1269 results about "Material removal" patented technology

The invention relates to the technical field of material removal in laser processing, in particular to a laser positioning stripping system and method for special-shaped neodymium iron boron waste, and the method comprises the following steps: S1, carrying out multispectral scanning on the surface of the special-shaped neodymium iron boron waste; s2, dynamically adjusting energy parameters of laser lift-off, and constructing an energy thickness matching model; s3, generating a fractal scanning path of the adaptive special-shaped surface based on the geometric contour data of the three-dimensional characteristic spectrum; s4, in-situ surface roughness detection is carried out in the laser lift-off process, a secondary finishing mode is triggered according to a detection result, and the safe lift-off allowance is dynamically corrected based on lift-off depth data; and S5, in-situ separation of the oxide layer fragments and the matrix particles is achieved through the hot air flow field in combination with the gas-solid separation dynamics principle, and matrix particle recovery is assisted and strengthened through the magnetic field. The laser energy, the scanning path and the thermal control strategy can be dynamically adjusted according to real-time data, so that material loss and waste are effectively avoided, and the processing efficiency and the recovery rate are improved.

The invention discloses a double-force-control automatic compensation method and double-force-control grinding and polishing integrated device.According to the technical scheme, the double-force-control automatic compensation method comprises the steps that workpiece surface crystal orientation data are obtained through a diffraction pattern, and a crystal orientation distribution matrix is generated through denoising and clustering analysis; dividing a crystal orientation region and associating the friction coefficient, hardness and other mechanical properties; based on the material removal rate distribution matrix, a gradient algorithm is adopted to correct grinding tracks and cutting parameters of all areas, and a compensation track matrix is generated; and double-force-control feedback of normal force and tangential force is combined, the abrasive particle contact force and the feeding rate are dynamically adjusted, and a closed-loop compensation strategy is formed. Through crystal orientation partition optimization and double-force-control dynamic compensation, the problem that compensation is insufficient in the grinding process of the glass crystal is solved, and high-precision and self-adaptive surface machining is achieved.

The invention discloses a visual precise plastic mold surface milling system and method, and the method comprises the steps: obtaining and analyzing the surface topography data of a milling region and a tool displacement track in real time through an optical sensor, and extracting wear-related micro-deformation features through multi-band filtering processing; generating a deviation vector matrix through three-dimensional mapping of the deviation vector matrix and a reference curved surface, and realizing dynamic calculation and path correction of the cutter offset; the high efficiency and stability of the compensation cutting process are ensured by combining the self-adaptive adjustment of the rotating speed and the feeding rate of the main shaft; meanwhile, the compensation effect is projected to a visual interface in real time to form a comparison layer, hardware acceleration is started to maintain the system response speed when the frame rate fluctuates, and finally the material removal volume is evaluated according to the deviation vector matrix to intelligently control the machining cycle termination time. Therefore, the problem of microtopography deviation caused by tool abrasion in the milling process of the complex curved surface mold is effectively solved, and the machining precision and efficiency as well as the robustness and the automation level of the system are remarkably improved.

The invention provides a titanium alloy thin-wall part high-precision milling method and system based on dynamic compensation, and the method comprises the following steps: constructing a multi-physics field coupling model based on the constitutive relation and milling process parameters of a titanium alloy material; according to the method, a multi-physical field coupling model represented by dynamic parameters is constructed, structural feature recognition and coupling weight dynamic allocation are combined, and the model is iteratively optimized through a detection result after processing, so that the problem that a traditional prediction model is disjointed from an actual working condition is solved; by building a real-time monitoring and feedback system and combining a dynamic compensation closed-loop mechanism, non-interruption linkage of monitoring-adjustment in the machining process is achieved, and the problem that the hysteresis of a traditional compensation method is remarkable is solved; the initial compensation amount is optimized through a multi-objective genetic algorithm, a self-adaptive processing path strategy is adopted, dynamic parameter adjustment of structure adaptation is combined, a traditional single compensation strategy is replaced, and the problem of dynamic rigidity change in the complex curved surface and material removal process can be flexibly solved.

