which are sequentially stacked, a connector communicated with an inner conductor of the coupler is arranged on the outer wall of the coupling assembly, and the coupling assembly comprises a shell. A through groove body is arranged in the shell, a coupler inner conductor is arranged in the groove body, the coupler inner conductor comprises a straight-through inner conductor and a coupling inner conductor, and a plurality of through holes are formed in the side wall of the shell along the path where the straight-through inner conductor and the coupling inner conductor are located. In the preparation process of the coupling assembly, the positions of the coupling inner conductor, the straight-through inner conductor and the shell are always kept integrated, the assembly precision is improved, and the assembly difficulty is reduced.

The packaging box comprises a bottom plate and a cover body structure arranged on the bottom plate, one end of the bottom plate is rotationally connected with a front folding plate, the other end of the bottom plate is rotationally connected with a rear folding plate, the front folding plate is rotationally connected with a first top plate, the rear folding plate is rotationally connected with a second top plate, and the second top plate is rotationally connected with a second top plate. A first clamping structure used for clamping the first top plate and the second top plate together is arranged between the first top plate and the second top plate, and a containing cavity used for containing tea cakes is defined by the bottom plate, the front folding plate, the rear folding plate, the first top plate and the second top plate. The bottom plate, the front folding plate, the rear folding plate, the first top plate and the second top plate which are formed by single paper define the containing cavity used for containing the tea cakes, on the premise that the tea cakes are packaged, compared with the prior art, the processing steps are reduced, and therefore the effect of reducing the production cost is achieved.

The invention discloses a hydrogel for skin surface antibacterial and a preparation method thereof, belonging to the field of antibacterial gel. The present invention first modifies 6-amino-β-cyclodextrin to obtain acryloyl cyclodextrin (Ac-βCD); then adamantane is grafted onto hyaluronic acid to obtain adamantane-hyaluronic acid (Ad-HA); acrylyl cyclodextrin (Ac-βCD) is dispersed in water to obtain aqueous solution I; adamantane-hyaluronic acid (Ad-HA), an antibacterial agent, a moisturizer and a photoinitiator are dispersed in water to obtain aqueous solution II; aqueous solution I and aqueous solution II are mixed, left to stand, and ultraviolet irradiation is performed to obtain a hydrogel for skin surface antibacterial. The hydrogel for skin surface antibacterial in the present invention can be directly applied to the skin surface and kept moist for a long time, and its antibacterial rate for Gram-negative bacteria and Gram-positive bacteria reaches more than 99%, effectively inhibiting bacterial growth and protecting human health.

The application relates to a MOS structure for automobile starting, a manufacturing method and an automobile starting system, which comprises a base island, a first MOS tube and a second MOS tube arranged on the base island, and a plastic sealing body for sealing the base island, the first MOS tube and the second MOS tube, the gate of the first MOS tube is connected with the gate of the second MOS tube, and the drain of the first MOS tube is connected with the drain of the second MOS tube. The application has the effects of saving space, reducing cost and reducing internal resistance.

This utility model discloses an embedded torque-speed sensor, comprising a base shell and a cover, the cover being fixedly connected to the base shell by a fixing bolt, and a speed measuring component disposed at the outer end of the base shell and the cover, the speed measuring component calculating speed data through the principle of magneto-electric induction; it also includes a torque measuring component disposed within the base shell, the torque measuring component calculating torque data through a Wheatstone bridge circuit, a rotating rod inserted into the base shell, and a rotor being clamped in the middle of the rotating rod. This utility model belongs to the field of sensor technology, specifically an embedded torque-speed sensor.

The utility model discloses a kind of tantalum capacitor shell packaging structures of accurate positioning, it is related to tantalum capacitor shell packaging technical field, including workbench, positioning adjusting assembly and automatic positioning assembly, the upper side of workbench is provided with feeding belt, and the upper front side of workbench is welded with fixed plate, the both sides of the fixed plate are respectively equipped with servo motor and positioning adjusting assembly.The tantalum capacitor shell packaging structure of accurate positioning, the rotation of rotating frame is facilitated by servo motor and its output shaft, so as to facilitate automatic positioning assembly to be turned to upside or back side when tantalum capacitor shell feeding, avoid the normal feeding of tantalum capacitor shell to be shielded by positioning side plate, positioning adjusting assembly is convenient for adjusting the movement of positioning side plate, two push plates can retract and push the movement of tantalum capacitor shell, so as to push tantalum capacitor shell to push plate and resist plate between realization the multi-face positioning of tantalum capacitor shell, avoid the situation of positioning inclination.

