4753results about "Grinding feed control" patented technology

The invention relates to the technical field of grinding wheel monitoring, in particular to a centerless grinding machine full-life-cycle grinding wheel state monitoring system and method.According to the centerless grinding machine full-life-cycle grinding wheel state monitoring system and method, through combined difference extraction of a main shaft current mean value fluctuation ratio and a power gradient continuous variation value and assisted by transverse comparison of periodic response intervals, effective recognition of time period boundaries of working condition states is achieved; according to the method, operation stage division does not depend on static threshold judgment any more, a track trend is established through linkage judgment of an amplitude kick point and a slope extreme value, a dynamic evolution path of signal response is clearer, the identification resolution of abnormal changes and local deviation trends is improved, response synchronous identification of parameter state changes is achieved, and the identification accuracy is improved. In multi-signal collaborative analysis, directivity comparison between a temperature rise mutation fragment and a current residual error response is carried out, so that the consistency analysis capability of response logic between different monitoring paths is enhanced, and the real-time performance, stability and anti-interference capability of state identification are improved.

The invention discloses a metal grinding machine tool grinding wheel wear compensation type intelligent control system, and relates to the technical field of mechanical manufacturing automation, and the system comprises a contact type reference detection module which is used for obtaining the initial contour and reference wear loss of a grinding wheel through discrete point measurement in a non-machining state; the multi-parameter non-contact real-time detection module is used for collecting acoustic emission, vibration and spindle current signals in the grinding process through three types of sensors; the grinding environment sensing module collects the temperature of a grinding area and the cutting fluid concentration; the intelligent control unit receives reference data and an environment signal, performs deep learning on a wear loss prediction model after multi-source data fusion, performs periodic reference calibration, analyzes the dynamic wear loss, and synchronously transmits the data to the data storage and tracing module; the executing mechanism adjusts grinding wheel feed amount compensation according to the dynamic abrasion loss; and the data storage and tracing module stores full-process data in real time. According to the system, high-precision and real-time wear compensation is achieved, the machining precision and consistency are improved, and high-end manufacturing requirements are met.

The invention relates to a polishing process for improving local flatness of a silicon wafer, which belongs to the technical field of semiconductor manufacturing, and comprises the following operation steps of: 1, pretreating the silicon wafer, cleaning the silicon wafer, activating the surface of the silicon wafer, removing surface impurities and an oxide layer, and preparing for subsequent polishing; secondly, partition parameter setting is conducted, the wafer is scanned, the surface of the wafer is divided into a plurality of different areas, and independent polishing parameters are set for each area according to the material characteristics, the thickness and the preset flatness target of each area; and thirdly, dynamic polishing is conducted, specifically, multi-axis linkage polishing equipment is adopted, and the movement tracks and working parameters of the polishing head in different areas are dynamically adjusted in real time according to preset partition parameters. Through silicon wafer pretreatment, partition parameter setting and dynamic polishing process monitoring and feedback adjustment mechanisms, polishing process parameters can be accurately controlled, deviation in the polishing process can be corrected in time, and stability and consistency of polishing quality are ensured.

The invention relates to the technical field of optical manufacturing and processing control, in particular to an intelligent control system of lens processing equipment, which comprises a process relationship pre-storage module, a pressure distribution acquisition module, a surface shape error prediction module, a pressure compensation decision module, an actuator control module and a processing effect verification module. Wherein the process relation pre-storage module is used for establishing a pressure-removal rate relation mapping table; the pressure distribution acquisition module is used for acquiring pressure distribution data; the surface shape error prediction module is used for predicting surface shape error data generated by the lens; the pressure compensation decision module is used for generating a regionalized pressure compensation amount; and the actuator control module is used for dynamically adjusting the pressure applied to different areas of the lens by the polishing head. According to the method, by constructing the pressure-removal rate mapping and closed-loop self-calibration mechanism, intelligent pressure regulation and control and surface shape error dynamic correction in the lens polishing process are achieved, and the machining precision and stability are remarkably improved.

