2210 results about "Ceramic substrate" patented technology

The invention belongs to the technical field of semiconductors, and discloses a SiC power semiconductor module with low parasitic parameters and a preparation method. Comprising a SiC power semiconductor chip, a SiC power semiconductor chip substrate cushion block, a positive electrode power terminal, a negative electrode power terminal, an output power terminal, a positive electrode side middle layer cushion block, a positive electrode side ceramic decoupling capacitor, a positive electrode side substrate middle layer cushion block, a negative electrode side middle layer cushion block, a negative electrode side ceramic decoupling capacitor and a negative electrode side substrate middle layer cushion block. A first copper-clad ceramic substrate, a third copper-clad ceramic substrate, a fourth copper-clad ceramic substrate, a second copper-clad ceramic substrate, a first commutation loop middle copper layer and a second commutation loop middle copper layer; according to the invention, a commutation path is provided for the SiC power semiconductor device by using the middle layer copper of the laminated copper-clad ceramic substrate, the concept of mutual inductance offset of double commutation loops is innovatively introduced, and the parasitic inductance of the module is further reduced.

The invention discloses a preparation method of a textured silicon nitride ceramic substrate, and belongs to the technical field of ceramic products. Beta-silicon nitride whiskers with the long diameter of 4-15 microns and the short diameter of 1-3 microns are added into silicon nitride ceramic slurry according to the design, and when the whiskers containing beta-silicon nitride pass through a scraper of a casting machine, the whiskers tend to be directionally arranged in the casting direction, so that a textured structure is generated in the silicon nitride ceramic substrate. The textured structure is beneficial to improving the three-point bending strength, the fracture toughness and the thermal conductivity in the horizontal direction of the ceramic substrate.

The invention relates to the technical field of ceramic substrates, and provides a high-toughness multilayer ceramic substrate and a preparation method thereof. Raw materials of the high-toughness multilayer ceramic substrate comprise the following components in parts by weight: 90-95 parts of aluminum oxide, 13-17 parts of a sintering aid, 2-5 parts of a plasticizer, 1-3 parts of a dispersant, 3-5 parts of a binder, 10-12 parts of an aid and 55-65 parts of water, the auxiliaries comprise boron carbide, copper-tin alloy powder and graphene oxide. According to the technical scheme, the problem of poor toughness of the multi-layer ceramic substrate in the prior art is solved.

The invention relates to the technical field of ceramic substrates, and provides a bending-resistant multilayer ceramic substrate and a preparation method thereof.The bending-resistant multilayer ceramic substrate is prepared from, by weight, 100 parts of aluminum oxide, 2-4 parts of a sintering aid, 1-2 parts of a plasticizer, 1-2 parts of a reinforcing agent, 1-3 parts of a dispersing agent, 8-12 parts of a binder and 85-90 parts of water; the reinforcing agent comprises tungsten trioxide and cobaltosic oxide. According to the technical scheme, the problem of low bending strength of the multilayer ceramic substrate in the prior art is solved.

The invention discloses an orthogonally stacked double-sided cooling power module and a preparation method thereof. The orthogonally stacked double-sided cooling power module comprises a decoupling capacitor, a copper-clad ceramic substrate, a power chip and a metal cushion block, the metal cushion blocks and the power chips are stacked and connected layer by layer in a metal cushion block-power chip-metal cushion block mode to form a series chipset, and the copper-clad ceramic substrate is connected with the two sides of the metal cushion blocks in the series chipset and is perpendicular to the power chips. According to the invention, through the cooperative effect of orthogonal stacking packaging and double-face cooling of the double copper cushion blocks, the electrical and thermal performance of the cooling power module is cooperatively optimized, the parasitic inductance of the power module is significantly reduced, the transient over-current supporting capability is significantly improved, and the packaging technology has good flexibility and is suitable for large-scale production. The method is suitable for power modules of different packaging types.

