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358results about How to "Made thinner" patented technology

Brick Layout and Stackup for a Touch Screen

A touch sensor panel is disclosed having an array of co-planar single-layer touch sensors fabricated on a single side of a substrate. The sense (or drive) lines can be fabricated in a single strip as columnar or zig-zag patterns in a first orientation, and the drive (or sense) lines can be fabricated as rows of polygonal (e.g. brick-shaped or pentagonal) conductive areas in a second orientation. Each sense (or drive) line in the first orientation can be coupled to a separate metal trace in the border area of the touch sensor panel, and each polygonal area in the second orientation can also be coupled to a metal trace in the border area of the touch sensor panel. The metal traces can allow both the row and column lines to be routed to the same edge of the substrate for flex circuit attachment.
Owner:APPLE INC

Radio IC tag, method for manufacturing radio IC tag, and apparatus for manufacturing radio IC tag

A radio IC tag includes a first antenna and a first spacer, and is arranged so as to generate an operating power by a radio wave received at the first antenna and having a predetermined frequency, operate an IC chip using the power, read out identification information stored in the IC chip, and transmits the identification information, further includes a second antenna having a predetermined length for resonating with the radio wave having the predetermined frequency, and a second spacer provided between the first antenna and the second antenna for holding a distance between the both antennas.
Owner:HITACHI LTD

Illuminating apparatus

This specification discloses an illuminating apparatus having a light source and an optical unit disposed forwardly on the object side of the light source, the optical unit being provided with an incidence surface on which light from the light source is incident, a light emergence surface provided with a Fresnel lens, and a side reflecting surface for totally reflecting the light incident on the incidence surface toward the Fresnel lens, wherein the light totally reflected by the side reflecting surface is refracted by the Fresnel lens and efficiently irradiates the object.
Owner:CANON KK

Zoom flash with no moving parts

A camera system having an electronic flash with a variable illumination angle, comprising: an image forming system having a user-selectable field-of-view for forming an image of a scene onto an image plane; an electronic flash system including a plurality of fixed focal length illumination lenses having two or more different focal lengths and one or more light emitters positioned behind each of the illumination lenses, the light emitters being positioned relative to their respective illumination lenses to provide two or more different illumination angles onto the scene; and a flash controller that selectively fires different subsets of the light emitters responsive to the selected field-of-view of the image forming system.
Owner:INTELLECTUAL VENTURES FUND 83 LLC

Vascular filter with improved strength and flexibility

A medical device, such as a vascular filter, composed of: a reinforced membrane unit composed of: a thin filter membrane; and fibers of reinforcement material embedded in the membrane to strengthen the filter and securely attach the fibers to the membrane.A method of fabricating the filter by the steps of: providing a mold that can be melted, dissolved, or deformed without damaging membrane material; covering the mold with an intermediate material that is easily separated from the membrane material; covering the intermediate material with the membrane material; placing the fibers in contact with the membrane material that covers the intermediate material; covering the fibers with additional membrane material to form the membrane with embedded fibers; removing the mold by melting, dissolving, or deforming the mold; and removing the intermediate material from the membrane.
Owner:DON MICHAEL INT

Elastic wave device and method for manufacturing the same

An elastic wave device propagating plate waves includes a stack of an acoustic reflection layer, a piezoelectric layer, and IDT electrode on a supporting substrate. The piezoelectric layer is thinner than a period of fingers of the IDT electrode. The acoustic reflection layer includes low-acoustic-impedance layers and high-acoustic-impedance layers. The low-acoustic-impedance layers are made of SiO2, and the high-acoustic-impedance layers are made of at least one material selected from the group consisting of W, LiTaO3, Al2O3, AlN, LiNbO3, SiN, and ZnO.
Owner:MURATA MFG CO LTD

