1327 results about "Ceramic substrate" patented technology

The invention relates to the technical field of printed circuit boards, and discloses a circuit board structure and a preparation method thereof, and the circuit board structure comprises a copper seat, the top of which is provided with a first groove; a chip, wherein the chip is arranged in the first groove; the ceramic substrate layer is arranged at the bottom of the copper seat, and the shape of the cross section of the ceramic substrate layer is the same as that of the bottom surface of the copper seat; the copper plate layer is arranged at the bottom of the ceramic substrate layer, and the shape of the cross section of the copper plate layer is the same as that of the cross section of the ceramic substrate layer. The ceramic substrate layer and the copper plate layer are sequentially arranged at the bottom of the copper base, the thermal resistance of the chip during working can be remarkably reduced, the overall heat dissipation performance can be improved, the cross sections of the ceramic substrate layer and the copper plate layer are consistent with the bottom surfaces of the copper base and the copper plate layer in shape, and the layers are high in structural fitting degree, uniform in stress distribution and good in plate thickness consistency after lamination; and the warping problem of the copper seat caused by thermal expansion is effectively reduced.

The invention discloses a self-cleaning composite piezoelectric ceramic membrane as well as a preparation method and application thereof, and belongs to the field of composite ceramic membranes. The technical problem that an existing ceramic membrane separation technology is poor in biomembrane pollution resisting effect is solved. According to the preparation method, the barium titanate ceramic membrane is firstly prepared to serve as the base membrane, then the copper oxide one-dimensional nanostructure is loaded on the piezoelectric ceramic substrate, and the base membrane has a large membrane surface area and can be combined with more catalysts, so that more active sites are provided for catalytic reaction; according to the composite membrane, the hydrophilicity, the anti-pollution performance and the piezoelectric catalysis self-cleaning performance of the membrane are remarkably improved, and pollutants in water can be quickly and effectively separated, so that the flux and the anti-pollution performance of the membrane are improved.

The invention discloses a ceramic substrate surface defect intelligent identification method and system based on multispectral imaging, and the method comprises the following steps: synchronously collecting multispectral images under a plurality of visible light and near-infrared wavebands, constructing a multispectral image stack, and completing dark field deduction, registration and geometric correction processing; inputting the crack sensitive wave band combination image into a CrackFormer crack identification network, extracting slender structure characteristics and positioning a crack area; inputting the edge enhancement graph into an improved BDCN edge detection network, extracting the contour structure of the ceramic substrate, and identifying the position of a contour gap; a chromatic aberration defect area is extracted through brightness difference calculation; and fusing the identification results of the three types of defects, and outputting a defect mask pattern and structured defect information. According to the method, the multi-band image and the deep learning model are fused, and the accuracy and adaptability of ceramic substrate defect detection are improved.

The utility model discloses ceramic substrate automatic optical detection equipment and a blanking module thereof, the blanking module comprises a plurality of blanking bins and a blanking device, the plurality of blanking bins are linearly arranged and are used for storing detected ceramic substrates classified according to detection results; the discharging device comprises a vacuum belt conveying assembly, the vacuum belt conveying assembly is arranged above the multiple discharging bins, and the vacuum belt conveying assembly is used for receiving the detected ceramic substrates from a conveying belt and putting the detected ceramic substrates into the corresponding discharging bins according to external control signals. Through cooperation of the linearly-arranged discharging bins and the vacuum belt conveying assembly, the discharging process with the compact structure, the simplified conveying path and the stable carrying can be achieved, the detected ceramic substrates can be preliminarily classified efficiently and softly, and follow-up quality management is facilitated.

The invention provides a high-reliability silver-free AMB ceramic substrate and a preparation method thereof, and the preparation method comprises the following steps: (1) arranging silver-free active metal modified layers on the upper and lower surfaces of a ceramic substrate, and obtaining the ceramic substrate with the silver-free active metal modified layers; and (2) assembling the ceramic substrate with the silver-free active metal modified layer and two copper sheets into a sandwich structure, and performing brazing welding to obtain the high-reliability silver-free AMB ceramic substrate. High-temperature welding is carried out after the silver-free active metal modified layer is arranged, effective bonding between copper and ceramic is achieved, a good metallurgical bonding interface is formed, the high-reliability silver-free AMB ceramic substrate is obtained, the preparation cost is low, and the high-reliability silver-free AMB ceramic substrate is suitable for large-range application and popularization.

