1850results about "Bonded abrasive wheels" patented technology

[Problem] To provide a plasma-assisted polishing method and a device therefor, capable of suppressing one-sided wear of a polishing pad and facilitating attachment / detachment work of a polishing pad and a workpiece in processing of a hard-to-work material using a plasma-assisted polishing method. [Solution] In an operation for relatively moving a workpiece W and a polishing pad P, the workpiece is polished by a combination of the rotation of the workpiece and the polishing pad each having an axis in a first direction, and the swing in a second direction orthogonal to the first direction and increasing or decreasing the distance between the two axes. The workpiece and the polishing pad face each other by being detachably held by mounting parts 10, 13 provided with rotary shafts 9, 12 each directed in the first direction. When the workpiece and / or the polishing pad is attached / detached, the workpiece and the polishing pad are moved in the second direction beyond a range of oscillation in a normal polishing process in a state of stopping the rotation of the workpiece and / or the polishing pad, and the workpiece and / or the polishing pad is attached / detached to / from the mounting part in a state where the workpiece and / or the polishing pad is exposed from the facing member.

A grinding wheel (24), particularly suitable for electro-erosive dressing, has a rotational axis (136) and an abrasive coating (142) with a macroscopic matrix (154). The grinding wheel (24) is rotatable about the rotational axis (136). Abrasive grains (156) are embedded in the macroscopic matrix (154). The macroscopic matrix (154) is conductive. The abrasive grains (156) have a conductive microscopic matrix (164) in which cutting particles (166) are embedded. A grinding machine (10) uses such a grinding wheel (24) suitable for electro-erosive dressing. A method is used for dressing such a grinding wheel (24) by wire electro-erosion.

The present invention relates to an attachment hub for attachment to a sander, comprising a quick-release attachment assembly configured for releasable and aligned engagement with a counterpart of a backup pad particularly for an abrasive disc. Furthermore, the invention relates to a backup pad having a disc-like shape and comprising a first major surface and a second major surface, the first major surface configured for direct or indirect attachment of an abrasive disc, and the second major surface configured for facing towards an attachment hub for attachment to a sander, and a mounting portion for aligned engagement with an attachment hub of a sander.

The invention discloses a vortex air inner-cooling and inner-lubricating grinding wheel which comprises a hot shaft assembly, a rotating seat assembly, a rotating main shaft, a fan-shaped spray head, a grinding wheel mounting disc assembly and a grinding wheel disc. A hot shaft in the hot shaft assembly, the fan-shaped spray head and a grinding wheel installation disc in the grinding wheel installation disc assembly are sequentially connected with a rotating main shaft through threads, and the grinding wheel disc and the grinding wheel installation disc are fastened through bolts. During machining, compressed air is introduced into one side of the grinding wheel, high-speed airflow generates vortexes through an internal vortex pipeline structure, cold airflow and hot airflow are separated out, and the cold airflow is separated towards the grinding wheel disc side. And meanwhile, lubricating liquid is introduced into the other side of the grinding wheel, cold air and the lubricating liquid converge and enter a grinding wheel disc cavity through a fan-shaped spray head, and then flow out through a grinding wheel hole to cool and lubricate a grinding area. The grinding force and the grinding heat during grinding are effectively reduced, the production cost is reduced, the grinding quality is improved, and green machining is achieved.

The invention relates to a modeling method for predicting surface roughness of silicon modified silicon carbide processed by a small grinding head, which relates to the technical field of optical manufacturing and comprises the following steps of: i, analyzing pressure intensity distribution between a grinding disc and a workpiece; step ii, calculating the press-in depth of the grinding material according to the maximum value of the pressure intensity distribution; and iii, establishing a surface roughness physical model by combining the motion trail length of the grinding material and the press-in depth of the grinding material. The modeling method for predicting the surface roughness of the silicon modified silicon carbide processed by the small grinding head is not limited to prediction of a roughness physical model of a silicon modified silicon carbide material polished by the small grinding head of a robot; and the method is also suitable for predicting the roughness physical model of metal or hard and brittle materials processed by equipment such as other numerical control processing machine tools and guiding actual processing.

