124 results about "Plasma cleaning" patented technology

The invention belongs to the technical field of powder metallurgy, and particularly relates to a high-fluidity MIM metal feed and a forming process thereof.The high-fluidity MIM metal feed is composed of the following materials: metal powder: spherical metal powder (a titanium alloy TC4 material), polycaprolactone and graphene nanosheets; wherein the volume ratios are 68-72 vol%, 0.5-2 wt% (based on the mass of the metal powder) and 0.1-0.5 wt% (based on the mass of the metal powder) respectively; a powder oxide layer is removed through vacuum plasma cleaning (300-500 W, argon atmosphere), a metal core-PCL / graphene shell structure is prepared in combination with ultrasonic-assisted in-situ polymerization, lubrication and adhesion enhancement are synchronously achieved, the powder oxygen content is controlled to be smaller than 500 ppm, and sintering oxidation defects are reduced.

The present application relates to the technical field of intelligent predictive maintenance of industrial equipment, in particular to a low-temperature plasma cleaning machine intelligent predictive maintenance method and system; the method comprises the following steps: collecting set power, actual output power, nozzle inlet air pressure, spray gun temperature, control instructions and the time stamp of all data, and establishing a runtime sequence dataset; calculating a discharge path drift index, a jet channel impedance mutation rate index and an energy response lag coefficient based on the runtime sequence dataset; constructing an energy transmission link degradation prediction model, and constructing a multi-level energy link causal structure diagram based on the energy transmission link degradation prediction model, executing a phase consistency link matching determination rule, and generating a degradation phase determination result; determining a low-temperature plasma cleaning machine fault list and a maintenance list. The present application realizes intelligent predictive maintenance and positioning of the energy transmission degradation phase fault of the low-temperature plasma cleaning machine.

The invention relates to the technical field of plasma, in particular to a plasma cleaning device capable of being spliced. The plasma generator comprises a main cavity, side plates, an electrode assembly and a high-voltage electric connector, the side plates are connected to the two sides of the main cavity in a sealed mode, the main cavity is formed by splicing a plurality of cavity modules, each cavity module is provided with a discharge area, an exhaust area, a plasma air outlet, an exhaust inlet and a splicing installation position, the discharge areas of the multiple cavity modules are communicated, and the exhaust areas of the multiple cavity modules are communicated with the splicing installation position. The exhaust areas of the plurality of cavity modules are communicated, the discharge areas are isolated from the exhaust areas, the plasma gas outlets are communicated with the discharge areas, the exhaust inlets are communicated with the exhaust areas, an electrode assembly is installed in the discharge area of each cavity module, and the high-voltage electric connectors are connected with the electrode assemblies. And the side plates and the cavity modules are positioned, butted and fixed through the splicing mounting positions. The cleaning heads with different lengths are composed of a modular product and can be spliced and customized according to customer requirements, and the overall transformation cost and the manufacturing cost can be reduced.

1. The name of the design product: roller type plasma cleaning device. 2. The use of the design product: roller type plasma cleaning equipment for loading materials to be surface treated and plasma cleaning thereof. 3. The design points of the design product: in shape. 4. The picture or photo that best shows the design points: assembly state perspective view.

The invention belongs to the technical field of variable optical films, discloses a multifunctional composite variable optical film and a preparation method thereof, and aims at solving the problems that an existing variable optical film is single in function, unstable in optical performance, poor in flexibility and bending resistance and low in process precision. The preparation method comprises the following steps: pre-treating the base material: sequentially carrying out plasma cleaning on the PET base material and sputtering the ITO conductive layer, sequentially carrying out ultrasonic cleaning on the glass substrate and preparing the YAG powder enhancement layer; the coating of the functional layer is that the surface of the ITO layer of the PET-ITO composite base material is coated with a PDLC layer and an electrochromic layer, and the surface of the YAG layer of the YAG-glass composite base material is coated with a temperature-sensitive layer; the compounding and curing are as follows: firstly laminating after aligning and compounding, and then carrying out UV segmented curing. The light transmittance of the product can be adjusted by 5-95% in an electric field, and the infrared reflectivity is gt; and after the ITO layer is bent for 1000 times and the bending radius is 5mm, the resistance change rate is less than or equal to 10%, so that the ITO film is suitable for a sunshade film for a vehicle and an intelligent window of a building.