The utility model is applicable to the technical field of silicon nitride ceramic substrate preparation, and provides a surfactant mixing and ball-milling device for silicon nitride ceramic substrate preparation, which comprises a ball mill, a feeding component and a driving component, the ball mill comprises a support arranged horizontally, a hollow circular ball milling barrel and a machine cover arranged in the horizontal direction. The feeding assembly is arranged at the top of the ball milling barrel and is used for injecting milling balls and grinding materials into the ball mill; the driving assembly is arranged at the end, away from the ball milling barrel, of the support and used for providing power for ball milling of the ball mill. The device solves the problems that when powder of a silicon nitride ceramic substrate is prepared in a ball milling mode, a ball mill is prone to being damaged due to the fact that the falling speed of grinding media (steel balls and ceramic balls) is too high, and powder is prone to being splashed due to the fact that the grinding media fall to hit the powder. The purpose of ensuring that the powder and the grinding medium smoothly enter the ball mill through the feeding assembly is achieved.

The invention relates to the technical field of inertial units, and discloses a surface-mounted inertial measurement unit IMU module and a preparation method, the surface-mounted inertial measurement unit IMU module comprises a substrate, the substrate is provided with at least one IMU chip and a control chip, the bottom of the substrate is provided with an external bonding pad used for surface mounting, the IMU module is mounted in front of an external mainboard after packaging is completed, and the IMU chip is connected with the control chip. The calibration of inertial parameters is completed, and the calibration parameters are stored in an internal storage unit of the control chip; the substrate is a ceramic substrate, a sealing box dam is arranged on the periphery of the substrate, the top of the sealing box dam is fixedly connected with an upper cover, and an airtight or nearly airtight packaging structure is formed. According to the compact surface-mounted inertial measurement unit IMU module and the preparation method thereof, the compact surface-mounted inertial measurement unit IMU module has the advantages of capability of avoiding welding stress influence, stable performance, low cost, small size, easiness in automatic production and the like, and the problems of poor performance stability, high cost, high production complexity and huge size of an IMU module in the prior art are solved.

The invention provides an electronic device, a ceramic substrate and a preparation method thereof, and relates to the technical field of semiconductors. The ceramic substrate comprises a ceramic base body and a liquid channel layer, the liquid channel layer is arranged in the ceramic base body, the liquid channel layer and the ceramic base body are integrally sintered and formed, the liquid channel layer comprises a liquid channel, the liquid channel is used for containing a cooling medium, and the liquid channel extends in the ceramic base body along a three-dimensional space path. The preparation method of the ceramic substrate comprises the following steps: preparing slurry containing ceramic powder, preparing a sacrificial template matched with a target liquid channel in shape, pouring the slurry to coat the sacrificial template, filling a mold with the slurry to obtain a ceramic blank, removing the sacrificial template to form a hollow channel in the ceramic blank, and sintering to form the ceramic substrate with the liquid channel. The electronic device comprises the ceramic substrate, a component and a liquid cooling circulation system.

The invention belongs to the technical field of ceramic slurry, and particularly relates to ceramic slurry and a preparation method and application thereof.The ceramic slurry comprises inorganic components and organic components, the inorganic components comprise inorganic additives and glass powder, the inorganic additives comprise Al2O3, ZrO2 and Y2O3, and the organic components comprise modified acrylic resin, organic solvent and auxiliaries. By controlling the relative content of carboxyl and ester groups in the modified acrylic resin and utilizing the polarity difference of functional groups, selective adsorption of inorganic powder is realized, so that the dispersion uniformity of the powder in the ceramic slurry is remarkably improved, segregation of yttrium oxide is effectively inhibited, and the service life of the ceramic slurry is prolonged. Therefore, monoclinic-phase zirconium oxide, tetragonal-phase zirconium oxide and cubic-phase zirconium oxide with a proper proportion can be formed in the sintered ceramic substrate, further the bending strength of the ceramic substrate is remarkably improved, and the ceramic substrate is particularly suitable for manufacturing miniaturized and thin electronic components.