The invention discloses an ultra-miniature patch fuse structure and a production process thereof. A fuse comprises a ceramic substrate, an inner electrode part, a terminal electrode part, a fuse wire part and a covering protection layer. An inner electrode groove is formed in the side wall of the ceramic substrate, and the inner electrode part comprises a first inner electrode and a second inner electrode; the first inner electrode and the second inner electrode are respectively provided with a fuse wire fixing groove. According to the production process, inner electrode grooves are formed in the two ends of a ceramic substrate, a first inner electrode and a second inner electrode are constructed through metallization wall-hanging treatment, a fuse part is inserted into a fuse fixing groove and connected through thermal ultrasonic or hot pressing bonding, and a protection layer is printed and cured to enhance the insulation performance. According to the invention, through cooperation of the fuse wire fixing grooves, accurate limitation and anti-drop protection of fuse wire component connection points are realized, and the structural stability and the electrical connection reliability between the fuse wire component and the first inner electrode and between the fuse wire component and the second inner electrode are improved.

The invention relates to a communication computing power transmitting and receiving system chip based on core particle stacking packaging. The communication computing power transmitting and receiving system chip comprises an organic packaging substrate, programmable radio frequency transceiver core particles, computing power device core particles, programmable logic core particles and a ceramic substrate. The computing power device core particles and the programmable logic core particles are horizontally and adjacently arranged on the device mounting surface of the organic packaging substrate; a pre-buried semi-groove is dug in the second surface of the ceramic substrate, and the programmable radio frequency transceiver core particles are arranged in the pre-buried semi-groove; the ceramic substrate is buckled on the organic packaging substrate, the device mounting surface of the organic packaging substrate is opposite to the second surface of the ceramic substrate, and the ceramic substrate completely covers the arranged programmable logic core particles and the arranged computing power device core particles; a conductive layer is arranged between the ceramic substrate and the organic packaging substrate. The communication computing power transceiving system chip can solve the problems of large occupied space, high signal transmission delay and low heat dissipation efficiency in a traditional packaging scheme, can reduce the size of a fuselage of an unmanned aerial vehicle, and enhances the performance of the unmanned aerial vehicle.

The invention belongs to the technical field of silicon nitride ceramic substrates, and particularly relates to a high-thermal-conductivity and high-breaking-strength silicon nitride substrate and a sintering method and application thereof. In order to simultaneously improve the thermal conductivity and the breaking strength of the existing silicon nitride ceramic substrate and ensure the stability and the consistency of the performance during the production of the silicon nitride substrate, the method comprises the following steps: coating the surface of a silicon nitride ceramic biscuit subjected to tape casting with isolation powder, carrying out nitrogen or air atmosphere glue removal treatment, and then sintering; in the sintering process, the cooling process is optimized, a multi-temperature heat preservation platform is arranged above the liquid phase conversion temperature, grain growth and grain boundary composition of the silicon nitride ceramic are regulated and controlled, grain size distribution of the silicon nitride ceramic is made to be more uniform, the grain boundary structure is made to be more optimized, and the heat conductivity coefficient and breaking strength of the substrate are remarkably improved. Meanwhile, the uniformity of a temperature field in the sintering furnace can be greatly improved through the sintering method, it is ensured that the product can reach the consistent performance standard in different areas, and the stability and reliability of the product are improved.

The invention relates to the technical field of printed circuit boards, and discloses a circuit board structure and a preparation method thereof, and the circuit board structure comprises a copper seat, the top of which is provided with a first groove; a chip, wherein the chip is arranged in the first groove; the ceramic substrate layer is arranged at the bottom of the copper seat, and the shape of the cross section of the ceramic substrate layer is the same as that of the bottom surface of the copper seat; the copper plate layer is arranged at the bottom of the ceramic substrate layer, and the shape of the cross section of the copper plate layer is the same as that of the cross section of the ceramic substrate layer. The ceramic substrate layer and the copper plate layer are sequentially arranged at the bottom of the copper base, the thermal resistance of the chip during working can be remarkably reduced, the overall heat dissipation performance can be improved, the cross sections of the ceramic substrate layer and the copper plate layer are consistent with the bottom surfaces of the copper base and the copper plate layer in shape, and the layers are high in structural fitting degree, uniform in stress distribution and good in plate thickness consistency after lamination; and the warping problem of the copper seat caused by thermal expansion is effectively reduced.