The invention relates to the technical field of industrial cleaning, in particular to an annular pulse plasma cleaning device and method for a precise instrument. According to the technical scheme, the plasma cleaning device comprises a high-voltage pulse power supply, a host device, a supporting bracket and an object carrying platform, the high-voltage pulse power supply, the host device, the supporting bracket and the carrying platform are sequentially arranged from top to bottom; the host device comprises an air valve, an outer electrode, a diagnosis port, a cylindrical inner electrode, a conical inner electrode, a solenoid, a top flange, an insulating part, a sealing part and a control computer. High-density compact ring plasma clusters are adopted for pulse type directional cleaning, cleaning uniformity is improved, heat input is greatly reduced due to the instantaneous energy deposition characteristic, damage to heat-sensitive materials is avoided, the modular generator is compact in structure and convenient and fast to maintain, accurate positioning is achieved through cooperation with X-axis and Y-axis guide rails, and the service life of the modular generator is prolonged. The device is suitable for efficient cleaning of complex structures and stubborn pollutants.

The invention belongs to the technical field of double-layer copper-plated conductors, and provides a double-layer copper-plated conductor precisely regulated and controlled automatic electroplating production line system which is characterized in that an inert gas transition cabin with the argon purity not lower than 99.999% and the pressure maintained to be 5-10 kPa is arranged between a first-layer plating tank and a second-layer plating tank, 5-10 nm precise etching is achieved through low-temperature plasma cleaning, and a second-layer plating tank is arranged between the first-layer plating tank and the second-layer plating tank; a roughened grain boundary structure is formed, an EBSD sensor is adopted to collect grain texture direction and size data of a bottom-layer copper coating, a crystal structure analytical model is constructed based on a CNN in combination with a lattice matching database, a crystal nucleus growth induction target is output, and real-time production parameters and parameter threshold ranges corresponding to the induction target are compared; dynamically regulating and controlling production parameters through a PID algorithm; epitaxial growth of the two copper plating layers is achieved, the interface internal stress is remarkably reduced, the bending life of the conductor is prolonged, the structural reliability of the conductor is improved, and the performance requirements of high-end equipment for high-frequency communication, flexible electronics and the like are met.

The invention relates to the technical field of semiconductor chip manufacturing, and discloses plasma cleaning equipment which comprises two vertical plates, a fixed table, a dust collecting box with an opening in the front side wall, an inferior product collecting box, a qualified product collecting box, a driving transportation assembly, a cleaning mechanism, a dust removal mechanism and a visual inspection assembly. A plurality of rotating shafts are rotationally connected between the two vertical plates at equal intervals, the multiple rotating shafts are jointly sleeved with a conveying belt, the visual detection assembly is matched with the inferior product collecting box and the qualified product collecting box, and automatic quality detection and sorting of cleaned products can be achieved. A visual detection head can quickly and accurately identify unqualified products, a second electric telescopic rod drives a material pushing plate to push the inferior products to an inferior product collecting box, qualified products are conveyed to the end along with a conveying belt and fall into a qualified product collecting box, manual intervention is not needed, the labor cost is reduced, the detection and sorting efficiency and accuracy are greatly improved, and the product quality is improved. The large-scale production requirements are met.

