Method comprising: Depositing a dummy gate (70, 76) over and along sidewalls of a fin (36, 56) extending upwardly from a
semiconductor substrate (32, 50); Forming a first gate spacer (80) along a sidewall of the dummy gate (70, 76);
plasma doping the first gate spacer (80) with carbon to form a carbon-doped gate spacer (80B); Forming a source / drain region (42, 44, 82, 84) adjacent to a channel region (108, 112) of the fin (36, 56); and Diffusing carbon from the carbon-doped gate spacer (80B) into a first region of the fin (36, 56) to provide a first carbon-doped region (106, 110), the first carbon-doped region (106, 110) being disposed between at least a portion of the source / drain region (42, 44, 82, 84) and the channel region (108, 112) of the fin (36, 56); wherein forming the source / drain region (42, 44, 82, 84) comprises
etching a second portion of the rib (36, 56) to provide a recess (102, 104) adjacent to the first portion of the rib (36, 56), the method further comprising
plasma doping the recess (102, 104) with carbon to form a second carbon-doped region (107, 111) along sidewalls and a bottom surface of the recess (102, 104).