588 results about "Material removal" patented technology

The invention provides a five-axis series-parallel numerical control machine tool machining process virtual monitoring simulation method and system based on digital twinning, and the method comprises the steps: building an information interaction mechanism between a physical machine tool and a digital twinning model, enabling a server side to collect sensor data, and transmitting the real-time data to a client side through a communication protocol; the client processes the data and drives the digital twin model. And aiming at potential errors of twin system forecast, tool setting error compensation can be carried out in real time, so that the machining precision is improved. Meanwhile, the system supports an offline simulation function, combines an inverse kinematics algorithm and an NC code, fuses a material removal model, simulates a machining process, evaluates machining performance and errors, and provides an optimization basis for machining strategies of workpieces with different geometrical shapes and materials. According to the method, bidirectional interaction between the physical entity and the virtual model is achieved, the real-time monitoring and visualization capability of the machining process is enhanced, a reliable simulation evaluation and optimization means is provided for machining of complex parts, and the method has wide industrial application prospects.

The invention relates to a machining path planning system, in particular to the technical field of intelligent manufacturing and numerical control machining, and overcomes the defect that a thermal coupling effect is ignored in traditional geometric planning by constructing an evolution model fused with a physical law. A dynamic decoupling algorithm is utilized to extract a real cutting load from multi-source data and reconstruct a rigidity field changing along with material removal in real time, the problem that a physical boundary is difficult to perceive under a complex working condition is solved, and the system effectively eliminates size out-of-tolerance caused by heat accumulation through transient deformation advanced prediction. According to the method, the non-linear error is actively counteracted in cooperation with a reverse compensation strategy based on sensitivity analysis, the machining precision and surface quality of the thin-wall weak-rigidity part are remarkably improved, the rejection rate and trial cutting cost are reduced, and intelligent closed-loop control over the manufacturing process is achieved.

A diesel engine crankshaft residual stress and deformation relation prediction method belongs to the technical field of internal combustion engine key component manufacturing. The method comprises the steps of dynamically correcting a finite element model through multi-stage measured data, performing high-precision reconstruction of a crankshaft residual stress field, establishing a quantitative relation between stress distribution and deformation, and combining numerical simulation and response surface method optimization to realize high-precision residual stress distribution prediction. And further analyzing the release and redistribution rules of the residual stress in the material removal process. Residual stress distribution is actively controlled to prolong fatigue life, and stable production of high-precision and long-life crankshafts is ensured. The grinding feeding rate is reduced through active control over residual stress in the grinding process so that the tensile stress peak value in the layer depth direction can be reduced, and meanwhile it is guaranteed that the surface roughness is within a proper interval. A gradient cooling strategy is adopted, the cooling liquid flow is increased in the initial grinding stage, and surface layer thermal stress accumulation is restrained. And the grinding wheel linear speed is controlled, and grinding efficiency and residual stress inhibition requirements are balanced.

The invention discloses a uniformity removal trajectory planning method and system suitable for flexible grinding and polishing machining, and the method comprises the steps: S100, building a material removal depth model and a material removal profile at a grinding and polishing point after a flexible grinding and polishing contact wheel is in contact with a workpiece according to the contact pressure in a flexible grinding and polishing profile contact region; s200, correcting the material removal depth model by considering the variable quantity of the chord height error caused by the compliant contact deformation to obtain a corrected material removal depth model; and S300, based on the corrected material removal depth model, the material removal profile is fused into the corrected material removal depth model to realize uniformity removal trajectory planning considering material removal characteristics, and a processing trajectory sequence containing attitude information is obtained. According to the method, equal chord height error step length calculation of contact deformation and equal residual height line spacing calculation of uniform material removal are considered, so that uniform removal trajectory planning of smooth grinding and polishing is realized, and the problem of trajectory discontinuity caused by elastic deformation is remarkably reduced.

Provided in the embodiments are a machining monitoring method, a machining monitoring apparatus, a computing device and a computer-readable storage medium. By acquiring first information of a first machining process in real time, retrieving a model in a model library on the basis of the first information, and matching a physical model having second information identical to the first information, the matched physical model characterizes a second relationship between material removal characteristics and specific cutting energy, thereby eliminating the influence of tool types and workpiece materials, and reflecting the machining characteristics of a second machining process; by comparing a first relationship with the second relationship, the differences between the first machining process and the second machining process are obtained to provide monitoring suggestions; and since the first relationship and the second relationship are acquired on the basis of the material removal characteristics and the specific cutting energy, and a monitoring threshold value is generated without using a signal strongly correlated with process conditions to perform learning, the method is well-suited for various machining scenarios.

