6739results about "Grinding feed control" patented technology

The invention relates to the technical field of grinding, in particular to a self-adaptive force control grinding system and method for a complex curved surface machining robot. Three-dimensional point cloud data of a workpiece are obtained through machine vision, gridding processing is carried out, and normal vector and curvature characteristic parameters are calculated; performing operation area division and operation path planning based on curvature characteristics; calculating operation parameters according to the normal vector and curvature characteristics; a self-adaptive impedance control algorithm is adopted, the polishing force is monitored in real time through a force sensor, and the rigidity and damping parameters of the robot are dynamically adjusted; and performing defect identification on the surface image of the processed workpiece by using the deep learning model, and when defects are identified, re-planning the operation path. According to the method, self-adaptive grinding of the complex curved surface workpiece is achieved, and the grinding efficiency and quality of the complex curved surface can be improved.

The invention relates to the technical field of grinding wheel monitoring, in particular to a centerless grinding machine full-life-cycle grinding wheel state monitoring system and method.According to the centerless grinding machine full-life-cycle grinding wheel state monitoring system and method, through combined difference extraction of a main shaft current mean value fluctuation ratio and a power gradient continuous variation value and assisted by transverse comparison of periodic response intervals, effective recognition of time period boundaries of working condition states is achieved; according to the method, operation stage division does not depend on static threshold judgment any more, a track trend is established through linkage judgment of an amplitude kick point and a slope extreme value, a dynamic evolution path of signal response is clearer, the identification resolution of abnormal changes and local deviation trends is improved, response synchronous identification of parameter state changes is achieved, and the identification accuracy is improved. In multi-signal collaborative analysis, directivity comparison between a temperature rise mutation fragment and a current residual error response is carried out, so that the consistency analysis capability of response logic between different monitoring paths is enhanced, and the real-time performance, stability and anti-interference capability of state identification are improved.

The invention relates to the technical field of optical engineering, in particular to an AI silicon carbide lens-oriented aspheric laser polishing precision online detection and feedback system. Comprising a detection module; the data processing module is electrically connected with the detection module and used for constructing a lens surface three-dimensional model and calculating polishing precision parameters; the feedback control module is electrically connected with the data processing module, is used for generating a feedback control strategy and comprises a strategy generation unit and a parameter optimization unit; an execution module; and an intelligent learning module. According to the design, a laser measuring head, an energy sensor array and an environment sensor are integrated through the detection module, synchronous acquisition of multi-dimensional data such as surface profile, laser energy distribution and environment parameters is realized, and three-dimensional point cloud data with consistent time and space are generated through multi-modal fusion processing (time domain synchronization, space registration and feature enhancement) of the data preprocessing unit; the physical essence of the polishing process is completely represented, and the detection comprehensiveness and the data relevance are improved.

The invention discloses a glass ceramic thickness detection method and a related device, and the method comprises the steps: obtaining a vibration signal generated in a glass ceramic thinning and grinding process, and extracting a vibration dominant frequency, a frequency spectrum centroid frequency and a frequency band energy distribution ratio as thickness characteristic parameters through fast Fourier transform processing; three-dimensional position coordinates of the grinding head are obtained, space mapping and weighted average processing are conducted on the thickness characteristic parameters, and space distribution of the thickness characteristic parameters is obtained; performing process interference compensation and sliding window time sequence smoothing processing according to the grinding process parameters to obtain stable thickness characteristic distribution; based on the stable thickness feature distribution and the current grinding process, final thickness distribution is predicted, and a thickness qualification pre-judgment result is obtained; and extracting a time sequence change characteristic of the thickness characteristic parameter as a vibration evolution index, and performing comprehensive quality evaluation in combination with a thickness eligibility pre-judgment result. According to the scheme, the thickness can be detected in real time in the thinning and grinding process of the microcrystalline glass, and the production efficiency is improved.

