214 results about "Chamber design" patented technology

Embodiments of the invention disclosed herein generally relate to a hydride vapor phase epitaxy (HVPE) deposition chamber that utilizes a plasma generation apparatus to form an activated precursor gas that is used to rapidly form a high quality compound nitride layer on a surface of a substrate. In one embodiment, the plasma generation apparatus is used to create a desirable group-III metal halide precursor gas that can enhance the deposition reaction kinetics, and thus reduce the processing time and improve the film quality of a formed group-III metal nitride layer. In addition, the chamber may be equipped with a separate nitrogen containing precursor activated species generator to enhance the activity of the delivered nitrogen precursor gases.

A substrate processing system includes a thermal processor or a plasma generator adjacent to a processing chamber. A first processing gas enters the thermal processor or plasma generator. The first processing gas then flows directly through a showerhead into the processing chamber. A second processing gas flows through a second flow path through the showerhead. The first and second processing gases are mixed below the showerhead and a layer of material is deposited on a substrate under the showerhead.

Systems, chambers, and processes are provided for controlling process defects caused by moisture contamination. The systems may provide configurations for chambers to perform multiple operations in a vacuum or controlled environment. The chambers may include configurations to provide additional processing capabilities in combination chamber designs. The methods may provide for the limiting, prevention, and correction of aging defects that may be caused as a result of etching processes performed by system tools.

A variable hydraulic resistor for use with implantable pumps is disclosed. The variable hydraulic resistor according to the present invention is particularly useful in varying the flow rate of a medication fluid from an otherwise constant flow implantable pump. An implantable pump is also disclosed, which does not require a complicated clinching system or the like, and which may include an undulating membrane and chamber design to reduce the height of the pump.

A system for harvesting, storing, and generating energy, that includes floating structure supporting machinery to extract energy from wind, waves, surface generators, or currents. At least one energy storage and power generating unit is anchored to the seafloor and adapted to tether the floating structure to the unit. The unit includes an internal chamber into which water flows through a hydroelectric turbine to generate electrical energy. A pump is provided, powered by energy from the floating structure machinery, to evacuate water from the unit and a control system directs power from the machinery to pump water out of the unit during periods of excess energy extraction by the machinery and to allow water to flow into the chamber through the hydroelectric turbine to generate electrical energy during periods of lower energy extraction by the machinery. The same internal chamber design can be utilized to store hydrocarbons in the vicinity of undersea wellheads during “shut-in” procedures when the wellhead would otherwise be secured.

The present invention relates to systems and methods for controlled combustion and decomposition of gaseous pollutants while reducing deposition of unwanted reaction products from within the treatment systems. The systems include a novel thermal reaction chamber design having stacked reticulated ceramic rings through which fluid, e.g., gases, may be directed to form a boundary layer along the interior wall of the thermal reaction chamber, thereby reducing particulate matter buildup thereon. The systems further include the introduction of fluids from the center pilot jet to alter the aerodynamics of the interior of the thermal reaction chamber.

An apparatus and process for testing a sample of a hydraulic fracturing fluid is provided. A small quantity of a fracturing fluid sample to be observed and/or tested is placed in a chamber designed with suitable heat and pressure simulation apparatus. With the sample chamber, the efficacy of the fracturing fluid can be ascertained, improper fracturing fluid compositions and/or mixtures, e.g., caused by human error, can be detected, and contamination of the frac-tank can be determined. The overall apparatus is portable and can be transported to the site of the fracturing fluid tank, thereby allowing testing immediately prior to introduction into the well. The samples in the test chamber can be observed for quality control and quality assurance prior to, or during stimulation and water shutoff treatments in the field.

Disclosed are methods and apparatus enabling the efficient utilization of urea for purposes such as selective catalytic reduction (SCR) of NO_x, which enable feeding urea to a chamber designed to efficiently and completely gasify the urea to enable ammonia feed. Preferably, aqueous urea is fed to a gasification chamber, which is also fed with heated gases. An injector means, capable of distributing the aqueous urea as fine droplets, is positioned centrally of a gas distribution plate in the chamber. An arrangement of spaced holes in the gas distribution plate provides higher gas velocity in the vicinity of the injector means than near the walls of the chamber. Uniform gas distribution without equipment fouling is achieved.

An integrated workpiece vacuum processing system for processing semiconductor workpieces is provided using a stacked chamber design. The processing system comprises a multiple chamber support unit having a plurality of processing chamber support bays arranged in rows and columns wherein a vacuum processing chamber module is received in each support bay and a transfer chamber is coupled to the plurality of processing chamber modules.

In large area plasma processing systems, process gases may be introduced to the chamber via the showerhead assembly which may be driven as an RF electrode. The gas feed tube, which is grounded, is electrically isolated from the showerhead. The gas feed tube may provide not only process gases, but also cleaning gases from a remote plasma source to the process chamber. The inside of the gas feed tube may remain at either a low RF field or a zero RF field to avoid premature gas breakdown within the gas feed tube that may lead to parasitic plasma formation between the gas source and the showerhead. By feeding the gas through an RF choke, the RF field and the processing gas may be introduced to the processing chamber through a common location and thus simplify the chamber design.