The invention particularly relates to a grinding force closed-loop control and flutter suppression system for crankshaft variable stiffness machining, and aims to solve the problems of unstable grinding force, flutter and surface defects caused by time-varying stiffness characteristics of a crankshaft due to a multi-crank throw and cantilever supporting structure. The system comprises a grinding force detection module, a control module and an execution module. The grinding force detection module is arranged in a grinding wheel and crankshaft contact area and collects grinding force signals in real time. The control module receives an actual grinding force signal, compares the actual grinding force signal with a target value, and outputs a compensation instruction and a suppression instruction; the compensation instruction is generated by adopting a self-adaptive PID or fuzzy PID algorithm based on force deviation, and the grinding wheel feeding speed or the main shaft rotating speed is dynamically adjusted to stabilize the grinding force; and extracting a high-frequency component of the force signal as a flutter feature, identifying a flutter bud through time-frequency analysis, and generating an anti-phase displacement instruction to suppress flutter. The execution module adjusts feeding or rotating speed according to the compensation instruction and adjusts radial displacement of the crankshaft or the grinding wheel according to the suppression instruction.

The invention provides a wafer film thickness measuring method and device and chemical mechanical polishing equipment, the wafer film thickness measuring method comprises the following steps: a measuring spectrum and an interference spectrum are obtained, the measuring spectrum is formed by measuring light, and the interference spectrum is formed by reflected light after the measuring light is reflected by a wafer; calculating a correction coefficient according to the measured spectrum, and correcting the interference spectrum according to the correction coefficient; calculating a reflectivity curve of the wafer according to the corrected interference spectrum; and determining the film thickness of the wafer according to the reflectivity curve. According to the wafer film thickness measurement method, the influence of measurement noise on an interference spectrum is eliminated, the control precision of the wafer surface quality is improved, and the chip manufacturing yield is further improved.

The invention belongs to the field of robot polishing and metal material processing and manufacturing, and discloses a steel plate surface defect detection and self-adaptive polishing system and method, and the system comprises a surface defect detection system, a three-dimensional contour detection system, a roller bed control system, a robot polishing system and a server; the surface defect detection system is used for acquiring types and position information of defects; the three-dimensional contour detection system is used for accurately measuring depth information of the defect; the roller bed control system is used for controlling the movement of the roller bed to transfer the steel plate; the server is used for data interaction and storage among the surface defect detection system, the three-dimensional contour detection system, the roller bed control system and the robot grinding system; and the robot polishing system accurately polishes the surface defects of the steel plate according to the defect position and depth data in the server. The full-process intelligent operation of steel plate surface defect detection, defect three-dimensional contour scanning and robot self-adaptive grinding is achieved, and the automation level and the production efficiency of a production line are effectively improved.

The invention provides a wafer thinning equipment control method and device, electronic equipment and a storage medium, and relates to the technical field of wafer thinning. The method comprises the following steps: monitoring spreading and thinning behaviors of a spin-coating liquid film in real time and generating a residual layer distribution diagram; according to an area indicated by the residual layer distribution map, obtaining local thickness information by analyzing a fluorescence signal received from the area; after a laser beam is used for scanning the surface of the wafer, micro-vibration signals are recognized and extracted by analyzing reflected light signals; dividing the surface of the wafer into a plurality of grid areas; and the risk of generating cracks in each grid area is evaluated, and a wafer surface risk thermodynamic diagram used for controlling the grinding head and the grinding fluid is generated. The method aims at solving a series of problems caused by a microcosmic residual layer on the surface of the wafer or surface energy difference in the wafer thinning process, early and accurate sensing of microcosmic abnormity on the surface of the wafer is achieved, and a control system is guided to conduct regional and self-adaptive grinding parameter adjustment.