The invention relates to the field of aluminum nitride ceramic substrates, provides a preparation method of a high-thermal conductivity aluminum nitride substrate, and solves the defects of low thermal conductivity and insufficient mechanical strength of an aluminum nitride substrate obtained by adopting a preparation method in the prior art. Comprising the following preparation processes: (1) preparing raw materials and auxiliary materials; (2) mixing the raw materials and the auxiliary materials; (3) tape casting; (4) aging; (5) pre-flattening treatment; (6) sintering; and (7) post-treatment.

The invention relates to the field of inorganic ceramic materials, in particular to a high-thermal-conductivity silicon nitride ceramic substrate and a preparation method and application thereof. The preparation method of the high-thermal-conductivity silicon nitride ceramic substrate comprises the following steps: obtaining at least two kinds of silicon nitride slurry with different total contents of sintering aids, and respectively molding the silicon nitride slurry into green sheets; stacking the at least two green body sheets according to a preset lamination sequence and spatial orientation to obtain a laminated green body with a sintering aid concentration gradient; and sintering the laminated green body to obtain the high-thermal-conductivity silicon nitride ceramic substrate. According to the method, additional seed crystal or complex atmosphere accurate regulation and control are not needed, directional driving force is spontaneously formed in the sintering process through material intrinsic gradient design and laminated structure construction, silicon nitride crystal grains are effectively induced to grow in a preferred orientation mode in the preset direction, therefore, directional arrangement of the crystal grains is controllable, the process is simple and stable, repeatability is good, and the method is suitable for industrial production. The thermal conductivity, the bending strength and the fracture toughness of the prepared silicon nitride ceramic substrate are synchronously optimized.

The invention designs a broadband intermediate-frequency heterogeneous integrated communication transceiving micro module and a three-dimensional packaging method, and belongs to the technical field of advanced packaging. The micro module comprises a TSV silicon adapter plate, a Fan-out module, an HTCC ceramic substrate and a digital chip. The TSV silicon adapter plate adopts a high-resistance silicon substrate, and a coaxial shielding TSV structure is arranged on the TSV silicon adapter plate and comprises an inner layer signal through hole and an outer layer grounding layer. A frequency synthesizer chip and a radio frequency chip are embedded in the Fan-out module, and high-density horizontal interconnection is realized through a plurality of redistribution layers. The HTCC ceramic substrate is of a multi-layer laminated structure, and an impedance matching network is arranged in the HTCC ceramic substrate. The three-dimensional packaging method comprises the steps of TSV silicon adapter plate preparation, Fan-out module processing, digital chip stacking and system-level integration. High-density packaging of the radio frequency chip and the digital chip is achieved through the three-dimensional heterogeneous integrated architecture, and low-loss transmission of broadband signals is guaranteed through the coaxial shielding TSV structure and the impedance matching network.

The invention relates to the technical field of heat dissipation of power semiconductor devices, in particular to a ceramic heat dissipation carrier plate, a preparation method thereof and a power semiconductor device. The ceramic heat dissipation carrier plate of the present invention comprises: a ceramic substrate; the first bonding layer is arranged on one side of the ceramic substrate; the metal circuit layer is arranged on the first bonding layer; the second bonding layer is arranged on the other side of the ceramic substrate; the metal heat dissipation layer is arranged on the second bonding layer; a porous structure is arranged in the metal heat dissipation layer; the first bonding layer and the second bonding layer are formed in a magnetron sputtering mode. According to the ceramic heat dissipation carrier plate, the porous structure is arranged in the metal heat dissipation layer, the ultrathin combination layer is formed through magnetron sputtering, thermal expansion mismatch between metal and ceramic is remarkably reduced, residual stress and warping are effectively restrained, meanwhile, the heat conduction path is shortened, the cavity defect is eliminated, and the heat dissipation efficiency is improved. Therefore, collaborative improvement of high heat dissipation efficiency and long-term reliability is realized in a high-voltage, high-temperature and high-vibration environment.