The invention relates to a method for rinsing a machining front (4) in a hollow structure (2) formed by material removal in a workpiece (1), preferably in a substrate for an optical element. The method comprises: arranging a free end (8) of a preferably flexible fluid line (7) in the region of the machining front (4). In the method, to rinse the machining front (4), the fluid (6) is supplied to the machining front (4) through a space (9) between an outer surface (10) of the fluid line (7) and a circumferential surface (5) of the hollow structure (2) and discharged from the machining front (4) within the fluid line (7). The invention also relates to a device (12) configured for carrying out the method.

The invention discloses a light-weight cabin efficient self-adaption machining method based on cutting parameter learning, solves the cutting parameter self-adaption problem in light-weight cabin machining, and belongs to the technical field of spacecraft structural part manufacturing or numerical control self-adaption machining. The method aims at improving the machining quality and the machining efficiency, minimizing the cutting force and maximizing the material removal rate, a mathematical model of two targets and cutting parameters is established, an orthogonal process test is designed to analyze the response characteristics of the two targets to the cutting parameters, the influence of the cutting parameters to the cutting force in the actual cutting process is analyzed, and the machining precision is improved. Optimized operation data and a tool database are formed; and learning of adaptive parameters is realized by applying an ACM adaptive optimization technology, and adaptive processing is carried out.

A method and a device for machining an elongated workpiece having a shaft extending in the direction of the workpiece longitudinal axis forms at least one groove with a defined groove surface on the workpiece by material removal by a laser beam directed with its beam axis onto the workpiece surface and guided along a laser path extending exclusively parallel to a groove profile curve corresponding to the intersection between the groove surface to be produced and a geometric plane that forms an angle β with the workpiece longitudinal axis, where 90°≥β≥the angle of groove inclination. The distance between the curve and the path is predetermined such that the workpiece material located in the geometric plane on the path side facing away from the curve completely sublimates or vaporizes due to the laser beam power density when the beam is guided along the path.

Provided is a whipstock and well system. The whipstock, in one aspect, includes a coupling section having a first radius of curvature, the coupling section configured to engage with a mill bit when running in hole. The whipstock, in accordance with this aspect, further includes a casing breakthrough section having a second radius of curvature, and a controlled exit section having a third radius of curvature, wherein the second radius of curvature is less than the third radius of curvature.

The invention particularly discloses a wafer heavy scratch three-dimensional shape repairing process based on a DFG 8560 single-axis accurate grinding mode, and aims to solve the problems that deep subsurface damage is introduced by rough grinding in a traditional double-stage grinding process, the machining efficiency is low, and material waste is serious. The process comprises the following steps: identifying a heavy scratch defect existing on the surface of a wafer through an automatic optical detection system; a ceramic bond diamond grinding wheel with the particle size of 8000 is adopted, uniaxial accurate grinding is conducted through ultrapure water cooling under the optimized parameters that the rotating speed of a main shaft is 1300-2300 rpm, the rotating speed of a workbench is 1785-2100 rpm and the rotating speed ratio is 0.6-1.3, and three-dimensional shape repairing is directly completed by skipping rough grinding; the rotating speed and pressure of grinding are dynamically regulated and controlled in three stages, the total time is less than or equal to 135 seconds, and the removal amount is 6-12 microns. By the adoption of the technical scheme, the surface roughness Ra can be smaller than 0.5 nm, the subsurface damage layer can be smaller than 50 nm, the repair success rate is larger than 98.5%, the machining time is remarkably shortened by 35% or above, and the material removal amount is reduced by 40%.

The invention relates to a method for preparing a super-thick compact infiltrated layer through interface reactivation type cyclic nitridation, and aims to solve the problems that an infiltrated layer obtained through existing salt bath nitridation treatment is insufficient in thickness and poor in performance. The method for preparing the super-thick compact infiltrated layer comprises the following steps: 1, putting a preheated workpiece in a nitriding furnace into a molten salt bath medium, and carrying out salt bath nitriding treatment at the temperature of 380-650 DEG C; 2, carrying out layer removal treatment through stress-assisted surface subtractive machining to remove a surface compound layer of the workpiece; thirdly, the salt bath nitriding treatment and the layer removing treatment are repeated for multiple times; and 4, carrying out surface ultrasonic rolling post-treatment on the workpiece subjected to circulating salt bath nitriding. According to the method, a compound layer formed in the nitriding process is removed, the nitrogen atom diffusion driving force of subsequent nitriding treatment is enhanced, the nitrided layer subjected to circulating salt bath nitriding treatment has higher nitrogen concentration, the thicker nitrided layer is prepared, the depth and compactness of the nitrided layer of the metal workpiece can be remarkably improved, and the comprehensive performance of the nitrided layer is enhanced.

