128results about How to "Improve thickness uniformity" patented technology

The invention relates to the technical field of copper plate strip rolling liquid, and provides environment-friendly copper plate strip rolling liquid which comprises the following components in percentage by mass: 40%-50% of base oil, 12%-18% of an additive, 5%-10% of triethanolamine, 0.05%-0.15% of graphene and the balance of water, the additives comprise a lubricant, an antioxidant, a corrosion inhibitor, an emulsifier and a bactericide, wherein the lubricant accounts for 2%-5%, the antioxidant accounts for 1%-2%, the corrosion inhibitor accounts for 0.5%-1.5%, the emulsifier accounts for 5%-10%, and the bactericide accounts for 2%-5%; the base oil comprises synthetic oil, vegetable oil and mineral oil, and the synthetic oil accounts for 20%-50%, the vegetable oil accounts for 15%-45% and the mineral oil accounts for 30%-60%. The rolling force and equipment energy consumption can be effectively reduced, the rolling speed stability is improved, the surface quality, hardness and thickness uniformity of the copper plate strip are remarkably improved, corrosion to equipment is lower, and the production quality and efficiency of the copper plate strip can be improved.

The invention provides a forming method and device for a high-torsion-degree blade, and belongs to the technical field of pipe machining. The forming method comprises the steps that firstly, a tubular blank is filled with low-melting-point metal to form a solid pipe, then the solid pipe is extruded into a preformed blade with cambered surfaces on the two sides through a preforming device, projections of all the cross sections of the preformed blade coincide in the longitudinal direction, and the preformed blade is formed. The method comprises the following steps: pre-forming a blade, respectively clamping two longitudinal ends of the pre-formed blade by adopting a torsion forming device, enabling the two longitudinal ends to relatively rotate so as to twist the blade, correcting the shape of the twisted blade by adopting a shape correcting device, and finally melting the low-melting-point metal to obtain the high-torsion-degree blade. Compared with an existing forming process, the overall deformation process only comprises extrusion, torsion and shape correction, the forming process is simplified, the machining efficiency can be improved, the low-melting-point metal and the tubular blank are compounded from the beginning, and the material buckling problem in the subsequent forming process is avoided.

The invention discloses a filter and a forming method thereof, and electronic equipment, and the method comprises the steps: carrying out the thinning of a passivation material layer in a target resonance region through first thinning processing after a piezoelectric laminated structure is provided, so as to enable the thickness of a passivation layer in the target resonance region to be smaller than the thickness of passivation layers in other resonance regions, therefore, the vibration frequency of the passivation layer of the target resonance area is faster than that of the passivation layer of other resonance areas, the frequency of the resonator of the target resonance area shifts rightwards, the target resonance area is used for forming the resonator with the highest vibration frequency, the bandwidth of the corresponding filter is increased, and the bandwidth of the filter is increased. The surface roughness of the passivation layer in the target resonance area is further reduced through the first thinning treatment, which means that the thickness uniformity of the passivation layer in the target resonance area is improved, so that the right side frequency of the filter bandwidth is modulated, the uniformity of the right side frequency of the filter bandwidth is improved, and the filter performance is improved. And during measurement, more frequency points fall within the range of specification requirements, so that the yield of the filter can be improved.

The invention relates to the technical field of energy storage capacitor dielectrics, and provides a high-entropy ceramic-polymer composite energy storage dielectric thin film material, a preparation method and application. The chemical composition of the material disclosed by the invention can be expressed as Sr0. 7Bi0. 2TiO3 (at) (Ba0. 25Ca0. 25La0. 25Na0. 25) TiO3 / PVDF, and is abbreviated as SBT (at) BCLNT / PVDF, the PVDF is polyvinylidene fluoride, the ratio of BCLNT to SBT is 9 wt%-18 wt%, and the ratio of SBT (at) BCLNT to PVDF is 3 wt%-12 wt%. The SBT coated BCLNT is subjected to high-entropy treatment to obtain the SBT coated BCLNT high-entropy ceramic filler with a'core-shell 'structure; and preparing the SBT-coated BCLNT / PVDF high-entropy ceramic-polymer composite energy storage dielectric film by taking the PVDF polymer as a base material and adopting a tape casting method.

