The method for forming an
electrode according to an exemplary embodiment includes a shielding
pattern formation process, a loading process, and a conductive layer formation process. In the shielding
pattern formation process, a shielding pattern is formed on a surface of a substrate using a shielding material to
expose a localized area of that surface. The shielding material is a
polymer comprising ends having at least one bond structure having covalent and double bonds. In the loading process, the substrate on which the shielding pattern is formed is loaded into a chamber. In the conductive layer formation process, a
copper-containing
source material and a
reactive material reacting with the
source material are alternately sprayed into the chamber using
atomic layer deposition to form a
copper-containing conductive layer on the exposed surface of the substrate. Therefore, according to the method for forming an
electrode according to the exemplary embodiment, a thin film made of the material used to form the
electrode is not formed on the surface of the shielding pattern. No residue is left when the shielding pattern is removed, preventing defects caused by residue.