The invention discloses a 3DVC welding method, a 3DVC and a radiator. The 3DVC welding method comprises the following steps that S1, a to-be-welded 3DVC is placed in a closed vacuumizing chamber to be vacuumized, the vacuum degree reaches 5 * 10 <-1 > Torr through first-time vacuumizing, and the vacuum degree reaches 9 * 10 <-2 > Torr through second-time vacuumizing; and S2, the 3DVC to be welded is placed in a brazing furnace to be welded, protective gas is injected into the brazing furnace, and the protective gas is pure nitrogen or hydrogen-nitrogen mixed gas. According to the preparation method, the 3DVC radiator is obtained, the long-term reliability of 3DVC is improved, the problems of chemical corrosion, oxidation and creep deformation of traditional welding flux under high heat load are solved by adopting novel anti-corrosion welding flux, and stable performance of a product under harsh working conditions (such as 85 DEG C / 85% RH and 1000 h aging) is ensured.

The invention discloses a catalytic cracking catalyst with high thermal wear resistance and a preparation method thereof, the catalytic cracking catalyst comprises the following raw materials: a zeolite molecular sieve, a matrix and a binder, the matrix is composed of a gamma-alumina precursor with a peptizing index less than or equal to 50% and clay, the binder comprises a phosphorus-containing compound, an aluminum-containing compound and a binder modifier; the binder modifier comprises a polymeshed chelating ligand, a metal center ligand, alcohol and organic acid, and the metal center ligand contains at least two metal ions; the catalytic cracking catalyst is prepared in a high shear emulsifier. Compared with the existing catalytic cracking catalyst, the catalytic cracking catalyst containing phosphorus and zeolite provided by the invention has the advantages of higher abrasive resistance, large pore volume, high molecular sieve content, high solid content and excellent reaction performance.

The invention provides a chip packaging structure, a preparation method and an electronic device. The chip packaging structure comprises a first interconnection unit, a glass core plate unit, a second interconnection unit and a chip unit which are sequentially stacked. Wherein the lead in the first interconnection unit and the lead in the second interconnection unit are connected through the glass core plate unit, the chip unit comprises at least one chip, and the pin side of the chip faces the second interconnection unit and is electrically connected with the second interconnection unit. The chip packaging structure further comprises packaging units, the packaging units are at least located on the periphery of the chip, the packaging units are further located on the side wall of the glass core plate unit and the side wall of the first interconnection unit, and the peripheral side of the second interconnection unit is exposed relative to the packaging units. Thus, through the above structure, effective packaging of the glass core plate unit is realized, and the stability of the chip packaging structure is enhanced.

A semiconductor package includes a first die and a second die that transmit and / or receive signals to each other. The semiconductor package includes: a package substrate; at least one first die on and connected to the package substrate, with an interposer between the at least one first die and the package substrate; and at least one second die on and connected to the package substrate. Each of the first die and the second die includes a transmitter and a receiver each including a data channel, and a number of data channels of the transmitter and / or receiver of the first die is different from a number of data channels of the transmitter and / or receiver of the second die.

The utility model relates to the field of chip packaging, in particular to a short-wave infrared detector, which comprises a ceramic tube shell, an optical window, a tube shell metal ring, a short-wave infrared chip and a refrigerator, the tube shell metal ring is arranged at the opening of the cavity of the ceramic tube shell to increase the height of the cavity; the optical window covers the opening of the cavity, and forms a closed working cavity with the ceramic tube shell and the tube shell metal ring; the refrigerator is arranged at the bottom of the closed working cavity, and the short wave infrared chip is arranged in the closed working cavity and located at the top of the refrigerator. According to the utility model, the ceramic tube shell with smaller insulator spacing is used, and a section of tube shell metal ring is additionally arranged at the opening of the cavity of the ceramic tube shell, so that the height of the cavity is increased, the packaging of a stacked structure formed by the short-wave infrared chip and the refrigerator is realized, the problem of low yield is avoided, and the production efficiency is improved. And the universality of the short-wave infrared detector is improved.

The application provides an intelligent design method for electromechanical systems based on semantic modeling and association, aiming at the problems of fragmentation of existing electromechanical system design knowledge, low reuse efficiency and poor cross-professional collaboration, and constructs a five-tuple semantic template, wherein G is a geometric skeleton, P is a parameter set, C is a rule set, R is an inline relationship, and K is external knowledge; converts project design requirements into a requirement feature vector, matches and instantiates the semantic template; in the instantiation process, the rule set C is executed, the geometric skeleton G is automatically driven to generate a BIM model, the multi-professional collaboration is maintained through the inline relationship R, and the real equipment parameters are backfilled by using the external knowledge K. Then, a design scheme is derived according to the instantiated semantic template. The application realizes parameterization, automation and intelligent reuse of electromechanical system design, significantly improves design efficiency and quality consistency, ensures cross-professional design collaboration, and is suitable for rapid generation of various building electromechanical systems.