The invention relates to the technical field of lubricants, in particular to a low-osmotic-pressure hyaluronic acid lubricant and a preparation method thereof. The low-osmotic-pressure hyaluronic acid lubricant disclosed by the invention is prepared from the following materials in parts by weight: 88.35 to 92.97 parts of purified water, 4 to 6 parts of modified polyvinyl alcohol, 2 to 5 parts of 1, 2-propylene glycol, 0.1 to 1 part of sodium hyaluronate, 0.01 to 0.1 part of aloe extract, 0.01 to 0.1 part of snail stock solution, 0.01 to 0.1 part of herba centellae extract, 0.05 to 0.06 part of phenoxyethanol, 0.45 to 0.55 part of ethylhexylglycerin and 0.01 to 0.03 part of lactic acid. The lubricant obtained by the preparation method disclosed by the invention can effectively improve the lubricating property and prolong the service life; by means of accurately controlling the dosage and proportion of each component, optimizing the preparation process and the like, multiple advantages of low osmotic pressure, moisturizing and lubrication, skin friendliness, stability, safety and the like are realized, the requirements of different crowds can be met, and comfortable use experience is provided.

The invention discloses a surface nickel plating process for quartz glass, and aims to improve the adhesive force, uniformity and functional performance of a nickel plating layer, simplify the process flow and meet the environmental protection requirement. The process comprises the following steps: firstly, cleaning and roughening the surface of quartz glass, removing surface impurities through a 2% sodium hydroxide solution and a 10% hydrofluoric acid solution, and forming a microscopic rough structure; then treating in a sensitizing solution composed of stannous chloride and hydrochloric acid to enable the surface to adsorb stannous ions; then treating in an activating solution composed of palladium chloride and hydrochloric acid to form a catalytic active layer; then carrying out nickel plating reaction in a chemical nickel plating solution with the temperature of 85 DEG C and the pH value of 4.5, wherein the thickness of a plating layer is 5-10 microns; and finally, the waste liquid is neutralized and flocculated to realize environment-friendly discharge. The process is simple and convenient to operate, and the generated nickel coating is uniform and compact, has excellent conductivity and corrosion resistance, and can be widely applied to the fields of electronics, optics and chemistry.

The invention relates to the technical field of semiconductor manufacturing, in particular to a pore sample with large depth, and provides a method for observing a bottom structure by preparing the pore sample through a focused ion beam (FIB). According to the method, by means of filling special resin for ion thinning into pores, introducing an improved back-cutting technology and the like, the problems of pore structure deformation and large damage of focused ion beams to the interiors of the pores during sample preparation in the prior art are solved; the method has the technical effects that the stability of the bottom structure of the pore sample can be improved, and damage to the pore structure in the thinning process is avoided.

The invention discloses a preparation method of an all-composite mast, which belongs to the technical field of ships and comprises the following steps: a, preparing a bottom flange; b, preparing a mast main body, and winding an inner skin on the mast main body; c, the bottom flange is assembled to the mast body, and the inner skin is pre-cured; d, the boundary dimension of the inner skin is machined, and the honeycomb core is bonded to the surface of the inner skin; e, stabilizing the honeycomb core, and winding an outer skin on the honeycomb core; f, carrying out integral curing treatment, and carrying out boundary dimension processing and finishing on the cured outer skin; and g, demolding. The bottom flange is prepared and formed by the composite material through the autoclave technology, the bottom flange is inserted into the mast body to be integrally formed, the bottom flange prepared through the technology is light in weight, high in strength, easy to machine and good in connecting performance with the mast body, the strength and stability of the connecting part are improved, and the number and complexity of connecting pieces are reduced.

The invention discloses a full-automatic PTEE film stretching and sintering machine and a stretching and sintering method, and relates to the technical field of PTEE film stretching and sintering machines, the full-automatic PTEE film stretching and sintering machine comprises a sintering and heating bin, conveying pieces, a film to be stretched, a first assembly, a second assembly and a third assembly, the conveying pieces are symmetrically arranged in an inner cavity of the sintering and heating bin, and the film to be stretched is located in the middle of the conveying pieces; the first assembly and the second assembly are located on the same vertical plane, and through the design of the stabilizing pipe and the pushing piece, solution conveying work can be completed when the first assembly and the second assembly work; the problem that whether the conveying device and the stretching device are not flush or not and consequently the thin film is stressed unevenly can be ingeniously monitored indirectly through movement of the push piece in the stabilizing pipe; the design of one group of parts with multiple functions obviously reduces the complex maintenance work and cost caused by the increase of the parts; the overall operation efficiency of the equipment is improved, and the production continuity is guaranteed.