The invention discloses a numerical control machine tool cutting parameter optimization method and system based on multi-source data fusion. The method comprises the following steps: synchronously collecting machine tool state, dynamic response and machining result multi-source data, and carrying out preprocessing and feature association; based on historical data, deriving a material removal rate, a flutter risk, an acoustic emission energy ratio and a surface quality implementation coefficient feature, and constructing an enhanced feature data set; by taking the cutting parameters as input and the features as output, constructing and incrementally updating a machining process response surface agent model by adopting Gaussian process regression; and defining a search space by combining a mechanism hard constraint based on a tool capability, machine tool performance and a stability lobe graph, calling an agent model, and performing optimization by adopting a multi-objective evolutionary algorithm to obtain a Pareto optimal parameter solution set. According to the method, deep coupling of data and a mechanism is achieved, the efficiency can be improved through dynamic optimization on the premise that the machining stability and quality are guaranteed, and high adaptability and reliability are achieved.

The invention provides a single-layer core-shell structure polishing abrasive for silicon carbide wafer polishing, a polishing solution, a preparation method and a polishing method, and relates to the technical field of chemical mechanical polishing, the single-layer core-shell structure polishing abrasive takes silicon dioxide with the particle size of 300-800 nm as an inner core and aluminum oxide with the particle size of 10-150 nm as an outer shell, the particle size ratio of the inner core to the outer shell is 2: 1-10: 1, and the polishing solution is prepared from silicon dioxide with the particle size of 300-800 nm and aluminum oxide with the particle size of 10-150 nm. And single-layer coating is realized through cationic polyelectrolyte assisted electrostatic adsorption. The polishing solution comprises the following components in parts by weight: 3-15 parts of a polishing abrasive with a single-layer core-shell structure, 0.2-8 parts of an oxidizing agent, 0.1-8 parts of a dispersing agent and the balance of deionized water, and the pH value is adjusted to 8-11. The hardness of the inner core abrasive material of the prepared polishing abrasive material with the core-shell structure is smaller than that of the outer shell abrasive material, the polishing abrasive material with the core-shell structure has high dispersity and low agglomeration rate, in the final polishing process of SiC wafers, the surface roughness Ra smaller than or equal to 0.15 nm can be obtained, meanwhile, the material removal rate is kept to be larger than or equal to 1500 nm / h, the scratch density is remarkably reduced, and the polishing abrasive material is suitable for batch finish machining of high-end power device substrates.

Generally described, one or more aspects of the present disclosure relate to systems, methods, and devices for trimming and peeling electrode films. The system can be integrated into a calender rolling system and can create multi-lane films with clean edge quality for lamination. The system can include a trimming device including a cutting device, and a material removing device positioned downstream from the cutting device, the material removing device including a scraper element, a support element positioned upstream from the scraper element, and a vacuum element.

The invention discloses a magneto-rheological efficient polishing device with a spherical magnetic field arranged in a flow channel. The magneto-rheological efficient polishing device comprises a series spherical magnetic field generating device and a magneto-rheological fluid reciprocating supply system. According to the series spherical magnetic field generation device, a plurality of magnetic balls are connected in series through a flexible rope and then placed in a flow channel, a magnetic field generated by the magnetic balls enables magnetorheological fluid in reciprocating motion to generate a rheological effect, a flexible'magnetic brush 'is formed, the apparent viscosity is increased, abrasive particles are wrapped to scour the wall face, and material removal is achieved. Meanwhile, a local necking structure is formed at the magnetic ball, the circulation sectional area is reduced, a high-speed and high-pressure area is generated, the abrasive particle impact speed and updating frequency are increased, and the polishing efficiency is improved. The flexible series connection structure can penetrate through the complex inner flow channel in a self-adaptive mode, and the polishing requirement of the special-shaped component is met. Through the built-in magnetic field generating device and the necking effect, the polishing efficiency is cooperatively improved, and the problems that in an existing inner flow channel magneto-rheological polishing process, magnetic field attenuation is large, and an external device is difficult to be attached to a complex flow channel are solved.