The invention relates to the technical field of electroplating, and discloses a ceramic substrate through hole electro-coppering hole filling process control method which comprises the following steps: acquiring structural parameters of a target ceramic substrate through hole, optimizing the proportion of a prefabricated electroplating solution to obtain a proportioned electroplating solution, analyzing a composite electroplating medium of the proportioned electroplating solution, and inquiring a pulse current waveform; the copper deposition morphology is monitored, polarization effect coefficients under different current densities are calculated, duty ratio indexes are optimized to score a shaped current sequence, a multi-order electric field is applied to obtain in-hole flow field data, and the copper deposition uniformity is calculated; and performing multi-cycle electroplating-annealing iteration to obtain a copper hole filling structure, testing residual stress, identifying a lattice distortion section, generating a crystallization-annealing curve, and formulating a process optimization scheme according to regulation and control data. According to the invention, the reliability of the through hole electro-coppering filling process can be improved.

The invention discloses an efficient heat dissipation system of a new energy automobile circuit board, and the system comprises a composite heat dissipation substrate which is formed by compounding a ceramic substrate layer, a graphene heat conduction layer and a copper alloy supporting layer through vacuum hot pressing, and the surface of the graphene heat conduction layer is provided with a micron-sized groove array; the dynamic heat dissipation assembly comprises a thermoelectric refrigeration module and a temperature sensor which are embedded in the composite heat dissipation substrate, the thermoelectric refrigeration module is linked with the temperature sensor through a PID controller, and active refrigeration based on temperature rise of the circuit board is achieved; the multi-layer heat dissipation channel comprises a micro-channel and a bionic fin structure, the micro-channel vertically penetrates through the composite heat dissipation substrate, the bionic fin structure covers the surface of the substrate, and the micro-channel is filled with a phase change material and is communicated with an external liquid cooling circulation system; the airflow adjusting module comprises a rotatable flow guide plate and a piezoelectric fan array, the flow guide plate dynamically adjusts the heat dissipation airflow direction according to the vehicle speed, and the frequency response range of piezoelectric fans is larger than or equal to 100 Hz.

The invention relates to the technical field of ceramic substrates, and provides a high-toughness aluminum oxide ceramic substrate and a preparation method thereof, the high-toughness aluminum oxide ceramic substrate comprises the following raw materials by weight: 100 parts of aluminum oxide, 1-3 parts of a plasticizer, 4-6 parts of an auxiliary agent, 4-6 parts of a binder, 1-3 parts of a dispersant, and 55-65 parts of water; the auxiliary agent is composed of an auxiliary agent A and an auxiliary agent B, the auxiliary agent A comprises rare earth oxide, and the auxiliary agent B is composed of molybdenum boride, scandium oxide and zirconium oxide. According to the technical scheme, the problem of low toughness of the aluminum oxide ceramic substrate in the prior art is solved.

The invention provides an aerosol generating device and a coil assembly thereof, the aerosol generating device comprises a control assembly, the control assembly transmits an electric signal to the coil assembly through an electric connection part, the coil assembly comprises a ceramic substrate, a conductive heating body and a temperature feedback element, the ceramic substrate defines a heating cavity, and the conductive heating body is arranged in the heating cavity. The heating cavity is used for accommodating an aerosol forming substrate; the conductive heating body is arranged on the ceramic base body, and the conductive heating body heats the aerosol to form a substrate so as to generate aerosol; the temperature feedback element is arranged on the inner side or the outer side of the heating cavity and used for obtaining temperature related information of the conductive heating body and feeding back the temperature related information to the control assembly. The ceramic base body integrates the conductive heating body and the temperature feedback printed circuit, precision of temperature feedback control is achieved, real-time feedback adjustment can be conducted on the coil circuit according to the preset temperature, and stability and precision of the heating process are guaranteed.