The invention discloses a solar cell vertical electroplating device which comprises an electroplating process tank body, a rectifier, a spraying module, a plurality of solar cells and a plurality of anode plates, the solar cells are arranged and fixed on a carrier in a matrix mode, and a metal load is arranged on the periphery of each solar cell. The anode plates are uniformly distributed on the two insulating frames to form two anodes and are respectively arranged on two sides of the carrier, the insulating frames serve as anode shields between the adjacent anode plates, and the number of the anode plates in each anode is the same as the total number of the solar cells; the spraying assembly comprises a plurality of nozzles which are evenly distributed on the periphery of each anode plate, and outlets of the nozzles directly face one side of the carrier. According to the invention, by optimizing the electroplating device and process parameters, the preparation of the copper grid line with good thickness uniformity and line width of less than 10 microns is realized, and a rapid and effective solution is provided for further improving the photoelectric conversion efficiency of a solar cell and reducing the production and manufacturing cost.

This application belongs to the field of semiconductor processing technology, specifically relating to a backlight reflective layer printing device and its application. This application effectively controls the vibration generated during the printing process by optimizing the mechanical structure and position design of the frame, support plate device, and multi-axis spindle, reducing the deviation between the actual operating path and the planned path of the piezoelectric jet valve. This significantly improves the stability of the piezoelectric jet valve operation and the printing accuracy. Furthermore, this application, by setting up a micro-adjustment device, a positioning system, an inkjet calibration system, and a needle alignment device, and utilizing their coordinated relationship, can precisely correct printing parameters such as the jetting position or jetting volume of the piezoelectric jet valve. Therefore, based on the aforementioned stable printer body structure, the coating quality of the backlight reflective layer obtained by piezoelectric jet printing will be further improved. Thus, the backlight reflective layer prepared using this invention has better thickness uniformity and a better reflective effect.

This invention discloses a foreign matter collection device and method for overflow-type down-drawing substrate glass furnaces, belonging to the field of flat glass manufacturing technology. The device provided by this invention includes a fixed tube, a collection tube, and a rotary drive mechanism. The collection tube is hinged to the inner end of the fixed tube within the furnace and consists of two symmetrical U-shaped grooves connected by a central rotating hinge shaft. The rotary drive mechanism drives the collection tube to rotate, so that when the central rotating hinge shaft faces downwards, the two grooves automatically open under gravity to form a U-shaped receiving groove, and when facing upwards, they automatically close to form a sealed circular tube. Using this invention, the process of removing foreign matter from the furnace for cleaning can avoid secondary pollution or safety accidents caused by scattering. The entire switching process is completed online outside the furnace without interrupting production or opening the furnace, completely solving the problems of large production losses and severe disturbances to the furnace temperature and airflow fields caused by the need to stop production for cleaning in traditional devices.

The invention provides a high-temperature polyamide cast film. The raw material of the high-temperature polyamide cast film comprises high-temperature polyamide resin. Therefore, the high-temperature polyamide cast film disclosed by the invention not only has excellent mechanical properties, chemical resistance, dimensional stability, thickness uniformity, high temperature resistance and the like, but also can be endowed with different functions, such as low oxygen permeability, uniform color, flame retardance and the like; the method has important significance in expanding the application of polyamide in the fields of packaging, automobiles, new energy and the like.

This invention provides a slurry brushing device. The device drives a brushing mechanism to move laterally above an operating table via a brushing moving component. A brushing preparation table and a substrate support are arranged on the upper surface of the operating table in the direction of the brushing mechanism's movement. A convex platform is provided on the brushing preparation table. During the brushing mechanism's movement, the bristles of the discharge cylinder roll against the surface of the convex platform and the substrate surface on the substrate support. This invention, through the convex platform, supplies slurry to bristles that are not fully covered. The bristles of the discharge cylinder are simultaneously penetrated by the slurry and rolled against the surface of the convex platform. The convex platform is large enough for the bristles of the discharge cylinder to roll around the entire surface, allowing the slurry at the discharge port to evenly penetrate the interior of the bristles under gravity. The process of the bristles being squeezed around the entire surface allows the slurry on the inner side of the bristles to better penetrate to the outer side, resulting in a more uniform and fine coating on the substrate surface.