A method for manufacturing a component includes steps for providing a surface formed by a material, arranging a mask structure on the surface, and performing a material removal process, whereby material is removed from the surface and deposited on the mask structure where it forms a structure.

A near-atomic-scale electrolytic machining method based on an interface self-assembly biomask comprises the steps that firstly, hydroxylation pretreatment is conducted on the surface of an anode of a workpiece, then the surface of the anode is covered with an organic solvent phase containing phospholipid monomers, water-phase electrolyte drops are introduced, molecular self-assembly driving force at an oil-water-metal three-phase interface is utilized, and the surface of the anode of the workpiece is subjected to near-atomic-scale electrochemical machining. And rapidly forming a layer of ultrathin, continuous and stable support phospholipid bilayer mask on the surface of the workpiece in situ. Then, biological nanochannels are embedded in the biomimetic mask to construct a confinement ion transport path. And finally, a precise pulse electric field is applied, electrolyte ions are driven to be strictly limited in the nanometer channel and transmitted to the surface of the workpiece, local anodic dissolution is triggered, and therefore localized material removal of the nanometer scale or even the near-atomic scale is achieved. According to the method, the technical bottleneck that the high-quality phospholipid bilayer is difficult to prepare on the high-surface-energy metal surface is solved, and a new way is provided for ultra-precision electrolytic machining.

The utility model relates to the technical field of precious metal smelting, in particular to a mounting structure for a driving part of a driving roller of a pressurized copper material removal banded extruder. The transmission mechanism comprises a main shaft, a mounted bearing, a chain wheel thrust ring, a chain wheel, a mounting seat, a gear, a labyrinth seal and a driving roller are sequentially mounted on the main shaft in a penetrating manner from left to right, the mounting seat is of an annular structure with a middle protrusion, the middle protrusion penetrates through the chain wheel, and the chain wheel is fixedly mounted on the mounting seat through a pin bolt and a pin nut. And a chain wheel thrust ring is arranged at the end part of the chain wheel, is fixed with the chain wheel through a bolt, and is movably connected with the mounting seat through a clamping groove. According to the installation structure, when overload torque is input into the chain wheel or a hard object is clamped between the driving roller and the driven roller meshed with the driving roller, the pin bolt is cut off, and therefore the spindle head of the spindle is protected against deformation. The utility model provides the structure which is easy to install, convenient to maintain, simple in structure and low in cost, and ensures that the pressurized copper material removal extruder stably runs for a long period.

The invention discloses a functional structure integrated optimization polishing pad capable of uniformly removing materials. The functional structure integrated optimization polishing pad comprises a polishing layer and an elastic layer, the polishing layer is composed of a plurality of protrusions, and the protrusions are arranged in a honeycomb shape. The elastic layer is of a concentric partition structure and comprises a soft area and a hard area. By designing surface patterns of the polishing pad, abrasive particle tracks on the surface of the workpiece are uniformly distributed; by designing the polishing pad structure, the contact pressure on the surface of the workpiece is uniformly distributed. The surface pattern and structure of the polishing pad are subjected to comprehensive optimization design, integrated optimization of the functional structure of the polishing pad is achieved, the abrasive particle motion trail and contact pressure distribution can be cooperatively regulated and controlled, and the material removal uniformity of the surface of a workpiece is improved.

The utility model provides drilling fluid ferromagnetic substance removing equipment, and relates to the technical field of drilling auxiliary equipment, the drilling fluid ferromagnetic substance removing equipment comprises a material screening module, a machine body frame, a liquid draining module, a magnetic suction module, a cleaning module and a PLC, the material screening module is fixed above the machine body frame in a bolted mode, the liquid draining module is fixedly connected below the material screening module, and the magnetic suction module is fixedly connected below the cleaning module. A magnetic attraction module is arranged below the liquid draining module, the magnetic attraction module is fixed to the inner side of the machine body frame in a bolting mode, a cleaning module is arranged below the magnetic attraction module, the cleaning module is fixed to the machine body frame in a bolting mode, and the PLC is electrically connected with the material screening module and the magnetic attraction module. Drilling fluid can be evenly distributed on the sheet base band through the liquid draining plate, the adsorption time is prolonged, the adsorption capacity of the powerful magnet is improved, the device has a stronger magnetic adsorption effect, ferromagnetic substances in the drilling fluid can be efficiently removed through the device, through multi-layer adsorption filtration, the removal effect is good, and the efficiency is high.

