The present application relates to a method for manufacturing an epitaxial layer, an epitaxial layer and a super-junction power device with a wide
process window. The present application comprises providing an N-type substrate with a high
doping concentration, forming a first epitaxial layer, forming a second epitaxial layer, defining the positions of N-type columns and P-type columns,
etching to form a first empty trench, forming a
silicon dioxide column, forming a first
silicon dioxide column with a second
barrier layer on the top and a second
silicon dioxide column with the second
barrier layer on the top being etched away, forming a second empty trench, growing an N-type
semiconductor to fill the second empty trench, the N-type
semiconductor in the second empty trench forming an N-type column, forming a third
barrier layer, selectively
etching the third barrier layer,
etching to form a third empty trench, growing a P-type
semiconductor to fill the third empty trench, the P-type semiconductor in the third empty trench forming a P-type column,
grinding and removing the third barrier layer, and the P-type columns and the N-type columns being distributed at intervals. The present application ensures that the total amount of N-type impurities is equal to the total amount of P-type impurities.