The invention belongs to the technical field of metallurgical engineering, and relates to an intelligent guide grinding system and method for the surface of a casting blank. By arranging the parameter initialization module, the parameter compensation module and the deviation correction module, the problem of unstable grinding quality caused by grinding force fluctuation, temperature change and material difference in the casting blank surface grinding process is solved. The method specifically comprises the steps that the feeding speed is dynamically adjusted by collecting grinding force data in real time, thermal deformation compensation is conducted according to the casting blank temperature and the steel grade characteristics, the upper limit value is determined based on quantitative analysis of surface state parameters and historical standard samples, and adaptive adjustment of the next round of coping parameters is achieved. According to the method, the consistency of the grinding depth is effectively improved, the over-grinding risk in the high-temperature casting blank grinding process is prevented, closed-loop optimization and continuous improvement of the grinding process are achieved, the stability and reliability of the casting blank surface grinding quality are improved, and it is ensured that the product quality cannot be affected by surface defects in the subsequent rolling process of the casting blank.

The invention discloses a part polishing track generation method and device, electronic equipment and a storage medium. The method comprises the steps that contour features corresponding to a first contour presented by a to-be-polished part under a first visual angle are determined; matching in a template library based on the contour features, and determining a target part template; a plurality of candidate part templates are stored in the template library; different second contours exist between the candidate part templates, and at least part of the second contours in the candidate part templates are used for indicating the edge position information of the part needing to be polished; the second contour is a contour under the first visual angle; and based on the first polishing track associated with the target part template, a second polishing track corresponding to the to-be-polished part under the first visual angle is determined. According to the scheme, the proper part template can be matched based on the contour features of the to-be-polished part, so that the to-be-polished part can be quickly recognized, and the polishing track can be quickly determined.

The invention provides a curved surface local grinding and polishing trajectory planning method and a grinding and polishing system, and relates to the technical field of grinding and polishing machining. According to the curved surface local grinding and polishing trajectory planning method, workpiece point clouds are collected, simplification and filtering are carried out, the number of effective voxels is reduced, and the operation processing efficiency is improved; the method comprises the following steps: extracting a damaged area, determining a grinding and polishing area according to the damaged area, planning the grinding and polishing area according to surface topography characteristics of a workpiece, constructing a grating path corresponding to the grinding and polishing area based on workpiece point cloud, and converting according to the grating path to obtain a workpiece grinding and polishing path so as to realize accurate and efficient grinding and polishing operation. Besides, the normal pressure of the grinding and polishing tool corresponding to the grinding and polishing path of the workpiece is calculated in combination with coupling of the surface curvature of the workpiece, the normal pressure of the grinding and polishing tool can be adjusted in real time, concave area force increasing and convex area force reducing are achieved, the over-grinding problem of the curved surface workpiece can be effectively avoided, and accurate grinding of the area boundary is achieved.

The invention discloses a rubber roller grinding method which comprises the following steps: acquiring a size parameter of a rubber roller, setting an initial coarse grinding parameter of coarse grinding equipment based on the size parameter, dispersing the contour of the rubber roller into a plurality of control points, performing primary coarse grinding on the rubber roller according to the coarse grinding parameter and a coarse grinding path, acquiring a coarse grinding contour value of the rubber roller, and calculating a first difference value, adjusting the feeding pressure in the coarse grinding process based on the correlation between the grinding data and the first difference value, updating the initial coarse grinding parameter into a final coarse grinding parameter, performing secondary coarse grinding on the rubber roller based on the final coarse grinding parameter, collecting the finish degree of a fine grinding finished product, and comparing the finish degree with a second preset value to obtain a quality judgment result. The precise size parameters of the rubber roller are obtained through the multispectral three-dimensional scanner, the control precision of the surface quality of the rubber roller is improved, the production efficiency of the surface quality control of the rubber roller is improved through the automatic coarse grinding and fine grinding processes, and the grinding consistency of the rubber roller is enhanced through data-based difference calculation and parameter adjustment.