The invention provides a silicon wafer surface grinding method and device. The method comprises the steps that a first supply unit is controlled to supply a first grinding material to a grinding area; receiving and responding to the switching signal; controlling a second supply unit to supply a second grinding material to the grinding area; wherein the first grinding material and the second grinding material are different in particle size. An automatic switching double-mortar-barrel liquid supply mode is adopted in a single process of the same equipment, large-particle-size grinding materials are adopted in the coarse grinding stage so that the material removal efficiency can be improved, small-particle-size grinding materials are automatically switched in the fine grinding stage so that surface damage generated in the coarse grinding stage can be removed, the product yield and quality are improved, and the product quality is improved. And the cost and the risk caused by multi-equipment processing are avoided, and the silicon wafer with high surface quality is efficiently obtained.

The invention relates to the technical field of optical precision machining, in particular to a curvature self-adaptive curved surface fitting method and system in optical element polishing, and the method comprises the steps: obtaining a material height difference removal matrix based on interference measurement data before and after polishing of an optical element; traversing the height difference matrix by using a sliding window mode, calculating a Hessian matrix eigenvalue in a local area, forming a curvature sensitivity index (CSI), dividing an optical surface area into a plane area, a gradual change area and a high curvature area, and setting curved surface fitting parameters in the areas respectively; performing curved surface fitting on the region by adopting a weighted least square method to obtain a continuous surface model, and performing adaptive numerical integration calculation on the continuous surface to obtain a material removal volume; according to the method, the process control requirement of high-precision optical manufacturing can be met, the calculation precision is high, the calculation precision and the calculation efficiency can be maximized, the global efficiency is high, the capability of capturing local features can be achieved, the method can be integrated into an existing quality control system, and process decision making is facilitated.

The application discloses a die machining process for aluminum-magnesium alloy multi-pressure material deep cavity forming, which comprises the following steps: minimum drawing depth calibration and stamping direction simulation; forming optimization and forming margin calculation; inner pressure material arrangement and material supplement analysis; during the material supplement analysis; multi-circle design and pressure configuration; die machining assembly; staged debugging and partition pressure regulation; high-angle pre-loss and surface quality improvement; margin test correction. The application solves the problem that the single-action equipment of cold stamping forming cannot realize bidirectional air top and staged air top through the embedded self-pressure source mode, successfully utilizes the multi-circle combination mode of external double-pressure ring and internal pressure ring, realizes multiple motion pressure material, thereby greatly reduces the cavity depth of deep cavity automobile cover forming, reduces the stretching material removal amount, realizes the deep cavity forming technology depth reduction mode for aluminum-magnesium alloy, thereby realizes the deep cavity forming of high yield strength aluminum-magnesium alloy, and also provides a replicable mode for the forming of other lightweight materials.

The invention relates to a method for producing a brake disc, comprising prefabricating a base body (2) with a hub mounting (6) having an annular hub contact surface (7) and a metal friction ring (3), the friction ring (3) having two opposite annular friction surfaces (4, 5) extending about a rotational axis (A) of the base body (2), by casting the base body (2) from metal, and optionally forming a friction surface (4, 5) between the friction surfaces (4, 5). The region of the annular friction surface (4, 5) and / or the region of the hub contact surface (7) are / is subjected to material removal such that the annular friction surface (4, 5) has a radial inclination (W1) with respect to the hub contact surface (7). A wear-resistant layer (10) is subsequently produced on one or both friction surfaces (4, 5) in such a way that thermally induced stresses deform the annular friction surfaces (4, 5) during this process such that the absolute value of the radial inclination (W1) is reduced to a smaller absolute value of the radial residual inclination (W2).

The invention discloses a polishing method and system for controlling LTV at a marking hole of a SiC wafer, and relates to the technical field of semiconductor manufacturing. A polishing solution is adopted to carry out chemical mechanical polishing on the SiC wafer with the laser marking hole under the polishing process parameters; the polishing solution comprises a KMnO4 oxidizing agent with the mass fraction of 10% + / -3% and a mixed grinding material of Al2O3 and CeO2, the particle size of the Al2O3 grinding material is 250-350 nm, the particle size of the CeO2 grinding material is 80-120 nm, the mass ratio of Al2O3 to CeO2 is 1: 1, the mass fraction of Al2O3 and CeO2 in the polishing solution is 5%-6%, and the polishing solution is maintained to be acidic. The material removal rate of the marking hole area and the material removal rate of the wafer body area are highly consistent, the SiC wafer surface with the ultrahigh flatness is obtained, local thickness changes, caused by laser marking, around the marking hole are restrained, and the overall quality and yield of SiC wafer manufacturing are improved.

