1320results about "Bonded abrasive wheels" patented technology

The present invention discloses a CMP pad dresser which has a plurality of uniformly spaced abrasive particles protruding therefrom. The abrasive particles are super hard materials, and are typically diamond, polycrystalline diamond (PCD), cubic boron nitride (cBN), or polycrystalline cubic boron nitride(PcBN). The abrasive particles are brazed to a substrate which may be then coated with an additional anti-corrosive layer. The anti-corrosive layer is usually a diamond or diamond-like carbon which is coated over the surface of the disk to prevent erosion of the brazing alloy by the chemical slurry used in conjunction with the CMP pad. This immunity to chemical attack allows the CMP pad dresser to dress the pad while it is polishing a workpiece. In addition to even spacing on the substrate, the abrasive particles extend for a uniform distance away from the substrate, allowing for even grooming or dressing of a CMP pad both in vertical and horizontal directions. A method of producing such a CMP pad dresser is also disclosed.

Fused abrasive particles comprising eutectic material comprising Al2O3-MgO-REO eutectic. The fused abrasive particles can be incorporated into abrasive products such as coated abrasives, bonded abrasives, non-woven abrasives, and abrasive brushes.

A bond matrix for metal bonded abrasive tools includes a metal bond system, porosity and an optional filler. Tools according to embodiments of the invention exhibit long tool life, produce an acceptable quality of cut and can have self-dressing properties. The bond matrix can be used, for example, in abrasives tools configured for the electronics industry, such as 1A8 wheels for slicing ball grid arrays (BGAs) and other such slicing operations.

Bonded abrasive tools, e.g., grinding wheels, can be reinforced using, for instance, one or more fibreglass web(s) having a surface of glass per unit of at least 0.2. Alternatively or in addition, the fibreglass web has a thickness of 2 mm or less. The web can be designed to provide improved adhesion between the fibreglass reinforcement and the mixture employed to form the bonded abrasive tool. In some examples, the middle reinforcement at the neutral zone of the wheel can be eliminated or minimized.

In a depressed-center abrasive wheel assembly a reinforcement layer of polygonal shape is located between a front face of the abrasive wheel and a front flange. The reinforcement layer is dimensioned to entirely cover the depressed center portion of the wheel. An example of polygonal reinforcement layer has a hexagonal shape and is made of fiberglass cloth. A polygonal shape reinforcement layer can also be employed between the front flange and the front face in an abrasive flat wheel assembly that employs a wheel without internal reinforcement.

A single-use grinding tool includes a wheel portion having a profiled recess (e.g., such as a U, V, or bowl shape) extending circumferentially along the wheel portion's periphery. A multi-layered bonded abrasive (e.g., 3-dimensional matrix of abrasive grains and bond material, or multiple layers of abrasive tape) is conformably coated or otherwise applied in a uniform thickness along the profiled recess. The bonded abrasive in one particular case includes a metal bond with diamonds. However, organic, resinous, vitrified, and hybrid bonds, as well as other abrasive grit types, can be used. The wheel portion is supported by an arbor portion which may be removably coupled to the wheel portion, or formed integrally with the wheel portion. The tool is useful, for example, in edge grinding a workpiece, such as sheet glass. Methods of tool use and tool manufacture are disclosed as well.

Unitary finishing elements having discrete finishing members fixedly attached to unitary resilient body are disclosed for finishing semiconductor wafers. The discrete finishing members can be comprised of a multiphase polymeric composition. The new unitary finishing elements have lower cost to manufacture and high precision. The unitary finishing elements can reduce unwanted surface defect creation on the semiconductor wafers during finishing.

Superabrasive tools and methods for the making thereof are disclosed and described. In one aspect, superabrasive particles are chemically bonded to a matrix support material according to a predetermined pattern by a braze alloy. The brazing alloy may be provided as a powder, thin sheet, or sheet of amorphous alloy. A template having a plurality of apertures arranged in a predetermined pattern may be used to place the superabrasive particles on a given substrate or matrix support material.