The invention belongs to the technical field of grinding, and particularly relates to a metallic bond diamond grinding wheel, a preparation method of the metallic bond diamond grinding wheel and a thinning method. The diamond grinding block comprises a porous diamond grinding material, a metal binding agent and a pore forming agent. The porous diamond abrasive is prepared by carrying out a thermochemical corrosion method on diamond; the metal bonding agent comprises copper-tin alloy powder, graphite powder, nano Al2O3, cadmium powder and polyimide resin. Compared with the prior art, the problem that in the prior art, the thinning technological parameters of the grinding wheel are not suitable for the novel grinding wheel with the fine granularity is solved. According to the scheme, the novel grinding wheel with the fine granularity is provided, the thinning parameters are researched on the basis of the novel grinding wheel, and therefore better machining efficiency and silicon wafer surface quality can be obtained under the grinding wheel and the thinning process parameters.

The invention provides a gear inner hole grinding device and a grinding method thereof, and belongs to the technical field of gear inner hole grinding. Comprising a grinding mechanism and a gear, and the grinding mechanism comprises a mounting frame and a double-rod air cylinder; a clamping assembly used for fixing the gear and polishing one side face of the gear is installed between the two lugs of the installation frame. According to the gear grinding device, by arranging the clamping assembly, gears with different diameters can be clamped in a matched mode conveniently, the tedious clamping process is avoided, operation is easy and convenient, meanwhile, the gear grinding device can be matched with one side walls of the gears with different sizes for grinding, and certain operation procedures of operators are reduced; according to the gear grinding device, inner holes of gears with different inner hole diameters can be matched for grinding, the other side wall of each gear can be conveniently ground, the gears and the grinding device can be accurately and rapidly cooled, a grinding head is prevented from being replaced when the inner holes of the gears with the different inner hole diameters are ground, certain operation procedures of operators are reduced, and meanwhile waste of cooling liquid is avoided.

The invention provides glass edge grinding equipment. The glass edge grinding equipment comprises a rolling supporting platform, a grinding device and a limiting device. The rolling support platform is used for rolling and supporting a glass plate, and the distance between a polished part and a human body standing position can be adjusted by adjusting deformation; the limiting device is used for supporting one side of the polished edge of the glass plate in a rolling manner; a grinding disc of the grinding device penetrates out of the position between the two supporting assemblies of the limiting device. A grinding groove is formed in the side wall of the grinding disc, is in a closed-loop shape around the axis of the grinding disc and is of a V-shaped groove structure; the limiting device can change the relative protruding range of the grinding disc by adjusting the position of the supporting assembly. The grinding device can vertically move through adjustment, so that the grinding disc is matched with the bearing plane of the rolling support platform; the limiting device vertically moves along with the grinding device; parameters can be automatically adjusted according to grinding requirements, use and operation are convenient, and the adjusting accuracy is high. And the size of the workbench can be adjusted according to requirements, a more suitable working station is provided, and operation is convenient.

The invention relates to a deep blind hole grinding method and a grinding device, the grinding device comprises a working table and a main shaft, a positioning tool is arranged on the working table, the main shaft is connected with a detachable first grinding tool or a detachable second grinding tool, and the length of the first grinding tool is smaller than that of the second grinding tool; the second grinding tool comprises a connecting rod, one end of the connecting rod is provided with a connector, the outer wall of the other end of the connecting rod is sleeved with a grinding tool, the connecting rod between the connector and the grinding tool is sleeved with a supporting sleeve, the supporting sleeve is in clearance fit with the connecting rod, and the end, facing the connector, of the supporting sleeve is connected with a positioning mechanism. The supporting sleeve extending into the blind hole is used for supporting the connecting rod, the stability of the connecting rod can be improved, bending deformation of the connecting rod is prevented, vibration of the connecting rod is reduced, and therefore the grinding precision is improved.

Systems and methods for grinding semiconductor workpieces are provided. In one example, a method includes providing a surface of the semiconductor workpiece against a grinding apparatus. The grinding apparatus includes an abrasive surface. The method further includes imparting relative motion between the abrasive surface and the semiconductor workpiece to implement a grinding operation on the semiconductor workpiece. The method further includes providing a fluid to the surface of the semiconductor workpiece or the abrasive surface during the grinding operation. The fluid includes an additive. The additive includes one or more of an oxidizing agent, an etchant, a surfactant, or a lubricant.