The invention discloses a discrete point-based cutting force prediction method supporting any cutting edge shape, and relates to the technical field of milling machining.The discrete point-based cutting force prediction method comprises the steps that firstly, a workpiece and a tool are both expressed in a discrete model, a milling track is defined as a series of linear segments through NC codes, and a tool and cutting edge model and a Tri-Dexel workpiece model are built; secondly, a tool swept volume is obtained, and material removal is calculated; then subdividing the tool motion into smaller analysis steps to obtain the cutting condition of each turn, determining the cutting meshing area of each analysis step and blade elements participating in cutting, and calculating the nominal instantaneous undeformed chip thickness of each blade element based on the actual feeding direction, the normal vector and the compensation coefficient; then, discretizing the cutting condition into a plurality of orthogonal cutting units, and predicting the cutting force of each participating blade element by adopting a neural network trained based on simulation data; and finally, integrating the cutting forces of all participating blade elements to obtain a synthetic cutting force field of each analysis step. According to the method provided by the invention, the force field prediction capability in a variable geometry processing scene is effectively improved.

The invention provides a five-axis series-parallel numerical control machine tool machining process virtual monitoring simulation method and system based on digital twinning, and the method comprises the steps: building an information interaction mechanism between a physical machine tool and a digital twinning model, enabling a server side to collect sensor data, and transmitting the real-time data to a client side through a communication protocol; the client processes the data and drives the digital twin model. And aiming at potential errors of twin system forecast, tool setting error compensation can be carried out in real time, so that the machining precision is improved. Meanwhile, the system supports an offline simulation function, combines an inverse kinematics algorithm and an NC code, fuses a material removal model, simulates a machining process, evaluates machining performance and errors, and provides an optimization basis for machining strategies of workpieces with different geometrical shapes and materials. According to the method, bidirectional interaction between the physical entity and the virtual model is achieved, the real-time monitoring and visualization capability of the machining process is enhanced, a reliable simulation evaluation and optimization means is provided for machining of complex parts, and the method has wide industrial application prospects.

The present invention discloses a laser metal curved surface automatic focus processing system and method thereof, including: a multimodal data fusion device, a curved surface detection module with a secondary tracking structure, integrated 3D structured light vision and vibration sensing equipment; a dynamic focus correction module, configured with an adaptive energy control unit and a beam shaping component; a nonlinear motion control console, including a six-degree-of-freedom parallel mechanism motion platform, and its servo control system integrates a time-space phase compensation algorithm; a core control unit, the core control unit has an embedded fusion algorithm model, and establishes a nonlinear mapping between material removal efficiency η and multivariable dynamic parameters. The processing quality level of the present invention is improved through the multi-source data fusion of 3D structured light and vibration sensing, the curvature recognition accuracy is improved, and the focus offset is reduced in combination with the axial vibration compensation mechanism, thereby effectively improving the processing quality.

The invention relates to an implicit voxel Boolean subtraction optimization method in five-axis machining simulation. According to the method, an implicit tool geometric expression model based on a symbolic distance function is constructed, and a dynamic voxel modeling technology with a layered structure is combined, so that efficient interactive modeling of a material removal process between a tool and a workpiece is realized. The whole process of the method comprises four key stages of spatial positioning, vertex interference detection, projection correction and grid reconstruction, and can cope with geometric modeling challenges caused by continuous motion of a multi-degree-of-freedom and multi-attitude cutter. A dynamic block loading mechanism and a local state synchronization strategy are introduced, so that the real-time response capability of Boolean subtraction operation under complex working conditions is effectively improved, and meanwhile, the continuity and integrity of machining geometric boundaries are kept. The method has good expandability and robustness, obviously reduces space-time complexity of calculation on the basis of keeping geometric surface continuity and topological correctness, realizes millisecond-level response time in an experiment, and has a good application prospect. The method is widely applied to virtual machining simulation and intelligent process verification systems of complex free-form surface parts such as aero-engine blades and automobile structural parts.

The invention discloses an alloy part small-deformation machining path planning method and system, and the method comprises the steps: obtaining machining parameters, and building a part rigidity evolution prediction model based on a material removal process; carrying out residual stress testing on the surface of the blank, and constructing a part residual stress initial distribution model; performing multi-physics field coupling on the part rigidity evolution prediction model based on the material removal process and a constructed part residual stress initial distribution model to obtain a coupling model, simulating the material removal process under a preset processing path, and correcting part deformation predicted by the coupling model through simulation experiment data; and a small-deformation machining path is obtained based on the mapping relation between the part deformation and the machining path. Through staged rigidity calculation and stress partitioning, the deformation prediction precision is improved.