Proposed is a cutting wheel bladed on the outer periphery of a base wheel with abrasive particles, e.g., particles of diamond and cubic boron nitride, suitable for cutting of a hard and brittle material such as a sintered block of a rare earth-based magnet alloy with good cutting accuracy and low material loss by cutting. The cutting wheel is an integral disk body consisting of a base wheel of a relatively small thickness made from a cemented metal carbide, e.g., tungsten carbide particles cemented with metallic cobalt, instead of conventional steel materials and a cutting blade formed on the outer periphery of the base wheel which contains from 10 to 80% by volume of the abrasive particles having a specified average particle diameter.

A cylindrical, abrasive grinding wheel having a cylindrical abrasive region with an abrasive surface at an outer circular band thereof. The abrasive region includes layers of abrasive particles. The layers of abrasive particles can be tilted with respect to an axis of rotation of the grinding wheel or they can such that grooving in the grinding wheel and a workpiece ground by the grinding wheel can be reduced. Alternatively, the abrasive region can be formed from a plurality of abrasive segments each having layers of abrasive particles. The layers of abrasive particles can be staggered in the direction of the axis of rotation from one segment to another. This can also reduce grooving in the grinding wheel and workpieces.

Fused abrasive particles comprising eutectic material. The fused abrasive particles can be incorporated into abrasive products such as coated abrasives, bonded abrasives, non-woven abrasives, and abrasive brushes.

The invention provides an LED package and a backlight device incorporating the LED lens. The LED package has a bottom surface and a light exiting surface cylindrically extended around a central axis of the package from the bottom surface. Also, a reflecting surface is positioned on an opposite side of the bottom surface and symmetrical around the central axis such that light incident from the bottom surface is reflected toward the light exiting surface. Further, a scattering area is formed on the reflecting surface. According to the invention, by applying scattering materials on the reflecting surface of the LED package, a reflecting paper does not need to be attached, thereby simplifying a process and reducing the manufacture time and cost.

A method of manufacturing a chemical-mechanical polishing (CMP) pad comprises the steps of (a) forming a layer of a polymer resin liquid solution (i.e., a polymer resin dissolved in a solvent); (b) inducing a phase separation in the layer of polymer solution to produce an interpenetrating polymeric network comprising a continuous polymer-rich phase interspersed with a continuous polymer-depleted phase in which the polymer-depleted phase constitutes about 20 to about 90 percent of the combined volume of the phases; (c) solidifying the continuous polymer-rich phase to form a porous polymer sheet; (d) removing at least a portion of the polymer-depleted phase from the porous polymer sheet; and (e) forming a CMP pad therefrom. The method provides for microporous CMP pads having a porosity and pore size that can be readily controlled by selecting the concentration polymer resin in the polymer solution, selecting the solvent based on the solubility parameters of the polymer in the solvent polarity of solvent, selecting the conditions for phase separation, and the like.

In the electrodeposited abrasive wheel 20 of the abrasive tool according to the present invention, plural mound parts 21, which are upheaved at the central domain of base metal 19 in almost columnar shape, are arranged mostly in the shape of lattice. An abrasive grain layer 22 is formed on a base metal 19, and plural ultra abrasive grains 14 are adhered only to each mound parts 21 by electrodeposited metal phase 25, and referred as the small abrasive-grain-layer parts 24, respectively. Ultra abrasive grains are laid out at corner R part 21a and top 21b of the mound parts 21 at the small abrasive-grain-layer parts 24. Ultra abrasive grains at each small abrasive-grain-layer parts are set as 11-500 pieces, and the rate which ultra abrasive grains occupy to the whole area of abrasive grain layer accounted by plane projection is set as 20%-80% of the range. At the time of grinding, only ultra abrasive grains contact to grinding work piece, then high abutment pressure is maintained, and sharpness and the discharge performance of ground wastes are good.

