The invention provides an electrical contact based on powdered copper and a preparation process thereof. The electrical contact based on the powdered copper is prepared from the following materials in percentage by weight: 0.3 to 7 percent of nickel, 0.1 to 6 percent of boron, 0.1 to 8 percent of tungsten, 0.2 to 10 percent of graphite, 1 to 7 percent of titanium, 0.1 to 6 percent of molybdenum, 0.1 to 8 percent of diamond, 0.2 to 7 percent of lanthanum, 0.5 to 9 percent of aluminum, 0.5 to 8 percent of niobium, 0.1 to 5 percent of silicon, 0.1 to 6 percent of yttrium, 0.1 to 6 percent of chromium, 0.1 to 5 percent of cerium, and the balance of copper powder. The preparation process comprises the steps of mixing, cold pressing and sintering. In the preparation process, a general silver alloy contact is replaced by copper, so that the cost of silver alloy contacts of electric switches is reduced. The electrical contact based on the powered copper has high electrical performance and mechanical properties, and is a cheap substitute product of silver alloy materials of electrical contacts of low-voltage electric switches.