The invention relates to the technical field of grinding machining, and particularly discloses a crankshaft connecting rod grinding force dynamic error compensation method and system.The method comprises the steps that a prediction reference signal is collected; a grinding force signal of the grinding wheel spindle is collected based on a piezoelectric sensor; extracting spectrum characteristic parameters according to the predicted reference signal; predicting grinding force fluctuation information according to the spectrum characteristic parameters; a feedforward compensation instruction is generated according to the grinding force fluctuation information; generating a feedback compensation instruction according to the difference between the grinding force signal and the target grinding force of the current task; synthesizing the feedforward compensation instruction and the feedback compensation instruction to generate a compensation control instruction; according to the method, a control strategy combining feedforward and feedback is adopted, the response speed and compensation precision of a system to dynamic changes of grinding force are remarkably improved, accordingly, elastic deformation caused by fluctuation of the grinding force is effectively restrained, and finally the grinding machining precision and surface quality of key parts of the crankshaft connecting rod are improved.

The invention relates to the technical field of grinding machining, and discloses a blade grinding wheel abrasion loss online compensation method which comprises the steps that a dynamic hexagonal detection grid is constructed based on the rotating phase of a grinding wheel, non-repeated high-density sampling is achieved through a Fibonacci spiral expansion path, a detection area is dynamically adjusted to reduce the overlapping rate, and the blade grinding wheel abrasion loss is obtained. Micron-sized wear transition is accurately captured; dispersing the abrasion loss into minimum compensation units, constructing a dynamic state equation in combination with grinding force, dressing displacement and workpiece errors, introducing an attenuation coefficient related to the service life of a dressing wheel, and automatically correcting a model drift error; a grading triggering strategy of residual uncompensated quantity is adopted, dynamic decision making of a processing period is combined, and through integral multiple compensation and a margin temporary storage mechanism, it is ensured that long-term accumulative errors are restrained at the submicron level while overmodulation oscillation is avoided. Through the synergistic effect of space-time coupling detection, discrete-continuous double-domain modeling and intelligent compensation decision, the grinding wheel abrasion compensation precision and the system stability are remarkably improved.

The present invention belongs to the field of quality control of processed products, and discloses a digital twin control system for product processing quality. The digital twin control system establishes a real-time interactive digital twin system completely matched with an actual processing system according to the working principle of a CNC (Computer Numerical Control) system and the control strategy of a feedback loop of each moving part of the machine tool, extracts real-time following errors of each moving part of the machine tool during processing under different load fluctuations with respect to control needs for product processing quality, and establishes a dynamic digital twin control system for product processing quality through point-to-point real-time mapping, so as to achieve real-time monitoring of product quality. Processing parameters under stable following errors can be obtained based on the established digital twin control system to achieve real-time control of product processing quality.

The invention relates to the technical field of semiconductor chemical mechanical polishing, in particular to a pressure-adjustable double-frequency ultrasonic-assisted semiconductor chemical mechanical polishing device which comprises a rotary table, and a tray, a lower vibration plate, an upper vibration plate, a magnetic sheet and a polishing pad are sequentially stacked and fixed to the upper surface of a table plate of the rotary table from bottom to top. A piezoelectric ceramic piece is fixed to the middle of the lower surface of the upper vibration plate, a retaining sleeve is eccentrically placed on the upper surface of the polishing pad, a threaded sleeve is in threaded connection with the upper end of the outer side face of the retaining sleeve, a damping spring is fixed to the outer top face of the threaded sleeve, a supporting piece is fixed to the upper end of the damping spring, and an inner ring of a second electric sliding ring is fixed to the upper surface of the supporting piece. A transmission shaft is fixedly assembled in an inner ring of the second electric slip ring, a clamping sleeve is fixed to the lower end of the transmission shaft, and an ultrasonic vibrator is fixedly assembled in the clamping sleeve. The method solves the problems that an existing semiconductor chemical mechanical polishing technology is low in polishing speed, poor in surface quality after polishing and low in polishing qualification rate, and is suitable for semiconductor chemical mechanical polishing.