Perpendicular Magnetic Recording Disc

A perpendicular magnetic disk is provided. The disk includes, on a base and in the order from bottom, a first granular magnetic layer group including a plurality of magnetic layers each having a granular structure, a non-magnetic layer having Ru or a Ru alloy as a main component, a second granular magnetic layer group including a plurality of magnetic layers each having the granular structure, and an auxiliary recording layer having a CoCrPtRu alloy as a main component. Layers closer to a front surface among the plurality of magnetic layers included in the first granular magnetic layer group having an equal or smaller content of Pt. Layers closer to the front surface among the plurality of magnetic layers included in the second granular magnetic layer group having an equal or smaller content of Pt and having an equal or larger content of an oxide.
Owner:WESTERN DIGITAL TECH INC

Shock protection for disk drive embedded in an enclosure

A shock absorbing device for protecting a hard disk drive housing found primarily in portable electronic devices. The shock absorbers include protuberances that emanate from the body of the shock absorber and that extend through apertures provided in the enclosure. Thus, the physical shock is taken up by the body of the shock absorber as well as the protuberances, which increase the compression height of the shock absorber and increase the shock damping characteristics of the shock absorber. This permits decreasing the size of the enclosure, which is often desirable to consumers.
Owner:MAXTOR

Perpendicular Magnetic Recording Disc

[Summary][Problem] An object is to make a film thinner while keeping the function as an auxiliary recording layer and increase an SNR.[Solution] A structure of the perpendicular magnetic disk 100 according to the present invention includes, on a base 110, a granular magnetic layer 160 and an auxiliary recording layer 180 disposed above the granular magnetic layer, the granular magnetic layer having a granular structure in which a non-magnetic substance having an oxide as a main component is segregated around magnetic particles having a CoCrPt alloy as a main ingredient growing in a columnar shape to form a grain boundary part, and the auxiliary recording layer having a CoCrPtRu alloy as a main component and further containing, as a accessory component, a metal forming passivity and not being an antiferromagnet.
Owner:WESTERN DIGITAL TECH INC

Semiconductor device, method for manufacturing the same, circuit board, and electronic apparatus

Exemplary embodiments of the present invention include a semiconductor device, a method for manufacturing the same, a circuit board and an electronic apparatus with increased productivity and reliability. An exemplary method for manufacturing a semiconductor device of the present invention includes forming a conductive part in a concave part on a first surface of a semiconductor substrate, the first surface having a plurality of chip mounting areas. Stacking at least one semiconductor chip in each of the chip mounting areas, providing a sealing member on the first surface of the semiconductor substrate and making part of a second surface of the semiconductor substrate thin so as to make the conductive part penetrate from the first surface to the second surface.
Owner:ADVANCED INTERCONNECT SYST LTD

Multi-chips bumpless assembly package and manufacturing method thereof

A multi-chips bumpless assembly package with a patterned conductive layer, a patterned dielectric layer and an insulation layer interposed between the chips is provided, which can shorten the distance of the electrical connection between the chips so as to upgrade the electrical performance of the assembly package and make the package thinner and thinner. Moreover, a manufacturing method thereof is also provided to form a package with high electrical performance.
Owner:ADVANCED SEMICON ENG INC

Photoelectric conversion layer, photoelectric conversion device and imaging device, and method for applying electric field thereto

A photoelectric conversion layer comprising a compound represented by the following formula (1): wherein R1 to R10 each independently represents a hydrogen atom or a substituent; L represents a monovalent group or a divalent or polyvalent connecting group; m is 0 or 1; and n represents an integer of from 1 to 4.
Owner:FUJIFILM HLDG CORP +1

Electronic device including movable flexible display

An electronic device may include an assembly that enables varying a visible portion of a display by extending and retracting a bendable portion of the display. The extending and retracting of the bendable display is facilitated by a first assembly on which a substantially planar visible portion of the display is disposed and a second assembly slidably attached to the first assembly. A space is defined by the first and second assemblies in which a bent portion of the display is housed. When the first assembly is extended (e.g., opened) with respect to the second assembly, at least a portion of the bent portion of the display is extended so as to be visible, and when the first assembly is closed (e.g., retracted) with respect to the second assembly, the extended bent portion of the display is retracted into the space between the first assembly and the second assembly, and is no longer visible. Various constructions of the first and second assemblies and corresponding structures are provided.
Owner:SAMSUNG ELECTRONICS CO LTD

