94results about How to "Improve thickness uniformity" patented technology

The invention discloses a surface nickel plating process for quartz glass, and aims to improve the adhesive force, uniformity and functional performance of a nickel plating layer, simplify the process flow and meet the environmental protection requirement. The process comprises the following steps: firstly, cleaning and roughening the surface of quartz glass, removing surface impurities through a 2% sodium hydroxide solution and a 10% hydrofluoric acid solution, and forming a microscopic rough structure; then treating in a sensitizing solution composed of stannous chloride and hydrochloric acid to enable the surface to adsorb stannous ions; then treating in an activating solution composed of palladium chloride and hydrochloric acid to form a catalytic active layer; then carrying out nickel plating reaction in a chemical nickel plating solution with the temperature of 85 DEG C and the pH value of 4.5, wherein the thickness of a plating layer is 5-10 microns; and finally, the waste liquid is neutralized and flocculated to realize environment-friendly discharge. The process is simple and convenient to operate, and the generated nickel coating is uniform and compact, has excellent conductivity and corrosion resistance, and can be widely applied to the fields of electronics, optics and chemistry.

The invention relates to the technical field of semiconductor manufacturing, in particular to a pore sample with large depth, and provides a method for observing a bottom structure by preparing the pore sample through a focused ion beam (FIB). According to the method, by means of filling special resin for ion thinning into pores, introducing an improved back-cutting technology and the like, the problems of pore structure deformation and large damage of focused ion beams to the interiors of the pores during sample preparation in the prior art are solved; the method has the technical effects that the stability of the bottom structure of the pore sample can be improved, and damage to the pore structure in the thinning process is avoided.

The invention discloses a preparation method of an all-composite mast, which belongs to the technical field of ships and comprises the following steps: a, preparing a bottom flange; b, preparing a mast main body, and winding an inner skin on the mast main body; c, the bottom flange is assembled to the mast body, and the inner skin is pre-cured; d, the boundary dimension of the inner skin is machined, and the honeycomb core is bonded to the surface of the inner skin; e, stabilizing the honeycomb core, and winding an outer skin on the honeycomb core; f, carrying out integral curing treatment, and carrying out boundary dimension processing and finishing on the cured outer skin; and g, demolding. The bottom flange is prepared and formed by the composite material through the autoclave technology, the bottom flange is inserted into the mast body to be integrally formed, the bottom flange prepared through the technology is light in weight, high in strength, easy to machine and good in connecting performance with the mast body, the strength and stability of the connecting part are improved, and the number and complexity of connecting pieces are reduced.

This application belongs to the field of semiconductor processing technology, specifically relating to a backlight reflective layer printing device and its application. This application effectively controls the vibration generated during the printing process by optimizing the mechanical structure and position design of the frame, support plate device, and multi-axis spindle, reducing the deviation between the actual operating path and the planned path of the piezoelectric jet valve. This significantly improves the stability of the piezoelectric jet valve operation and the printing accuracy. Furthermore, this application, by setting up a micro-adjustment device, a positioning system, an inkjet calibration system, and a needle alignment device, and utilizing their coordinated relationship, can precisely correct printing parameters such as the jetting position or jetting volume of the piezoelectric jet valve. Therefore, based on the aforementioned stable printer body structure, the coating quality of the backlight reflective layer obtained by piezoelectric jet printing will be further improved. Thus, the backlight reflective layer prepared using this invention has better thickness uniformity and a better reflective effect.

This invention discloses a foreign matter collection device and method for overflow-type down-drawing substrate glass furnaces, belonging to the field of flat glass manufacturing technology. The device provided by this invention includes a fixed tube, a collection tube, and a rotary drive mechanism. The collection tube is hinged to the inner end of the fixed tube within the furnace and consists of two symmetrical U-shaped grooves connected by a central rotating hinge shaft. The rotary drive mechanism drives the collection tube to rotate, so that when the central rotating hinge shaft faces downwards, the two grooves automatically open under gravity to form a U-shaped receiving groove, and when facing upwards, they automatically close to form a sealed circular tube. Using this invention, the process of removing foreign matter from the furnace for cleaning can avoid secondary pollution or safety accidents caused by scattering. The entire switching process is completed online outside the furnace without interrupting production or opening the furnace, completely solving the problems of large production losses and severe disturbances to the furnace temperature and airflow fields caused by the need to stop production for cleaning in traditional devices.