The present invention discloses an LED integrated lamp bead capable of simulating a standard light source and a spectrum adjustment adaptation method. The LED integrated lamp bead of the present invention comprises a substrate, an LED chip and a fluorescent adhesive layer. A PCB circuit is integrated on the substrate, and the PCB circuit is electrically connected to the LED chip. The LED chips are in multiple groups, and the multiple groups of LED chips are arranged in parallel. Each group of LED chips comprises multiple LED chips, and multiple LED chips in each group are arranged in series. The multiple groups of LED chips are evenly arranged on the substrate in a rectangular array and are welded and fixed to the substrate. The fluorescent adhesive layer covers the top of multiple LED chips and the substrate for spectrum adjustment and overall packaging. The LED integrated lamp bead has a reasonable design, a simple structure, and high operational flexibility. It can realize the fitting of multiple standard spectra, has good spectrum continuity, and a high matching degree. At the same time, the LED integrated lamp bead can also achieve the beneficial effects of energy saving and environmental protection, long service life, high energy efficiency, low cost, and adjustable brightness, and has a good market application prospect.

The present invention provides a motor for an electric toothbrush with dual bearing packaging, comprising a housing and a motor shaft, wherein the housing comprises a first shell and a second shell arranged relative to each other along the axial direction of the motor shaft, wherein the motor shaft is rotatably supported in the first shell by a first bearing and rotatably supported in the second shell by a second bearing; the first shell is provided with a first mounting groove, wherein the first bearing is accommodated in the first mounting groove; the second shell is provided with a second mounting groove, wherein the second bearing is accommodated in the second mounting groove; the first shell is pressed inwardly by the first bearing and the second shell is pressed inwardly by the second bearing, and the first shell and the second shell are clamped and connected. When assembling the motor shaft and the first shell, and the motor shaft and the second shell, it is only necessary to knock in the first bearing from the outside of the first shell and the second bearing from the outside of the second shell accordingly, so that the product packaging is realized and the bearings are installed in one riveting operation, thus saving the installation process and improving the assembly efficiency.

The invention discloses a hydrogel-based composite film integrating efficient phase change cooling, high thermal conductivity, electromagnetic shielding and leakage prevention and a preparation method of the hydrogel-based composite film. The thin film is of a double-layer composite structure, wherein the lower layer is a high-thermal-conductivity electromagnetic shielding layer composed of polyacrylamide (PAM) hydrogel, Si3N4 and electromagnetic shielding filler, and the upper layer is a phase-change leakage-proof layer composed of PAM hydrogel and polyethylene glycol (PEG); the upper layer and the lower layer form a stable integrated structure through the synergistic effect of interface hydrogen bonds and physical entanglement, and finally integration of thermal management and electromagnetic protection functions is achieved. The phase change latent heat of the prepared film is larger than or equal to 120 J / g, the X-band electromagnetic shielding effectiveness (SE) is larger than or equal to 32 dB, and leakage is avoided at the high temperature of 80 DEG C. The preparation process is simple, and the product can be applied to various scenes such as power chips, LED equipment and wearable electronic devices.

The utility model relates to the technical field of chemical production equipment, in particular to filling equipment for chemical production, which comprises a mounting frame and a stepping conveying structure for sequentially conveying tanks, a plurality of placing grooves for placing the tanks are arranged on the stepping conveying structure, telescopic spring plates are arranged in the placing grooves, vertical rods are fixedly connected onto the telescopic spring plates, and the vertical rods are fixedly connected onto the mounting frame. A pressing plate for pressing the telescopic spring plate, a filling structure for filling the tank body, a blocking structure for continuously blocking a tank opening after filling and a packaging structure for packaging the tank opening are sequentially arranged on the mounting frame in the tank body conveying direction; the sealing structure comprises a spring telescopic rod and a sealing plate, the spring telescopic rod is fixedly connected to the mounting frame, the sealing plate is fixedly connected to the spring telescopic rod, the sealing plate is provided with a sliding way for the vertical rod to slide, and the vertical rod is provided with a hook block which can hook the sealing plate and enable the sealing plate to continuously block a tank opening. And the environment and the body health of employees are influenced by volatile substances.

This utility model discloses a flexible LCD structure. The flexible substrate adopts a sandwich structure of a double-layer TAC thin film layer sandwiching a PVA polarizing film. By introducing the PVA polarizing film into the flexible substrate, the overall thickness of the flexible LCD structure is reduced to less than 0.25mm, thus reducing the thickness of the product. The nano-silver film is printed on the flexible substrate by relief printing, which does not require etching, reduces acid and alkali emissions, and has lower resistivity. The spacers are coated on the first PI layer by photolithography, so they will not move when bent. The spacing in the first region at the center is small, while the spacing in the second regions on both sides is large, which strengthens the bending support force in the center of the flexible LCD when bent. In the center region with high stress, the spacing distance is reduced and the density of the spacers 7 is increased, ensuring the uniformity of cell thickness under bending.