The invention relates to an injection system, an injection method and a control method for medical capillary polishing, and the injection system comprises a first liquid storage pipe used for storing magnetorheological fluid; the first three-way connector is connected with the first liquid storage tank through a first pipeline; the first pump is connected with the first three-way joint through a second pipeline; the second pipeline comprises a vertical pipe body which is partially vertically arranged, and the space between the first pump and the vertical pipe body is filled with a gas section; the capillary tube is connected with the first three-way connector through a third pipeline; the first pinch valve is installed on the first pipeline and the third pipeline and used for cutting off the first pipeline or the third pipeline. The particle settling volume in the injection system can be reduced, the machining precision is improved, and the service life of equipment is prolonged.

The invention discloses a grinding and polishing processing method of an ultra-precise YIG (yttrium iron garnet) single crystal, which is suitable for a planar YIG (yttrium iron garnet) single crystal (circle) prepared by a liquid phase epitaxy method, a molten salt method and a floating zone melting method, and comprises the following steps: grinding the YIG single crystal, and controlling the thickness and the total thickness deviation (TTV) of the crystal; rough polishing is carried out on the YIG single crystal, and subsurface damage of the wafer is eliminated; and finally, carrying out ultra-precision polishing on the YIG crystal to realize surface planarization with sub-nano-scale surface roughness. According to the method, the surface roughness of the yttrium iron garnet single crystal can be controlled below 1nm.

The invention relates to the technical field of precision machining, discloses a double-shaft DFG grinding machine Z1-Z2 linkage removal amount control and grinding wheel loss optimization method and system, and aims to solve the problems of unreasonable Z1-Z2 removal amount distribution, inaccurate grinding wheel loss control and poor wafer surface damage adaptability of existing DFG grinding. According to the method and system, Z1 rough grinding parameters are determined and adjusted through multi-objective optimization and self-adaptive control by means of the initial morphology and material characteristics of a wafer; in combination with a Z1 result, a deep learning model is utilized to intelligently distribute Z2 accurate grinding removal amount and parameters, and adaptive adjustment and abnormal Air Cut are realized; and meanwhile, the grinding parameters are continuously optimized by adopting the grinding wheel loss prediction model. By adopting the technical scheme, the grinding efficiency and precision can be remarkably improved, the service life of the grinding wheel is prolonged, the cost is reduced, and the problems of removal amount distribution, grinding wheel loss and wafer damage are solved.

The utility model discloses a self-adaptive track sanding device for a complex curved surface. The device comprises a flange seat, a universal cross arranged at the front end of the flange seat, a motor body arranged in the universal cross, a brake ring and a polishing disc, wherein the brake ring and the polishing disc are arranged at the output end of the motor body; the universal cross is of a circular ring structure and is rotationally connected with the front end of the flange base through a first pin shaft, the upper portion of the motor body penetrates through the universal cross, and the motor body and the universal cross are rotationally connected through a second pin shaft. Connecting lines respectively formed by the first pin shaft and the second pin shaft are crossed, and the motor body realizes two-degree-of-freedom rotation through the first pin shaft and the second pin shaft. The motor body rotates through the universal cross to adjust the binding face between the grinding disc and the to-be-ground curved surface to achieve self-adaption to the to-be-ground curved surface, it can be guaranteed that the normal of the grinding disc coincides with the normal of the curved surface without precisely adjusting the posture and the positioning precision of a robot, and therefore the good grinding effect is obtained.

The invention relates to the technical field of material polishing, and discloses a PEEK material composite polishing method and system based on multi-process collaboration.The method comprises the steps that surface detection is conducted on a PEEK material, and crystallinity gradient distribution information is obtained; according to the crystallinity gradient distribution information, process parameter calculation is conducted on the crystalline area and the amorphous area, and a polishing process parameter combination is obtained; inputting the polishing process parameter combination into multi-process collaborative composite polishing equipment, and carrying out gradient interface strengthening polishing on the PEEK material to obtain an interface strengthening polishing semi-finished product; and dynamically adjusting the process parameters of the semi-finished interface strengthening and polishing product to obtain the finished interface strengthening and polishing product, so that accurate division of a crystallization area and an amorphous area of the PEEK material and differential process parameter calculation are realized, and the composite polishing precision of the PEEK material is improved.

