2866results about "Bonded abrasive wheels" patented technology

The present invention discloses a CMP pad dresser which has a plurality of uniformly spaced abrasive particles protruding therefrom. The abrasive particles are super hard materials, and are typically diamond, polycrystalline diamond (PCD), cubic boron nitride (cBN), or polycrystalline cubic boron nitride(PcBN). The abrasive particles are brazed to a substrate which may be then coated with an additional anti-corrosive layer. The anti-corrosive layer is usually a diamond or diamond-like carbon which is coated over the surface of the disk to prevent erosion of the brazing alloy by the chemical slurry used in conjunction with the CMP pad. This immunity to chemical attack allows the CMP pad dresser to dress the pad while it is polishing a workpiece. In addition to even spacing on the substrate, the abrasive particles extend for a uniform distance away from the substrate, allowing for even grooming or dressing of a CMP pad both in vertical and horizontal directions. A method of producing such a CMP pad dresser is also disclosed.

Fused abrasive particles comprising eutectic material comprising Al2O3-MgO-REO eutectic. The fused abrasive particles can be incorporated into abrasive products such as coated abrasives, bonded abrasives, non-woven abrasives, and abrasive brushes.

A bond matrix for metal bonded abrasive tools includes a metal bond system, porosity and an optional filler. Tools according to embodiments of the invention exhibit long tool life, produce an acceptable quality of cut and can have self-dressing properties. The bond matrix can be used, for example, in abrasives tools configured for the electronics industry, such as 1A8 wheels for slicing ball grid arrays (BGAs) and other such slicing operations.

Bonded abrasive tools, e.g., grinding wheels, can be reinforced using, for instance, one or more fibreglass web(s) having a surface of glass per unit of at least 0.2. Alternatively or in addition, the fibreglass web has a thickness of 2 mm or less. The web can be designed to provide improved adhesion between the fibreglass reinforcement and the mixture employed to form the bonded abrasive tool. In some examples, the middle reinforcement at the neutral zone of the wheel can be eliminated or minimized.

In a depressed-center abrasive wheel assembly a reinforcement layer of polygonal shape is located between a front face of the abrasive wheel and a front flange. The reinforcement layer is dimensioned to entirely cover the depressed center portion of the wheel. An example of polygonal reinforcement layer has a hexagonal shape and is made of fiberglass cloth. A polygonal shape reinforcement layer can also be employed between the front flange and the front face in an abrasive flat wheel assembly that employs a wheel without internal reinforcement.

A single-use grinding tool includes a wheel portion having a profiled recess (e.g., such as a U, V, or bowl shape) extending circumferentially along the wheel portion's periphery. A multi-layered bonded abrasive (e.g., 3-dimensional matrix of abrasive grains and bond material, or multiple layers of abrasive tape) is conformably coated or otherwise applied in a uniform thickness along the profiled recess. The bonded abrasive in one particular case includes a metal bond with diamonds. However, organic, resinous, vitrified, and hybrid bonds, as well as other abrasive grit types, can be used. The wheel portion is supported by an arbor portion which may be removably coupled to the wheel portion, or formed integrally with the wheel portion. The tool is useful, for example, in edge grinding a workpiece, such as sheet glass. Methods of tool use and tool manufacture are disclosed as well.

Unitary finishing elements having discrete finishing members fixedly attached to unitary resilient body are disclosed for finishing semiconductor wafers. The discrete finishing members can be comprised of a multiphase polymeric composition. The new unitary finishing elements have lower cost to manufacture and high precision. The unitary finishing elements can reduce unwanted surface defect creation on the semiconductor wafers during finishing.

Superabrasive tools and methods for the making thereof are disclosed and described. In one aspect, superabrasive particles are chemically bonded to a matrix support material according to a predetermined pattern by a braze alloy. The brazing alloy may be provided as a powder, thin sheet, or sheet of amorphous alloy. A template having a plurality of apertures arranged in a predetermined pattern may be used to place the superabrasive particles on a given substrate or matrix support material.

Proposed is a cutting wheel bladed on the outer periphery of a base wheel with abrasive particles, e.g., particles of diamond and cubic boron nitride, suitable for cutting of a hard and brittle material such as a sintered block of a rare earth-based magnet alloy with good cutting accuracy and low material loss by cutting. The cutting wheel is an integral disk body consisting of a base wheel of a relatively small thickness made from a cemented metal carbide, e.g., tungsten carbide particles cemented with metallic cobalt, instead of conventional steel materials and a cutting blade formed on the outer periphery of the base wheel which contains from 10 to 80% by volume of the abrasive particles having a specified average particle diameter.