The invention provides an RPS source microwave plasma ionization chamber structure and a plasma cleaning machine, the RPS source microwave plasma ionization chamber structure comprises an ionization chamber, the ionization chamber is internally provided with a hollow ionization chamber, and the top of the ionization chamber is provided with a first air inlet hole; the dispersing head is connected with the first air inlet hole, a plurality of annular guide holes are formed in the end face part, opposite to the first air inlet hole, of the dispersing head, and the annular guide holes are arranged in a wavy outward radiation mode with the hole center of the first air inlet hole as the original point and used for dispersing air flow entering the ionization cavity through the first air inlet hole; according to the invention, the dispersion head with a plurality of annular guide holes arranged in a wavy outward radiation manner is mounted in the ionization cavity, so that microwaves and process gas can be dispersed according to regions and enter the ionization cavity through the dispersion head, and the introduced gas flow can stably and uniformly enter the interior of the cavity; and the microwave energy can be quickly and intensively focused on a set ionization area to form a high-concentration gas atmosphere, so that the ionization efficiency of the gas is effectively improved, and the cleaning with high plasma density is further ensured.

The utility model discloses a kind of plasma cleaning plate, including bottom plate, bottom plate is provided with cathode, the surface of bottom plate is opened with at least one cathode groove, cathode groove is U shape, by the cathode groove design is U-shaped curved surface, the contact area of cathode and anode is significantly increased 30%-50%, current density distribution is optimized, make ionization area more concentrated and uniform, greatly improve the energy density of plasma arc and atmosphere dissociation degree, and, plasma can be maintained in lower temperature state in generation and effect process, unnecessary heat loss is reduced, to realize the effect of energy saving, at least one row of array distribution's plasma cleaning hole is equipped in cathode groove, and staggered distribution design is adopted, so that plasma beam is ejected at different angles and positions, form interlaced covering jet field, not only significantly improve cleaning efficiency, make cleaning process more efficient, can also ensure that cleaning has no dead angle, more comprehensive.

The invention discloses a micro-nano device photoetching process based on surface energy repair and a micro-nano device, and relates to the technical field of photoetching. The process provided by the invention comprises the following steps: carrying out plasma cleaning on a substrate, immersing the substrate subjected to plasma cleaning into an organic cleaning solvent, and removing an unstable metamorphic layer and pollutants on the surface of the substrate by adopting at least one of soaking, stirring and ultrasonic treatment, then, the cleaned substrate is adopted to carry out subsequent photoetching and micro-nano machining processes; the step of organic solvent cleaning is added after substrate plasma cleaning, an unstable metamorphic layer is disintegrated and other impurities are removed through permeation and slight dissolution effects of an organic solvent on the surface of the substrate, so that the surface of the substrate is recovered to a smooth and stable state; therefore, the defects of edge collapse, side wall roughness and the like of the photoresist pattern in the photoetching process are remarkably reduced, and the photoetching morphology precision and the production yield of the micro-nano device are effectively improved.

The utility model relates to a kind of electric plasma cleaning machine, wherein electric plasma cleaning machine includes fixed plate and briquetting, fixed plate is installed in the side of upper cover towards cavity bottom, the side of fixed plate towards cavity bottom is provided with sliding slot, briquetting is installed in sliding slot, briquetting has the first height along vertical direction, substrate has the second height along vertical direction, the distance between fixed plate and the bottom of cavity is equal to the sum of first height and second height.The utility model can install fixed plate and briquetting on upper cover, directly exert pressure on substrate by briquetting, and adjust the position of briquetting by fixed plate, effectively avoid cleaning abnormal situation caused by substrate deformation warping.

The utility model relates to the technical field of plasma cleaning machines, and discloses a multi-chamber plasma cleaning device which comprises a box body, two groups of sliding rails are fixedly connected in the box body, a mounting seat is connected outside the sliding rails in a sliding mode, a dismounting mechanism is arranged in the mounting seat, and the dismounting mechanism is connected with the box body in a sliding mode. The interior of the box body is fixedly connected with a plurality of plasma generators, the exterior of the box body is rotatably connected with a box door, the dismounting mechanism comprises a mounting groove, the mounting groove is formed in the mounting base, the interior of the mounting groove is fixedly connected with a spring, and the end, away from the mounting groove, of the spring is fixedly connected with a sliding plate; and the exterior of the sliding plate is slidably connected to the interior of the mounting groove. According to the device, the cleaning cavity can be conveniently taken out for maintenance through the dismounting mechanism, meanwhile, the getter pump and the treatment box are used for ensuring that waste gas reaches the standard to be discharged, and the maintenance convenience and the environmental protection performance of equipment are effectively improved.