The invention relates to the field of wafer processing, and discloses a wafer grinding and polishing adjustment control system based on a tension sensor, which comprises a processing pressure acquisition module for acquiring the gravity of a heavy object, acquiring the tension of an electric cylinder in real time based on the tension sensor, calculating the processing pressure through a formula, and acquiring grinding state parameters of a wafer in real time; the processing pressure stability analysis module comprises a first analysis unit and a second analysis unit; the first analysis unit is used for calculating the accumulated variable quantity of the processing pressure in a preset monitoring period, comparing the accumulated variable quantity with a change threshold value and sending out an alarm signal; the second analysis unit inputs the grinding state parameters into a grinding state model to analyze a grinding state value, and reversely evaluates the state of the grinding disc; the adjusting control module adjusts the pulling force of the electric cylinder based on the first analysis unit and judges whether the grinding disc is replaced based on the second analysis unit. Accurate monitoring and stability control of the machining pressure are achieved, the state of the grinding disc can be effectively evaluated, and the wafer grinding and polishing quality and efficiency are improved.

The invention discloses a metal grinding machine tool grinding wheel wear compensation type intelligent control system, and relates to the technical field of mechanical manufacturing automation, and the system comprises a contact type reference detection module which is used for obtaining the initial contour and reference wear loss of a grinding wheel through discrete point measurement in a non-machining state; the multi-parameter non-contact real-time detection module is used for collecting acoustic emission, vibration and spindle current signals in the grinding process through three types of sensors; the grinding environment sensing module collects the temperature of a grinding area and the cutting fluid concentration; the intelligent control unit receives reference data and an environment signal, performs deep learning on a wear loss prediction model after multi-source data fusion, performs periodic reference calibration, analyzes the dynamic wear loss, and synchronously transmits the data to the data storage and tracing module; the executing mechanism adjusts grinding wheel feed amount compensation according to the dynamic abrasion loss; and the data storage and tracing module stores full-process data in real time. According to the system, high-precision and real-time wear compensation is achieved, the machining precision and consistency are improved, and high-end manufacturing requirements are met.

The invention discloses an automatic dovetail welding seam grinding control method based on robot visual positioning, and relates to the technical field of visual positioning. The method comprises the steps that after welding is completed, a dovetail welding seam image is collected and converted into a three-dimensional coordinate through a vision algorithm, and a three-dimensional point cloud is generated; smooth interpolation is performed on the three-dimensional point cloud through a B spline curve method to obtain a parameterized curve, and a control point set is optimized through a genetic algorithm to generate a global optimal polishing path; the polishing robot executes a task according to a path, a tail end sensor collects a real-time path and calculates a deviation value with a global path, and when the deviation value exceeds a preset threshold value, inverse kinematics is triggered to solve and correct the path; the hardness of the dovetail weld is measured through laser-induced breakdown spectroscopy, a comprehensive hardness value is obtained in combination with a matrix hardness database, meanwhile, a visual sensor collects the surface state, and polishing process parameters are dynamically adjusted according to the surface state; after the task is completed, the welding seam angle and flatness are detected. According to the method, the optimal path is generated through visual positioning, and automatic grinding of the dovetail welding seam is achieved.

The invention relates to the technical field of polishing, and discloses an intelligent steel rail polishing control method which comprises the following steps: acquiring surface and internal defect data of a steel rail through laser and ultrasonic fusion detection, discretizing the data into multi-dimensional nodes, and constructing a dynamic graph model comprising a microscopic-macroscopic dual-cluster neural network to predict a defect evolution trend; based on fractal dimensions and information entropy, multi-source data are dynamically fused, abnormities are eliminated, chaotic optimization and wear prediction are adopted to generate global optimal polishing parameters, and finally parameter dynamic adjustment is achieved through closed-loop feedback of pulse frequency and control errors. Steel rail defect collaborative perception is achieved through a multi-scale dynamic graph model, fractal-entropy weight dynamic fusion is combined to enhance data reliability, global optimal parameters are generated through chaos optimization and abrasion prediction, accurate grinding is achieved through pulse-error closed-loop control, and the method is simple and convenient to implement. The problems of data fusion failure, defect response lag, parameter local optimization and insufficient control precision in the prior art are solved.