The present invention relates to a method for manufacturing a ceramic substrate. Each of upper and lower metal layers respectively bonded to upper and lower surfaces of the ceramic substrate may have a thickness of 0.3 mm to 10 mm, so as to be applicable to a high output power module, and may reduce a chemical etching process time by performing, in advance, a trenching process, which is a mechanical processing scheme, in order to form an electrode pattern on the upper metal layer.

The invention belongs to the field of module parasitic parameter reduction, and discloses a multi-loop decoupling-based low electromagnetic parasitic parameter SiC power semiconductor module, which is characterized in that an independent copper substrate is adopted as an alternating current copper layer to be laminated on a DBC (Direct Bond Copper) ceramic substrate, and a lower tube chip is flipped and then welded on the lower DBC substrate which is disconnected from a radiator; an upper tube chip and a lower tube chip are connected with a copper substrate above through a copper-molybdenum-copper cushion block, and an alternating current output end of the module is suspended above the DBC substrate through the chips and the cushion block. According to the invention, parasitic capacitance of the module AC output end to the grounding radiator can be almost completely eliminated, power-heat transfer loop capacitive decoupling is realized, common-mode current of a SiC device under high-speed switching is significantly reduced, and electromagnetic interference of a high-frequency switching circuit to a driving circuit and a control system is effectively reduced. And meanwhile, the parasitic inductance of the module is remarkably reduced, and orthogonal decoupling of a signal-power loop magnetic flux space is realized.

Disclosed herein are a membrane suitable for separation of chemical species, the membrane comprising a ceramic substrate having a first surface and a second surface, an anchoring chemical layer on the first surface of the ceramic substrate, and a covalent organic framework (COF) layer on the anchoring chemical layer, and a method of using the membrane in a process of separating a first organic compound from a second organic compound. Also disclosed herein are a method of forming a membrane suitable for separation of chemical species, and a device to manufacture a membrane suitable for separation of chemical species.

The invention discloses a conductive paste, a metallized substrate and a metallization process for manufacturing the metallized substrate, the conductive paste comprises metal particles, the particle size of the metal particles is 0.1-10 [mu] m, and the mass ratio of the metal particles is 80-98%; in the metallization process, a copper layer is arranged on the hole wall of a through hole or a blind hole of a substrate, then conductive slurry is filled in the hole with the copper layer, heating sintering treatment is carried out, and after heating sintering is carried out in an inert gas atmosphere at the temperature of less than or equal to 300 DEG C, metal particles can be fused to form a connection structure or a eutectic structure. A reinforcing layer can be formed between the nano metal particles and the copper layer, and the reinforcing layer is a metal bonding layer or an intermetallic compound layer. The metallization mode is suitable for a through hole or a blind hole of a glass / silicon / ceramic substrate with a high aspect ratio and a micro aperture, and the technical problems that complete filling is difficult to achieve and filling defects exist in an existing electroplating process, the electrical resistivity of conductive paste is high, and the interface bonding force is insufficient can be solved.

The invention discloses a self-cleaning composite piezoelectric ceramic membrane as well as a preparation method and application thereof, and belongs to the field of composite ceramic membranes. The technical problem that an existing ceramic membrane separation technology is poor in biomembrane pollution resisting effect is solved. According to the preparation method, the barium titanate ceramic membrane is firstly prepared to serve as the base membrane, then the copper oxide one-dimensional nanostructure is loaded on the piezoelectric ceramic substrate, and the base membrane has a large membrane surface area and can be combined with more catalysts, so that more active sites are provided for catalytic reaction; according to the composite membrane, the hydrophilicity, the anti-pollution performance and the piezoelectric catalysis self-cleaning performance of the membrane are remarkably improved, and pollutants in water can be quickly and effectively separated, so that the flux and the anti-pollution performance of the membrane are improved.