The utility model relates to a lens plasma cleaning tray, include: tray, be equipped with a plurality of with array form distribution's convex on the upper surface of tray, the area of the region of distribution convex on tray is bigger than the area of single lens, and the gap between two adjacent convexes has and the size of center spacing is smaller than the size of single lens. Advantageous effect is: the tray can place a plurality of lenses in the region of distribution convex, and can guarantee that the lens is not inclined after placing, since the lens is supported by a plurality of convexes, compared with sticking to the tray, the other surfaces (five surfaces) of the lens and the downward surface can contact the plasma gas during plasma cleaning, and the corresponding bonding standard can be cleaned, so that the situation of confusing A and B surfaces will not occur, and the tray can use an automatic suction nozzle to suck the lens, which greatly improves the efficiency compared with manual use of tweezers.

The invention discloses a sintering method of an aluminum oxide electrostatic chuck, and belongs to the technical field of electrostatic chucks, and the sintering method comprises the following steps: S1, preparing an insulating layer substrate from raw materials and a multilayer structure, depositing an electrode layer on the insulating layer substrate, coating the electrode layer with aluminum oxide nano powder to form a dielectric layer, and spraying a silicon carbide coating on the surface of the dielectric layer to form the multilayer structure; s2, primary sintering is conducted, specifically, the multi-layer structure is placed in a vacuum sintering furnace to be subjected to primary sintering; s3, secondary sintering is conducted, specifically, the multi-layer structure obtained after primary sintering is subjected to secondary sintering through the pulse discharge plasma sintering technology, and cooling is conducted after secondary sintering; s4, the heat-conducting glue is attached to and integrated with the cooling base, the bottom of the insulation layer base body obtained after secondary sintering of the multi-layer structure is coated with the heat-conducting glue, the insulation layer base body and the cooling base are pressed, the electrostatic chuck is manufactured, and plasma cleaning is conducted on the surface of the electrostatic chuck; and S5, performing performance optimization treatment, namely performing high-voltage corona treatment on the electrostatic chuck.

The invention provides a plasma cleaning device, an air conditioner and a control method of the air conditioner. The plasma cleaning device comprises an air duct structure, an electrode pair and a driving unit, the electrode pair comprises a discharge electrode and a grounding electrode, and the electrode pair is arranged in the air duct structure; the discharge electrode is fixedly arranged; comprising a swing structure, the swing structure comprises a first swing arm and a swing rod, a driving unit drives the first swing arm to swing, and the swing rod is connected to the swing end of the first swing arm and serves as a grounding electrode; under the driving of the driving unit, the swing structure swings in the air duct structure and enables the distance between the swing rod and the discharge electrode to change. The air conditioner comprises the plasma cleaning device. The air conditioner control method comprises the step of controlling the position of the swing rod according to ozone concentration. In the invention, the swinging grounding electrode reduces the internal change of the air conditioner, and the design difficulty and the production cost are reduced.

The invention relates to the technical field of wire and cable manufacturing, and discloses a high-adhesion PEEK insulation aluminum flat wire extrusion molding process and system, and the process comprises the steps: preparing a rare earth reinforced aluminum alloy flat wire conductor, and carrying out argon hydrogen plasma cleaning and silane coupling agent coating to activate the surface; then, performing high-frequency induction preheating on the conductor, performing PEEK material extrusion by using a special-shaped mold with non-concentrically distributed runner gaps, and compensating bone-shaped defects by reducing R-angle gaps and utilizing an extrusion effect; the coated conductor is crystallized and cooled through a multi-stage gradient water tank; and finally, dynamically adjusting the rotating speed and the traction speed of the screw in a closed-loop manner based on the thickness and the surface quality of the insulating layer measured on line. Through matrix strengthening, surface chemical modification and rheological mold design, the problems of poor adhesive force of an aluminum flat wire insulating layer and R angle thinning are effectively solved, and the electrical insulation performance and machining stability of a product are guaranteed.