The invention discloses a UPA pressure automatic compensation system and method for mask substrate polishing. The UPA pressure automatic compensation system comprises a pressure execution module, a distributed sensing feedback network and an intelligent control unit. Wherein the pressure execution module is used for directly polishing a mask base plate and comprises a force application shaft, a polishing head, an air source, a UPA air bag and an electric proportional valve, the distributed sensing feedback network comprises an air path pressure sensor and a tail end contact pressure sensor, and the intelligent control unit receives a collection signal of the distributed sensing feedback network and sends the collection signal to the polishing head. On the basis of a current process formula and process parameter coupling model, a data fusion algorithm, a feed-forward compensation algorithm and a fuzzy PID algorithm are operated to obtain a feed-forward compensation amount and a fuzzy PID output amount, the feed-forward compensation amount and the fuzzy PID output amount are superposed, a total control voltage is generated and output to an electric proportional valve, and then the input air pressure of a UPA air bag is adjusted. Therefore, closed-loop control over the polishing pressure of the mask substrate is achieved. Through multi-sensor data fusion, fuzzy PID self-adaptive control and intelligent feed-forward compensation based on a process parameter coupling model, real-time, accurate and constant control of the polishing pressure is realized, so that the surface precision and yield of the mask substrate are improved.

The invention discloses a cosmetic glass bottle surface polishing method and system, and the method comprises the steps: carrying out gradient mesh abrasive composite modification on a sand leather base material, and carrying out three-dimensional cutting according to the surface curve contour of a glass bottle through a laser cutting technology to form a composite sand leather polishing piece; the composite sand leather grinding piece is assembled at the executing end of a six-axis linkage mechanical arm, partition differentiated grinding is carried out according to the surface pollutant distribution density image recognition result, and a glass bottle rough blank obtained after preliminary grinding is obtained; performing synchronous purging on the surface of the glass bottle rough blank by adopting inert gas flow with a micro-bubble generation device, and controlling the composite sand leather polishing piece to perform micro-vibration at the same time, so as to obtain a glass bottle semi-finished blank; and the glass bottle semi-finished blank is placed in a sealed cavity to be sprayed, final polishing is carried out in cooperation with pulse type ultrasonic vibration, and a cosmetic glass bottle finished product is obtained. According to the embodiment of the invention, high-precision grinding of the curved surface of the glass bottle can be realized, and the surface cleanliness and the gloss uniformity are improved.

The embodiment of the invention provides a non-standard frame polishing method and device and a storage medium. The method comprises the steps that a non-standard frame is fixed to a first preset position through a first fixing unit; performing primary polishing treatment on the non-standard frame through the first polishing unit to obtain a first frame, wherein the primary polishing treatment comprises rough polishing and medium polishing; the two first frames are buckled through a second fixing unit and then fixed to a second preset position; and controlling the second polishing unit to synchronously carry out secondary polishing treatment on the two first frames to obtain a second frame. Through the first polishing unit, rough polishing and medium polishing before fine polishing can be conducted on the non-standard frames, the polishing precision is guaranteed, the second polishing unit synchronously conducts secondary polishing treatment on the two first frames which are placed at the second preset position in a buckled mode to obtain the second frame, fine polishing of the two first frames can be completed at a time, and the polishing efficiency is improved. And the fine polishing efficiency of the frame is improved.

The invention is suitable for the technical field of pipe outer circle grinding, and provides a PE pipe outer circle grinding device which comprises a workbench, a grinding mechanism used for grinding a pipe is arranged on the workbench, a supporting frame is horizontally and slidably connected with a moving seat, and the supporting frame is fixedly connected with a second motor. An output shaft of the second motor is in threaded connection with a moving seat, the moving seat is fixedly connected with an electric lifting seat, and the telescopic end of the electric lifting seat is fixedly connected with a guide sleeve; the pipe polishing machine further comprises a feeding speed optimization system which can regulate and control the extension speed of the electric lifting seat by comprehensively evaluating the polishing state of the abrasive belt, the clamping state of the clamping mechanism and the stable state of the pipe, and then the feeding speed during pipe polishing is optimized. The feeding speed self-adaptive adjustment under the interference of multiple factors such as abrasive belt abrasion, pipe temperature change and clamping force fluctuation is achieved.