This invention provides a method and system for controlling the polishing pressure of a thermos cup, relating to the field of cup polishing control technology. The method includes the following steps: determining whether the polishing wheel encounters a localized hard spot in the weld area based on torque data and material removal rate; when the polishing wheel encounters a localized hard spot, dynamically adjusting the processing parameters according to a preset parameter adjustment priority, and controlling the polishing tool to process the cup according to the adjusted processing parameters; and recalculating the material removal rate after each adjustment of the processing parameters until the material removal rate reaches a preset target value. This invention aims to solve the technical problems in existing thermos cup polishing technology, such as uneven polishing due to localized hard spots in the weld area, difficulty in controlling the material removal rate, and the risk of workpiece damage from directly increasing polishing pressure, significantly improving polishing quality and product yield.

The invention discloses an electrochemical polishing solution for laser additive manufacturing of a tantalum material and a preparation method and process, and relates to the technical field of surface treatment of metal workpieces. According to the electrochemical polishing solution, an alcohol-salt system is adopted for electropolishing treatment, and compared with a traditional electropolishing solution, the electrochemical polishing solution has the advantages of electrochemical and chemical stability, relatively high conductivity, relatively high controllability, relatively low toxicity, low volatility, environment friendliness and the like; the electropolishing solution has the characteristics of no volatilization, no odor, low toxicity to a human body and the like by adding the inorganic solid acid formed by replacing sulfamic acid sulfuric acid hydroxyl with amino, and not only has the oxidation capacity of sulfuric acid, but also can promote dissolution and improve the material removal rate by the amino; the electrochemical polishing solution is mild in process parameter, insensitive to temperature, capable of implementing polishing at room temperature, small in corrosion to electrolysis equipment and capable of being used for a long time.

In one embodiment, a polishing composition can comprise abrasive particles including zirconia, an oxidizing agent including hydroxylamine and water. The polishing composition can have a high copper removal rate of at least 3500 Å / min, and a polishing selectivity of copper to silicon dioxide(Cu:SiO2) can be at least 2.5:1. In another embodiment, a combination product can comprise a first polishing composition and a second polishing composition, wherein each of the first polishing composition and the second polishing composition can comprise abrasive particles including zirconia and an oxidizing agent including hydroxylamine, wherein a hydroxylamine weight% ratio of the first polishing composition to the second polishing composition may be at least 5:1.

The utility model relates to copper wire processing technical field, and specifically is a kind of for copper wire processing's hot melting connection device, including flash butt welding machine and melting material removal component, the rack discharge end of flash butt welding machine is equipped with equipment box by bolt, the melting material removal component is installed on equipment box and passes through, and the centre of melting material removal component is aligned with the clamping surface of the electrode clamp of flash butt welding machine, the melting material removal component includes first mounting disc and second mounting disc, and the first mounting disc and second mounting disc are coaxially arranged. By flash butt welding machine and melting material removal component, a set of steel wire hot melting connection device with the function of removing the excess melting material of steel wire interface peripheral is formed, the interface peripheral of steel wire is removed by melting material removal component after the equipment box, so that the diameter of steel wire interface peripheral is consistent with steel wire, and the subsequent use effect of steel wire is guaranteed.

This application discloses a feedback control method for the material removal rate during sapphire substrate polishing, relating to the field of precision machining control technology. The method pre-establishes a tool head wear compensation model and a mapping model between the material removal rate and process parameters, generating a priority list of adjustment variables based on the sensitivity coefficients of each process parameter. During polishing, the measured material removal rate is obtained after detecting spacing changes using a non-contact displacement sensor array and compensating for tool head wear. The deviation between this rate and the target value is calculated cyclically according to the sampling period. Parameter adjustments are implemented using an incremental control law based on the priority list of adjustment variables. When the adjustment variable reaches its range boundary, the process automatically switches to the next level of process parameters. Simultaneously, the thickness of the removed material is accumulated, and polishing stops when the target value is reached. This application overcomes rate drift caused by polishing slurry degradation, tool head wear, and environmental disturbances, significantly improving the batch-to-batch thickness consistency and removal accuracy of sapphire substrates.