A vacuum chamber for passivation and/or stripping a photoresist layer formed on a semiconductor substrate. The chamber includes an internal chamber body that forms a cavity to surround the substrate and has a plurality of gas passages extending therethrough to the cavity and one or more heaters to heat the internal chamber body. The internal chamber body is slidably mounted on an external chamber body that surrounds a side of the internal chamber with a gap therebetween. The device also includes: an exhaust unit operative to pump the gas from the cavity; a chamber top mounted on the internal chamber body to cover a top surface of the internal chamber body with a gap therebetween and having an opening in fluid communication with the gas passages; and a plasma source operative to energize the gas into a plasma state and coupled to the opening for fluid communication with the cavity.

An electric line cutter device for high voltage busbars has a two-part housing, a piston, an igniter and a busbar. The upper housing includes a cylinder, cuboid or prism chamber. The lower housing also includes a cylinder, cuboid or prism chamber. The piston is contained inside one of either the upper housing chamber or the lower housing chamber. Upon igniting the igniter, the piston breaks a portion of the busbar moving the piston and the portion of the busbar into the opposite chamber thereby stopping the electric current flow. The piston is at least partially formed as an insulator to prevent electric discharge. The piston design together with chamber design includes integrated “squeeze areas” and “blow channels” for the appearing arc. A channel system outside or from inside the piston allow the pyro gases to push the arc plasma into a filter system to cool down the gases.

A method is provided which includes etching one or more layers in an etch chamber while introducing a noble gas heavier than helium into the etch chamber. In a preferred embodiment, the introduction of such a noble gas may reduce the formation of defects within an etched portion of the semiconductor topography. Such defects may include bilayer mounds of nitride and a material comprising silicon, for example. In some embodiments, the method may include etching a stack of layers within a single etch chamber. The stack of layers may include, for example, a nitride layer interposed between an anti-reflective layer and an underlying layer. In addition, the single etch chamber may be a plasma etch chamber designed to etch materials comprising silicon. As such, the method may include etching an anti-reflective layer in a plasma etch chamber designed to etch materials comprising silicon.

A variable hydraulic resistor for use with implantable pumps is disclosed. The variable hydraulic resistor according to the present invention is particularly useful in varying the flow rate of a medication fluid from an otherwise constant flow implantable pump. An implantable pump is also disclosed, which does not require a complicated clinching system or the like, and which may include an undulating membrane and chamber design to reduce the height of the pump.

Described herein is a fuel processor that produces hydrogen from a fuel source. The fuel processor comprises a reformer and burner. The reformer includes a catalyst that facilitates the production of hydrogen from the fuel source. Voluminous reformer chamber designs are provided that increase the amount of catalyst that can be used in a reformer and increase hydrogen output for a given fuel processor size. The burner provides heat to the reformer. One or more burners may be configured to surround a reformer on multiple sides to increase thermal transfer to the reformer. Dewars are also described that increase thermal management of a fuel processor and increase burner efficiency. A dewar includes one or more dewar chambers that receive inlet process gas or liquid before a burner receives the process gas or liquid. The dewar is arranged such that process gas or liquid passing through the dewar chamber intercepts heat generated in the burner before the heat escapes the fuel processor.

This invention comprises a new process for imparting the flavor of smoke to food and consists of a vacuum/compression chamber designed for the placement of meat or other food product within; and which can be sealed to create an airtight condition within; and which is connected by an adjustable valve or valves to a smoke producing chamber capable of producing smoke saturated air which can be sucked into said vacuum/compression chamber by an attached vacuum pump, causing said smoke saturated air to be pulled deeper into said meat or other food product than would occur under normal exposure conditions; and subsequently pushed further into said meat or other food product by compression of said smoke saturated air within said vacuum/compression chamber; and this process can be enhanced by piercing meat or other food product with a skewer device which creates more exposed surface within the meat or other food item.

A sound chamber design of cell phones. The shell of the cell phone has a front sound hole, and a circuit board is in the internal space of the shell and divides the internal space into the first and the second sound chambers. A sounding device is in the first sound chamber and electrically connects the circuit board. The circuit plate has at least a sound through hole to link the first and the second sound chambers, to increase the volume of the resonance chamber of this sounding device and improve its low frequency response effect. In addition, the shell also has an attuning hole to link the first and the second sound chambers to the outside. The flattening of the resonance frequency curve of the whole cell phone improves the sound quality.

An apparatus with a narrow slit chamber generates plasma having non-equilibrium characteristics and a brush-like shape at a temperature near room temperature and at a pressure of about one atmosphere. Plasma gas enters the narrow slit chamber. An external power source provides power to electrodes near the exit that excite the plasma gas and produce a plasma jet having a brush-like shape that exits the chamber. The apparatus operates with low power consumption, and the temperature of the plasma is low. Glow-to-arc transitions are prevented using a ballast resistor and appropriate plasma gases with the narrow slit chamber design. The brush-like shaped plasma extends beyond the exit of the chamber, and possesses the reactive features of low-pressure or non-equilibrium plasmas. The plasma brush apparatus can be used for plasma treatment, plasma cleaning, plasma deposition, plasma sterilization, and plasma decontamination of chemical and biological warfare agents.

Embodiments of the present disclosure provide a cover assembly that includes a cover disposed between a device side surface of a substrate and a reflector plate, which are disposed within a thermal processing chamber. The presence of the cover between the device side surface of a substrate and a reflector plate has many advantages over conventional thermal processing chamber designs, which include an improved temperature uniformity during processing, a reduced chamber down time and an improved cost-of-ownership of the processes performed in the thermal processing chamber. In some configurations, the cover includes two or more ports that are formed therein and are positioned to deliver a gas, from a space formed between the reflector plate and the cover, to desired regions of the substrate during processing to reduce the temperature variation across the substrate.