This invention provides a slurry brushing device. The device drives a brushing mechanism to move laterally above an operating table via a brushing moving component. A brushing preparation table and a substrate support are arranged on the upper surface of the operating table in the direction of the brushing mechanism's movement. A convex platform is provided on the brushing preparation table. During the brushing mechanism's movement, the bristles of the discharge cylinder roll against the surface of the convex platform and the substrate surface on the substrate support. This invention, through the convex platform, supplies slurry to bristles that are not fully covered. The bristles of the discharge cylinder are simultaneously penetrated by the slurry and rolled against the surface of the convex platform. The convex platform is large enough for the bristles of the discharge cylinder to roll around the entire surface, allowing the slurry at the discharge port to evenly penetrate the interior of the bristles under gravity. The process of the bristles being squeezed around the entire surface allows the slurry on the inner side of the bristles to better penetrate to the outer side, resulting in a more uniform and fine coating on the substrate surface.

The present invention relates to the technical field of composite wire forming equipment, and discloses a mold and a composite furnace for wire solid-liquid continuous casting, including a mold body, a solidification forming sizing hole with an inner diameter larger than the core material diameter is opened in the mold body, and a continuous casting gap is arranged between the inner wall of the solidification forming sizing hole and the outer wall of the core material; the outer wall of the mold body is opened with a liquid inlet portion connected to the solidification forming sizing hole, and one end of the mold body is opened with a wire inlet hole coaxially arranged with the solidification forming sizing hole and having a diameter larger than the diameter of the solidification forming sizing hole, and a plugging piece for plugging the liquid inlet portion is slidably connected in the wire inlet hole, and a through hole coaxially arranged with the solidification forming sizing hole is arranged in the plugging piece. The present application can solve the problem in the prior art that when different composite wires are formed and different core materials are replaced, a lot of time will be consumed, which affects the efficiency of composite wire forming.

The utility model discloses a focusing ring, a process chamber and semiconductor process equipment, and relates to the field of semiconductors. A focusing ring comprises a ring body and a fan-shaped adjusting piece. An annular surface is arranged at one end of the ring body along the axis of the ring body, and the adjusting piece is arranged on the annular surface and protrudes out of the annular surface in the axis direction; the central angle of the adjusting piece is smaller than 180 degrees. The problem that the thickness of the functional layer is not uniform after the product is etched can be solved.

The application discloses a chuck assembly and a semiconductor device, relates to the technical field of semiconductor devices, and comprises a chuck and one or more shaft cylinders, wherein the last shaft cylinder of the plurality of shaft cylinders or one shaft cylinder is connected with the chuck, the inside of each shaft cylinder is provided with a central hole, the central hole is provided with a balance mass and an elastic damping piece, and the elastic damping piece is sleeved with the balance mass to form a balance mass-spring-damping system. The chuck assembly is sleeved with the balance mass through the elastic damping piece to form the balance mass-spring-damping system, the balance mass-spring-damping system generates reverse vibration matched with the vibration of the chuck, micro-vibration generated between the disc surface of the chuck and the contact surface of the substrate is inhibited, generation of friction particles is reduced, stability and cleanliness of a core area of a process environment are improved, process quality of a deposited film is improved, and the needs of high-end processes for extremely low defect rate and ultra-high uniformity of the deposited film are met.

The application provides a dry-process electrode tab film and a preparation method thereof, and belongs to the technical field of dry-process electrode manufacturing. The dry-process electrode tab film comprises active material particles, conductive agent particles and an adhesive, the adhesive is in a fibrous form, the active material particles comprise large-diameter active material particles and small-diameter active material particles, wherein the particle size D50 of the large-diameter active material particles is 4-10 mu m, the particle size D50 of the small-diameter active material particles is 0.9-1.8 mu m, and the small-diameter active material particles are arranged in an area close to and adhered to the adhesive along the extension direction of the adhesive. The dry-process electrode tab film can have good film-forming property and high compaction density.

The technical idea of the present disclosure provides a coating apparatus comprising: a first coating mold configured to discharge a first coating liquid to a base substrate, where the first coating mold comprises: a first outlet configured to discharge the first coating liquid to the base substrate, and a second outlet configured to discharge the first coating liquid to the base substrate; the first outlet is configured to discharge the first coating liquid, and the length of the first outlet in a first direction is greater than that in a second direction; and the first groove is communicated with the first outlet and extends in the second direction.