The invention discloses a ceramic substrate testing device capable of preventing broken contact, and relates to the technical field of insulation and voltage resistance detection of ceramic substrates, the ceramic substrate testing device capable of preventing broken contact comprises a rack, a master control system and PID thermal control equipment, the rack is provided with a detection table, the rack is provided with a push-pull positioning clamp, and the push-pull positioning clamp is connected with the master control system. A sealing cover is installed on the push-pull positioning clamp, an upper electrode assembly is arranged at the lower end of the push-pull positioning clamp, a lower electrode assembly and a heating module are arranged on the detection table, the ceramic substrate is placed on the detection table, the push-pull positioning clamp pushes the upper electrode assembly and the sealing cover to move downwards, and the heating module is started to heat the ceramic substrate. The upper electrode assembly and the lower electrode assembly are matched to apply high voltage to the substrate and monitor leakage current and breakdown voltage conditions in real time, so that the insulation and voltage resistance of the copper-clad ceramic substrate can be accurately evaluated under a high-temperature condition, and an insulation reliability test under an electric-thermal coupling condition can be realized; and the reliability and repeatability of the test are obviously improved.

A metal-ceramic substrate and an electronic component comprising a metal-ceramic substrate. The metal-ceramic substrate comprises: a) a ceramic body which has a main extension plane, b) a metal layer which is connected to the ceramic body, in a planar manner, the metal layer having a structuring region which comprises: (i) solid material in some areas and (ii) non-solid material in some areas, and c) a contact region comprising silver arranged on the metal layer, wherein, in a cross section through the metal-ceramic substrate perpendicular to the main extension plane, the structuring region has a geometry in which the following requirement is met:A⁡(BCDsolid) / A⁡(BCDtotal)>70⁢%,wherein A (BCDtotal) represents the total area of the triangle described by the points B, C and D, and A (BCDsolid) represents the area of the triangle described by the points B, C and D which is occupied by solid material.

The invention discloses ZTA ceramic powder, a ceramic substrate and a preparation method of the ceramic substrate, and relates to the field of ceramic substrate materials. The preparation method of the ZTA ceramic powder comprises the following steps: dissolving aluminum alkoxide in an organic solvent, adding a polyether alcohol dispersant, uniformly stirring, and adjusting the pH value to 2.8-3.2 to obtain an aluminum precursor solution; the zirconium precursor solution is dropwise added into the aluminum precursor solution, the molar ratio of Al to Zr in an aluminum precursor and a zirconium precursor is (5-20): 1, and an aluminum-zirconium mixed solution is obtained; and adding water into the aluminum-zirconium mixed solution, heating for hydrolysis reaction, cooling and stirring to form gel, freeze-drying and calcining to obtain the ZTA ceramic powder with uniform particle size, good dispersity and regular morphology, thereby enhancing the density, thermal conductivity, hardness and bending strength of the substrate.

The invention discloses an anti-interference array antenna of a satellite navigation receiver, which relates to the technical field of satellite navigation and comprises a radiation element, a ceramic substrate, an array element base and a metal bottom plate, a threaded hole is formed in the upper portion of the array element base, and a first slotted pan head screw is arranged in the threaded hole. The array element base is provided with a ceramic substrate and a radiation element through a slotted pan head screw I; the radiation element is positioned above the ceramic substrate; a central antenna array element is mounted at the central position of the top of the metal bottom plate, and a choke ring is arranged on the outer side of the central antenna array element; and an SMA connector is mounted below the slotted pan head screw I. Hardware-level mutual coupling suppression is realized by combining the multilayer microstrip antenna with the EBG choke ring and optimizing the arrangement of the antenna array elements, and by optimizing the hardware structure, the mutual coupling interference between the array elements is reduced from the source, the performance of the antenna is improved, and the interference positioning problem in an unknown mutual coupling environment is solved. Interference can be accurately and quickly positioned and suppressed, and the anti-interference capability of the antenna is improved.