A cylindrical, abrasive grinding wheel having a cylindrical abrasive region with an abrasive surface at an outer circular band thereof. The abrasive region includes layers of abrasive particles. The layers of abrasive particles can be tilted with respect to an axis of rotation of the grinding wheel or they can such that grooving in the grinding wheel and a workpiece ground by the grinding wheel can be reduced. Alternatively, the abrasive region can be formed from a plurality of abrasive segments each having layers of abrasive particles. The layers of abrasive particles can be staggered in the direction of the axis of rotation from one segment to another. This can also reduce grooving in the grinding wheel and workpieces.

Fused abrasive particles comprising eutectic material. The fused abrasive particles can be incorporated into abrasive products such as coated abrasives, bonded abrasives, non-woven abrasives, and abrasive brushes.

The invention provides an LED package and a backlight device incorporating the LED lens. The LED package has a bottom surface and a light exiting surface cylindrically extended around a central axis of the package from the bottom surface. Also, a reflecting surface is positioned on an opposite side of the bottom surface and symmetrical around the central axis such that light incident from the bottom surface is reflected toward the light exiting surface. Further, a scattering area is formed on the reflecting surface. According to the invention, by applying scattering materials on the reflecting surface of the LED package, a reflecting paper does not need to be attached, thereby simplifying a process and reducing the manufacture time and cost.

A method of manufacturing a chemical-mechanical polishing (CMP) pad comprises the steps of (a) forming a layer of a polymer resin liquid solution (i.e., a polymer resin dissolved in a solvent); (b) inducing a phase separation in the layer of polymer solution to produce an interpenetrating polymeric network comprising a continuous polymer-rich phase interspersed with a continuous polymer-depleted phase in which the polymer-depleted phase constitutes about 20 to about 90 percent of the combined volume of the phases; (c) solidifying the continuous polymer-rich phase to form a porous polymer sheet; (d) removing at least a portion of the polymer-depleted phase from the porous polymer sheet; and (e) forming a CMP pad therefrom. The method provides for microporous CMP pads having a porosity and pore size that can be readily controlled by selecting the concentration polymer resin in the polymer solution, selecting the solvent based on the solubility parameters of the polymer in the solvent polarity of solvent, selecting the conditions for phase separation, and the like.

In the electrodeposited abrasive wheel 20 of the abrasive tool according to the present invention, plural mound parts 21, which are upheaved at the central domain of base metal 19 in almost columnar shape, are arranged mostly in the shape of lattice. An abrasive grain layer 22 is formed on a base metal 19, and plural ultra abrasive grains 14 are adhered only to each mound parts 21 by electrodeposited metal phase 25, and referred as the small abrasive-grain-layer parts 24, respectively. Ultra abrasive grains are laid out at corner R part 21a and top 21b of the mound parts 21 at the small abrasive-grain-layer parts 24. Ultra abrasive grains at each small abrasive-grain-layer parts are set as 11-500 pieces, and the rate which ultra abrasive grains occupy to the whole area of abrasive grain layer accounted by plane projection is set as 20%-80% of the range. At the time of grinding, only ultra abrasive grains contact to grinding work piece, then high abutment pressure is maintained, and sharpness and the discharge performance of ground wastes are good.

This invention provides polishing pad tiles which, by virtue of their geometry and surface features, can be arranged to form mosaic pads having channels at the seams which facilitate the flow of polishing fluid during polishing of a workpiece.

An abrasive article may include an abrasive body having a grinding layer, where the grinding layer may include a bond and abrasive particles contained within the bond. The abrasive body also may include a volumetric ratio GLV_b/GLV_ap of at least about 0.4, where GLV_b is a volume percent of bond for a total volume of the grinding layer and GLV_ap is a volume percent of abrasive particles for a total volume of the grinding layer. The abrasive particles may include seeded sol-gel ceramic and may have an average particle size of at least about 600 microns. In addition, the abrasive particles may include a coupling agent that may include an organic material with a silane functional group. Prior to formation of the abrasive article, the abrasive particles may be coated by the coupling agent at a ratio A_COA/A_AB of at least about 0.1, where C_COA is the amount of coupling agent in grams in a pre-formation mixture and A_AB is the amount of abrasive particles in pounds (lbs) in the pre-formation mixture.

A conditioning disk and a conditioner for a chemical mechanical polishing (CMP) pad, and a method of fabricating, reworking, and cleaning the conditioning disk, are utilized to improve conditioning efficiency, and to reduce production expenses. The conditioning disk for a CMP pad is divided into regions defined by a size difference of abrasive grains formed on the body surface in each region of the conditioning disk. The method of fabricating the conditioning disk is performed by forming adhesive films for attaching the abrasive grains onto the body surface multiple times. In addition, a used conditioning disk may be reworked by detaching the abrasive grains from the body, and attaching new abrasive grains. A used conditioning disk can also be cleaned of by-products of the conditioning process by a cleaning method using a HF solution or BOE (buffered oxide etch) solution.