The invention discloses a packaging structure and a packaging method of a SiP module based on a ceramic material, the packaging structure takes the ceramic material as a packaging shell, the position of a substrate part of the shell is designed to be a concave staggered layer structure, so that the assembly of chips and passive devices with different sizes and different heights is facilitated, and because the internal circuit of the SiP module is complicated and the number of interface pins is large, the packaging cost is low. Therefore, a ball grid array pin mode is adopted outside the shell, a metallization layout design is carried out on the ceramic substrate to realize chip assembly bonding pad and partial circuit wiring, and meanwhile, through hole metallization slurry filling is designed between substrates to realize connection of an internal metallization bonding pad and an external ball grid array pin. And a specific chip and a passive device are assembled at different positions, and lead bonding interconnection is assisted, so that a complete packaging process of a specific circuit SiP module is realized. The power distribution cabinet has the advantages of being good in insulation performance, ultrahigh in integration level, ultra-light in weight, fast in heat dissipation, high in reliability and the like, and has very high popularization value.

The invention discloses a ceramic substrate surface defect intelligent identification method and system based on multispectral imaging, and the method comprises the following steps: synchronously collecting multispectral images under a plurality of visible light and near-infrared wavebands, constructing a multispectral image stack, and completing dark field deduction, registration and geometric correction processing; inputting the crack sensitive wave band combination image into a CrackFormer crack identification network, extracting slender structure characteristics and positioning a crack area; inputting the edge enhancement graph into an improved BDCN edge detection network, extracting the contour structure of the ceramic substrate, and identifying the position of a contour gap; a chromatic aberration defect area is extracted through brightness difference calculation; and fusing the identification results of the three types of defects, and outputting a defect mask pattern and structured defect information. According to the method, the multi-band image and the deep learning model are fused, and the accuracy and adaptability of ceramic substrate defect detection are improved.

A ceramic circuit board includes a ceramic substrate and a metal plate bonded together via a bonding layer, wherein when the ceramic circuit board is observed through a cross-section defined by a thickness direction and lateral direction of the ceramic circuit board: a side surface of the metal plate has an inclined shape; and the bonding layer has a bonding-layer protruding portion which protrudes by 20 μm or more and 150 μm or less from an edge where the bonding layer is in contact with the side surface of the metal plate. The shape and Vickers hardness of the side surface of the metal plate are controlled. The ceramic substrate is preferably a silicon nitride substrate.

The application discloses a kind of AOI detection equipment for copper-clad ceramic substrate detection, belong to AOI detection equipment technical field, it includes basic pedestal, detection chamber is provided on the basic pedestal, the outer side of the basic pedestal is provided with multiple cover plates, and the cover plate is all opened with heat dissipation port.Through the setting of flap mechanism, linkage box is linked, after suction cup adsorbs copper-clad ceramic substrate, it can automatically lift copper-clad ceramic substrate and make it be in vertical state, so when optical detection is carried out to copper-clad ceramic substrate, realize double-sided synchronous detection, to improve its detection efficiency, in optical detection system, it is equipped with light supplement mechanism, by setting sunflower lamp group, realize multispectral illumination, sunflower lamp group integrates RGBW four color LED and ultraviolet, infrared special light source, realize multi-angle dynamic illumination under high-speed rotating state, when sunflower lamp group moves at high speed, multi-color light source cooperates with multi-angle illumination, compared with traditional white light, ultraviolet crack, infrared copper thickness can be more easily identified.