The invention provides a grinding control method, device and equipment for a transmission gear and a storage medium, and the method comprises the steps that a three-dimensional digital model of the transmission gear to be ground is constructed according to multi-dimensional physical parameters and material parameters collected by the transmission gear to be ground; a multi-stage grinding process parameter set is generated according to the three-dimensional digital model and a process parameter database; determining grinding track data of the transmission gear to be ground according to the multi-stage grinding process parameter set and the three-dimensional digital model; performing dynamic simulation on the grinding track data, and optimizing the grinding track data based on simulation feedback; and grinding the transmission gear to be ground according to the optimized grinding track data. A personalized three-dimensional digital model is constructed by collecting multi-dimensional physical and material parameters, accurate generation and optimal control of a grinding track are achieved based on the model and a multi-stage process parameter set, and the machining precision of the gear grinding process is effectively improved.

The invention relates to the technical field of machining, in particular to an intelligent control system and method for sapphire substrate polishing, and the method comprises the following steps: S1, surface topography data acquisition: collecting surface roughness data and a three-dimensional topography distribution diagram of a sapphire substrate in real time; s2, generating characteristic parameters: extracting the surface waviness, the local recess depth, the bulge density, the lattice distortion index and the residual stress distribution gradient as the characteristic parameters; s3, dynamic parameter adjustment: generating a dynamic adjustment instruction of the polishing pressure, the rotating speed of the polishing disk and the supply rate of the polishing solution; s4, distribution optimization of the polishing solution: realizing uniform coverage of the polishing solution on the surface of the substrate; s5, stress real-time monitoring: generating a stress abnormity early warning signal; s6, outputting a closed-loop control instruction: feeding back a stress abnormity early warning signal to the adaptive control model, and iteratively correcting the dynamic adjustment instruction; according to the method, the risks of stress concentration and fatigue damage can be reflected in real time, and the safety and high efficiency of the polishing process are ensured.

An offline programming method for a full-six-axis CNC rough machining and polishing device. The method comprises: importing a three-dimensional model of a product into CAM software, interactively setting information of a workpiece coordinate system and a tool coordinate system of the three-dimensional model, selecting a route on which an operation is required, and generating path data; importing the three-dimensional model and the path data into offline programming software, and performing simplification processing on the path data; implementing an overall offset function, a single-point offset function and posture adjustment of the path data in the tool coordinate system; implementing simulation running of a tool and collision detection; on the basis of the path data and tool data, generating an NC program conforming to a program standard; and a six-axis device creating the workpiece coordinate system on the product; and monitoring a running state. Therefore, problems such as the polishing programming efficiency of products of complex structures being low, the follow-up reading, modifying and positioning being time-consuming due to the fact that CAM software exports excessive path data, and there being a certain difference between a model generation path and an actual device running path are solved.

The invention relates to a polishing process for improving local flatness of a silicon wafer, which belongs to the technical field of semiconductor manufacturing, and comprises the following operation steps of: 1, pretreating the silicon wafer, cleaning the silicon wafer, activating the surface of the silicon wafer, removing surface impurities and an oxide layer, and preparing for subsequent polishing; secondly, partition parameter setting is conducted, the wafer is scanned, the surface of the wafer is divided into a plurality of different areas, and independent polishing parameters are set for each area according to the material characteristics, the thickness and the preset flatness target of each area; and thirdly, dynamic polishing is conducted, specifically, multi-axis linkage polishing equipment is adopted, and the movement tracks and working parameters of the polishing head in different areas are dynamically adjusted in real time according to preset partition parameters. Through silicon wafer pretreatment, partition parameter setting and dynamic polishing process monitoring and feedback adjustment mechanisms, polishing process parameters can be accurately controlled, deviation in the polishing process can be corrected in time, and stability and consistency of polishing quality are ensured.

The invention relates to the technical field of automatic control, in particular to a numerical control grinding machine debugging control system based on intelligent industry, which comprises a wear area division module, a grinding wheel regulation and control module, a basic compensation value analysis module, a thermal error compensation module and a management database, according to the system, the abrasion area of the surface of the grinding wheel at each time point is obtained through threshold segmentation of the surface image of the grinding wheel at each time point, and the parameters of the grinding wheel are regulated and controlled based on the deviation value between the actual power and the target power of the grinding wheel at each time point; the instantaneous position error change rate of machine tool motion is calculated by collecting instruction positions and actual positions of machine tool motion at all sampling moments, so that a basic compensation value is obtained through analysis, a thermal compensation value is obtained through prediction of a temperature-thermal error mapping relation, a compensation value is obtained by combining the basic compensation value, and the compensation value is superposed to the instruction positions. And the self-adaptive optimization of the whole polishing process is realized.

