3982 results about "Thin film solar cell" patented technology

A method of manufacturing improved thin-film solar cells entirely by sputtering includes a high efficiency back contact/reflecting multi-layer containing at least one barrier layer consisting of a transition metal nitride. A copper indium gallium diselenide (Cu(In_XGa_1-x)Se₂) absorber layer (X ranging from 1 to approximately 0.7) is co-sputtered from specially prepared electrically conductive targets using dual cylindrical rotary magnetron technology. The band gap of the absorber layer can be graded by varying the gallium content, and by replacing the gallium partially or totally with aluminum. Alternately the absorber layer is reactively sputtered from metal alloy targets in the presence of hydrogen selenide gas. RF sputtering is used to deposit a non-cadmium containing window layer of ZnS. The top transparent electrode is reactively sputtered aluminum doped ZnO. A unique modular vacuum roll-to-roll sputtering machine is described. The machine is adapted to incorporate dual cylindrical rotary magnetron technology to manufacture the improved solar cell material in a single pass.

A thin-film solar cell (10) is provided. The thin-film solar cell (10) comprises a flexible metallic substrate (12) a having a first surface and a second surface. A back metal contact layer (16) is deposited on the first surface of the flexible metallic substrate (12). A semiconductor absorber layer (14) is deposited on the back metal contact. A photoactive film deposited on the semiconductor absorber layer (14) forms a heterojunction structure and a grid contact (24) deposited on the heterjunction structure. The flexible metal substrate (12) can be constructed of either aluminium or stainless steel. Furthermore, a method of constructing a solar cell is provided. The method comprises providing an aluminum substrate (12), depositing a semiconductor absorber layer (14) on the aluminum substrate (12), and insulating the aluminum substrate (12) from the semiconductor absorber layer (14) to inhibit reaction between the aluminum substrate (12) and the semiconductor absorber layer (14).

A thin-film solar cell having a hetero-junction of semiconductor and the fabrication method thereof are provided. Instead of the conventional hetero-junction of III-V semiconductor or homo-structure of IV semiconductor, the thin-film solar cell according to the present invention adopts a novel hetero-junction structure of IV semiconductor to improve the cell efficiency thereof. By adjusting the amount of layer sequences and the thickness of the hetero-junction structure, the cell efficiency of the thin-film solar cell according to the present invention is also optimized.

A photovoltaic module comprises a first group of solar cells; a second group of solar cells; a first interconnection member extending across a first surface of the first group of solar cells and across a first surface of the second group of solar cells to connect the first and second groups of solar cells in parallel; and a second interconnection member extending across a second surface of the first group of solar cells and across a second surface of the second group of solar cells.

The metallic components of a IB-IIIA-VIA photovoltaic cell active layer may be directly coated onto a substrate by using relatively low melting point (e.g., less than about 500° C.) metals such as indium and gallium. Specifically, CI(G)S thin-film solar cells may be fabricated by blending molten group IIIA metals with solid nanoparticles of group IB and (optionally) group IIIA metals. The molten mixture may be coated onto a substrate in the molten state, e.g., using coating techniques such as hot-dipping, hot microgravure and/or air-knife coating. After coating, the substrate may be cooled and the film annealed, e.g., in a sulfur-containing or selenium-containing atmosphere.

The present invention relates to new methods for manufacturing photovoltaic devices and an apparatus for practicing those methods of manufacture. The present invention employs a transfer-through system for advancing work piece substrates through an integrated apparatus of multiple treatment chambers that control each of the manufacturing processes.

The present invention provides module structures and methods of manufacturing rigid or flexible photovoltaic modules employing thin film solar cells fabricated on flexible substrates, preferably on flexible metallic foil substrates. The solar cells may be Group IBIIIAVIA compound solar cells or amorphous silicon solar cells fabricated on thin stainless steel or aluminum alloy foils. In one embodiment, initially a solar cell string including two or more solar cells is formed by interconnecting the solar cells with conductive leads or ribbons. At least one bypass diode electrically connects conductive back surfaces of at least two solar cells. The bypass diode and the solar cells are encapsulated with support material and are packed with the protective shell such that the at least one bypass diode is placed between at least one solar cell and the bottom protective sheet. The bypass diode is thermally connected to the back conductive surface of one of the solar cells so that the back conductive surface of the solar cell functions as a heat sink.

