1187 results about "Intermetallic" patented technology

Methods to manufacture nanoscale particles comprising metals, alloys, intermetallics, ceramics are disclosed. The thermal energy is provided by plasma, internal energy, heat of reaction, microwave, electromagnetic, direct electric arc, pulsed electric arc and/or nuclear. The process is operated at some stage above 3000K and at high velocities. The invention can be utilized to prepare nanopowders for nanostructured products and devices such as ion conducting solid electrolytes for a wide range of applications, including sensors, oxygen pumps, fuel cells, batteries, electrosynthesis reactors and catalytic membranes.

A coated steel material excellent in corrosion resistance and a method of producing the same, wherein a coated steel material has on the surface of the steel sheet a Zn-alloy coating layer containing 1-10 wt % of Mg, 2-19 wt % of Al and 0.01-2 wt % of Si, where Mg and Al satisfy Mg (%)+Al (%)<=20%, the balance being Zn and unavoidable impurities, and has a coating layer structure of a Mg intermetallic compound or the like. As a base metal treatment, it is preferably provided with a Ni coating layer. The coated Zn-alloy coated steel sheet may have provided on the coating layer, as an intermediate layer, a chromate film layer, and, as an upper layer, an organic coating layer. The Zn-alloy coating layer may further contain one or more of 0.01-1 wt % of In, 0.01-1 wt % of Bi and 1-10 wt % of Sn. The coated steel material may be painted.

Typically 20–40 films of a tough first metal, normally 0.1–1.0 mm thick films of titanium, nickel, vanadium, and/or steel (iron) and alloys thereof, interleaved with a like number of films of a second metal, normally 0.1–1.0 mm thick films of aluminum or alloys thereof, are pressed together in a stack at less than 6 MPa and normally at various pressures 2–4 MPa while being gradually heated in the presence of atmospheric gases to 600–800° C. over a period of, typically, 10+ hours until the second metal is completely compounded; forming thus a metallic-intermetallic laminate composite material having (i) tough first-metal layers separated by (ii) hard, Vickers microhardness of 400 kg/mm²+, intermetallic regions consisting of an intermetallic compound of the first and the second metals. The resulting composite material is inexpensive, lightweight with a density of typically 3 to 4.5 grams/cubic centimeter, and very hard and very tough to serve as, among other applications, lightweight armor. Upon projectile impact (i) the hard intermetallic, ceramic-like, layers are confined by the tough metal layers while (ii) cracking and fracturing is blunted and channeled in directions orthogonal to the axis of impact.

The present invention relates to a process for the production of an elemental material, comprising the step of reacting a halide of the elemental material with a reducing agent in solid form in a fluidized bed reactor at a reaction temperature which is below the melting temperature of the reducing agent. In a preferred embodiment of the present invention, the elemental material is titanium and the titanium is produced in powder form. The invention also relates to the production of alloys or intermetallics of the elemental materials.

The invention relates to an Al—Ni—La system Al-based alloy sputtering target comprising Ni and La, wherein, when a section from (¼)t to (¾)t (t: thickness) in a cross section vertical to a plane of the sputtering target is observed with a scanning electron microscope at a magnification of 2000 times, (1) a total area of an Al—Ni system intermetallic compound having an average particle diameter of 0.3 μm to 3 μm with respect to a total area of the entire Al—Ni system intermetallic compound is 70% or more in terms of an area fraction, the Al—Ni system intermetallic compound being mainly composed of Al and Ni; and (2) a total area of an Al—La system intermetallic compound having an average particle diameter of 0.2 μm to 2 μm with respect to a total area of the entire Al—La system intermetallic compound is 70% or more in terms of an area fraction, the Al—La system intermetallic compound being mainly composed of Al and La.

The present invention provides a method for forming a refractory metal-intermetallic composite. The method includes providing a first powder comprising a refractory metal suitable for forming a metal phase; providing a second powder comprising a silicide precursor suitable for forming an intermetallic phase; blending the first powder and the second powder to form a powder blend; consolidating and mechanically deforming the powder blend at a first temperature; and reacting the powder blend at a second temperature to form the metal phase and the intermetallic phase of the refractory metal-intermetallic composite, wherein the second temperature is higher than the first temperature.

