305results about How to "Improved thermal management" patented technology

A monolithic, multi-bandgap, tandem solar photovoltaic converter has at least one, and preferably at least two, subcells grown lattice-matched on a substrate with a bandgap in medium to high energy portions of the solar spectrum and at least one subcell grown lattice-mismatched to the substrate with a bandgap in the low energy portion of the solar spectrum, for example, about 1 eV.

A semiconductor structure and method of manufacturing that has integrally-formed enhanced thermal management. During operation of a semiconductor device, electron flow between the source and the drain creates localized heat generation. A containment gap is formed by selectively removing a portion of the back side of the semiconductor device substrate directly adjacent to a localized heat generation area. A thermal management material is filled in the containment gap. This thermal management material enhances the thermal management of the semiconductor device by thermally coupling the localized heat generation area to a heat sink. The thermal management material may be a Phase Change Material (PCM) having a heat of fusion effective for absorbing heat generated in the localized heat generation area by the operation of the semiconductor device for reducing a peak operating temperature of the semiconductor device.

The present invention is directed toward devices comprising carbon nanotubes that are capable of detecting displacement, impact, stress, and / or strain in materials, methods of making such devices, methods for sensing / detecting / monitoring displacement, impact, stress, and / or strain via carbon nanotubes, and various applications for such methods and devices. The devices and methods of the present invention all rely on mechanically-induced electronic perturbations within the carbon nanotubes to detect and quantify such stress / strain. Such detection and quantification can rely on techniques which include, but are not limited to, electrical conductivity / conductance and / or resistivity / resistance detection / measurements, thermal conductivity detection / measurements, electroluminescence detection / measurements, photoluminescence detection / measurements, and combinations thereof. All such techniques rely on an understanding of how such properties change in response to mechanical stress and / or strain.

The invention relates to an electric-heat-aging junction temperature calculation model establishing method of an IGBT module. The method is technologically characterized by comprising the following steps of testing electric heating parameters of the IGBT module in different aging degrees, acquiring a three-dimensional relation curved surface and establishing an electric heating data sheet in different aging degrees; establishing an electric model of the IGBT module and a thermal network model of the IGBT module, inputting a power loss which is calculated through the electric model of the IGBT module into the thermal network model of the IGBT module in a current source manner, performing real-time feedback of the junction temperature which is calculated by the thermal network model to the electric model, and finishing establishment of an electric-heat coupling model of the IGBT module; performing aging state evaluation on the IGBT module; and performing junction temperature calculation on the IGBT module. According to the electric-heat-aging junction temperature calculation model establishing method, the corresponding electric heating parameters for different aging processes are acquired and furthermore the electric heating parameters are input into the electric-heat coupling model for performing junction temperature calculation, namely the parameter of the electric-heat coupling model is dynamically changed in real time according to the aging degree of the model, thereby realizing a junction temperature prediction function for the module aging degree.

An electronics equipment heat exchanger system for thermally managing the electronic devices of a computer server and the exhaust air emitted from the computer server. The electronics equipment heat exchanger system generally includes a heat exchanger attached near an air outlet of a support unit for a support rack, a thermal management unit fluidly connected to the heat exchanger, and a thermal conditioning unit fluidly connected to the thermal management unit and the heat exchanger. The thermal management unit directly thermally manages one or more electronic devices of the server mainboard while the heat exchanger thermally manages the exhaust air before the exhaust air exits through the outlet of the support unit of the computer server.

The present invention relates to fuel cells and components used within a fuel cell. Heat transfer appendages are described that improve fuel cell thermal management. Each heat transfer appendage is arranged on an external portion of a bi-polar plate and permits conductive heat transfer between inner portions of the bi-polar plate and outer portions of the bi-polar plate proximate to the appendage. The heat transfer appendage may be used for heating or cooling inner portions of a fuel cell stack. Improved thermal management provided by cooling the heat transfer appendages also permits new channel field designs that distribute the reactant gases to a membrane electrode assembly. Flow buffers are described that improve delivery of reactant gases and removal of reaction products. Single plate bi-polar plates may also include staggered channel designs that reduce the thickness of the single plate.

A thermal management for EMI shielded circuit packs having one or more high-power components, i.e. heat sources. More particularly, a heat transfer device or assembly for EMI shielded circuit packs is provided whereby multiple components (e.g., high-power components) are cooled by individual heat sinks (i.e., each component has its own individual heat sink) which protrude into an external airflow through individual openings in the lid of the EMI shield. Mechanically-compliant, electrically-conductive gaskets are used to seal the base plates of the individual heat sinks against the lid of the EMI shield enclosure. As such, in accordance with the various embodiments, the conductive gaskets establish a compliance layer which accommodates any variation in the heights of the individual components, thereby, allowing optimum thermal contact between the components and their respective heat sinks without compromising the EMI shielding.