The invention belongs to the technical field of precision machining and in-situ measurement, and discloses an in-situ measurement and bidirectional tool setting integrated system and method for an internal thread grinding machine. Various system errors and random errors are effectively eliminated through a non-hardware error compensation model and a high-fidelity data processing algorithm, in-situ measurement of the internal thread is completed in a modularized mode, and high-precision and high-efficiency in-situ automatic measurement of key parameters such as the pitch diameter, the thread pitch and the thread angle of the thread is achieved. The system can be directly integrated on the internal thread grinding machine, measurement is rapidly completed after machining or between procedures, workpieces do not need to be disassembled, secondary clamping errors are effectively avoided, and the detection efficiency and consistency are greatly improved.

The invention provides a model training method, a silicon wafer processing method, a silicon wafer processing device, a storage medium and equipment. The model training method comprises the following steps: acquiring initial state information and target state information of a silicon wafer to be processed; through an action decision model, according to the initial state information and the target state information, machining action information for the machining machine table is generated; determining an award parameter corresponding to the processing action information, wherein the award parameter represents the processing quality and efficiency when the processing machine processes the to-be-processed silicon wafer based on the processing action information; if the reward parameter is not more than the preset condition, updating the initial action decision model according to the reward parameter to obtain an updated action decision model; and based on the updated action decision model, returning to execute the step of generating the processing action information through the action decision model according to the initial state information and the target state information until the reward parameter is greater than the preset condition, and obtaining a target action decision model. According to the invention, the processing machine table can be accurately adjusted.

In a processing machine, a machine body drives at least one of a workpiece and a tool to process the workpiece by the tool. A processing chamber isolates the workpiece, the tool, and a nozzle from at least part of the machine body while housing the workpiece, the tool, and the nozzle. An internal temperature sensor measures a temperature of an atmosphere in the processing chamber. An external temperature sensor measures a temperature of an atmosphere around the processing machine. A temperature adjustment part raises a temperature of the processing fluid to be supplied to the nozzle when a measured temperature of the internal temperature sensor is lower than a measured temperature of the external temperature sensor, and / or the temperature adjustment part lowers the temperature of the processing fluid to be supplied to the nozzle when the measured temperature of the internal temperature sensor is higher than the measured temperature of the external temperature sensor.

The invention discloses a numerical control machine tool autonomous tool setting method based on 3D visual guidance. The method comprises the following steps: firstly, acquiring three-dimensional point cloud data of a cutter and a workpiece by using a 3D visual sensor and preprocessing; then, segmenting the point clouds through a region growing algorithm, realizing the separation of the tool point clouds and the workpiece point clouds, and extracting the point clouds of each cylindrical section of the workpiece; thirdly, based on a cylinder fitting algorithm, cylinder model fitting is conducted on the segmented tool and workpiece point cloud, and geometric parameters such as the axis direction, the radius and the center coordinate are obtained; calculating a relative position relation between the tool and the workpiece according to the geometric parameters, generating a tool setting path and converting the tool setting path into an NC code; and finally, the NC code is transmitted to a grinding machine control system through a grinding machine communication module, and tool setting operation is completed. The automatic tool setting device has the advantages that the relative position relation between the workpiece and the tool can be automatically measured in the machining process, automatic and rapid tool setting is completed, and the machining quality and efficiency are guaranteed.