Grinding systems and methods for semiconductor workpieces are provided. In one example, a grinding system includes a workpiece support operable to support a semiconductor workpiece and rotate the semiconductor workpiece about a first axis. The grinding system further includes a grind wheel operable to rotate about a second axis. The grind wheel has a plurality of grinding teeth arranged in a grinding ring on the grind wheel. A radius of the grinding ring is less than or equal to a radius of the semiconductor workpiece (e.g., such that an effective gap ratio between grinding teeth on the grind wheel are reduced).

The invention belongs to the technical field of advanced manufacturing, and particularly relates to a microtexture functional curved surface machining method based on a structured grinding tool, which comprises the following steps of: determining an artificial joint type and an artificial joint surface microtexture array form; a grinding wheel is selected according to the microtexture array form; the grinding wheel is provided with an upper convex part and a lower concave part; mounting the artificial joint and the grinding wheel on a five-axis numerical control ultra-precision machine tool; setting a moving track of a grinding wheel according to the artificial joint type; and polishing the surface of the artificial joint to form a micro-texture array. The micro-texture array is machined on the surface of the artificial joint in a structured grinding mode, and the method has the advantages of being high in machining efficiency, good in process continuity, low in cost and the like, and is wide in applicability and high in flexibility.

The invention discloses a grinding and polishing tool applied to curved surface machining and a preparation method of the grinding and polishing tool. The grinding and polishing tool comprises a grinding and polishing layer, a base body layer and a rigid layer. The grinding and polishing layer is a uniform mixture of hydrophilic resin and grinding materials, protrusions are evenly distributed, the center axes of the protrusions are perpendicular to the lower end face of the tool, and the spherical surface where the tops of the protrusions are located and the spherical surface where the bottoms are located are the same in radius and collinear in sphere center. The matrix layer is made of hydrophilic resin the same as that of the grinding and polishing layer; the rigid layer 3 is one of an organic glass plate, a polyvinyl chloride plate and a polycarbonate plate. A convex tool is adopted for concave surface machining, and a concave tool is adopted for convex surface machining. The grinding and polishing tool is integrally formed, bonding is reduced, functional structure integration of the tool is achieved, and the machining precision is improved; the hydrophilic resin has the swelling characteristic when encountering water, full flexibility of the tool is achieved, and the tool can be attached to the surface of a workpiece easily and has the self-finishing function.

A superhard material grinding tool for a difficult-to-machine material and a grinding process. The superhard material grinding tool comprises a base body I (1), a pressing plate (2) and a plurality of grinding disks (3), wherein the base body I (1) is of an annular structure, the plurality of grinding disks (3) are distributed in a circumferential direction of the base body I (1) and assembled into an annular structure, and a radially running water groove (4) is formed between two grinding disks (3); the pressing plate (2) is of an annular structure and is fixedly mounted at one end of the base body I (1) and configured to tightly press the plurality of grinding disks (3); and a mixed cooling channel (5) for introducing a grinding fluid and / or a cooling liquid is formed between the pressing plate (2) and the base body I (1), each grinding disk (3) comprises a multi-grain abrasive material, and the thickness h of each grinding disk (3) and the grain size b of the abrasive material meet the following relational expression: b ≤ h ＜ 2b. The grinding tool can be combined with auxiliary means in accordance with the particularity of different difficult-to-grind materials, so as to improve the grinding efficiency and the grinding quality.

The grinding tool holder (4) of the grinding tool (1) includes: a handle portion (6), a mounting portion (21) for mounting the grinding tool (3), and an electric motor (35), and further includes: a moving mechanism (22) for moving the mounting portion (21) in the axial direction (X) of the handle portion (6), a load detector (23) for detecting the load applied to the grinding tool (3) mounted on the mounting portion (21), and a control unit (52) for driving and controlling the electric motor (35). The control unit (52) monitors the output from the load detector (23), sequentially calculates the change amount of the load, drives the electric motor (35) based on the load and the change amount, and performs a protrusion control operation for advancing and retracting the grinding tool (3) mounted on the mounting portion (21).