The invention relates to the technical field of automobile part machining, and particularly discloses a crankshaft machining optimization method and system.The method comprises the steps that a grinding force signal and a vibration signal in the grinding process are collected; grinding feature information is obtained according to the grinding force signal, and vibration feature information is obtained according to the vibration signal; material hardness information is generated according to the grinding feature information; grinding stability information is generated according to the grinding feature information and the vibration feature information; on the basis of a preset strategy library, parameter adjustment amount is generated according to the material hardness information and the grinding stability information, and the parameter adjustment amount comprises feeding speed adjustment amount and / or grinding depth adjustment amount; according to the method, a grinding force signal and a vibration signal which are acquired in real time based on a sensor are converted into quantitative information reflecting the material hardness and the grinding stability, and the parameter adjustment amount is dynamically generated according to the real-time information based on a preset strategy library, so that the effect of considering the machining efficiency and the stability is achieved.

A double-track welding system is provided. A first track is detachably mounted on a first side of a weld seam of a workpiece, and a second track is detachably mounted on a second side of the weld seam of the workpiece. The first track and the second track are both mounted on a fixed support, and the fixed support can drive the first track and second track to move. At least one welding trolley is arranged on each of the first track and the second track. An image acquisition component is used for acquiring an image of a part to be welded; a weld seam scanning device is used for acquiring the weld seam morphology; and a control system is used for controlling, according to the image of the part to be welded, the fixed support to move.

The invention discloses a cast pipe inner wall grinding device and system and relates to the technical field of grinding equipment, the cast pipe inner wall grinding system comprises a rack, a rotary supporting device and a cast pipe inner wall grinding device, and the cast pipe inner wall grinding device comprises a grinding feeding mechanism, an anti-swing mechanism and a grinding mechanism; the grinding feeding mechanism comprises a first linear driving device, a first rotating power source, an outer fixing sleeve and an inner rotating shaft, the anti-swing mechanism comprises an outer rotating sleeve, a positioning wheel assembly and a distance adjusting mechanism, and the grinding mechanism comprises a second linear driving device and a grinding wheel body. The outer fixing sleeve is radially supported through the positioning wheel assembly, radial swing of the grinding wheel shaft is restrained, and the grinding stability can be improved; the distance adjusting mechanism can dynamically adjust the distance between the positioning wheel assemblies to adapt to cast pipes with different calibers; and the second linear driving device drives the grinding wheel to move in the radial direction, constant-pressure grinding is achieved in cooperation with the pressure detection device, the grinding rhythm is dynamically adjusted, the grinding effect can be improved, and the grinding consistency is improved.

The invention provides a peak value extraction method, a thickness measurement method and equipment. The method is applied to the high-precision measurement field. The method comprises the following steps: acquiring a frame of spectral signal of a wafer; performing peak extraction on the current frame spectral signal according to a preset intensity threshold value; when a peak is extracted, determining the peak value of the peak as a main peak value; obtaining a thickness guess value; performing reverse solving according to the thickness guess value and the main peak-to-peak value by using a thickness equation to obtain a secondary peak-to-peak value; and taking the main peak value and the secondary peak value as initial guess values of a double-peak pseudo Voigt fitting equation, and fitting the current frame of spectral signal to obtain a main peak value and a secondary peak value of the current frame of spectral signal. The method successfully solves the problem that the position of the secondary peak is difficult to accurately identify due to the fact that initial guess is missing and two peaks approach, and can accurately fit the peak value of the main peak and the peak value of the secondary peak of one frame of spectral signal.