The invention is suitable for the technical field of laser processing, and provides a hole structure processing method of a ceramic substrate, a controller, equipment and a ceramic circuit board. The hole structure processing method of the ceramic substrate comprises the following steps: acquiring processing parameters of a hole structure; processing a hole structure with a hole outer contour and a target processing depth at the hole position; wherein the hole structure machining process is multi-time layered machining, and the machining process of a first layer in the multi-time layered machining comprises the steps that first laser is used for conducting laser winding cutting machining along a machining path matched with the outer contour of a hole according to the first machining depth, second laser is used for conducting laser scanning machining along the defined area of the outer contour of the hole according to the second machining depth smaller than the first machining depth; after multi-time layered machining, the accumulated value of the first machining depth is larger than or equal to the target machining depth, and the accumulated value of the second machining depth is larger than or equal to the target machining depth. According to the embodiment of the invention, the pore structure meeting the requirements can be effectively processed on the ceramic material layer.

The invention belongs to the technical field of electronic ceramic substrate materials, and particularly relates to a preparation method of a microcrystalline glass composite silicon nitride ceramic substrate, which is prepared from the following raw materials: 1-5% of alpha-phase silicon nitride powder, 86-95% of beta-phase silicon nitride powder, 0.2-3% of metal silicon powder, 2.5-8% of glass powder and 1.3-8% of metal oxide. The preparation method comprises the following steps: S1, mixing and grinding raw materials to obtain ceramic slurry; s2, adding Arabic gum into the ceramic slurry as a binder, and carrying out spray granulation; granulation powder is obtained; s3, carrying out dry pressing molding and cold isostatic pressing treatment on the granulation powder to prepare a ceramic plate blank; and S4, sintering and crystallizing the ceramic plate blank. According to the invention, the glass ceramic powder is introduced as a sintering aid and a second phase, and the sintering temperature of the silicon nitride is obviously reduced from the conventional temperature of more than 1800 DEG C to 1500 DEG C by utilizing the liquid phase effect of the glass ceramic powder in the sintering process, so that two modes of air pressure sintering and normal pressure sintering can be used, and the energy consumption and the requirements on equipment are reduced.

The invention belongs to the technical field of PCB detection, particularly relates to a PCB ceramic substrate appearance laser measuring instrument, and aims to solve the problem that tiny cracks hidden on a substrate are difficult to find when the substrate is not stressed in the actual detection process, the following scheme is provided: the PCB ceramic substrate appearance laser measuring instrument comprises a counterweight seat, support rods are fixed on the upper surface of the counterweight seat close to four corners, and the support rods are fixed on the upper surface of the counterweight seat; the top ends of the four supporting rods are fixedly provided with the same workbench, the middle of the workbench is rotationally connected with a vertical supporting pipe, the top end of the supporting pipe is fixedly provided with an arch-shaped supporting plate, and the two ends of the arch-shaped supporting plate are provided with bearing modules which are of the same structure and are symmetrical to each other respectively. According to the invention, the ceramic plate body can be extruded before surface defect detection, so that the residual stress of the ceramic plate body can be amplified to a certain extent, some potential surface micro-defects are forced to be amplified, a laser probe can find the surface micro-defects more easily, and potential quality defects of the ceramic plate body can be detected.

The invention relates to the technical field of ceramic substrate detection, in particular to a defect detection device and method for a ceramic substrate, the defect detection device for the ceramic substrate comprises a panel, and a first conveyor and a second conveyor are sequentially installed on the panel in the length direction; a feeding mechanism is arranged on the first conveyor in a spanning mode. The conveyor I and the conveyor II are arranged at an interval; an appearance detection module I is arranged on the conveyor II; the tail end of the conveyor II is connected with a vacuum conveyor; and a storage mechanism is arranged below the vacuum conveyor. The defect detection of the ceramic substrate is realized through the appearance detection module I on the conveyor II, so that the comprehensiveness and the accuracy of defect identification are greatly improved; the detection method depends on the matched defect detection device, continuous feeding of the ceramic substrate is achieved through alternate operation of the two feeding assemblies, comprehensive and accurate defect recognition is achieved through primary and secondary double appearance detection, all steps are smoothly linked, and the automation degree is high.

