OLED display panel encapsulation method and encapsulation structure

Abstract

The invention provides an OLED display panel encapsulation method and encapsulation structure. According to the OLED display panel encapsulation method provided by the invention, a film encapsulationlayer for water and oxygen barrier is independently fabricated with respect to an OLED substrate; a number of annular first grooves and a number of annular first protrusions are formed on the first inorganic barrier layer of the film encapsulation layer and the OLED substrate through photolithography; and a vacuum bonding method is used to bond the OLED substrate and the film encapsulation layer through meshing of a number of first protrusions and a number of first grooves and an adhesive layer, so as to realize the functions of film encapsulation and flexible display. The technical problem that the existing OLED film encapsulation process is complex is effectively solved. Particles, holes and other badness caused by a diaphragm plate and increased cost in the production process are prevented. Low membranous density caused by low temperature film formation and other technical problems are solved. The film encapsulation layer and the OLED substrate are manufactured independently, whichis beneficial to improving the product yield.

Description

technical field [0001] The invention relates to the field of flat panel display technology, in particular to a packaging method and a packaging structure of an OLED display panel. Background technique [0002] Organic Light-Emitting Diode (OLED) displays have the characteristics of self-illumination, high brightness, wide viewing angle, high contrast, flexibility, and low energy consumption. Has begun to gradually replace the traditional liquid crystal display. At present, the application of OLED display panels has become a high-end symbol from small-sized mobile phone display screens to large-sized high-resolution flat-panel TVs. [0003] Unlike traditional liquid crystal display technology, OLED display technology does not require a backlight, and uses very thin coatings of organic materials and glass substrates that emit light when an electric current passes through them. However, because organic materials are easy to react with water vapor or oxygen, as a display devic...

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Problems solved by technology

[0006] The object of the present invention is to provide a method for encapsulating OLED display panels, which can effectively solve the complex process existing in the existing OLED thin film encapsulation process, the defects of particles and holes caused by the use of mask plates in the production process, and the cost increase and low temperature. Technical problems such as low film quality and compactness caused by film formation

[0007] Another object of the present invention is to provide a packaging structure for OLED display panels, which can effectively solve the complex process existing in the existing OLED thin-film packaging process, the use of a mask plate in the production process to cause defects such as particles and holes, and increase the cost. , Technical problems such as low film quality and compactness caused by low temperature film formation

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