The invention discloses a SiC power module sintering packaging method, and relates to the technical field of power module packaging, and the method comprises the steps: sequentially carrying out the ultrasonic cleaning, plasma activation and drying of a SiC chip and a ceramic substrate, and obtaining an activated ceramic substrate and a SiC chip; the surfaces of the activated ceramic substrate and the SiC chip are spin-coated with nano-silver paste, and a nano-porous silver layer is formed through pre-curing and low-temperature sintering; aligning the graphene / nano-porous silver composite layer chip with the ceramic substrate, performing segmented pressure sintering in a vacuum sintering furnace, and outputting a SiC power module; the SiC power module is subjected to epoxy resin packaging glue coating, ultraviolet light curing and annealing treatment, internal stress is eliminated, and the corrosion resistance is enhanced; and screening a SiC power module, performing XRD and SEM detection, coating a high-temperature-resistant silica gel sealing layer, performing curing, and outputting a finished product. Through the epoxy resin packaging adhesive coating and thermal-acoustic combined annealing technology, the residual stress of the packaging interface is released, the service life of the SiC power module is prolonged, and the adaptability of the SiC power module is improved.

The utility model discloses ceramic substrate automatic optical detection equipment and a blanking module thereof, the blanking module comprises a plurality of blanking bins and a blanking device, the plurality of blanking bins are linearly arranged and are used for storing detected ceramic substrates classified according to detection results; the discharging device comprises a vacuum belt conveying assembly, the vacuum belt conveying assembly is arranged above the multiple discharging bins, and the vacuum belt conveying assembly is used for receiving the detected ceramic substrates from a conveying belt and putting the detected ceramic substrates into the corresponding discharging bins according to external control signals. Through cooperation of the linearly-arranged discharging bins and the vacuum belt conveying assembly, the discharging process with the compact structure, the simplified conveying path and the stable carrying can be achieved, the detected ceramic substrates can be preliminarily classified efficiently and softly, and follow-up quality management is facilitated.

The invention discloses a dry pattern transfer method for an AMB copper-clad ceramic substrate in the technical field of ceramic substrate sintering, and the method comprises the following steps: S1, manufacturing a positioning hole, and forming a process reference; s2, prefabricating a circuit pattern through a stamping process; s3, brazing material layers are printed on the two faces of the ceramic substrate; S4, the copper layer pattern and the ceramic substrate are assembled in an aligned mode; s5, carrying out high-temperature sintering on the copper layer and the ceramic substrate, and carrying out metallurgical bonding; and S6, the sintered substrate is subjected to cleaning, surface treatment and laser precision cutting. According to the method, laser positioning and micron-sized reaming are adopted, an accurate alignment reference is established, mechanical assembly errors are fundamentally eliminated, a copper circuit directly forms a preset pattern on a substrate through cooperation of a copper block pre-forming structure and an accurate brazing process, the lateral corrosion problem of a traditional etching process is avoided, and the production efficiency is improved. The size error of the product graph is reduced, and the product graph accuracy and the machine graph size consistency are improved.

The invention relates to a water jet-laser / mechanical energy field cooperative precision machining method for a ceramic base material, and belongs to the field of laser-mechanical cooperative machining. During the execution period, the method comprises the following steps in sequence: firstly, carrying out rapid and low-damage precise material reduction on the ceramic matrix composite material through water jet assisted laser; and then, a superhard forming grinding wheel on the same machine tool is matched with mixed grinding fluid to conduct in-situ finishing and polishing on the surface obtained after material reduction. Wherein the surface quality can be improved while high-efficiency machining is ensured through the synergistic combination of laser and machinery. Through the in-situ grinding and polishing effect of the grinding wheel and the mixed grinding fluid, the precision of a formed surface is higher, and a damaged layer is thinner and even completely removed. Based on a water jet assisted laser milling / mechanical grinding and polishing collaborative machining strategy, rough machining, finish machining and fine polishing of the ceramic matrix composite can be completed on the same equipment, and the method has the characteristics of being high in precision, high in efficiency, high in quality and extremely low in surface damage.