The invention discloses an elastic diamond grinding wheel, and particularly relates to the technical field of grinding and polishing machining consumables, the elastic diamond grinding wheel comprises a thin-wall elastic metal cover and a cutter bar, the thin-wall elastic metal cover is of a hollow annular body structure, and the diameter, used for being connected with the cutter bar, of one end of the thin-wall elastic metal cover is smaller than that of the center of the thin-wall elastic metal cover; the diameter of one end of the thin-wall elastic metal cover is larger than that of the center, the diameter of the other end of the thin-wall elastic metal cover is smaller than or equal to that of the center, multiple sets of diamond abrasive particles are evenly arranged on the outer side of the thin-wall elastic metal cover, the cutter bar is arranged at one end of the thin-wall elastic metal cover, one end of the cutter bar is of a hollow structure, and a bolt is connected into the hollow end of the cutter bar through threads. The outer side of the bolt is sleeved with a gasket; according to the diamond grinding wheel, the problem that an existing electroplating grinding and polishing wheel or a brazing grinding and polishing wheel lacks flexibility can be solved, the problem that an existing overlapping wheel or an abrasive belt wheel is short in service life can also be solved, a new consumable tool is provided for automatic blade root fillet grinding, and the quality of a ground and polished blade is guaranteed.

A bonded abrasive comprising a body including abrasive particles contained within a bond material, wherein the abrasive particles comprise a first group of abrasive particles in a first content (Cl), the first group including shaped abrasive particles having a first average particle size (PSI) and a second group of abrasive particles in a second content (C2), the second group including non-shaped abrasive particles having a second average particle size (PS2), wherein PS2<PS1 and a content ratio (C2 / C1) of at least 0.05 to 1.

The invention provides silicon wafer processing equipment, and belongs to the technical field of semiconductors. Comprising a grinding wheel internally provided with a containing space, at least one groove is formed in the inner wall of the grinding wheel in a concave mode, and the cross section of each groove is round and parallel to the horizontal plane; the positioning workbench is arranged in the accommodating space, the positioning workbench is used for fixing a silicon wafer to be processed, and the edge of the silicon wafer extends into one of the grooves; the first driving mechanism is connected with the positioning workbench; the control mechanism is connected with the first driving mechanism; wherein the control mechanism is used for sending a first signal to the first driving mechanism, and the first signal is used for controlling the first driving mechanism to drive the positioning workbench to rotate on the horizontal plane and drive the silicon wafer to rotate, so that the edge of the silicon wafer and the groove are subjected to opposite grinding. According to the technical scheme, the problem that the uniformity of the edge morphology of the silicon wafer is difficult to guarantee in the existing silicon wafer processing can be solved.

The invention relates to a 45-degree double-shaft butterfly valve rust removal device, and belongs to the technical field of rust removal, the 45-degree double-shaft butterfly valve rust removal device comprises a workbench, and further comprises a bearing mechanism, a dust removal mechanism and a dust removal mechanism; and a driving mechanism. According to the grinding device, by means of the particularity of the shape of the 45-degree butterfly valve body, the 45-degree butterfly valve body can extrude a wiping ball during grinding, and then a cleaning mechanism works to inject grinding and polishing liquid between the inner surface of the 45-degree butterfly valve body and the grinding face of a grinding plate; according to the grinding and polishing device for the 45-degree butterfly valve body, when the 45-degree butterfly valve body is ground, grinding and polishing liquid is only injected into the grinding portion of the 45-degree butterfly valve body, the amount of the grinding and polishing liquid is saved, waste of the grinding and polishing liquid is reduced, in addition, when a wiping ball is separated from the 45-degree butterfly valve body, a cleaning mechanism can blow air to the grinding face of a grinding plate, and the grinding effect is improved. And the separation of scraps left on the polishing surface of the polishing plate due to polishing is promoted, so that the polishing and derusting quality of the 45-degree butterfly valve body is ensured.

The present invention provides a process of forming a cutting tool comprising the steps of: additive deposition of a tool material comprising at least one of: tungsten carbide, TaNbC, a tungsten carbide containing alloy or composite, or a TaNbC containing alloy or composite onto a base substrate having a longitudinal axis, said tool material being deposited onto the base substrate to form a deposit body configured to form at least one cutting formation therein; and subsequently subtracting selected portions of the deposit body to produce at least one cutting formation having a selected cutting edge configuration, thereby forming the cutting tool.