The invention relates to the technical field of numerical control machining, in particular to a CNC cutting path optimization method and system based on quantum computing. The optimization method comprises the following steps: acquiring a three-dimensional geometric model and a cutting process parameter set of a target workpiece, wherein the cutting process parameter set comprises a cutter diameter, a feeding rate, a cutting depth and a material removal rate threshold value; and constructing a multi-objective optimization model with the purposes of minimizing the total length of the path, maximizing the load balance degree of the cutter and minimizing the idle stroke time. According to the method, a quantum-classical coupled multi-objective optimization model is constructed, the spatial correlation of cutting path points is mapped into the entanglement strength between quantum bits, and the curse limitation of dimensionality of a traditional optimization algorithm is broken through by using the parallel tunneling capability of a quantum annealing processor.

The invention discloses a cutting device and a cutting method. The cutting device comprises a cutter, an energy supply assembly and a liquid guide assembly. The cutter is used for cutting a workpiece to be machined, and the cutter is made of a light-transmitting material. The energy supply assembly is configured to be capable of emitting laser, the laser penetrates through the tool and irradiates a machining part at the cutting position of the tool, the liquid guide assembly is suitable for providing reaction liquid for the machining part, and the reaction liquid is configured to be used for reacting with the machining part under irradiation of the laser so that materials of the machining part can be modified. And therefore, the difficulty in machining of the material at the machining part is improved, and the cutter can remove the material at the machining part of the to-be-machined workpiece conveniently. Under the dual effects of an energy field provided by the energy supply assembly and physical and chemical reactions of the reaction liquid, the material property of the processing part is rapidly and accurately changed, and on the premise of ensuring the processing quality, the controllability of material modification is realized, and the modification efficiency of the material is improved.

The invention relates to a machining path planning system, in particular to the technical field of intelligent manufacturing and numerical control machining, and overcomes the defect that a thermal coupling effect is ignored in traditional geometric planning by constructing an evolution model fused with a physical law. A dynamic decoupling algorithm is utilized to extract a real cutting load from multi-source data and reconstruct a rigidity field changing along with material removal in real time, the problem that a physical boundary is difficult to perceive under a complex working condition is solved, and the system effectively eliminates size out-of-tolerance caused by heat accumulation through transient deformation advanced prediction. According to the method, the non-linear error is actively counteracted in cooperation with a reverse compensation strategy based on sensitivity analysis, the machining precision and surface quality of the thin-wall weak-rigidity part are remarkably improved, the rejection rate and trial cutting cost are reduced, and intelligent closed-loop control over the manufacturing process is achieved.

The invention relates to the technical field of polishing solutions, in particular to an efficient and environment-friendly chemical polishing solution and a preparation method thereof. The chemical polishing solution comprises the following raw materials in percentage by weight: 5%-8% of a nano metal abrasive, 2%-4% of a silicon oxide abrasive, 2%-10% of an oxidizing agent, 1%-5% of a complexing agent, 0.05%-0.5% of a corrosion inhibitor and the balance of deionized water. The chemical polishing solution further comprises a pH regulator, and the pH of the chemical polishing solution is regulated to 7.5-8.5 by adopting the pH regulator. The chemical polishing solution disclosed by the invention adopts environment-friendly raw materials, shows a good polishing effect when being used for precision machining of the monocrystalline silicon wafer, and is high in material removal efficiency, and the polished silicon wafer is smooth in surface and free of damage.

The invention discloses an anti-blocking self-passing type plastic molding device, which relates to the technical field of plastic product processing, and comprises a base station, a screw conveying component and a mold closing component, and a material pipe is fixedly mounted at a feeding hole in the upper part of the screw conveying component. In the working process of the injection molding machine, the driving motor drives the sliding barrel to rotate, through cooperation of the sliding column and the spiral groove, the pushing disc effectively pushes plastic materials in the material pipe, softening and blocking are avoided, meanwhile, the cutting knife is used for refining material particles, the pushing difficulty is reduced, and the production efficiency is improved; materials are screened through cooperation of screening holes and a blocking plate, large or unqualified materials are removed, it is ensured that the granularity of the raw materials is uniform, in the pushing process, a connecting rod and a sealing plate are matched, the interior of a material pipe is sealed after pushing is completed, the material pressure at the screening holes is increased through the double effects of sealing and extruding, and material circulation is promoted; the screening stability and the production quality are improved, and the finished product quality of plastic products is guaranteed.

