5results about How to "Improve grinding performance" patented technology

The invention belongs to the technical field of grinding wheel abrasives, and particularly relates to a diamond porous microsphere, a grinding wheel abrasive and a preparation method and application thereof. The preparation raw materials of the diamond porous microspheres comprise mixed powder, a binder and water, the mixed powder comprises a first ceramic bond, diamond and a pore forming agent. The first ceramic bond, the diamond and the pore forming agent are used as raw materials for preparing the diamond porous microspheres, the diamond porous microspheres have natural pores and prefabricated spherical pores, the porosity is high, and the self-sharpening performance of the grinding wheel grinding material can be improved; the grinding wheel abrasive material is prepared through secondary air degreasing sintering of the diamond porous microspheres, a new three-dimensional pore structure is formed among the naturally stacked diamond porous microspheres, the grinding wheel abrasive material with a'natural pore + prefabricated spherical pore + stacked pore 'multi-stage pore structure is obtained, the cooling, lubricating and chip removal effects of a grinding wheel can be greatly improved, and the service life of the grinding wheel is prolonged. Therefore, the grinding performance and the service life of the grinding wheel are improved.

The application provides a diamond multi-blade contour forming tool and a preparation method thereof, V is partially replaced by Nb, the content of V is strictly controlled, high-hardness VC is replaced by low-hardness NbC, and the grain boundary is purified and the carbide is refined by rare earth Ce, so that the grinding performance is multiplied compared with existing high-speed steel, the industry pain point that high hardness and easy grinding cannot be achieved at the same time is solved, and the machining difficulty and production cost of complex multi-blade contour are greatly reduced. The uniformity of the base body composition is ensured by vacuum melting + electroslag remelting, the coarse carbide is broken by multi-directional forging, the strength and toughness balance is realized by sectional preheating precise quenching + three times tempering, the high-strength combination of the PCD composite sheet and the tool body is realized by vacuum brazing, the contour precision control within ± 2 mu m is realized by five-axis precision grinding, and the forming tool perfectly adapts to the high-precision machining demand of the complex special-shaped structural part of consumer electronics.

The application relates to a composite adjustable double-ring diamond cup-shaped grinding wheel and belongs to the technical field of glass edge grinding. The composite adjustable double-ring diamond cup-shaped grinding wheel comprises an inner wheel and an outer wheel sleeved on the inner wheel, a plurality of inner wheel cavity grooves are arranged on the inner wheel in a circumferential interval, a plurality of outer wheel cavity grooves are arranged on the outer wheel in a circumferential interval, inner wheel grinding pieces and outer wheel grinding pieces are respectively fixedly installed in the inner wheel cavity grooves and the outer wheel cavity grooves, the inner wheel grinding pieces and the outer wheel grinding pieces are arranged in a circumferential overlap and stagger mode, the inner wheel grinding pieces and the outer wheel grinding pieces are respectively elastic grinding pieces and rigid grinding pieces, and the outer peripheral surface profile of the part of the inner wheel grinding piece radially greater than or equal to the inner diameter of the outer wheel is an arc surface or an inclined surface. The application is favorable for avoiding the generation of steps in the grinding process, thereby avoiding the edge collapse of the workpiece.

The utility model relates to the technical field of coated abrasive tools, in particular to a chip removal channel combination structure and a coated abrasive tool, the chip removal channel combination structure comprises at least two kinds of chip removal channels with leading numbers, one of the chip removal channels is at least three-way, the chip removal channels are arranged between abrasive materials, and the chip removal channels are mutually communicated without blocking; the center lines of the adjacent chip removal channels intersect to form intersection points, and the chip removal channels between the adjacent intersection points are in a straight line shape or a curve shape. According to the utility model, the chip removal channels are communicated with each other and are not blocked, the center lines of the adjacent chip removal channels are intersected to form the chip removal channel intersection points, and the chip removal channels between the adjacent intersection points are straight lines or curved lines. The structure can improve the chip removal efficiency, prevent abrasive chip accumulation, prolong the service life of the grinding tool and improve the grinding effect, and is suitable for various grinding working conditions.

This invention provides a grinding station for the interior cavity of shell-type products, including a mounting mechanism and a grinding mechanism. The mounting mechanism has an actuator that can move along the X, Y, and Z axes. The grinding mechanism is mounted on the actuator. The moving actuator drives the grinding mechanism to extend into the shell cavity to grind the inner wall of the shell cavity. The grinding mechanism includes a self-rotating rigid first grinding component. A secondary grinding assembly is provided on one side of the first grinding component, coaxially arranged with the first grinding component, and includes a flexible second grinding component. When unfolded, the second grinding component is flush with or protrudes from the grinding end face of the first grinding component. During processing, the inner wall of the shell cavity is first ground by the first grinding component, and then the second grinding component is unfolded for a second grinding. During the unfolding process, the grinding mechanism does not need to exit the shell cavity. The mounting mechanism can be a three-axis machine tool or a robotic arm, which moves the actuator to drive the grinding mechanism into the shell cavity.