Patents
Literature
Eureka-AI is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Eureka AI

5129results about "Grinding feed control" patented technology

System and method for grinding industrial robot on basis of visual information

The invention relates to a system and a method for grinding an industrial robot on the basis of visual information. In the system, the image of a workpiece is collected by a video camera; the workpiece is positioned by computer recognition; the movement locus points of a mechanical arm from the current position to a fetching position are planned on line to control the mechanical arm to fetch the workpiece; and then, the revolving speed and the revolving direction of an abrasive belt are controlled by a preset operation step of grinding so as to control the industrial robot to move the workpiece to an appointed position and gesture for grinding and polishing the workpiece. In the system, the video camera collects the image of the workpiece in real time; the workpiece is identified and positioned by the computer to control the mechanical arm to fetch the workpiece; the movement of the industrial robot and the running state of a grinder in the workpiece grinding operation are controlled; the data end of a computer is connected with the data end of the control cabinet of the industrial robot; output locus points controls the industrial robot to move; and the data end of the computer is connected with the data end of the grinder to control the grinder to start and stop and control the revolving speed and the revolving direction of the abrasive belt.
Owner:INST OF AUTOMATION CHINESE ACAD OF SCI

Method and apparatus for post-polish thickness and uniformity control

A method for polishing wafers includes providing a wafer having a process layer formed thereon; providing a polishing tool having a plurality of control zones and being adapted to polish the process layer based on an operating recipe, the operating recipe having a control variable corresponding to each of the control zones; measuring a pre-polish thickness profile of the process layer; comparing the pre-polish thickness profile to a target thickness profile to determine a desired removal profile; determining values for the control variables associated with the control zones based on the desired removal profile; and modifying the operating recipe of the polishing tool based on the values determined for the control variables. A processing line includes a polishing tool, a metrology tool, and a process controller. The polishing tool is adapted to polish a wafer having a process layer formed thereon based on an operating recipe. The polishing tool includes a plurality of control zones and the operating recipe includes a control variable corresponding to each of the control zones. The metrology tool is adapted to measure a pre-polish thickness profile of the process layer. The process controller is adapted to compare the pre-polish thickness profile to a target thickness profile to determine a desired removal profile, determine values for the control variables associated with the control zones based on the desired removal profile, and modify the operating recipe of the polishing tool based on the values determined for the control variables.
Owner:GLOBALFOUNDRIES INC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products