The invention relates to a cover plate cold carving grinding head, a machining method of the cold carving grinding head and an application method of the cold carving grinding head. A cover plate cold carving grinding head comprises a cutter handle, a cutter head, cooling holes, a cooling groove and a cooling transverse groove, the cutter head is arranged at one end of the cutter handle, the cooling holes are formed in the middle of the cutter handle and the middle of the cutter head, the cooling groove is formed in the bottom of the cutter head, the cooling holes penetrate through the cutter handle and the cooling groove in the bottom of the cutter head, and the cutter head is provided with a plurality of grinding heads. The multiple grinding heads are evenly distributed on the periphery of the tool bit, and a cooling transverse groove is formed between every two adjacent grinding heads. By means of the mechanism, the problems that a traditional cold carving grinding head does not have the cooling function, multiple times of tool switching and multiple times of program switching are needed in the machining process, due to the fact that the cooling effect of the grinding head is poor, the grinding head is seriously worn, tool marks are likely to appear on glass, the follow-up polishing procedure is difficult to manufacture, and continuous automatic production cannot be achieved are solved.

The utility model discloses a diamond grinding brush applied to glass and ceramics, and relates to the technical field of diamond grinding brushes, the diamond grinding brush comprises a mounting disc and a diamond brush head, the front surface of the mounting disc is provided with a front positioning groove, the back surface of the mounting disc is provided with a back positioning groove, and the back surface of the diamond brush head is fixedly provided with a connecting plate; a connecting block is fixedly installed on the side, away from the diamond brush head, of the connecting plate, an inserting hole is formed in the inner side of the connecting block, and the side, close to the connecting block, of the diamond brush head is inserted into the inner side of the front positioning groove. By the adoption of the structure, after the clamping spring and one fixing bolt are taken down, the limiting frame is pulled out, and at the moment, the spring in the mounting cavity resets to push the limiting plate to move and drive the insertion block to be separated from the insertion hole of the connecting block, so that the diamond brush head can be conveniently and rapidly disassembled, assembled and replaced.

The utility model relates to the technical field of grinding wheels, and discloses a high-strength resin grinding wheel which comprises a grinding wheel body, an installation shaft is arranged on the upper surface of the grinding wheel body, a hollow column and a heat dissipation mechanism are fixedly installed on the upper surface of the grinding wheel body, and the heat dissipation mechanism is arranged on the grinding wheel body. The heat dissipation mechanism is used for conducting heat dissipation treatment on the surface of the grinding wheel body, the heat dissipation mechanism comprises a heat conduction groove, the heat conduction groove is formed in the upper surface of the grinding wheel body, and the dismounting and mounting mechanism is arranged on the grinding wheel body and used for dismounting and mounting the grinding wheel body. The high-strength resin grinding wheel can be rapidly disassembled and assembled in a clamping mode, compared with a flange installation and connection mode, the mode can achieve rapid installation and disassembly when the high-strength resin grinding wheel is replaced, fixing can be rapidly completed, the time needed for replacing the grinding wheel is saved, and more convenience is achieved.

A conditioning disk having microfeatures is described. More specifically, the conditioning disk has at least one discrete abrasive element and at least one microfeature. The asymmetry of at least one microstructure can enable a wide range of pad polishing parameters, such as surface roughness and pad wear rate, based on the orientation.

A tool segment (60) for a grinding tool for surface finishing of building materials has a base body (110) with an end face (112), a rear face (114) facing away from the end face (112), and a circumferential region (122) extending between the end face (112) and the rear face (114). The end face (112) is equipped with at least one hard material cutting element (140, 142). The rear face (114) has at least one fastening element (130) for mounting on a base body of a grinding tool. At least one circumferential side (124) of the circumferential region (122) is equipped with at least one hard material cutting element (150). A grinding tool has at least one such tool segment (60). A grinding machine for surface finishing of building materials has at least one such grinding tool.

The invention discloses an ultra-fine grinding thinning grinding wheel and a preparation method thereof.The grinding wheel comprises a grinding wheel base body and tool bit assemblies, a plurality of reserved grooves are formed in the circumferential direction of the grinding wheel base body at equal intervals, and the tool bit assemblies are arranged in the reserved grooves; the tool bit assembly comprises, by volume fraction, 35%-45% of composite abrasive micro powder, 30%-45% of a ceramic bonding agent, 20%-30% of a double-effect pore forming agent, 1%-3% of a filling agent, 1%-2% of a dispersing agent and a temporary bonding agent accounting for 5% of the total weight. Through design optimization of the grinding wheel formula and the preparation method, the better wafer surface quality can be obtained under the ultra-fine grinding and thinning process, and meanwhile, the stability and the long service life of the grinding wheel in the service process are guaranteed; and a composite abrasive material combination and a double-effect pore-forming agent are matched and optimized, so that the optimized superfine abrasive material combination obtains a high-quality grinding and thinning surface, and meanwhile, the stable and long-acting service life is considered.