A thin film solar cell includes: a transparent conductive film arranged on a translucent insulating substrate; first and second separation trenches orthogonal to each other on the translucent insulating substrate and separating the transparent conductive film; and a first opening trench parallel to the first separation trench and second opening trenches parallel to said second separation trench, orthogonal to each other on the translucent insulating substrate; wherein solar cells formed on the translucent insulating substrate are arranged at adjacent positions with said first opening trench positioned therebetween and at adjacent positions with said second opening trench positioned therebetween; pairs of said solar cells adjacent to each other with said first opening trench positioned therebetween are electrically connected, and among pairs of solar cells positioned adjacent to each other with the second opening trench in between, some are electrically connected to each other, and others are electrically insulated from each other. Method of manufacturing the thin film solar cell is also provided.

Methods for manufacturing three-dimensional thin-film solar cells 100, using a template. The template comprises a template substrate comprising a plurality of posts and a plurality of trenches between said plurality of posts. The three-dimensional thin-film solar cell substrate is formed by forming a sacrificial layer on the template, subsequently depositing a semiconductor layer, selectively etching the sacrificial layer, and releasing the semiconductor layer from the template. The resulting three-dimensional thin-film solar cell substrate may comprise a plurality of single-aperture unit cells or dual-aperture unit cells. Select portions of the three-dimensional thin-film solar cell substrate are then doped with a first dopant, while other select portions are doped with a second dopant. Next, emitter 525 and base metallization regions 532 are formed.

The invention relates to a method for producing a photovoltaic thin film module (1) which is provided with a thin film solar cell system (2) that is mounted on carrier materials (3) and is covered with a compound (4) on at least one side of the surface, whereby said compound consists of an encapsulating material and is provided with a sealing layer (5) on the side of the surface thereof, said side being arranged on the thin film solar cell system (2). According to a covering method, the encapsulating material (4) and the thin film solar cell system (2), together with the carrier (3), are guided along one another and are pressed under pressure and at an increased temperature in such a way that a weather-proof, photovoltaic thin film module in the form of a compound (1) is designed. According to a method that can be carried out easily, a photovoltaic thin film module that is resistant to UV light, water vapour and other effects of the weather is provided. The photovoltaic module can additionally be provided with flexible characteristics by selecting the carrier material in such a way that said material is configured in the form of plastic foils or plastic foil compounds for instance.

Solar module structures and methods for assembling solar module structures. The solar module structures comprise pyramidal three-dimensional thin-film solar cells arranged in solar module structures. The pyramidal three-dimensional thin-film solar cell comprises a pyramidal three-dimensional thin-film solar cell substrate with emitter junction regions and doped base regions. The three-dimensional thin-film solar cell further includes emitter metallization regions and base metallization regions. The three-dimensional thin-film solar cell substrate comprises a plurality of pyramid-shaped unit cells. The solar module structures may be used in solar glass applications, building façade applications, rooftop installation applications as well as for centralized solar electricity generation.

The present invention provides a method of forming interconnects in a photovoltaic module. According to one aspect, a method according to the invention includes processing steps that are similar to those performed in conventional integrated circuit fabrication. For example, the method can include masks and etches to form isolation grooves between cells, and additional etches to form a conductive step adjacent to the grooves that can be used to form interconnects between cells. According to another aspect the method for forming the conductive step can be self-aligned, such as by positioning a mirror above the module and exposing photoresist from underneath the substrate at an angle one or more times, and etching to expose the conductive step. According to another aspect, the process can include steps to form grid lines in the module to improve current transport in the structure.

Disclosed is a thin-layer solar cell array system and a method for producing the same, having placed over a carrier substrate of plane design, a solar cell layer which is provided with at least one n-type conducting semiconductor zone (emitter) and at least one p-type conducting semiconductor zone (base) as well as a first and a second contact electrode, each of different electric polarity, which are each electrically connected to the emitter respectively to the base.The invention is distinguished by at least the first contact electrode being applied directly on the carrier substrate or separated by an electrically insulating layer, an electrically insulating layer being provided thereupon, and the solar cell layer being placed over the insulating layer, by at least one contact channel extending through the insulating layer and/or the solar cell layer in such a manner that the first contact electrode and the semiconductor layer zone of respective polarity inside the solar cell layer being electrically connectable by means of an electrically conducting material provided inside the contact channel, and by the second contact electrode like the first contact electrode being placed above or in the case of a conductive carrier layer also under the carrier layer and under the electrically insulating layer and the solar cell layer, and by at least one contact channel extending through the insulating layer and/or the solar cell layer in such a manner that the second contact electrode and the semiconductor layer zone of respective polarity inside the solar cell layer being electrically connected by means of an electrically conducting material provided inside the contact channel.