The present invention relates to the technical field of composite wire forming equipment, and discloses a mold and a composite furnace for wire solid-liquid continuous casting, including a mold body, a solidification forming sizing hole with an inner diameter larger than the core material diameter is opened in the mold body, and a continuous casting gap is arranged between the inner wall of the solidification forming sizing hole and the outer wall of the core material; the outer wall of the mold body is opened with a liquid inlet portion connected to the solidification forming sizing hole, and one end of the mold body is opened with a wire inlet hole coaxially arranged with the solidification forming sizing hole and having a diameter larger than the diameter of the solidification forming sizing hole, and a plugging piece for plugging the liquid inlet portion is slidably connected in the wire inlet hole, and a through hole coaxially arranged with the solidification forming sizing hole is arranged in the plugging piece. The present application can solve the problem in the prior art that when different composite wires are formed and different core materials are replaced, a lot of time will be consumed, which affects the efficiency of composite wire forming.

The utility model discloses a focusing ring, a process chamber and semiconductor process equipment, and relates to the field of semiconductors. A focusing ring comprises a ring body and a fan-shaped adjusting piece. An annular surface is arranged at one end of the ring body along the axis of the ring body, and the adjusting piece is arranged on the annular surface and protrudes out of the annular surface in the axis direction; the central angle of the adjusting piece is smaller than 180 degrees. The problem that the thickness of the functional layer is not uniform after the product is etched can be solved.

The application discloses a chuck assembly and a semiconductor device, relates to the technical field of semiconductor devices, and comprises a chuck and one or more shaft cylinders, wherein the last shaft cylinder of the plurality of shaft cylinders or one shaft cylinder is connected with the chuck, the inside of each shaft cylinder is provided with a central hole, the central hole is provided with a balance mass and an elastic damping piece, and the elastic damping piece is sleeved with the balance mass to form a balance mass-spring-damping system. The chuck assembly is sleeved with the balance mass through the elastic damping piece to form the balance mass-spring-damping system, the balance mass-spring-damping system generates reverse vibration matched with the vibration of the chuck, micro-vibration generated between the disc surface of the chuck and the contact surface of the substrate is inhibited, generation of friction particles is reduced, stability and cleanliness of a core area of a process environment are improved, process quality of a deposited film is improved, and the needs of high-end processes for extremely low defect rate and ultra-high uniformity of the deposited film are met.

The application provides a dry-process electrode tab film and a preparation method thereof, and belongs to the technical field of dry-process electrode manufacturing. The dry-process electrode tab film comprises active material particles, conductive agent particles and an adhesive, the adhesive is in a fibrous form, the active material particles comprise large-diameter active material particles and small-diameter active material particles, wherein the particle size D50 of the large-diameter active material particles is 4-10 mu m, the particle size D50 of the small-diameter active material particles is 0.9-1.8 mu m, and the small-diameter active material particles are arranged in an area close to and adhered to the adhesive along the extension direction of the adhesive. The dry-process electrode tab film can have good film-forming property and high compaction density.

The present invention relates to a method for preparing a light-emitting device and a method for preparing a display panel. The method for preparing a light-emitting device forms a peeling layer on a surface of a first pixel defining layer away from a substrate, and then forms a functional layer in a pixel unit. After the functional layer is formed, the peeling layer is removed, and at this time, the height difference between the functional layer and the first pixel defining layer is very small or the functional layer can be made flush with the first pixel defining layer. Then, when an electrode layer is formed on the surface of the functional layer and the first pixel defining layer, the electrode layer does not need to cover the step formed by the large height difference, so that the electrode layer can be stably formed and each part of the electrode layer can maintain a uniform thickness, effectively improving the thickness uniformity of the electrode layer and improving the display performance of the display panel.

The technical idea of the present disclosure provides a coating apparatus comprising: a first coating mold configured to discharge a first coating liquid to a base substrate, where the first coating mold comprises: a first outlet configured to discharge the first coating liquid to the base substrate, and a second outlet configured to discharge the first coating liquid to the base substrate; the first outlet is configured to discharge the first coating liquid, and the length of the first outlet in a first direction is greater than that in a second direction; and the first groove is communicated with the first outlet and extends in the second direction.