The invention belongs to but not limited to the technical field of aviation, discloses a surface integrity constrained aircraft engine blade grinding and polishing process optimization method and system, and establishes a material removal model of a blade based on an orthogonal center combination experiment data set. And model input and output of machine learning are set, data are preprocessed, and the completeness of the grinding and polishing surface is predicted through a machine learning XGBoost algorithm. And obtaining multiple groups of solutions of the optimization variables according to an MSPSO particle swarm multi-objective optimization algorithm. And according to the multiple groups of solutions of the optimization variables, screening out a priority solution of each optimization target and a global optimal solution conforming to all constraints and optimization targets. According to the method, through analysis of a grinding and polishing experiment data set, a material removal model of the blade is established, and a material removal coefficient is calibrated. The model can quantitatively describe the influence of each process parameter on the material removal depth, and provides theoretical support for quantitative and accurate grinding and polishing processing of the aircraft engine blade.

The invention relates to the technical field of part manufacturing, in particular to a hollow non-straight section composite part which is characterized in that a low-melting-point alloy is used for manufacturing a core mold to serve as a forming inner mold, fiber prepreg is laid on the surface of the core mold and subjected to curing treatment to form a shell structure, finally, the inner mold is removed in a melting mode, and the hollow non-straight section composite part is obtained. According to the hollow non-straight composite material part manufacturing method, the characteristic that materials can be controllably removed is utilized, the mold design is greatly simplified, the manufacturing cost is reduced, and meanwhile the forming freedom degree of a complex geometric structure is improved.

The invention provides a wafer polishing method, a polishing device and processing equipment, the wafer polishing method is used for removing a target layer comprising a first layer and a second layer with similar friction coefficients, a primary polishing process comprises a first polishing stage and a second polishing stage, and the method comprises the following steps: determining first time; determining the material removal amount and the material removal rate of the wafer in the second polishing stage; calculating second time; adjusting the first time according to the second time to obtain third time; and polishing the current wafer, executing a first polishing stage according to a third time, and executing a second polishing stage according to a second time, so that the second layer reaches the target thickness. According to the polishing method, the chemical mechanical polishing efficiency and polishing precision of the specific wafer can be improved.

The invention relates to the technical field of blister trays, and discloses a blister tray rim charge cutting device which comprises a placing unit, a transmission unit and a cleaning unit, the placing unit comprises a workbench, a sliding door is arranged on the front side of the workbench, four supporting rods are fixedly installed above the workbench, and every two supporting rods are symmetrical to each other; a top plate is fixedly installed above the four supporting rods, and a hydraulic cylinder is arranged at the bottom of the top plate. According to the plastic uptake tray cleaning device, when a driving rod horizontally moves, the driving rod can drive a cleaning plate to move at the moment, so that the cleaning plate can be close to a plastic uptake tray body, and the plastic uptake tray body is always in a vertically upward moving state, so that the side wall of the polished plastic uptake tray body can be cleaned through the cleaning plate; and when the blister tray body leaves the cleaning plate, the worker controls the servo motor to stop running through the controller, and therefore the cut blister tray body can be taken out.

The invention belongs to the technical field of robot automatic force control polishing of optical elements, and particularly discloses a robot polishing force speed planning method and system considering the surface shape precision and the machining efficiency of the optical elements. The method comprises the steps that based on the Preston theory, a material removal model of the small grinding head polishing device is established; acquiring surface shape data of a detection point of the optical element, and planning a polishing path of the optical element in an off-line manner; discrete cutter points are fitted, a parameterized position curve is obtained, points are taken uniformly to obtain surface shape optimization resident points, and a unit material removal matrix is established in combination with a material removal model; and constructing a first-step optimization model and a second-step optimization model, and obtaining the optimized contact force and feed speed. According to the invention, optimization of contact force and feeding speed during optical element processing can be realized, and high-quality optical elements can be obtained with high efficiency.

Provided are a recirculation system (200) for a material removal machine (102) and a material removal system (100). A material removal system (100) includes a recirculation system (200) in fluid communication with a material removal cabinet (104) housing a material removal machine (102). The recirculation system (200) may have an upper reservoir (300) configured to drain fluid into a lower reservoir (204) before recirculating the fluid. The upper reservoir (300) may have a standpipe (320) configured to allow swarf, debris, and / or other material within the fluid to be entrained prior to flowing over the standpipe (320).

