This invention belongs to the field of thermal
conductive materials technology, specifically relating to a thermally conductive
composite material, its preparation method, and its application. The thermally conductive
composite material provided by this invention includes an
organosilicon thermally conductive sheet and an
alloy layer stacked sequentially. An
alloy with a specific
melting point is loaded into the thermally conductive sheet as the bottom layer. In
actual use, the
alloy layer, serving as the bottom layer, is in
close contact with the heat-generating device. When the device heats up, causing the
system temperature to rise and reach the alloy's
melting point, the alloy melts from a
solid to a liquid, rapidly filling the tiny gaps between the
thermally conductive pad and the device. This effectively reduces
interfacial thermal resistance, improves the
heat flux density at the contact surface between the
thermally conductive pad and the heat-generating device, and promotes rapid
heat transfer. Simultaneously, it significantly improves the
thermal conductivity, meeting the high-efficiency heat dissipation requirements of high-performance
electronic equipment under extreme operating conditions, effectively ensuring the long-term stable operation of the equipment. This invention achieves a leap in the overall performance of thermally conductive pads, not only exhibiting excellent
thermal conductivity but also high reliability and a wide range of applications.