The utility model provides an NOL ring preparation tool. The NOL ring preparation tool comprises two tool split bodies which are connected in an inserted mode. Each tool split body comprises a transmission shaft and a winding part connected with one end of the transmission shaft, the winding part is provided with a plurality of insertion pieces which extend in the axial direction of the transmission shaft and are arranged in the circumferential direction of the transmission shaft at intervals, and an insertion groove is formed between every two adjacent insertion pieces; the two tool split bodies are connected by inserting the multiple inserting pieces into the corresponding inserting grooves to form a barrel, and the inserting pieces can be squeezed in the radial direction to be gathered towards the axis of the barrel. According to the NOL ring preparation tool, the multiple inserting pieces are connected in the corresponding inserting grooves in an inserted mode, so that the winding parts on the two tool split bodies form a barrel, winding of winding materials is facilitated, when the two tool split bodies move along the axes of the tool split bodies to be separated, the inserting pieces are extruded in the radial direction, the inserting pieces are gathered towards the axis of the barrel, and therefore the NOL ring preparation tool is formed. And the two separated winding parts can be conveniently separated from the NOL ring, so that the NOL ring can be conveniently demolded.

The invention relates to a spring coloring device which comprises a rectangular vertical frame, a guide assembly, a cleaning and coloring module, an air drying device and a conveying assembly, the guide assembly is assembled at the upper end of the rectangular vertical frame in a vibratable mode in the length direction of the rectangular vertical frame, and the guide assembly is provided with a smooth area, a vibration area, a cleaning and coloring module, an air drying device and a conveying assembly in the length direction of the guide assembly. When the spring cleaning and coloring device is used for cleaning and coloring a spring, vibration generated by an air drying device during working is utilized to drive a guide assembly to vibrate, so that a spring frame assembly loaded with the spring can vibrate in the cleaning and coloring module when passing through the cleaning and coloring module, and the cleaning and coloring effects are improved; and meanwhile, in the process that the spring frame assembly moves to the vibration area along the guide assembly, vibration is intensified in the process that the spring frame assembly moves to be close to the air drying device through cooperation of the rolling matching piece and the vibration area, so that surface moisture is rapidly shaken off, the air drying efficiency is improved, and then the working efficiency of cleaning and coloring the springs is improved.

The present invention belongs to the technical field of electrolytic copper foil production, and the present invention provides an additive for ultra-thick electrolytic copper foil, an ultra-thick electrolytic copper foil and a preparation process thereof. The additive comprises the following components: aspartic acid, 2-mercaptopyridine, gelatin, sodium polydisulfide dipropane sulfonate, polyvinyl alcohol and water. The present invention also provides a preparation process for ultra-thick electrolytic copper foil using the above-mentioned additive, comprising the following steps: S1, adding a copper block to a sulfuric acid solution for reaction to generate a copper sulfate electrolyte; S2, adding the additive to a copper sulfate solution for electrolysis to produce a super-thick electrolytic copper foil. The ultra-thick electrolytic copper foil prepared by the present invention not only ensures its own thickness, but also ensures its own strength. It will not easily become loose due to uneven sticking due to excessive thickness of the body, thereby extending its service life and meeting the needs of high-end circuit boards.

The packaging substrate manufacturing method of the present invention manufactures a packaging substrate by including the following steps: a preparation step of preparing a panel-level packaging substrate, the panel-level packaging substrate including a core substrate, a first redistribution layer disposed on the core substrate, and a second redistribution layer disposed below the core substrate; and an electroless surface treatment step of simultaneously performing an electroless surface treatment on the upper and lower surfaces of the panel-level packaging substrate to form terminals; the packaging substrate includes: a core layer, a first redistribution layer disposed on the core layer, a second redistribution layer disposed below the core layer, and the terminals disposed on the upper surface of the first redistribution layer and the lower surface of the second redistribution layer; the difference between the maximum thickness value and the minimum thickness value of the terminals formed on the packaging substrate is less than 5 μm; in this case, terminals with improved thickness uniformity can be formed and process efficiency can be improved during terminal formation.

The application provides a baffle assembly and a chemical vapor deposition system. The baffle assembly comprises: at least two baffle groups, which are respectively arranged in at least two temperature different filling areas of a vertical furnace; each baffle group comprises at least one baffle; the thicknesses of baffles in different baffle groups are different; the higher the temperature of the filling area where the baffle group is located, the smaller the thickness of the baffle in the baffle group. The application can make the sum of the thicknesses of the baffles and the films on the baffles in different baffle groups closer in the same reaction time, which is beneficial to reducing the thickness difference of the baffles in different baffle groups, and then the thickness monitoring step of the baffles can be synchronized, the replacement time and the cleaning time of different filling areas can be synchronized, and the efficiency of the thickness monitoring, replacement and cleaning of the baffles is improved. The edge part of the application is thinner than the middle part, the application has a convex structure, the adhesion of the baffle and the deposit can be reduced, and the baffle is convenient to take out.