The invention relates to an AMB ceramic substrate capable of improving reliability and a process method thereof. The AMB ceramic substrate comprises a first copper layer, a first solder layer, a ceramic layer, a second solder layer and a second copper layer which are sequentially stacked, the AMB ceramic substrate is of an axisymmetric structure in the width direction. The width of the first solder layer is larger than that of the first copper layer, and the wider structure in the first solder layer is marked as a first step structure on one side of a symmetry axis in the width direction of the AMB ceramic substrate; the width of the second solder layer is larger than that of the second copper layer, and the wider structure in the second solder layer is marked as a second step structure on one side of the symmetry axis in the width direction of the AMB ceramic substrate. According to the AMB ceramic substrate and the manufacturing method thereof, the step structures in the first solder layer and the second solder layer can achieve gradient dispersion of stress and effectively relieve residual stress, so that the stress distribution condition is remarkably improved, and the reliability of the AMB ceramic substrate is improved.

The invention provides a double-sided conduction AMB ceramic substrate and a manufacturing method thereof, and belongs to the technical field of ceramic substrates for power modules. The manufacturing method comprises the following steps: punching holes in a ceramic substrate; filling conductive metal slurry into the holes by using a screen printing machine and sintering at high temperature; brazing materials are printed on the two faces of the ceramic; the copper layer and the ceramic layer are laminated and then subjected to vacuum brazing; manufacturing a circuit; etching the solder layer of the AMB line groove to expose the ceramic; performing surface treatment; laser cutting; and conducting test and inspection. Two-sided conduction is realized through metal slurry hole filling and a high-temperature sintering process, the problem that conduction of an upper copper layer and a lower copper layer of a traditional AMB ceramic substrate cannot be realized is solved, the assembling size of a power module is reduced, the three-dimensional integration requirement of a high-end module is met, meanwhile, the technological process is reasonable, and the production cost is reduced.

The invention relates to a metal-ceramic substrate, to an electronic component comprising a metal-ceramic substrate, and to a method for producing a metal-ceramic substrate. The metal-ceramic substrate comprises: a) a ceramic body which has a main extension plane, b) a metal layer which is connected to the ceramic body in a planar manner, the metal layer having a structuring region which comprises (i) partially solid material and (ii) partially non-solid material, and c) a contact area which is arranged on the metal layer and comprises silver, the structuring region having a geometry in a cross-section through the metal-ceramic substrate perpendicular to the main extension plane, the following requirement being met: S(BCsolid) / S(BCtotal)>60%, wherein: S(BCtotal) represents the total length of the line between points B and C, and S(BCsolid) represents the length of the line between points B and C that intersects the solid material.

An optical element mounting package according to the present invention comprises: a ceramic substrate that includes a mounting part having a first surface on which a laser element is mounted; a first fixing part that is positioned at one end of the ceramic substrate in a first direction along the first surface; and a second fixing part that is positioned at the other end of the ceramic substrate opposite to the one end in the first direction. The first fixing part and the second fixing part can be used to fix the ceramic substrate. The first fixing part has a first through hole and a second through hole that pass therethrough in the direction intersecting the first surface. The second fixing part has a third through hole that passes therethrough in the direction intersecting the first surface. The maximum widths of the first through hole and the third through hole in the direction along the first surface are greater than the maximum width of the second through hole in the direction along the first surface.

The invention discloses a high-thermal-conductivity aluminum nitride ceramic substrate based on dynamic pressure and a preparation method thereof, and the preparation method comprises the following steps: step 1, filling aluminum nitride ceramic powder into a mold, heating to a pre-sintering temperature for pre-sintering, and cooling to obtain a pre-sintered green body; the pre-sintering temperature is 1300 to 1600 DEG C; basic static pressure is loaded in the heating stage, and after the presintering temperature is reached, dynamic pressure is superposed for heat preservation for 1-300 min; step 2, raising the temperature of the pre-sintered green body to a sintering temperature, and sintering; the sintering temperature is 1600 to 2100 DEG C; basic static pressure is loaded in the heating stage, and after the sintering temperature is reached, dynamic pressure is superposed, and heat preservation is conducted for 1-600 min; step 3, carrying out heat treatment on the sintered ceramic green body to obtain the required ceramic substrate after heat treatment; the performance uniformity of the AlN ceramic structure can be effectively improved through mutual cooperation of pre-sintering and sintering under dynamic pressure, the density of the ceramic is improved, the heat conductivity of the ceramic substrate is improved, and the preparation process and the process period are shortened.