The invention discloses an integrated tile-shaped magnet outer circle grinding device and method based on artificial intelligence, and belongs to the technical field of grinding machining. The integrated tile-shaped magnet outer circle grinding device comprises a feeding device, a grinding device and a visual detection device; the feeding device comprises a feeding conveying belt, a guide groove, a spring bin, a material blocking barrel, a feeding barrel, a magnetic suction cup, an electromagnetic push rod, a cooperative mechanical arm, a reset spring and a discharging conveying belt. The visual detection device comprises a magnetic shoe counting camera, an annular light source, a counting camera bracket, a measuring camera bracket, a backlight plate, an outer contour measuring camera, a positioning camera and a positioning camera bracket; integrated automatic operation of feeding, grinding, detection and discharging is achieved, the production efficiency is greatly improved, automatic counting, precision detection and discharging are completed through cooperation of visual detection and the conveying belt, the manual operation intensity is effectively reduced, production interruption caused by personal errors is avoided, and the productivity in unit time is remarkably improved.

The invention belongs to the technical field of wafer processing, and particularly discloses an ultrasonic displacement vision cooperation wafer detection and edge grinding system. According to the invention, the control module coordinates the grinding mechanism, the wafer carrying table and the assembly integrated with displacement and visual detection, so that cooperative detection and edge grinding are realized. Specifically, the displacement detection module obtains the distance between the wafer and the grinding mechanism in real time, and an accurate physical reference is provided for compensation control; and the visual detection module captures continuous images during rotation of the wafer, so that the control module can extract micro texture features to identify the deviation state of the wafer. The combination of the two realizes the comprehensive real-time perception of the grinding working condition, and overcomes the limitation of insufficient perception. And finally, the control module fuses the displacement and offset information to generate an edge grinding instruction, and dynamically controls the grinding mechanism and the wafer carrying table to carry out linked rigid body transformation, so that real-time sensing information is directly converted into compensation action, and the problem of uneven grinding caused by insufficient dynamic compensation capability is effectively solved.

The invention belongs to the technical field of threaded pipe machining, and particularly relates to an intelligent control method, device and equipment for self-adaptive force control of a grinding device and a medium. Comprising the following steps that real-time data of a polishing device in the polishing process are collected; real-time data in the polishing process are analyzed, and control data of preset polishing force Fd are obtained; based on the control data of the preset polishing force, the polishing device is controlled in real time to reach the preset polishing force; by acquiring the polishing force data in real time and analyzing and acquiring the control data of the preset polishing force, the polishing quality of the pipeline is accurately controlled, so that the actual polishing force quickly and accurately approaches the preset polishing force, and the polishing effect on the threaded pipe is optimized.

The invention provides a grinding fluid, the grinding fluid comprises a base fluid, a grinding material, nano-diamond and a dispersion stabilizer, the base fluid comprises polyether and silicone oil, the grinding material comprises surface modified silicon carbide particles, and the dispersion stabilizer comprises polyethylene glycol stearate and polyvinylpyrrolidone. The surface roughness of a grinding piece can be reduced, the scratch density and microcracks of the surface are reduced, damage of grinding fluid to the grinding piece is reduced or even avoided, and the service life of a cutter can be prolonged. The invention also provides a preparation method of the grinding fluid and a process method using the grinding fluid.

The invention discloses a forging part surface defect detection mechanism, and belongs to the technical field of forging part detection. The forging part surface defect detection mechanism comprises a detection table, a flaw detector is installed on the outer wall of the top end of an electric cylinder, a cleaning assembly used for cleaning oxide skin on the surface of a forging part is arranged on the outer wall of the detection table, and a driving assembly is arranged on the inner wall of a supporting plate. The distance between the front push block and the rear push block can be adjusted according to the length of the cylindrical forging part through rotation of the small-lead screw rod, and after the cylindrical forging part is placed on the surface of the supporting plate, the small-lead screw rod drives the front push block and the rear push block to push the cylindrical forging part to slowly move towards the flaw detector. And meanwhile, the first driving roller and the second driving roller push the cylindrical forging part to rotate rapidly, at the moment, the cleaning assembly moves towards the surface of the cylindrical forging part, a sealing area is formed on the surface of the cylindrical forging part, the grinding disc is started to grind oxide skin in the sealing area, and dust and impurities generated during grinding are intensively discharged through the exhaust pipe.