The invention provides a chip structure, a chip and a preparation method of the chip structure, and the preparation method comprises the steps: providing a substrate, and depositing a metal layer on one side of the substrate; depositing a first dielectric layer on one side, away from the substrate, of the metal layer; depositing a second dielectric layer on one side, deviating from the metal layer, of the first dielectric layer; etching the second dielectric layer, the first dielectric layer and the metal layer to form a metal reflection part and a metal interconnection part; depositing a third dielectric layer on one side, deviating from the substrate, of the etched structure; performing planarization processing on the third dielectric layer by taking the second dielectric layer as a grinding stop layer; removing the second dielectric layer; the first dielectric layer and the third dielectric layer are combined to form a dielectric layer, the dielectric layer comprises a first area and a second area correspondingly, and the surface of the side, away from the substrate, of the first area is flush with the surface of the side, away from the substrate, of the second area. According to the invention, the thickness of the dielectric layer can be accurately controlled, the thickness uniformity of the chip dielectric layer is effectively improved, and the performance of the chip is improved.

The utility model belongs to the technical field of film blowing machines, and particularly relates to a film bubble blowing device of a film blowing machine, which comprises an air ring shell, a plurality of air inlet pipes are mounted on the side wall of the air ring shell, filter boxes are mounted on the air inlet pipes, threaded holes are formed in a sealing plate and a top plate of each filter box, screw rods are assembled in the threaded holes, and the air ring shell and the air ring shell are integrally formed. A top plate and a sealing plate of the filter box are provided with sealing strips, air holes are formed in the side wall of the filter box, a collecting frame is placed in the filter box, a round hole is formed in the collecting frame, a filter plate is fixedly installed in the round hole, a screw is screwed out of a threaded hole in an air inlet pipe, then the sealing plate is opened, and the collecting frame clamped in the filter box is taken out. At the moment, accumulated dust can be collected on the collecting frame, the collecting frame can take out the dust together, then the collecting frame and the filter plate on the collecting frame are cleaned, rapid cleaning of the filter plate is achieved, the filter plate can be rapidly detached and cleaned through the structure, and the detaching convenience of the filter structure can be improved.

The application discloses a silicon dioxide deposition coating process of a vertical LPCVD device, and comprises the following steps: S1, checking whether the process pipe leaks; S2, blowing the process pipe with nitrogen gas under low pressure; S3, after the leakage rate detection is qualified, nitrogen gas is blown into the gas path pipeline, so that the pressure and the gas flow of the process pipe are stabilized under the pressure and the gas flow conditions set during film deposition; S4, under the set pressure condition, a reaction gas source is introduced, and a silicon dioxide film is deposited on the surface of a semiconductor substrate; and S5, after the silicon dioxide film deposition is completed, nitrogen gas is blown into the process pipe and the exhaust pipeline, nitrogen gas is introduced to increase the pressure to normal pressure, and the boat is discharged. The application has the advantages of simple operation, good stability, high film uniformity and the like, solves the problems of poor film thickness uniformity, high process granularity, poor repeat stability and extremely harsh requirements on process pressure of the existing LPCVD when depositing a SiO2 film, and realizes high-quality wafer coating.

The invention discloses a method for realizing water temperature difference adjustment by automatically adjusting water quantity of a crystallizer, and belongs to the technical field of continuous casting of ferrous metallurgy. According to the technical scheme, default cooling water flow of the wide face and the narrow face of the crystallizer is set according to the continuous casting pulling speed (the pulling speed larger than or equal to 1.3 m / min and the pulling speed smaller than 1.3 m / min are set in two gears); the water inlet and outlet temperature difference of the wide surface and the narrow surface is monitored in real time; when the wide surface temperature difference is larger than 9 DEG C, the wide surface water volume is gradually increased step by step, the water volume is 50 L / min every time, the interval is 1 min, and the pulling speed is reduced by 0.1 m / min if the water volume still exceeds the limit after two times of adjustment; when the temperature difference of the narrow surface is greater than 9 DEG C, increasing 30 L / min every time at an interval of 1 min, and reducing the pulling speed if the limit is still exceeded after two times; keeping the water quantity unchanged when the temperature difference is less than or equal to 9 DEG C; and a visual warning signal is sent out when abnormity occurs. According to the method, dynamic partition accurate adjustment of the cooling water amount is achieved, a multi-stage protection mechanism of increasing water first and then decreasing speed is established, surface cracks of the casting blank are remarkably reduced, and the hot delivery rate and production safety of a casting machine are improved.