The invention provides a gluing device and method for improving the surface energy of a balancing weight. The gluing device comprises a mounting table, a feeding mechanism, a conveying mechanism, a cleaning mechanism, a pushing mechanism and a gluing mechanism. The feeding mechanism is connected to the mounting table, the other mechanisms are arranged on the mounting table, an outlet of the feeding mechanism is connected to the conveying mechanism, and balancing weights are conveyed to the mechanisms; the cleaning mechanism is connected to the conveying mechanism and comprises a cleaning tool with the bottom provided with a hollowed-out part and plasma cleaning equipment, and the bottom of the balancing weight is cleaned through a plasma cleaning head below the hollowed-out part in the moving process of the balancing weight; and the cleaned balancing weight is conveyed to the rubberizing tool by the pushing mechanism, and an adhesive tape is pasted to the bottom of the balancing weight through the rubberizing mechanism. According to the gluing device, the surface of the balancing weight is cleaned through the plasma cleaning equipment, the surface energy of the balancing weight is effectively improved, the bonding strength is guaranteed, the purchasing and machining cost is effectively reduced, integrated machining is achieved, operation is convenient, and the working efficiency is high.

1. Name of the product in this design: Plasma Cleaner. 2. Application of this design: Plasma cleaning machine. 3. The key design feature of this product is its shape. 4. The image or photograph that best illustrates the design's key points: a 3D model.

The invention discloses integrated power supply encapsulation equipment and process, and belongs to the technical field of power supply module manufacturing. The equipment mainly comprises a machine shell, a lifting carrying table and a transferring device, wherein the lifting carrying table and the transferring device are arranged in the machine shell. And a plasma blowing nozzle and a gluing head are integrally mounted on the transferring device. The equipment is further provided with a vacuum and pressure regulation and control system, a sensor system and a control system. The process comprises the following steps of: placing and sealing the power supply module in the cavity; plasma cleaning is conducted, and the cleaning end point is judged according to monitoring data; vacuumizing and judging that the cavity reaches a pure state according to monitoring data; filling and sealing in a vacuum environment; gas is introduced in the curing and cooling stage of the encapsulating material for pressurized curing; and finally releasing pressure and taking out a finished product. By means of process integration and closed-loop control, secondary pollution between processes is avoided, elimination of bubbles and compensation of curing shrinkage stress are achieved, and the potting quality and the product reliability are improved.

This invention discloses an LED epitaxial wafer and its fabrication method, relating to the field of semiconductor device technology. The fabrication method includes: providing a substrate, sequentially growing an N-GaN layer, a multi-quantum-well light-emitting layer, and a P-GaN layer on the substrate; sequentially cleaning the grown structure with an organic solvent, acid washing, and drying; placing the dried structure in a plasma environment, first introducing a cleaning gas for plasma cleaning, the cleaning gas including at least one of argon and helium; then introducing a mixed gas for plasma modification, the mixed gas being composed of oxygen and a gas selected from argon and helium; then sequentially depositing an amorphous ITO seed layer and a crystalline ITO host layer; after deposition, performing annealing treatment to obtain the LED epitaxial wafer. This invention can solve the technical problems of high potential barrier, low hole injection efficiency, and poor interface stability at the ITO / P-GaN contact interface in the prior art.

The invention relates to a wafer bonding strength prediction method based on photoelectron spectroscopy. The method comprises the following steps: S1, carrying out surface cleaning pretreatment on a wafer sample; s2, cleaning and activating the surface of the wafer sample through plasma, and modifying the surface of the wafer sample; s3, acquiring an X-ray photoelectron spectroscopy; s4, carrying out translation correction on the X-ray photoelectron spectroscopy based on the C1s energy spectrum; and S5, obtaining the bonding strength based on the N1s energy spectrum after translation correction. Compared with the prior art, the method has the advantages that the bonding strength before bonding is predicted, and the problem that destructive experiments need to be carried out in a traditional bonding strength measuring means is effectively solved through nearly lossless photoelectron spectroscopy detection.