A skate blade sharpening system used to sharpen the blades of ice skates. The skate sharpener can include a housing that includes an elongated slot for receiving the blade of an ice skate for sharpening, and clamp jaws for retaining the skate. The housing can include at least one slot cover to engage the skate blade. Engagement of the skate blade can be sensed by a controller to enable sharpening operations to proceed. The skate blade sharpening system can automatically operate a grinding wheel and move the rotating grinding wheel back and forth along the lower face of the skate blade a desired number of times to sharpen the skate blade.

The present invention discloses a grinding wheel containing linear cooling channels and a double-wire 3D printing preparation method thereof, wherein the grinding wheel is composed of a working layer and a metal matrix, a plurality of linear cooling channels are evenly distributed on the surface of the working layer in the circumferential direction, the width of the linear cooling channels is 1 to 5 mm, and the spacing between any two adjacent linear cooling channels is 1 to 10 mm; the working layer is composed of an alloy matrix and abrasive particles, and the abrasive particles are selected from diamond particles or CBN particles. The present invention adopts double-wire 3D printing technology to accurately print out the designed miniature linear cooling channels, ensure the uniformity of powder distribution in the diamond or CBN grinding wheel of the linear cooling channel, and the linear cooling channels can not only improve the chip removal efficiency, but also cut off the heat transfer route when the grinding wheel is working to reduce the thermal damage to the diamond, improve the temperature field of the working layer and the workpiece interface, and improve the service life of the grinding wheel and the processing quality of the workpiece surface.

The utility model discloses a polishing wheel base body of a folding steel structure, which comprises a mounting seat, a rubber base body and a grinding material belt base body, the middle part of the mounting seat is mounted on a grinding wheel rod, the rubber base body is positioned on the peripheral wall surface of the mounting seat, the grinding material belt base body is folded and pleated to form a belt-shaped structure with wrinkles, and the rubber base body is positioned on the outer wall surface of the mounting seat. Rubber reinforced isolation blocks are arranged between the corrugation structures on the upper face and the lower face of the abrasive belt base body respectively, the abrasive belt base body of a belt-shaped structure is wound around the outer side wall face of the rubber base body, and then a complete polishing wheel base body is formed for polishing machining. The polishing wheel base body does not contain seams in the circumferential direction, the bonding strength is higher, the polishing wheel base body is not prone to falling off due to scratching, meanwhile, automation is easy to achieve in the process, mass production can be achieved, the manufacturing cost can be remarkably reduced, the polishing wheel base body can be popularized and applied to the civil industry grinding and polishing process, comprehensive automation of the process is achieved, and manual grinding is thoroughly eliminated.

The invention relates to an intermittent oscillation heat pipe grinding wheel for grinding aerospace high-toughness difficult-to-machine materials and a manufacturing method of the intermittent oscillation heat pipe grinding wheel. The intermittent oscillation heat pipe grinding wheel comprises an intermittent oscillation heat pipe pipeline, a liquid working medium, a body and a grinding material layer. Liquid working media are injected into the intermittent oscillation heat pipes, grooves are machined in the front side face and the rear side face of the body in a crossed mode, and the two intermittent oscillation heat pipes are embedded into the grooves respectively and fixed through brazing to form a whole with the body. The intermittent oscillating heat pipe pipeline is formed by bending a group of metal capillary tubes into more than one end-to-end S-shaped closed loop multi-loop, each loop comprises a straight pipe section and an elbow, and a necking is processed on the straight pipe section of each loop close to a condensation section. Under the working condition of high-speed grinding, the necking of the intermittent oscillating heat pipe generates local pressure difference to promote the liquid working medium to form intermittent spring flow and intermittently gush in the oscillating heat pipe, so that the grinding heat of the grinding wheel is quickly dredged and efficiently cooled.