The utility model provides an NOL ring preparation tool. The NOL ring preparation tool comprises two tool split bodies which are connected in an inserted mode. Each tool split body comprises a transmission shaft and a winding part connected with one end of the transmission shaft, the winding part is provided with a plurality of insertion pieces which extend in the axial direction of the transmission shaft and are arranged in the circumferential direction of the transmission shaft at intervals, and an insertion groove is formed between every two adjacent insertion pieces; the two tool split bodies are connected by inserting the multiple inserting pieces into the corresponding inserting grooves to form a barrel, and the inserting pieces can be squeezed in the radial direction to be gathered towards the axis of the barrel. According to the NOL ring preparation tool, the multiple inserting pieces are connected in the corresponding inserting grooves in an inserted mode, so that the winding parts on the two tool split bodies form a barrel, winding of winding materials is facilitated, when the two tool split bodies move along the axes of the tool split bodies to be separated, the inserting pieces are extruded in the radial direction, the inserting pieces are gathered towards the axis of the barrel, and therefore the NOL ring preparation tool is formed. And the two separated winding parts can be conveniently separated from the NOL ring, so that the NOL ring can be conveniently demolded.

The invention relates to a spring coloring device which comprises a rectangular vertical frame, a guide assembly, a cleaning and coloring module, an air drying device and a conveying assembly, the guide assembly is assembled at the upper end of the rectangular vertical frame in a vibratable mode in the length direction of the rectangular vertical frame, and the guide assembly is provided with a smooth area, a vibration area, a cleaning and coloring module, an air drying device and a conveying assembly in the length direction of the guide assembly. When the spring cleaning and coloring device is used for cleaning and coloring a spring, vibration generated by an air drying device during working is utilized to drive a guide assembly to vibrate, so that a spring frame assembly loaded with the spring can vibrate in the cleaning and coloring module when passing through the cleaning and coloring module, and the cleaning and coloring effects are improved; and meanwhile, in the process that the spring frame assembly moves to the vibration area along the guide assembly, vibration is intensified in the process that the spring frame assembly moves to be close to the air drying device through cooperation of the rolling matching piece and the vibration area, so that surface moisture is rapidly shaken off, the air drying efficiency is improved, and then the working efficiency of cleaning and coloring the springs is improved.

The present invention belongs to the technical field of electrolytic copper foil production, and the present invention provides an additive for ultra-thick electrolytic copper foil, an ultra-thick electrolytic copper foil and a preparation process thereof. The additive comprises the following components: aspartic acid, 2-mercaptopyridine, gelatin, sodium polydisulfide dipropane sulfonate, polyvinyl alcohol and water. The present invention also provides a preparation process for ultra-thick electrolytic copper foil using the above-mentioned additive, comprising the following steps: S1, adding a copper block to a sulfuric acid solution for reaction to generate a copper sulfate electrolyte; S2, adding the additive to a copper sulfate solution for electrolysis to produce a super-thick electrolytic copper foil. The ultra-thick electrolytic copper foil prepared by the present invention not only ensures its own thickness, but also ensures its own strength. It will not easily become loose due to uneven sticking due to excessive thickness of the body, thereby extending its service life and meeting the needs of high-end circuit boards.

The packaging substrate manufacturing method of the present invention manufactures a packaging substrate by including the following steps: a preparation step of preparing a panel-level packaging substrate, the panel-level packaging substrate including a core substrate, a first redistribution layer disposed on the core substrate, and a second redistribution layer disposed below the core substrate; and an electroless surface treatment step of simultaneously performing an electroless surface treatment on the upper and lower surfaces of the panel-level packaging substrate to form terminals; the packaging substrate includes: a core layer, a first redistribution layer disposed on the core layer, a second redistribution layer disposed below the core layer, and the terminals disposed on the upper surface of the first redistribution layer and the lower surface of the second redistribution layer; the difference between the maximum thickness value and the minimum thickness value of the terminals formed on the packaging substrate is less than 5 μm; in this case, terminals with improved thickness uniformity can be formed and process efficiency can be improved during terminal formation.