The invention belongs to the technical field of high-power electronic component base materials, and discloses an embedded high-thermal-conductivity ceramic packaging substrate for a high-power scene and a preparation method of the embedded high-thermal-conductivity ceramic packaging substrate. ABF composite layers are arranged above and below a ceramic core plate in the ceramic packaging substrate; a high-thermal-conductivity base material is fixed in the ceramic substrate; interconnection holes are formed in the ceramic substrate, and electroplating copper film layers are arranged on the upper surface and the lower surface of the ceramic substrate and in the interconnection holes; a copper-clad plate layer is arranged on the outer side of the ABF layer, a copper-clad plate groove is formed in the copper-clad plate layer, a blind hole is formed in the copper-clad plate groove, and a copper column is arranged in the blind hole; a solder mask layer is arranged on the surface of the ABF layer on the outermost side, a surface treatment layer is arranged on the outer side of the solder mask layer, and blind holes with built-in copper columns are formed in the surface treatment layer. The preparation method comprises the following steps: forming a substrate groove in the surface of the ceramic substrate; embedding a high-thermal-conductivity base material; arranging an electroplating copper film coating layer; an ABF composite layer is arranged; arranging a solder mask layer; and arranging a surface treatment layer. The LED lamp is good in heat dissipation effect.

The invention discloses a preparation method of a zirconium oxide toughened aluminum oxide ceramic substrate, which comprises the following steps: respectively carrying out surface modification on aluminum oxide powder and zirconium oxide powder by adopting a coupling agent, a catalyst and a cross-linking agent, then mixing the two modified powder with a rare earth sintering aid, a dispersing agent, a binder and a plasticizer, and carrying out ball milling treatment, thereby obtaining the zirconium oxide toughened aluminum oxide ceramic substrate. Carrying out tape casting and sintering processes to obtain a target ceramic substrate; the preparation method is simple, the process is easy to control, the bending strength of the prepared zirconium oxide toughened aluminum oxide ceramic substrate can reach 847 MPa at most, and the fracture toughness can reach 7.6 MPa.m < 1 / 2 > at most.

The invention discloses a fuel tank pressure sensor, and belongs to the technical field of automobile sensors, the fuel tank pressure sensor comprises a shell, a shell cover, a PCBA circuit unit and a ventilation unit, a monitoring channel is arranged in the shell, two sides of the monitoring channel are provided with communication connectors, the front end of the shell is provided with a wiring harness connector, the PCBA circuit unit is fixed in the shell, and the ventilation unit is fixed in the shell. The shell cover covers the outer shell, the ventilation unit is arranged on the shell cover, the PCBA circuit unit comprises a ceramic substrate and a circuit substrate with an electrical device, a detection hole communicated with a monitoring channel is formed in the outer shell, the ceramic substrate is bonded in the outer shell through a sealant, and the ventilation unit is arranged on the outer shell. The ceramic substrate is provided with a through hole corresponding to the detection hole, the circuit substrate is bonded above the ceramic substrate, and a monitoring chip is packaged in the circuit substrate. The device is high in reliability and low in manufacturing cost, and improves the accuracy and long-term stability of oil tank pressure detection.

The utility model relates to a heating device and a new energy automobile. The heating device comprises a shell and a heating device, wherein a containing cavity is defined by the shell; the shell is provided with a containing cavity, the heating unit is arranged in the containing cavity, the heating unit comprises a ceramic substrate and a heating piece, the ceramic substrate and the shell define a circulation cavity and an installation cavity which are independently arranged, and the heating piece is arranged on the ceramic substrate and located in the installation cavity; and the heating piece is used for heating the liquid passing through the circulating cavity. The ceramic substrate is an insulator, so that the heating element can be directly arranged on the ceramic substrate, and an insulating layer is omitted. In this way, heat generated by the heating piece is directly conducted to the liquid in the circulation cavity through the ceramic substrate, the heat loss is small due to the fact that the transmission path of the heat is short, the heat absorption effect of the insulating layer can be eliminated, the heat loss is further reduced, and finally the heating efficiency of the heating device is improved.