The invention discloses balance weight quality detection equipment, and relates to the technical field of balance weight detection, the balance weight quality detection equipment comprises an equipment base, a detection table is arranged above the equipment base, placing sinking grooves distributed at equal intervals are formed in the edge of the detection table, and the balance weight quality detection equipment further comprises a detection assembly, a clamping assembly and a material receiving assembly; the detection assembly comprises a stand column and a pair of folded rail grooves, a driving unit is arranged above the stand column, a detection unit is arranged at the bottom end of the stand column, and the driving unit drives the stand column to move along the folded rail grooves so as to make contact with or be separated from the balance block. The clamping assembly is arranged on the stand column, the material receiving assembly is used for receiving unqualified balance blocks, and the material receiving assembly comprises a storage box arranged on one side of a pair of folded rail grooves; the detection assembly and the clamping assembly are integrally designed, so that the structure integrates detection and material removal, and the detection efficiency is improved; and meanwhile, buffering material receiving is carried out on unqualified products, so that follow-up personnel can conveniently select products capable of being repaired.

The invention relates to a robot grinding allowance multi-time planning and force adjusting method and system. The method comprises the following steps: monitoring the change of the weld seam allowance in real time to obtain real-time actual weld seam allowance data; establishing a material removal rate model based on the historical polishing data and the material characteristics; wherein the historical polishing data comprises material removal amounts of materials with different material characteristics under different polishing parameters; the material removal rate model is used for predicting the material removal amount according to the actual polishing force and material characteristics; the grinding parameters comprise the grinding speed, the grinding path, the size and direction of grinding force and / or the inclination angle of a grinding tool; when deviation exists between the actual weld seam allowance data and the target allowance, grinding parameters are dynamically adjusted based on the material removal rate model; future polishing requirements are predicted according to the current polishing state, and polishing parameters are adjusted in advance. The grinding allowance consistency machining and grinding precision are improved, and the grinding quality and efficiency are improved.

The invention relates to the technical field of polishing trajectory planning, in particular to a polishing trajectory planning method for sub-aperture polishing, which comprises the following steps of: constructing a polishing material removal function based on a polishing load, a polishing tool rotating speed, a feeding speed, a polishing attitude angle, a polishing tool and a workpiece material attribute; optimizing the initial polishing tracks one by one according to a polishing material removal function; and the residence time is solved. According to the method, the controllability of distribution of the material removal amount in the time-space double domains in the polishing process is achieved, and the curved surface polishing quality and stability are improved.

The invention discloses a method for controlling CMP (chemical mechanical polishing) dish-shaped pits, corrosion pits and interface corrosion of ruthenium barrier layer copper wiring, which is suitable for a manufacturing process of integrated circuits of 14 nanometers and below. According to the method, a specifically synthesized TTAK corrosion inhibitor is introduced into a polishing solution system, the oriented adsorption characteristic of the molecular structure of the TTAK corrosion inhibitor is utilized, the corrosion reaction of copper is selectively inhibited, meanwhile, the normal material removal efficiency of a ruthenium barrier layer and a TEOS dielectric layer is maintained, and cooperative regulation and control of the removal rate of the Cu / Ru / TEOS material are achieved. By means of the method, dished pits, corrosion pits and Fang type interface defects generated in the fine polishing and barrier layer polishing process can be effectively eliminated, and copper / ruthenium interface corrosion is improved. According to the method, the global planarization quality of the copper interconnection ruthenium barrier layer is remarkably improved, the interface bonding strength and the electrical reliability of an interconnection circuit are enhanced, and an effective solution is provided for performance optimization of an advanced process integrated circuit device.

The invention relates to a polishing method for a hard and brittle free-form surface, in particular to a longitudinal-torsional composite ultrasonic vibration polishing method for inhibiting intermediate-frequency errors of the hard and brittle free-form surface, and solves the technical problem that an existing ultrasonic vibration polishing method cannot inhibit the intermediate-frequency errors of polishing of the free-form surface of a hard and brittle material. According to the method, a mechanical polishing method is adopted, longitudinal-torsional composite ultrasonic vibration is added to the polishing tool, so that the rotating motion and the feeding motion of the polishing tool are combined with the longitudinal-torsional composite ultrasonic vibration to form a space complex coupling polishing track, and the purpose that the polishing tool conducts polishing in the material removing direction according to the space complex coupling polishing track is achieved; by changing the amplitude and frequency of longitudinal-torsional composite ultrasonic vibration, the spatial attitude of a longitudinal-torsional composite ultrasonic vibration polishing time-varying removal function is changed in real time, so that the removal function of each polishing point is different under the action of a spatial complex coupling polishing track; therefore, the suppression of the intermediate-frequency error is realized.