The application provides a baffle assembly and a chemical vapor deposition system. The baffle assembly comprises: at least two baffle groups, which are respectively arranged in at least two temperature different filling areas of a vertical furnace; each baffle group comprises at least one baffle; the thicknesses of baffles in different baffle groups are different; the higher the temperature of the filling area where the baffle group is located, the smaller the thickness of the baffle in the baffle group. The application can make the sum of the thicknesses of the baffles and the films on the baffles in different baffle groups closer in the same reaction time, which is beneficial to reducing the thickness difference of the baffles in different baffle groups, and then the thickness monitoring step of the baffles can be synchronized, the replacement time and the cleaning time of different filling areas can be synchronized, and the efficiency of the thickness monitoring, replacement and cleaning of the baffles is improved. The edge part of the application is thinner than the middle part, the application has a convex structure, the adhesion of the baffle and the deposit can be reduced, and the baffle is convenient to take out.

The invention provides a chip structure, a chip and a preparation method of the chip structure, and the preparation method comprises the steps: providing a substrate, and depositing a metal layer on one side of the substrate; depositing a first dielectric layer on one side, away from the substrate, of the metal layer; depositing a second dielectric layer on one side, deviating from the metal layer, of the first dielectric layer; etching the second dielectric layer, the first dielectric layer and the metal layer to form a metal reflection part and a metal interconnection part; depositing a third dielectric layer on one side, deviating from the substrate, of the etched structure; performing planarization processing on the third dielectric layer by taking the second dielectric layer as a grinding stop layer; removing the second dielectric layer; the first dielectric layer and the third dielectric layer are combined to form a dielectric layer, the dielectric layer comprises a first area and a second area correspondingly, and the surface of the side, away from the substrate, of the first area is flush with the surface of the side, away from the substrate, of the second area. According to the invention, the thickness of the dielectric layer can be accurately controlled, the thickness uniformity of the chip dielectric layer is effectively improved, and the performance of the chip is improved.

The utility model belongs to the technical field of film blowing machines, and particularly relates to a film bubble blowing device of a film blowing machine, which comprises an air ring shell, a plurality of air inlet pipes are mounted on the side wall of the air ring shell, filter boxes are mounted on the air inlet pipes, threaded holes are formed in a sealing plate and a top plate of each filter box, screw rods are assembled in the threaded holes, and the air ring shell and the air ring shell are integrally formed. A top plate and a sealing plate of the filter box are provided with sealing strips, air holes are formed in the side wall of the filter box, a collecting frame is placed in the filter box, a round hole is formed in the collecting frame, a filter plate is fixedly installed in the round hole, a screw is screwed out of a threaded hole in an air inlet pipe, then the sealing plate is opened, and the collecting frame clamped in the filter box is taken out. At the moment, accumulated dust can be collected on the collecting frame, the collecting frame can take out the dust together, then the collecting frame and the filter plate on the collecting frame are cleaned, rapid cleaning of the filter plate is achieved, the filter plate can be rapidly detached and cleaned through the structure, and the detaching convenience of the filter structure can be improved.

The application discloses a silicon dioxide deposition coating process of a vertical LPCVD device, and comprises the following steps: S1, checking whether the process pipe leaks; S2, blowing the process pipe with nitrogen gas under low pressure; S3, after the leakage rate detection is qualified, nitrogen gas is blown into the gas path pipeline, so that the pressure and the gas flow of the process pipe are stabilized under the pressure and the gas flow conditions set during film deposition; S4, under the set pressure condition, a reaction gas source is introduced, and a silicon dioxide film is deposited on the surface of a semiconductor substrate; and S5, after the silicon dioxide film deposition is completed, nitrogen gas is blown into the process pipe and the exhaust pipeline, nitrogen gas is introduced to increase the pressure to normal pressure, and the boat is discharged. The application has the advantages of simple operation, good stability, high film uniformity and the like, solves the problems of poor film thickness uniformity, high process granularity, poor repeat stability and extremely harsh requirements on process pressure of the existing LPCVD when depositing a SiO2 film, and realizes high-quality wafer coating.