A valve seat made of an iron base sintered alloy for internal combustion engines comprises of hard particles of hardness 700-1300 Hv dispersed by 3-20% by volume in a matrix phase comprising comprising of a 5-40% psarlite phase, a 20-60% fine carbide dispersed phase, and a 5-20% high alloy diffusd phase. The hard paricles are preferably selected from a group of Mo-Ni-Cr-Si-Co intermetallic compound particles, Cr-Mo-Co intermetallic compound particles, and Fe-Mo alloy particles. The iron base sinteed alloy is conpised of, by weight, C: 0.2-2.0%, Cr: 1.0-9.0%, Mo: 1.0-9.0%, Si: 0.1-1.0%, W: 1.0-50%, V: 0.2-3.0%, one or more Cu, Co and Ni of 0.5-10.0% in total, and the remainder substantial Fe.

A method of forming a capping layer on a copper interconnect line (14). The method comprises providing a layer (20) of Aluminium over the interconnect line (14) and the dielectric layer (10) in which it is embedded. This may be achieved by deposition or chemical exposure. The structure is then subjected to a process, such as annealing or further chemical exposure, in an environment containing, for example, Nitrogen atoms, so as to cause indiffusion of Al into the copper line (14) and nitridation to form a diffusion barrier 26 of the intermetallic compound CuAlN.

A metallic interconnect structure (200) for connecting a gold bump (205) and a copper pad (212), as used for example in semiconductor flip-chip assembly. A first region (207) of binary AuSn₂ intermetallic is adjacent to the gold bump. A region (208) of binary AuSn₄ intermetallic is adjacent to the first AuSn₂ region. Then, a region (209) of binary gold-tin solid solution is adjacent to the AuSn₄ region, and a second region (210) of binary AuSn₂ intermetallic is adjacent to the solid solution region. The second AuSn₂ region is adjacent to a nickel layer (213) (preferred thickness about 0.08 μm), which covers the copper pad. The nickel layer insures that the gold/tin intermetallics and solutions remain substantially free of copper and thus avoid ternary compounds, providing stabilized gold bump/solder connections.

The invention discloses nano intermetallic compound soldering paste and a preparation method thereof, belonging to the field of material technologies. The nano intermetallic compound soldering paste disclosed by the invention comprises the following materials in mass ratio: 80-90 of nano intermetallic compound particles, 2-8 of dispersant, 2-8 of binder, 2-8 of thinner and 2-8 of soldering flux. The specific method comprises the following steps of: preparing the nano intermetallic compound particles by using a co-precipitation hydrothermal reduction method; mixing the prepared nano intermetallic compound particles with the dispersant, the binder, the thinner and the soldering flux; uniformly dispersing the obtained mixture in an organic solvent by using an ultrasonic oscillation, manual stirring or mechanical stirring method; and volatilizing an excess solvent, so that the nano intermetallic compound soldering paste is prepared. The soldering paste takes nano intermetallic compound particles as solid components, and by using the size effect of nano materials, an interconnection process at a temperature lower than the melting point temperature of a block is realized, thereby avoiding the high-temperature damages to components, avoiding the overreaction of a connection interface, achieving an effect of long-term high-temperature serving, and reducing the packaging cost.

A lead-free solder alloy exhibiting good performance in impact resistance and vibration resistance. Also provided are a solder ball using such a lead-free solder alloy, and an electronic member having a solder bump using such a lead-free alloy. Specifically, the lead-free solder alloy consists of 1.0 to 2.0% by mass of Ag, 0.3 to 1.0% by mass of Cu, 0.005 to 0.1% by mass of Ni and the balance including Sn and unavoidable impurities. In an Sn—Ag—Cu based solder joint portion on a Cu electrode, a Cu₃Sn intermetallic compound layer is formed directly on the Cu electrode, and then a Cu₆Sn₅ intermetallic compound layer is formed thereon. A Cu atomic site in the Cu₆Sn₅ intermetallic compound layer is replaced by Ni having a smaller atomic radius than Cu to thereby reduce strain in the Cu₆Sn₅ intermetallic compound layer, thus enabling impact resistance and vibration resistance to be improved therein.