The invention relates to a final polishing method for a wafer and a polished wafer. In the final polishing method for the wafer, the wafer comprises a first to-be-removed layer and a second to-be-removed layer, the first to-be-removed layer and the second to-be-removed layer are adjacent to each other and are made of different materials, and the final polishing method comprises the following steps: performing first polishing on the wafer to remove a part of the first to-be-removed layer; and performing second polishing on the wafer after the first polishing to remove the remaining part of the first to-be-removed layer and the second to-be-removed layer, the material removal rate of the second polishing being smaller than the material removal rate of the first polishing. By means of the final polishing method for the wafer, flatness deterioration of the wafer in the final polishing process stage can be avoided or relieved.

The invention relates to the technical field of stamping production devices, and discloses trailer production stamping equipment which comprises a stamping table, a lower die and an upper die, a stamping anti-deviation assembly for driving the upper die to vertically move is installed at the top of the stamping table, and stamping pushing parts are correspondingly installed on the two sides of the top of the lower die; stamping pushing pieces are correspondingly installed on the two sides of the top of the lower die. The stamping and anti-deviation effects can be achieved, anti-deviation precision and stability are achieved, stamping strength is high, edge warping is not prone to occurring, stamping quality is high, materials can be ejected out of the lower die, the situation that the materials are clamped in the lower die after stamping is avoided, die taking and demolding are convenient, the materials pushed to be demolded can be taken out of the die, and production efficiency is improved. The anti-deviation stamping device has the advantages that the anti-deviation stamping production capacity is excellent, the stamping precision is high, the stamping quality is good, automatic discharging and discharging are convenient, and the production efficiency is high.

A diesel engine crankshaft residual stress and deformation relation prediction method belongs to the technical field of internal combustion engine key component manufacturing. The method comprises the steps of dynamically correcting a finite element model through multi-stage measured data, performing high-precision reconstruction of a crankshaft residual stress field, establishing a quantitative relation between stress distribution and deformation, and combining numerical simulation and response surface method optimization to realize high-precision residual stress distribution prediction. And further analyzing the release and redistribution rules of the residual stress in the material removal process. Residual stress distribution is actively controlled to prolong fatigue life, and stable production of high-precision and long-life crankshafts is ensured. The grinding feeding rate is reduced through active control over residual stress in the grinding process so that the tensile stress peak value in the layer depth direction can be reduced, and meanwhile it is guaranteed that the surface roughness is within a proper interval. A gradient cooling strategy is adopted, the cooling liquid flow is increased in the initial grinding stage, and surface layer thermal stress accumulation is restrained. And the grinding wheel linear speed is controlled, and grinding efficiency and residual stress inhibition requirements are balanced.

The invention discloses a molten drop arc-laser induced additive and subtractive integrated manufacturing system and method. The method comprises the steps that raw materials are heated through one or more energy sources to form molten drops; multiple kinds of energy are synchronously applied to molten drops to form a composite molten pool, in-situ coupling of additive and subtractive materials is achieved, and material removal is conducted on a cladding layer while material adding is conducted in the composite molten pool; dynamically adjusting the energy ratio and spatial-temporal distribution of each energy field, and optimizing the droplet transition and metallurgical quality; when the temperature of the cladding layer is reduced to a solid-liquid mixing interval or a thermoplastic deformation interval, shaping and surface processing are carried out, and the ideal component shape and surface smoothness are achieved; energy field parameters are dynamically adjusted based on real-time feedback of multi-sensor data, residual stress is inhibited in combination with a heating compensation technology, the heating compensation technology is used for effectively controlling heat input and stress release, and it is ensured that the stress state of a component in the manufacturing process is effectively managed.

The invention relates to a water jet-laser / mechanical energy field cooperative precision machining method for a ceramic base material, and belongs to the field of laser-mechanical cooperative machining. During the execution period, the method comprises the following steps in sequence: firstly, carrying out rapid and low-damage precise material reduction on the ceramic matrix composite material through water jet assisted laser; and then, a superhard forming grinding wheel on the same machine tool is matched with mixed grinding fluid to conduct in-situ finishing and polishing on the surface obtained after material reduction. Wherein the surface quality can be improved while high-efficiency machining is ensured through the synergistic combination of laser and machinery. Through the in-situ grinding and polishing effect of the grinding wheel and the mixed grinding fluid, the precision of a formed surface is higher, and a damaged layer is thinner and even completely removed. Based on a water jet assisted laser milling / mechanical grinding and polishing collaborative machining strategy, rough machining, finish machining and fine polishing of the ceramic matrix composite can be completed on the same equipment, and the method has the characteristics of being high in precision, high in efficiency, high in quality and extremely low in surface damage.