The inventions described herein generally relate to photovoltaic or solar module design and fabrication and, more particularly, to modules utilizing thin film solar cells. In one aspect is described a solar module and method of making the same that has a shield material that is both an electrical insulator and a moisture barrier provided at a location corresponding to at least one hole that is used to route a wiring member, such that the shield material seals the at least one hole against moisture entering into the internal space and electrically insulates the wires of the wiring member from the at least one metallic layer of the back protective sheet.

In a module of photovoltaic cells, a method of forming the module interconnects includes a single cutting process after the deposition of all active layers. This simplifies the overall process to a set of vacuum steps followed by a set of interconnect steps, and may significantly module quality and yield. According to another aspect, an interconnect forming method includes self-aligned deposition of an insulator. This simplifies the process because no alignment is required. According to another aspect, an interconnect forming method includes a scribing process that results in a much narrower interconnect which may significantly boost cell efficiency, and allow for narrower cell sizes. According to another aspect, an interconnect includes an insulator layer that greatly reduces shunt current through the active layer, which can greatly improve cell efficiency.

A template 100 for three-dimensional thin-film solar cell substrate formation for use in three-dimensional thin-film solar cells. The template 100 comprises a substrate which comprises a plurality of posts 102 and a plurality of trenches 104 between said plurality of posts 102. The template 100 forms an environment for three-dimensional thin-film solar cell substrate formation.

Film formation is conducted at a low temperature to improve conversion efficiency and productivity and to enable a wider choice of substrate materials to be used.

The invention relates to the light absorption layer of a CIS compound semiconductor thin-film solar cell and to a method of forming the layer. The light absorption layer comprises a compound represented by Cu_x(In_1-yGa_y)(Se_1-zS_z)₂ and having a chalcopyrite type structure, the proportions of the components satisfying 0.86≦x≦0.98, 0.05≦y≦0.25, 0≦z≦0.3, x=αT+β, α=0.015y−0.00025, and β=−7.9y+1.105, provided that T (° C.) is anneal temperature and the allowable range for x is ±0.02. The layer is formed by the selenization method at a low temperature (about 500≦T≦550). As the substrate is used a soda-lime glass having a low melting point.

Solar module structures 210 and 270 and methods for assembling solar module structures. The solar module structures 210 and 270 comprise three-dimensional thin-film solar cells 110 arranged in solar module structures 210 and 270. The three-dimensional thin-film solar cell comprises a three-dimensional thin-film solar cell substrate (124 and 122, respectively) with emitter junction regions 1352 and doped base regions 1360. The three-dimensional thin-film solar cell further includes emitter metallization regions and base metallization regions. The 3-D TFSC substrate comprises a plurality of single-aperture or dual-aperture unit cells. The solar module structures 270 using three-dimensional thin-film solar cells comprising three-dimensional thin-film solar cell substrates with a plurality of dual-aperture unit cells may be used in solar glass applications. The solar module structures 210 using three-dimensional thin-film solar cells comprising three-dimensional thin-film solar cell substrates with a plurality of single-aperture unit cells may be used in building façade and rooftop installation applications as well as for centralized solar electricity generation.

The present invention provides a photovoltaic thin-film solar cell produced by a providing a vertically oriented pallet based substrate to a series of reaction chambers where layers can be sequentially formed on the pallet.

A high-resistance buffer layer and a window layer (transparent conductive film) are successively formed by the MOCVD method to obtain the same output characteristics as in conventional film deposition by the solution deposition method and to simplify a film deposition method and apparatus. Thus, the cost of raw materials and the cost of waste treatments are reduced to attain a considerable reduction in production cost.

After a metallic base electrode layer 1B and a light absorption layer 1C are formed in this order on a glass substrate 1A, a high-resistance buffer layer 1D and a window layer 1E are successively formed in this order in a multi layer arrangement on the light absorption layer 1C of the resultant semifinished solar cell substrate by the MOCVD method. Consequently, a film deposition method and apparatus are simplified and the cost of raw materials and the cost of waste treatments can be reduced.