The invention provides a battery management main system suitable for a new energy automobile and a control method. The battery management main system includes an MCU module, a battery management module, a current detection module, a liquid crystal display module, a whole set of voltage and insulating performance measurement module, a heat management module, a clock module and a memory module; the MCU module reads current data of the current detection module, total voltage and insulation resistance data measured by the whole set of voltage and insulating performance measurement module and terminal voltage of a single battery and temperature data which are sent by an acquisition module through CAN channels, and estimates internal states SOC and SOE of a battery pack, the heat management module is driven to perform heat management on the battery pack, battery state information and alarm information are sent to the liquid crystal display module, and corresponding diagnostic information is stored in the memory module. The beneficial effects of the battery management main system are that the system can realize utilization and protection an automobile battery to the greatest extent, improve efficiency of energy utilization, saves energy and reduces emissions, and guarantees safety of use.

The present invention is directed to a method for optimizing thermal management for a storage controller cache of a data storage system. The method allows for pending writes of a storage controller to be selectively provided to solid-state device (SSD) module(s) of the controller in a manner which allows operating temperatures of the SSD module(s) to be maintained within a thermal envelope.

The semiconductor portion of a circuit includes a plurality of flip chip devices which are arranged in a planar fashion in a common housing. The plurality of flip chip devices are connected to each other without wire bonding. The common housing includes a packaging structure, the packaging structure including a connective portion and at least one web portion, which aids in the thermal management of the heat emitted by the plurality of flip chip devices and which connects the flip chip devices to each other. Passive devices in the circuit may also be arranged in a planar fashion in the common housing.

The subject invention relates to beam control prisms and the use of a beam control prism to modify the beam properties of light emitted from an edge emitting diode laser. The subject invention can utilize a beam control prism placed next to a diode laser bar. The subject beam control prism can have, for example, a curved surface and / or a high reflective coated surface for a diode laser wavelength. The curved surface can collimate the fast axis divergence and the mirror surface can change the beam direction. The subject curved surface beam control prisms can incorporate one or more features, such as parabolic reflecting surface, elliptical exit surface with flat reflecting surface, and a hyperbolic entrance surface with flat reflecting surface.

The thermal management multi-layer film / sheet and hollow articles for the use with secondary battery, supercapacitor and battery pack as thermal management casings or sleeves achieve effective control of the temperature of the operating batteries / supercapacitors. The thermal management multi-layer film / sheet and hollow article structure comprises a laminate of a plurality of alternative metal, plastic, and adhesive layers. And the plastic and adhesive layers comprise of parent phase resin, heat conductive particles, and microencapsule-phase-change-material (MCPCM). The heat conductive particles enhances the thermal conductivity, the MCPCMs absorb heat while the batteries / supercapacitors are in discharging mode.

The invention provides a large-mode-area active optical fiber, which comprises a fiber core, a first cladding, a second cladding and a third cladding, wherein the first cladding, the second cladding and the third cladding sequentially encircle the periphery of the fiber core; the effective refractive index of the second cladding is lower than the effective refractive indexes of the first claddingand the fiber core; a pump core area encircles the outer side of the third cladding; an external cladding encircles the outer side of the pump core area and comprises a layer of air vent holes or capillary bars doped with quartz glass; and the effective refractive index of the external cladding is lower than that of the pump core area. On the premise of ensuring a large mode area of the active optical fiber, the optical fiber suppresses amplified spontaneous radiation, improves the stability of the optical fiber, and ensures the quality of light beam. The invention also provides a preparationmethod of the active optical fiber. By adopting a liquid phase multi-point doping mode of gas-phase aluminum doping and rare-earth ions, continuous doping for many times can be flexibly controlled and realized, the size of a rare-earth doped core bar is greatly increased, and uniform doping of the rare-earth ions and aluminum is simultaneously realized.

A thermal management for EMI shielded circuit packs having one or more high-power components, i.e. heat sources. More particularly, a heat transfer device or assembly for EMI shielded circuit packs is provided whereby multiple components (e.g., high-power components) are cooled by individual heat sinks (i.e., each component has its own individual heat sink) which protrude into an external airflow through individual openings in the lid of the EMI shield. Mechanically-compliant, electrically-conductive gaskets are used to seal the base plates of the individual heat sinks against the lid of the EMI shield enclosure. As such, in accordance with the various embodiments, the conductive gaskets establish a compliance layer which accommodates any variation in the heights of the individual components, thereby, allowing optimum thermal contact between the components and their respective heat sinks without compromising the EMI shielding.