Illumination system for a head up display

An illumination system for use in illuminating a spatial light modulator for a head up display system. The illumination system includes a high power light emitting diode (LED) array assembly; and, a Fresnel lens array operatively associated with the LED array assembly for receiving light produced by the LED and providing a nearly collimated light output for use by the spatial light modulator. Utilization of the ultra bright LED array and Fresnel lens array provides the capability of the illumination source to be made very thin, light weight, and efficient. The Fresnel lens array, which converges the light to be nearly collimated, enhances the harvest of the available flux thus increasing the system efficiency and providing a system that gives the illusion of having an image at infinity. Additional components such as holographic elements, optical compensation films, and brightness enhancement films can be used to tailor the light if required.
Owner:ROCKWELL COLLINS INC

Elastic wave device and method for manufacturing the same

An elastic wave device propagating plate waves includes a stack of an acoustic reflection layer, a piezoelectric layer, and IDT electrode on a supporting substrate. The piezoelectric layer is thinner than a period of fingers of the IDT electrode. The acoustic reflection layer includes low-acoustic-impedance layers and high-acoustic-impedance layers. The low-acoustic-impedance layers are made of SiO2, and the high-acoustic-impedance layers are made of at least one material selected from the group consisting of W, LiTaO3, Al2O3, AlN, LiNbO3, SiN, and ZnO.
Owner:MURATA MFG CO LTD

Honeycomb structural body

An object of the present invention is to provide a honeycomb structural body which is low in pressure loss and can prolong a period up to a regenerating process. The present invention is directed to a columnar honeycomb structural body comprising a large number of through holes placed in parallel with one another in a length direction with wall portion interposed therebetween, wherein: each of the through holes has one of ends sealed; one end face of the through hole differs in opening area from the other end face thereof; a ceramic material which constitutes the wall portion has an average pore diameter in a range from 5 to 30 μm; and the rate of capacity of micro pores each having a pore diameter two or more times larger than the average pore diameter is set to 30% or less of the capacity of the entire micro pores.
Owner:IBIDEN CO LTD

Multi-chips bumpless assembly package and manufacturing method thereof

A multi-chips bumpless assembly package with a patterned conductive layer, a patterned dielectric layer and an insulation layer interposed between the chips is provided, which can shorten the distance of the electrical connection between the chips so as to upgrade the electrical performance of the assembly package and make the package thinner and thinner. Moreover, a manufacturing method thereof is also provided to form a package with high electrical performance.
Owner:ADVANCED SEMICON ENG INC

Light Guide Plate, and Planar Lighting Device and Liquid Crystal Display Device Using Such Light Guide Plate

A parallel groove of a light guide place for accommodating a light source has, in a perpendicular cross section, a shape composed of a pair of contour lines that approach each other toward a light emitting plane, cross at a peak, and has a part where an inclination angle to a line vertical to the light emitting plane changes, and the inclination angle at a base end side far from the peak is sharper than that at a tip end side close to the peak. Thus, uniform and high brightness light can be emitted.
Owner:FUJIFILM CORP

Reflective mask blank for EUV lithography and process for producing the same

To provide an EUV mask blank provided with a low reflective layer, which has excellent properties as an EUV mask blank. A reflective mask blank for EUV lithography comprising a substrate, and a reflective layer for reflecting EUV light, an absorber layer for absorbing EUV light and a low reflective layer to an inspection light (wavelength: 190 to 260 nm) for a mask pattern, formed in this order on the substrate, wherein the low reflective layer has a stacked structure having a first layer containing at least 95 at % in total of silicon (Si) and nitrogen (N), and a second layer containing at least 95 at % in total of tantalum (Ta), oxygen (O) and nitrogen (N) or a second layer containing at least 95 at % in total of tantalum (Ta) and nitrogen (N), stacked in this order from the absorber layer side.
Owner:ASAHI GLASS CO LTD