The invention discloses a method for realizing water temperature difference adjustment by automatically adjusting water quantity of a crystallizer, and belongs to the technical field of continuous casting of ferrous metallurgy. According to the technical scheme, default cooling water flow of the wide face and the narrow face of the crystallizer is set according to the continuous casting pulling speed (the pulling speed larger than or equal to 1.3 m / min and the pulling speed smaller than 1.3 m / min are set in two gears); the water inlet and outlet temperature difference of the wide surface and the narrow surface is monitored in real time; when the wide surface temperature difference is larger than 9 DEG C, the wide surface water volume is gradually increased step by step, the water volume is 50 L / min every time, the interval is 1 min, and the pulling speed is reduced by 0.1 m / min if the water volume still exceeds the limit after two times of adjustment; when the temperature difference of the narrow surface is greater than 9 DEG C, increasing 30 L / min every time at an interval of 1 min, and reducing the pulling speed if the limit is still exceeded after two times; keeping the water quantity unchanged when the temperature difference is less than or equal to 9 DEG C; and a visual warning signal is sent out when abnormity occurs. According to the method, dynamic partition accurate adjustment of the cooling water amount is achieved, a multi-stage protection mechanism of increasing water first and then decreasing speed is established, surface cracks of the casting blank are remarkably reduced, and the hot delivery rate and production safety of a casting machine are improved.

The invention discloses a preparation method of a gate oxide layer of a SiC-based groove type transistor based on low-temperature oxidation and a device. The preparation method comprises the following steps: S10, obtaining a silicon carbide substrate, wherein the silicon carbide substrate comprises a plane region and a groove region with a groove; s20, forming a first silicon dioxide mask layer covering the side wall of the groove; s30, performing barium ion implantation to form an ion implantation layer; s40, removing the first silicon dioxide mask layer; s50, forming a second silicon dioxide mask layer covering the surface of the plane region, the bottom of the groove and the side wall of the groove; and S60, performing oxidation treatment at the temperature of 700-900 DEG C for 10-120 minutes to form a prefabricated gate oxide layer, and performing annealing treatment to obtain a gate oxide layer. According to the invention, barium ion implantation is carried out on the silicon carbide substrate to form the ion implantation layer, local non-crystallization of silicon carbide crystals is realized, and the oxidation treatment temperature is reduced by cooperating with the oxidation enhancement effect of activated barium ions.

The application relates to an amorphous spray package adjusting device, and relates to the technical field of amorphous strip production equipment, which comprises a rack and a movable frame movably arranged on the rack, a transverse driving mechanism is arranged on the movable frame and used for driving the movable frame to move transversely; an amorphous spray package body is detachably and movably arranged on the movable frame, and a lower end of the amorphous spray package body is provided with an amorphous spray head; a horizontal rotating mechanism and a vertical rotating mechanism are arranged between the movable frame and the amorphous spray package body and are used for driving the amorphous spray package body to rotate in a horizontal plane and a vertical plane respectively; and a lifting mechanism is further arranged to enable the amorphous spray package body to move in a vertical direction. The device can flexibly adjust the amorphous spray package body in multiple degrees of freedom directions, the spraying angle and position of the amorphous spray head can be timely corrected in the production process, so that the spraying precision and stability are improved, the thickness uniformity and surface quality of the amorphous strip are improved, and the reliability of the production process is improved.

The application discloses a method for improving the thickness and quality uniformity of crystal growth, a repairing method and a crystal. The method comprises the following steps: providing a growth system required for growing a group III nitride crystal by a flux method liquid phase epitaxy, forming a temperature gradient between a top layer part and a bottom layer part of a molten growth material, so as to form a closed circulation flow field of the molten growth material and a nitrogen source in the molten growth material; and in an initial stage of the growth of the group III nitride crystal, adjusting the temperature gradient to a positive temperature gradient, and then alternately switching the temperature gradient between the positive temperature gradient and a negative temperature gradient, so as to change the nitrogen source concentration distribution and the growth rate of different regions of a growth interface of the group III nitride crystal, until the growth interface of the group III nitride crystal presents as a flat surface. The method provided by the application is simple in operation and wide in application range, and can reduce the production cost and improve the yield of the crystal.