An abrasive article may include an abrasive body having a grinding layer, where the grinding layer may include a bond and abrasive particles contained within the bond. The abrasive body also may include a volumetric ratio GLV_b/GLV_ap of at least about 0.4, where GLV_b is a volume percent of bond for a total volume of the grinding layer and GLV_ap is a volume percent of abrasive particles for a total volume of the grinding layer. The abrasive particles may include seeded sol-gel ceramic and may have an average particle size of at least about 600 microns. In addition, the abrasive particles may include a coupling agent that may include an organic material with a silane functional group. Prior to formation of the abrasive article, the abrasive particles may be coated by the coupling agent at a ratio A_COA/A_AB of at least about 0.1, where C_COA is the amount of coupling agent in grams in a pre-formation mixture and A_AB is the amount of abrasive particles in pounds (lbs) in the pre-formation mixture.

A cutting device comprises a base having a working side that is oriented to face a workpiece from which material is to be removed. A plurality of individual cutting elements are arranged on the working side of the base, with each cutting element having a peak that comprises at least one cutting edge that is formed from a polycrystalline superhard material. The peaks of the cutting elements are aligned in a common plane.

A CMP polish pad used to chemically and mechanically polish a work to be polished. The CMP polish pad has polishing portions of two or more types, that have different conditions of contact with the work, provided on the pad surface. For example, polishing portions of a plurality of types having different coefficients of elasticity with respect to compression in the direction of pressing against the work may be provided on the pad surface. Also polishing portions of a plurality of types having different areas of contact with the work may be provided on the pad surface. Further, polishing portions of a plurality of types having different heights above the pad surface may be provided on the pad surface.

A rotary tool (T) has a rotary segment (10) with an opposed surface opposed to a work surface and a plurality of cutting parts (20) arranged on the opposed surface. Some cutting parts (20) include tips (22a) made of a grinding tool segment obtained by binding abrasive grains by a metal binder and the other cutting parts (20) include tips (24a) made of a sintered material harder than the grinding tool segment, and the respective cutting parts (20) are arranged such that the tips (24a) are located at positions more outward than the tips (22a) with respect to radial directions of the rotary segment.

A grinding wheel has a disc having a connection hole formed at a center thereof, to which a rotation axis of a grinder is connected, and a plurality of abrasive segments detachably connected to a surface of the disc. A plurality of fixing recesses are radially formed on the surface of the disc at an interval and fixing protrusions having a shape corresponding to the fixing recess are formed on bottom surfaces of the abrasive segments, so that the abrasive segments are connected to the disc by inserting the fixing protrusions into the fixing recesses. According to the grinding wheel, when the abrasive segment is worn away or inferior as it is used for a long time, it has only to replace the corresponding abrasive segment only. Accordingly, an economical efficiency is high.

Backing plates are provided for use with abrasive disks designed to permit a view of the surface while abrading is occurring. This is achieved by the removal of portions of the circumference of the plate and preferably also viewing apertures in the body of the plate.

The present invention relates to a diamond tool and a method of manufacturing the same, wherein multiple abrasive layers are formed through a brazing or electroplating method, thereby improving the performance and service life of the tool. According to the method of the present invention, a plurality of concave portions are formed in a surface of the shank. A bonding paste is coated into the concave portions and abrasives are dispersed in the bonding paste to thereby form a lower abrasive layer. Again, a bonding material is coated on the lower abrasive layer and abrasives are dispersed in the bonding material to thereby form an upper abrasive layer. Then, a heat treatment is executed to fusion-bond the bonding material and abrasives onto the surface of the shank. Therefore, the diamond tools manufactured through a multiple brazing or electroplating method according to the invention can significantly extend the service life thereof, which has been a detrimental weakness of the conventional diamond tools having a single abrasive layer, in spite of various advantages of the brazing and electroplating methods. Furthermore, multiple abrasive layers can be formed inside the concave portions having a desired spacing, width and depth, thereby significantly improving the service life and the cutting performance of diamond tools.