The embodiment of the invention provides a plasma voltage characteristic on-line monitoring device and method, and the device comprises a detection handle assembly, a shielding cable, a monitoring host, a signal processing module employing a resistance-capacitance voltage division and operational amplification architecture with AC amplitude-frequency characteristic compensation, and a full-scale linear non-step ADC sampling module. And in combination with a sliding window type transient voltage capture algorithm, plasma voltage signals are acquired, processed and monitored. By means of the technical scheme, full-scale high-precision online detection of the plasma voltage characteristics within the bandwidth ranging from-500 V to + 500 V and 0-2 MHz can be achieved, data support is provided for performance calibration and closed-loop adjustment of plasma cleaning equipment, and the risk of electrical damage to workpieces in the plasma cleaning process is greatly reduced.

The invention belongs to the technical field of sensor plastic packaging parts, and discloses an acceleration sensor plastic packaging part and a packaging method, which are used for thinning and cutting a wafer, assisting in realizing product miniaturization and meeting the requirements of scenes such as the Internet of Things and automatic driving on the size of a sensor. After the lead frame is fixed on the substrate, the bare chip is arranged and is cured and baked for the first time, and plasma cleaning is matched, so that the connection strength and reliability of the chip, the substrate and the lead frame can be improved, the influence of impurity oxides is reduced, bonding wire parameters are accurately controlled, airtight encapsulation is formed by the encapsulation film, the bare chip and bonding wires can be protected, and the sealing performance and stability are improved; the interference of the outside to the performance of the sensor is reduced, and the inorganic enhancement layer can enhance the mechanical strength. And after plasma cleaning is carried out again, a plastic package body is formed by a plastic package material, physical isolation is strengthened, creepage requirements of a high-voltage area and a low-voltage area are met, and meanwhile high temperature resistance and impact resistance are improved. The subsequent process further optimizes the performance and appearance of the product, so that the product has higher application potential in multiple fields.

The application provides a kind of plasma cleaning equipment, including cleaning mechanism and at least one set of fixed jig mechanism, cleaning mechanism includes mounting bracket, X-axis transverse module, Z-axis transverse module and cleaning spray gun head, cleaning spray gun head is installed on Z-axis transverse module, Z-axis transverse module is installed on X-axis transverse module, X-axis transverse module is installed on mounting bracket, fixed jig mechanism includes Y-axis transverse module and fixed jig device, fixed jig device is installed on Y-axis transverse module, fixed jig device includes screen fixed jig, middle frame fixed jig and connecting rod mechanism, connecting rod mechanism is respectively arranged in the two sides of middle frame fixed jig, and middle frame fixed jig is coverable by connecting rod mechanism and is arranged on the side of screen fixed jig.The cleaning mechanism of the application can effectively clean the watch screen, even if it is blocked by the wire, it can also ensure that the cleaning spray gun head can be cleaned in place, thereby improving the cleaning effect and efficiency.

The application relates to a positioning jig and a plasma cleaning device. The positioning jig comprises a bearing plate and a positioning frame. The bearing plate is detachably arranged on a machine table in the plasma cleaning device. The first side of the bearing plate away from the machine table is provided with a bearing surface for bearing a cleaning object. At least part of the outer edge contour of the bearing surface is located within the contour of the cleaning object. The positioning frame is arranged on the outer periphery of the bearing plate. The side of the positioning frame close to the bearing plate is provided with a positioning protrusion. The positioning protrusion is in abutment with the part of the cleaning object beyond the bearing surface. The positioning frame is also detachably arranged on the machine table. Through the above arrangement, the bearing plate and the frame body are in a split structure. When the bearing plate or the frame body is damaged, the damaged part can be replaced in time, and the whole positioning jig does not need to be replaced, thereby reducing the maintenance cost. When facing different types of cleaning objects, the appropriate positioning frame can be selected according to the size of the part of the cleaning object beyond the bearing surface, and the whole jig does not need to be replaced, thereby improving the universality of the positioning jig.