A coating and process for depositing the coating on a substrate. The coating is a nickel aluminide overlay coating of predominantly the beta (NiAl) and gamma-prime (Ni₃Al) intermetallic phases, and is suitable for use as an environmental coating and as a bond coat for a thermal barrier coating (TBC). The coating can be formed by depositing nickel and aluminum in appropriate amounts to yield the desired beta+gamma prime phase content. Alternatively, nickel and aluminum can be deposited so that the aluminum content of the coating exceeds the appropriate amount to yield the desired beta+gamma prime phase content, after which the coating is heat treated to diffuse the excess aluminum from the coating into the substrate to yield the desired beta+gamma prime phase content.

Plate consisting of a steel substrate (1) and a precoat (2) consisting of a layer of intermetallic alloy (3) in contact with said substrate, topped by a layer of metal alloy (4), characterized in that, on at least one precoated face of said plate, an area (6) situated at the periphery of said plate has said metal alloy layer removed.

This invention provides a composite product and an effective method for producing the same, based on an SHS or intense heat producing process. Said composite essentially comprises either (1) one or more skeletal structures of three dimensionally joined pieces of at least one ceramic material selected from carbide, boride, nitride and silicide of titanium, zirconium, tantalum, niobium, silicon, chromium, tungsten, and molybdenum, and metallic material of alloy and/or intermetallic compound which fills the gaps within each and between adjacent skeletal structures, or (2) a matrix consisting of SHS products of metallic and/or ceramic substances, and particles of superabrasive selected from diamond and high pressure polymorphism of boron nitride, which are held and distributed in the matrix in the whole, in the surface or surface area comprising the portion corresponding to the end working face. Also effective is the use of superabrasive particles coated with metallic and/or non-metallic materials by some specific techniques.

A method of processing a metal alloy includes heating to a temperature in a working temperature range from a recrystallization temperature of the metal alloy to a temperature less than an incipient melting temperature of the metal alloy, and working the alloy. At least a surface region is heated to a temperature in the working temperature range. The surface region is maintained within the working temperature range for a period of time to recrystallize the surface region of the metal alloy, and the alloy is cooled so as to minimize grain growth. In embodiments including superaustenitic and austenitic stainless steel alloys, process temperatures and times are selected to avoid precipitation of deleterious intermetallic sigma-phase. A hot worked superaustenitic stainless steel alloy having equiaxed grains throughout the alloy is also disclosed.

A solder paste including a metal component consisting of a first metal powder and a second metal powder having a melting point higher than that of the first metal, and a flux component. The first metal is Sn or an alloy containing Sn, and the second metal is a metal or alloy which forms an intermetallic compound having a melting point of 310° C. or higher with the first metal and has a lattice constant difference, i.e. a difference in between the lattice constant of the intermetallic compound and the lattice constant of the second metal component, of 50% or greater.

The production of ultrafine metal carbide powders from polymeric powder and metallic precursor powder starting materials is disclosed. In certain embodiments, the polymeric powder may comprise polypropylene, polyethylene, polystyrene, polyester, polybutylene, nylon, polymethylpentene and the like. The metal precursor powder may comprise pure metals, metal alloys, intermetallics and/or metal-containing compounds such as metal oxides and nitrides. In one embodiment, the metal precursor powder comprises a silicon-containing material, and the ultrafine powders comprise SiC. The polymeric and metal precursor powders are fed together or separately to a plasma system where the feed materials react to form metal carbides in the form of ultrafine particles.

A multilayer ceramic electronic component includes a ceramic body including a plurality of ceramic layers, the ceramic body having a first main surface and a second main surface and a plurality of side surfaces that connect the first main surface to the second main surface, an internal conductor including nickel, the internal conductor being disposed in the ceramic body and having an exposed portion exposed at least one of the side surfaces, and an external terminal electrode disposed on at least one of the side surfaces of the ceramic body, the external terminal electrode being electrically connected to the internal conductor. The external terminal electrode includes a first conductive layer including a Sn—Cu—Ni intermetallic compound, the first conductive layer covering the exposed portion of the internal conductor at least one of the side surfaces of the ceramic body.