Separator for fuel cell and fuel cell using the same

The present invention provides, as a separator for fuel cell which is lightweight, can be easily made thin, and which has superior corrosion resistance and shape stability, a fuel cell 100 containing a separator for fuel cell 10, wherein a conductor pattern 2 is formed on one principal plane 1A of an insulation layer 1 to form a groove for a gas flow path 3 sectioned by the conductor pattern 2 on this principal plane, a conductor terminal 4 is formed on the other principal plane 1B of the insulation layer 1, and this conductor terminal 4 and the conductor pattern 2 are electrically connected by a via hole 5 penetrating the insulation layer 1, and a membrane electrode assembly (complex having an electrolyte membrane and an electrode (fuel electrode, oxygen electrode) laminated thereon) 14 having the separator for fuel cell disposed on both surfaces.
Owner:NITTO DENKO CORP

Solid-state imaging device, manufacturing method for solid-state imaging device, and camera using the same

A solid-state imaging device includes a plurality of light-receiving units two-dimensionally arrayed in a semiconductor substrate, a filter unit operable to transmit incident lights of selected wavelengths to the plurality of light receiving units and a light shielding unit operable to shield incident light, the light shielding unit having a plurality of apertures, each aperture opposing a corresponding light receiving unit. Here, on a path of incident light from the light shielding unit to the plurality of light shielding units, the filter unit is disposed between the light shielding unit and the plurality of light-receiving units. The solid-state imaging device prevents color mixing caused by oblique light.
Owner:PANASONIC CORP

Semiconductor package for three-dimensional mounting, fabrication method thereof, and semiconductor device

A semiconductor package for three-dimensional mounting is provided. The package includes a wiring substrate having a first surface on which a first wiring pattern is formed and a second surface on which a second wiring pattern is formed, the first wiring pattern and second wiring pattern being electrically connected to each other; a semiconductor chip placed on the first surface of the wiring substrate and electrically connected to the first wiring pattern; a sealing resin layer sealing the semiconductor chip and the first wiring pattern; a thickness direction wire passing through the sealing resin layer in a thickness direction and having one end electrically connected to the first wiring pattern and the other end exposed at the surface of the sealing resin layer; and a lower surface connecting electrode formed on the second surface of the wiring substrate and electrically connected to the second wiring pattern.
Owner:LAPIS SEMICON CO LTD

Flat acoustic conversion device

A flat acoustic conversion device includes two magnets disposed so that their magnetic poles face upward arid are adjacent to or in contact with one another, and the magnetic pole faces of different polarities arc disposed alternately; a vibrating member disposed on the top surface of the yoke; coil pairs wound in helical form and disposed at front and reverse surfaces of the vibrating membrane; such that magnetic flux traveling in a direction substantially parallel to a surface of the vibrating membrane becomes a maximum, and interlinks with the coil pairs. When current is supplied to the coils, a direction of force which the current receives from a magnetic field is substantially orthogonal to the surface of the vibrating membrane, and force in a direction along the surface of the vibrating membrane becomes extremely low. Thus, noise components can be reduced such that sound quality can be improved.
Owner:FPS

Semiconductor device, method for manufacturing the same, circuit board, and electronic apparatus

Exemplary embodiments of the present invention include a semiconductor device, a method for manufacturing the same, a circuit board and an electronic apparatus with increased productivity and reliability. An exemplary method for manufacturing a semiconductor device of the present invention includes forming a conductive part in a concave part on a first surface of a semiconductor substrate, the first surface having a plurality of chip mounting areas. Stacking at least one semiconductor chip in each of the chip mounting areas, providing a sealing member on the first surface of the semiconductor substrate and making part of a second surface of the semiconductor substrate thin so as to make the conductive part penetrate from the first surface to the second surface.
Owner:ADVANCED INTERCONNECT SYST LTD

Coating composition

ActiveUS20090281224A1Low dielectric lossExcellent in winding property (flexibility)Thin/thick film capacitorFixed capacitor dielectricDielectric lossSolvent
There is provided a coating composition comprising (A) a thermoplastic non-fluorine-containing polymer, (B) inorganic ferroelectric particles, (C) an affinity-improving agent comprising at least one of a coupling agent, a surfactant and an epoxy group-containing compound, and (D) a solvent, and there is provided a film formed using the coating composition which has highly dielectric property and low dielectric loss, can be made thin, is excellent in winding property (flexibility) and is suitable as a highly dielectric film for a film capacitor.
Owner:DAIKIN IND LTD
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