An MOCVD process provides aligned p- and n- type nanowire arrays which are then filled with p- and n-type thermoelectric films to form the respective p-leg and n-leg of a thermoelectric device. The thermoelectric nanowire synthesis process is integrated with a photolithographic microfabrication process. The locations of the p- and n-type nanowire micro arrays are defined by photolithography. Metal contact pads at the bottom and top of these nanowire arrays which link the p- and n-type nanowires in series are defined and aligned by photolithography.

Disclosed is a modular light emitting diode (LED) light pod having heat dissipation structures. A reflective optic plate, which may be made in various modular sizes and designs, having a plurality of recesses is seated on an LED board having a plurality of LEDs, such that the plurality of LEDs fit within the plurality optical recesses. The optical recesses serve to collimate light in a desirable manner based on predetermined dimensional ratios of the optical recesses. A heat dissipation system involves a heat sink housing acting in combination with a heat extraction plate having a plurality thermally conductive posts extending perpendicularly from a top and bottom surface, and a heat dissipation plate to create a thermally conductive path for moving heat away from the LED board when the light pod is in use.

The invention provides a power semiconductor module adopting double-sided cooling. The power semiconductor module is characterized in that the power semiconductor module (100) contains at least two power semiconductor chips (107, 106) which are arranged between a first substrate (115) and a second substrate (103); each substrate is formed by an intermediate high heat conductivity electric insulation layer and upper and lower metal layers; the metal layers contain circuit structures which realize interconnection between the power semiconductor chips, a positive terminal, a negative terminal, an alternating current output terminal and grid control terminals through welding; the grid control terminals of the power semiconductor chips are arranged in the centers or corners of the chips; a concave cooling plate is reversely installed on an insulation layer (117) or a first metal layer (215a) on the first substrate (115) and the other flat cooling plate is horizontally arranged below the second substrate (103); and the heat of the power semiconductor chips is conducted to the two cooling plates to be dissipated via the first substrate (115) and the second substrate (103), thus realizing double-sided cooling.

The invention provides a modularized box type charging and battery swapping station used for replacing a battery of an electric car. The charging and battery swapping station comprises a central monitoring room 1, a battery swapping robot 2 and a charging and battery swapping box 3, wherein the central monitoring room 1 is used for monitoring the charging and battery swapping station, the battery swapping robot 2 is located between the charging and battery swapping circuit 3 and the electric cars provided with batteries to be replaced, and the battery between the electric cars provided with batteries to be replaced can be replaced; and a battery storage rack 301, a battery charger cabinet 302, a monitoring cabinet 303, a distribution cabinet 304, a temperature control system 305 and an access path 306 are arranged in the charging and battery swapping box 3. The modularized box type charging and battery swapping station, provided by the invention, has the advantages of strong adaptability, flexible configuration and expansibility, small floor space, high working efficiency, short construction period, benefit for large-scale popularization and construction, high automation degree, smaller device maintenance amount, simple structure and low fault rate.

A multi-cell monoblock battery in which a plurality of electrochemical cells are disposed in a battery case. The battery case includes one or more cell partitions which divide the interior of the case into a plurality of cell compartments that house the electrochemical cells. Preferably, one or more coolant channels are integrally formed with at least one of the cell partitions. The coolant channels may have inlets and outlets disposed in the walls of the battery case so as to provide a cross-flow cooling design.

A thermal management matrix for an electrochemical cell array including a plurality of electrochemical cell elements, the thermal management matrix at least in part enveloping the electrochemical cell array and being in thermal contact therewith. The thermal management matrix includes mainly expanded graphite, wherein the expanded graphite is arranged in the form of a block-like structure and the block includes at least one layer of expanded graphite having a higher in-plane thermal conductivity than the layers neighboring the layer with higher in-plane thermal conductivity. The thermal management matrix may also include phase change materials as a latent heat storage material.

The invention relates to a gas diffusion layer of a proton exchange membrane fuel cell. The gas diffusion layer comprises a hydrophobic medium in a gradient distribution in the direction of a flow channel in a plane, and the uniformity of water distribution in the gas diffusion layer during the reaction of a cell is ensured. The fiber arrangement in a direction perpendicular to the flow channel direction in the plane can improve the thermal conductivity ability between the gas diffusion layer and an electrode plate. The porosities in plane penetrating direction are in a gradient arrangement, and the transfer of cell reaction water from a lower surface to an upper surface of the gas diffusion layer is facilitated. The designs of electrode plate ridge lower and flow channel lower gas diffusion layer structures are different, the ridge lower gas diffusion layer structure is concave, the too small porosity in the gas diffusion layer caused by excessive compression is prevented, and the water accumulation in a ridge lower gas diffusion layer is reduced. Compared with the prior art, the consistency of water and heat in the gas diffusion layer can be effectively ensured, the water drainage and heat dissipation capacity of the fuel cell are enhanced, the mass transfer of reaction gas in the cell is increased, and the reaction efficiency of the cell is improved.