The utility model relates to plasma cleaning, and discloses an air circulation device of a plasma cleaning machine, which comprises an air circulation mechanism, the air circulation mechanism comprises an arc-shaped suction cover, an air circulation cover is sequentially arranged on the surface of the side wall of the arc-shaped suction cover, and a control box is arranged in the middle of the top end of the air circulation cover. An air suction sleeve is arranged in the middle of the top end of the control box, a base is arranged in the middle of the top end of the air suction sleeve, when the arc-shaped suction cover operates in the inner space of the plasma cleaning machine, the opened air suction sleeve and a sleeve of the air suction sleeve are arranged in a unified mode, and the base is used for being connected with a pipe body of an L-shaped guide pipe. Corresponding upper top plate structures are connected with one another according to the plate face structures of the corresponding side wall baffles, and circulation of gas in the vacuum box is achieved.

The utility model relates to a cleaning, code spraying and curing all-in-one machine. The Y-axis linear module is horizontally and longitudinally arranged on the machine table, the bearing disc is horizontally arranged at the driving end of the Y-axis linear module and used for containing wire harnesses, the portal frame and the curing module are arranged on the machine table, the X-axis linear module is horizontally and transversely arranged on the portal frame, and the Z-axis linear module is vertically arranged at the driving end of the X-axis linear module. The mounting frame is arranged at the driving end of the Z-axis linear module, and the visual module, the plasma cleaning module and the code spraying module are arranged on the mounting frame. The visual module is used for identifying the position of a wire harness and feeding back the position to the control system, and the plasma cleaning module, the code spraying module and the curing module are used for cleaning, code spraying and curing the wire harness in sequence; through multi-axis linkage and module integration, full-process automation of cleaning, code spraying and curing is achieved, and the problems that in the prior art, manual operation is relied on, and efficiency is low are solved.

The invention discloses a preparation method and application of a flexible porous membrane capable of identifying polar and non-polar gases, and the preparation method comprises the following steps: step 1, uniformly stirring and mixing a prepolymer and a curing agent, adding a mixture of carbon black and a sacrificial template, ultrasonically and uniformly mixing, vacuumizing to remove bubbles, and heating and curing to obtain a compound of a membrane and the sacrificial template; 2, removing the sacrificial template in the compound by using a template remover, cleaning by using a cleaning agent, and drying to obtain a flexible porous PDMS substrate; and step 3, placing the flexible porous PDMS substrate in a plasma cleaning instrument for radio frequency treatment, placing the flexible porous PDMS substrate subjected to radio frequency treatment in a cross-linking agent-containing solvent, standing in a dark place, cleaning, and drying to obtain the flexible porous membrane. According to the preparation method, carbon powder is introduced to enhance an electric signal after being in contact with gas, molecular chains containing F / H are connected into the surface and holes of the membrane through self-assembly, and due to the difference of F / H electronegativity, corresponding electric signals are presented for gas molecules with different polarities for people to distinguish the gas.

The utility model relates to sensor processing technical field discloses sensor processing's plasma cleaning device, including the bottom plate, the upper surface fixed connection of bottom plate has the slide rail, the upper surface sliding connection of slide rail has the placing table, the inside screw thread connection of placing table has the threaded rod, the outer wall fixed connection of threaded rod has the handle, the outer wall fixed connection of threaded rod has the clamping block, the inside sliding connection of placing table has the sliding rod, the outer wall of sliding rod is equipped with the spring, the outer wall fixed connection of sliding rod is in the outer wall of clamping block, the upper surface of bottom plate is provided with the support assembly. In the utility model, through the mutual cooperation between handle, threaded rod, placing table, slide rail, clamping block, sliding rod, spring can be fixed to the sensor that places on placing table and hold, to realize the accurate clamping and fixed of sensor, ensure its stability and positional consistency in the cleaning process.