The invention relates to the technical field of robot polishing quality prediction, and discloses an AI robot polishing quality prediction system based on digital twin drive, and the system comprises a process parameter collection module which can dynamically collect parameters such as processing track offset, judge quality deviation risk and trigger collaborative analysis; the surface topography analysis module extracts surface contour features through a white light interferometer, and quantitatively evaluates texture uniformity; the thermal distribution analysis module collects temperature field data and deduces a thermal coupling effect trend; the quality prediction fusion module is combined with the multi-dimensional data to generate a quality performance fusion index and track compensation and cooling adjustment signals; a process optimization generation module generates robot attitude compensation and cooling intensity adjustment parameters according to the parameters; the digital twin modeling module monitors virtual-real mapping consistency and outputs model confidence to correct a fusion index; and the dynamic optimization execution module forms closed-loop control. According to the system, accurate prediction and dynamic optimization of the polishing quality are achieved, and the machining quality and the production efficiency are improved.

The invention belongs to the technical field of piston rod machining equipment, particularly relates to a hydraulic oil cylinder piston rod machining device and a method thereof, and aims to solve the problem that an existing hydraulic oil cylinder piston rod machining device cannot integrally grind and polish a piston rod at a time. The bottom of the bearing platform is fixedly connected with the upper side of the base, the upper side of the base is fixedly connected with four symmetrical stand columns, and the upper sides of the four stand columns are fixedly connected with the same top plate. According to the hydraulic oil cylinder piston rod machining device and method, when the piston rod body is ground and polished through the device, fixing points, at the two ends of the piston rod body, of the clamp are switched; and therefore, when the device grinds and polishes the piston rod body, the whole piston rod body can be polished without halting, taking down the piston rod body and then fixing the piston rod body, the machining efficiency of the device on the piston rod body is remarkably improved, and the yield of the device is improved.

The invention relates to the technical field of process optimization, and discloses an optical fiber grinding process optimization method and device.The method comprises the steps that friction force monitoring is conducted on a contact interface of an optical fiber end face and a grinding diaphragm, and dynamic friction force data are obtained; performing instantaneous friction coefficient calculation based on the dynamic friction force data to obtain friction coefficient time domain change data in the grinding process; according to the friction coefficient time domain change data, geometric error prediction is carried out by combining the interference fringe density distribution data of the optical fiber end face, and end face curvature radius deviation data and vertex offset are obtained; and synchronous compensation is conducted based on the end face curvature radius deviation data and the vertex offset, a grinding track adjusting instruction and a contact pressure control instruction are output, synchronous optimization of the grinding track and the contact pressure is achieved, and the stability and effectiveness of compensation control are improved.

The invention relates to the technical field of optical manufacturing and processing control, in particular to an intelligent control system of lens processing equipment, which comprises a process relationship pre-storage module, a pressure distribution acquisition module, a surface shape error prediction module, a pressure compensation decision module, an actuator control module and a processing effect verification module. Wherein the process relation pre-storage module is used for establishing a pressure-removal rate relation mapping table; the pressure distribution acquisition module is used for acquiring pressure distribution data; the surface shape error prediction module is used for predicting surface shape error data generated by the lens; the pressure compensation decision module is used for generating a regionalized pressure compensation amount; and the actuator control module is used for dynamically adjusting the pressure applied to different areas of the lens by the polishing head. According to the method, by constructing the pressure-removal rate mapping and closed-loop self-calibration mechanism, intelligent pressure regulation and control and surface shape error dynamic correction in the lens polishing process are achieved, and the machining precision and stability are remarkably improved.

The invention particularly relates to a grinding force closed-loop control and flutter suppression system for crankshaft variable stiffness machining, and aims to solve the problems of unstable grinding force, flutter and surface defects caused by time-varying stiffness characteristics of a crankshaft due to a multi-crank throw and cantilever supporting structure. The system comprises a grinding force detection module, a control module and an execution module. The grinding force detection module is arranged in a grinding wheel and crankshaft contact area and collects grinding force signals in real time. The control module receives an actual grinding force signal, compares the actual grinding force signal with a target value, and outputs a compensation instruction and a suppression instruction; the compensation instruction is generated by adopting a self-adaptive PID or fuzzy PID algorithm based on force deviation, and the grinding wheel feeding speed or the main shaft rotating speed is dynamically adjusted to stabilize the grinding force; and extracting a high-frequency component of the force signal as a flutter feature, identifying a flutter bud through time-frequency analysis, and generating an anti-phase displacement instruction to suppress flutter. The execution module adjusts feeding or rotating speed according to the compensation instruction and adjusts radial displacement of the crankshaft or the grinding wheel according to the suppression instruction.