The invention relates to the technical field of carbon fiber manufacturing equipment, and discloses carbon fiber yarn flapping and conveying equipment and method based on carbon fiber cloth manufacturing, and the carbon fiber yarn flapping and conveying equipment based on the carbon fiber cloth manufacturing comprises an equipment table, a flapping assembly and a resin dipping device, the multiple carbon fiber bundles and the carbon fiber cloth are arranged in the equipment table, a yarn spreading mechanism and a carding mechanism are further arranged in the equipment table, and through the arrangement of the carding mechanism, when the carbon fiber bundles are conveyed to the position between a supporting plate and an adjusting plate, the upper surfaces of the carbon fiber bundles make contact with arc-shaped triggering blocks; if the carbon fiber bundles are wound, knotted and other local thicknesses are inconsistent, the carbon fiber bundles are carded, the two needle plate assemblies which are not located on the same horizontal line are arranged in a staggered mode, the carbon fiber bundles can be carded more comprehensively and efficiently, and the thickness uniformity and the appearance quality of the carbon fiber cloth are improved.

The present application relates to the technical field of vacuum coating, in particular to a rotating-evaporation rate collaborative control method and system based on deposition distribution model, which establishes a deposition process model containing an evaporation source distribution model, a substrate kinematics model and a cumulative dose model; based on the model, a rotating speed ω(t) and an evaporation rate R i (t) are optimized variables, a collaborative control trajectory is generated through multi-objective optimization; the trajectory is executed; and deposition state data is obtained in real time during the coating process, compared with the model prediction value, the model parameters are corrected online and the trajectory is regenerated, realizing rotating-evaporation rate collaborative control. The method first promotes the rotating speed from a fixed parameter to an active control variable, optimizes it collaboratively with the evaporation rate, increases a completely independent control degree of freedom, fundamentally breaks through the uniformity and component precision upper limit of traditional single-variable control, and solves the poor uniformity problem of perovskite photovoltaic components in the prior art.

The utility model relates to flexible circuit technical field, concretely for a kind of flexible circuit substrate, comprising: PI base material, PI base material is provided with functional layer, functional layer includes the buffer layer of TiO2 or SiO2, CrxOy material setting on PI base material, sputter Cu layer setting on buffer layer and electroplated copper layer setting on sputter Cu layer, through the setting of the buffer layer of TiO2 or SiO2, CrxOy material, compared with the nickel-chromium alloy layer set in traditional technology, need not secondary etching, reduce production procedure, can reduce material impedance, improve material performance, reduce production cost, reduce the generation of etching waste liquid, more environmental protection.

The utility model provides a lithium composite negative electrode with a tab and a lithium battery comprising the lithium composite negative electrode. The lithium composite negative electrode comprises an upper negative electrode layer and a lower negative electrode layer, the current collector layer is clamped between the two negative electrode layers, the width of the current collector layer is smaller than that of the negative electrode layers, one end of the current collector layer is aligned with the negative electrode layers in the width direction, and the other end of the current collector layer is provided with a tab joint part; the tab is provided with a current collector layer joint part, the current collector layer joint part and the tab joint part form a complementary structure, and the tab is seamlessly connected with the current collector layer through the complementary structure.

The application relates to a FLASH device and a forming method thereof. The forming method of the FLASH device comprises the following steps: forming a substrate, the substrate comprising a substrate, a plurality of unit structures located above the substrate and an isolation groove located between adjacent unit structures, the unit structure comprising a floating gate and a dielectric layer covering the floating gate; forming a filling layer filling the isolation groove and covering the dielectric layer; forming an auxiliary layer covering the filling layer, the etching selection ratio of the auxiliary layer and the filling layer reaching 1:1; etching back the auxiliary layer and the filling layer at the same etching rate, removing the auxiliary layer and part of the filling layer, and the surface of the remaining filling layer away from the substrate being flush with the surface of the dielectric layer away from the substrate. The application reduces or even avoids the generation of a filling layer sharp corner at the edge of the isolation groove, and eliminates the influence of the filling layer sharp corner on the subsequent deposition of an erasing layer.

A polyester film with high in-plane retardation, excellent thickness uniformity, high productivity, good workability, and good planarity is provided. The polyester film disclosed has an in-plane retardation of 3000 nm or more and 30000 nm or less, an in-plane orientation degree of 0.128 or more and 0.155 or less, and a thickness non-uniformity in the film flow direction of less than 8% (it should be noted that the thickness non-uniformity is a value obtained by (maximum thickness - minimum thickness) / average thickness × 100 (%)).