A grinding wheel including a circular grinding region (1) with a plurality of through-openings (3) formed therein, a central mounting region (2) coaxial with the grinding region (1), and a plurality of cutting bodies (4) having a rectangular base surface, projecting from the grinding region (1), and spaced from a center of the mounting region (2) by different radial distances, with each cutting body (4) having a longitudinal side (5) adjacent to the center of the mounting region (2) and a wide side (6) remote from the center of the mounting region (2), with the longitudinal side (5) and the wide side (6) forming together an edge (K), and with the longitudinal side (5) extending at an angle (B) of from 35° to 55° to a radial line (R) extending from the center of the mounting region (2) and passing tangentially to the edge (K).

An abrasive tool including a bonded abrasive article including a bond material comprising a metal or metal alloy, abrasive grains contained within the bond material, and a reaction agent dispersed within the bond material, wherein the reaction agent chemically reacting with a surface of the workpiece during abrasion to form a reaction product.

A grinding machine abrasive unit holder with the use of springs, gases or fluids allows each abrasive unit to be in contact with the floor, independently at all times. This action allows the finishing of the high and low spots of the floor in the same operation.

A method for machining a rotor having a disc and a plurality of integral airfoils projecting outwardly from the disc, according to one aspect of the invention, comprises a step of machining each airfoil with a disc tool having a grinding periphery thereof adapted for removing material from the airfoils. The grinding periphery has a thickness greater than a thickness of an adjacent supporting portion of the disc to permit the grinding periphery to pass a surface of an airfoil in a multi-axis simultaneous motion, thereby matching the grinding periphery with a predetermined geometry of a portion of the airfoil.

An objective of the present invention is to provide a polishing pad for a semiconductor wafer and a laminated body for polishing of a semiconductor wafer equipped with the same which can perform optical endpoint detection without lowering the polishing performance as well as methods for polishing of a semiconductor wafer using them. The polishing pad of the invention comprises a water-insoluble matrix material such as crosslinked 1,2-polybutadiene, and a water-soluble particle such as beta-cyclodextrin dispersed in this water-insoluble matrix material, and has a light transmitting properties so that a polishing endpoint can be detected with a light.

PCT No. PCT/JP96/00206 Sec. 371 Date Jul. 30, 1997 Sec. 102(e) Date Jul. 30, 1997 PCT Filed Feb. 1, 1996 PCT Pub. No. WO96/23630 PCT Pub. Date Aug. 8, 1996A cutting edge comprising a mass of superabrasive particles (2) electrodeposited on a thin-walled metallic base member (1) along a border (6) of said base member, wherein said mass (2) forms one or more layers at said border of said base member and fixed thereto, and each layer contains parts comprising at least five superabrasive particles (3) in a row in an extending direction of said base member from said border, so as to improve free-cut performance, decrease kerf width and prolong the life of cutting tool.

The present invention relates to an abrasive article comprising a rigid backing having a first major surface and a second major surface; a plurality of ceramic abrasive composites each comprising a plurality of abrasive particles distributed throughout a porous ceramic matrix; and at least one metal coating, optimally, a set of metal coatings, which affixes the ceramic abrasive composites to at least one major surface of the backing. The present invention also relates to a method for grinding workpiece using the abrasive article, which comprises the steps of bringing the surface of the workpiece into contact with the abrasive article, applying a liquid on the interface between the workpiece and the abrasive article, moving the workpiece and the abrasive article with respect to each other.

CMP pad dressers with increased pad dressing work loads on the centrally located abrasive particles during dressing of a CMP pad, and methods associated therewith are disclosed and described. The increase in work load on centralized particles improves pad dressing performance and also extends the service life of the pad dresser.

New, versatile finishing surfaces are described. Unitary finishing elements having discrete finishing members attached to unitary resilient body are disclosed for finishing microdevices such as semiconductor wafers. Finishing surfaces such as discrete finishing members can be comprised of a multiphase polymeric composition. The new unitary finishing elements have lower cost to manufacture and high precision. The unitary finishing elements and finishing surfaces can reduce unwanted surface defect creation on the semiconductor wafers during finishing.