The invention discloses a wafer polishing laser interference closed-loop pressure control method, and relates to the technical field of semiconductor manufacturing, and the method comprises the following steps: S1, triggering an automatic measurement program after a ceramic plate and a wafer are overturned; s2, driving a laser interference measuring head to perform non-contact scanning on T2 / T4 point positions of the wafer through a six-axis mechanical arm positioning system to obtain thickness distribution data; s3, fitting the thickness distribution data by adopting a Zernike polynomial to generate a three-dimensional distribution diagram, and calculating a pressure correction amount based on a process dynamic model and a pressure prediction model constructed by a support vector machine regression algorithm; s4, detecting a data outlier in real time through an exception handling module, and triggering an equipment protection strategy when the deviation exceeds a set threshold value; and S5, a pressure control instruction is transmitted to the polishing head through the PROFINET bus by means of the PLC. Through non-contact laser interference measurement, the laser interference technology is applied to thickness detection of the polished wafer for the first time, the single measurement time is shorter than 20 seconds, and the detection efficiency is remarkably improved.

The invention belongs to the technical field of numerical control machine tool control, and discloses a deep groove ball bearing ring grinding error compensation method and system, and the method comprises the steps: monitoring the temperature of a numerical control grinding machine body and a main shaft in real time through a plurality of temperature sensors, and obtaining the temperature field distribution data of a numerical control grinding machine; according to the numerical control grinding machine temperature field distribution data, the temperature gradient of each temperature measurement position is calculated; comparing each temperature gradient obtained by calculation with a preset temperature gradient threshold value, and judging whether a temperature measurement position with the temperature gradient exceeding the temperature gradient threshold value exists or not; when the temperature measurement positions with the temperature gradients exceeding the temperature gradient threshold exist, error compensation parameters of the numerical control system are determined according to the temperature gradients of all the temperature measurement positions, and the grinding machining track and grinding parameters are corrected; therefore, the grinding precision of the deep groove ball bearing ring can be improved.

The invention discloses a deterministic modification method and device for the inner wall of a cylindrical metal part. The method comprises the steps that a roundness instrument is used for measuring multi-section roundness error data of the inner wall of the cylindrical metal part, self-adaptive filtering processing is carried out, a polishing wheel for deterministic modification is selected, machining parameters are set, and a removal function is obtained. The removal function and the multi-section roundness error data obtained after self-adaptive filtering are used for simulation machining in process software, it is ensured that a polishing wheel and machining parameters meet the requirements, whether the dynamic performance of a machine tool meets the requirements or not is judged to obtain the optimal removal function, deterministic shape correction machining is conducted on the inner wall of the metal cylindrical part in combination with the optimal removal function, and the machining precision of the inner wall of the metal cylindrical part is improved. And if the roundness error data does not meet the requirement after the processing is finished, continuing iterative processing until the roundness error data meets the requirement. The method aims to overcome the limitation of the problem of error reflection, the machining efficiency of the inner wall of the metal cylindrical part is improved, and the machining precision of the inner wall of the metal cylindrical part is improved.

The invention provides a wafer film thickness measuring method and device and chemical mechanical polishing equipment, the wafer film thickness measuring method comprises the following steps: a measuring spectrum and an interference spectrum are obtained, the measuring spectrum is formed by measuring light, and the interference spectrum is formed by reflected light after the measuring light is reflected by a wafer; calculating a correction coefficient according to the measured spectrum, and correcting the interference spectrum according to the correction coefficient; calculating a reflectivity curve of the wafer according to the corrected interference spectrum; and determining the film thickness of the wafer according to the reflectivity curve. According to the wafer film thickness measurement method, the influence of measurement noise on an interference spectrum is eliminated, the control precision of the wafer surface quality is improved, and the chip manufacturing yield is further improved.