The invention provides a chip packaging structure and a preparation method of the chip packaging structure. The chip packaging structure comprises a glass core plate unit, a first interconnection unit and a second interconnection unit, the first interconnection unit and the second interconnection unit are located on the two opposite sides of the glass core plate unit, and a wire in the first interconnection unit and a wire in the second interconnection unit are connected through the glass core plate unit. The chip unit is located on the side, away from the glass core plate unit, of the first interconnection unit and comprises at least one chip, the chip comprises a pin side and a back side which are opposite to each other, and the pin side of the chip faces the first interconnection unit and is electrically connected with the first interconnection unit. The packaging unit is at least located on the periphery of the chip, the side wall of the glass core plate unit, the side wall of the first interconnection unit and the side wall of the second interconnection unit. Therefore, through the above structure, the packaging of the glass core plate unit is realized, and the stability and reliability of the chip packaging structure are improved.

The tool for cutting and packaging the membrane filaments comprises a frame, a hanging rod assembly and a supporting rod, the hanging rod assembly comprises a hanging rod and a membrane filament hook, the hanging rod is detachably and fixedly arranged on the frame, the membrane filament hook is arranged on the hanging rod and used for hanging the membrane filaments, the supporting rod is detachably and fixedly connected to the frame, and the supporting rod is fixedly connected to the frame. The supporting rod is located below the hanging rod. According to the utility model, a plurality of membrane filaments are bundled into a bundle, one ends of the membrane filaments are bundled, the bundled ends are hung on the membrane filament hooks, the membrane filaments droop naturally, the membrane filaments are cut along the upper surface of the supporting rod, and the cut membrane filaments are flat and smooth, are convenient to tidy and do not have the phenomenon of mutual winding; after cutting is completed, the packaging box is placed on the supporting rod, and finally the membrane filaments are packaged in the packaging box.

The application discloses a graphite furnace head electrode assembling structure and process and relates to the technical field of electrode assembling, which comprises a single electrode, a clamping and connecting device, a regulating device, and a connecting device. The electrode screw rod drives the sliding block ball to slide to the front end of the electrode shell, the sliding block ball drives the internal compression of the cooling spring of the cooling assembly, the cooling spring drives the first cooling column and the second cooling column to slide to the front end of the electrode shell, and the first cooling column and the second cooling column drive the first cooling fin and the second cooling fin to slide to the front end of the electrode shell, so that the change of the heat dissipation part and the heat dissipation efficiency is realized. A synchronous wheel is manually driven to rotate at the rear end of the regulating base, one synchronous wheel drives the remaining seven synchronous wheels to rotate through a synchronous belt, the synchronous wheel drives the pressing assembly to rotate through the electrode rotating shaft and the electrode screw rod, the pressing assembly drives the linkage column and the push-pull rod to slide outward and extrude the annular hook outward, so that the annular hook is inserted into the semispherical groove, and the locking function between the single electrodes is realized.

The invention discloses a differential shielding method and system based on WebGIS, electronic equipment and a storage medium, and relates to the technical field of network geographic information systems, and the key points of the technical scheme are that the system comprises a request receiving module, an interface packaging module, a platform packaging module, a platform switching module and a seamless transition module; the request receiving module is used for receiving a WebGIS calling request sent by an external terminal; the interface packaging module is used for realizing packaging of a WebGIS protocol interface; the platform switching module is used for adaptively switching the WebGIS platform; the platform packaging module is used for packaging a plurality of WebGIS platforms; and the seamless transition module is used for seamless and non-perceptual WebGIS platform switching. According to the method, a modular and plug-in design mode is adopted, a flexible and extensible architecture system is constructed, meanwhile, by adopting a scene state snapshot and preloading technology and utilizing a cache machine, the repeated loading time is shortened, the switching efficiency is improved, and a user can be helped to complete smooth transition of the engine unconsciously.

The utility model relates to the technical field of light-operated sensors, in particular to an integrated transmission type light-operated sensor, which comprises a plastic outer box capable of transmitting infrared light, a bottom plate of the plastic outer box is provided with a pair of through holes, and a pair of detection outer boxes capable of transmitting infrared light are respectively and integrally formed in the pair of through holes. According to the integrated transmission type light-operated sensor, the metal support is adopted to replace a traditional PCB, automatic insertion and welding of the infrared emitting unit and the infrared receiving unit are achieved, and the production efficiency is effectively improved; through the structural design that the infrared emitting unit and the infrared receiving unit are inserted into the sponge, epoxy resin packaging is achieved under the condition that infrared light transmission is not affected, dust is effectively prevented from entering, the service life of a product is greatly prolonged, and the dustproof and waterproof characteristics of the product are greatly improved.