The invention discloses a carbon-ceramic brake disc of a gradient composite structure, the carbon-ceramic brake disc is composed of a porous carbon-ceramic matrix and a gradient composite coating arranged on the surface of the porous carbon-ceramic matrix, the gradient composite coating is composed of a transition layer and a surface layer, the transition layer is a gradient Cf / SiC layer, and the surface layer is a gradient Cf / SiC layer. The carbon-ceramic brake disc comprises a carbon-ceramic base body, a transition layer and a surface layer, the transition layer is arranged on the surface of the carbon-ceramic base body, the volume fraction of carbon fibers in the transition layer is progressively decreased in a gradient mode from inside to outside, the volume fraction of SiC is progressively increased in a gradient mode from inside to outside, and the surface layer is a SiC / ZrB2 composite layer. The gradient composite coating is arranged on the surface of the carbon-ceramic base body, and the volume fraction of the carbon fibers in the inner layer is progressively decreased in a gradient mode from inside to outside; therefore, the difference of interlayer thermal expansion coefficients is greatly reduced, the cracking risk of the surface layer and the matrix is reduced, the surface layer has ultrahigh-temperature protection capability, the interface thermal stress of the carbon-ceramic brake disc provided by the invention is reduced by 62%, and the ultrahigh-temperature service life is prolonged by more than 3 times.

The application belongs to the technical field of functional coating materials, and particularly relates to a kind of super-hydrophobic solution based on fumed silica and its preparation method and application, comprising: step one, 20-200nm fumed silica nanoparticles are dispersed in ethanol / water mixed system, and sodium dodecyl benzene sulfonate is added to prevent agglomeration;Step two, under the catalysis of ammonia, tetraethyl orthosilicate and 1H, 1H, 2H, 2H-perfluorodecyltriethoxysilane are added dropwise in sequence for fluorination modification;Step three, fluorinated silica nanoparticle suspension is prepared by ultrasonic-assisted reaction;Step four, the solution is sprayed onto the surface of ceramic substrate with micro-nano structure to form a coating;Step five, strong adhesion without adhesive is realized by mechanical anchoring effect.The application realizes super-hydrophobic performance of 153±0.5° high water contact angle and physical adhesion stability under 100-200g load by the synergistic effect of nanoparticle size effect and substrate surface topological structure, low surface energy of fluorinated alkyl chain and Cassie-Baxter air cushion layer effect, and is especially suitable for self-cleaning surface, anti-icing coating and marine corrosion prevention field.

The invention provides a capacitive pressure sensor core, a preparation method thereof and a capacitive pressure sensor. Specifically, the capacitive pressure sensor core comprises a deformable diaphragm, a ceramic substrate and a capacitive performance transducer. The capacitive performance transducer comprises a first electrode comprising a first measuring electrode part and a first capacitive shielding electrode part, a second electrode comprising a second measuring electrode part and a second capacitive shielding electrode part, and a gap separator, wherein the first measuring electrode part comprises a first measuring electrode central part, the second measuring electrode part comprises a second measuring electrode central part, and the area of the first measuring electrode central part is smaller than that of the second measuring electrode central part; wherein the first measuring electrode part, the first capacitance shielding electrode part, the second measuring electrode part and the second capacitance shielding electrode part are formed by reducing and sintering organic metal conductor paste.

The invention provides a high-reliability silver-free AMB ceramic substrate and a preparation method thereof, and the preparation method comprises the following steps: (1) arranging silver-free active metal modified layers on the upper and lower surfaces of a ceramic substrate, and obtaining the ceramic substrate with the silver-free active metal modified layers; and (2) assembling the ceramic substrate with the silver-free active metal modified layer and two copper sheets into a sandwich structure, and performing brazing welding to obtain the high-reliability silver-free AMB ceramic substrate. High-temperature welding is carried out after the silver-free active metal modified layer is arranged, effective bonding between copper and ceramic is achieved, a good metallurgical bonding interface is formed, the high-reliability silver-free AMB ceramic substrate is obtained, the preparation cost is low, and the high-reliability silver-free AMB ceramic substrate is suitable for large-range application and popularization.