The invention relates to a temperature-control
assembly (1) for a microelectric
system and to a microelectric
system having such a temperature-control
assembly (1). The temperature-control
assembly (1) comprises a closed channel
system (3) which comprises at least one channel (4) for guiding an electrically and thermally conductive medium (5) and is thermally coupled to at least one microelectric system object of which the temperature is to be controlled. The assembly also comprises a magnetohydrodynamic pump (7) which has a plurality of magnetohydrodynamic modules (10), each module having an
electrode device with two electrodes and a
magnet device that generates a
magnetic field. At least two magnetohydrodynamic modules (10) are designed as pump modules (10A, 10B) and are electrically connected in series. In each of the pump modules (10A, 10B) a first
electrode of the
electrode device introduces an
electric current flow having a predefined
current density into the electrically and thermally conductive medium (5) at at least one channel portion, and a second electrode of the electrode device conducts the
electric current flow out of the electrically and thermally conductive medium (5) at the at least one channel portion. This causes the electrically and thermally conductive medium (5) guided in the closed channel system (3) to interact with the introduced
electric current flow and with the generated
magnetic field in such a way that a
Lorentz force is generated which specifically accelerates the electrically and thermally conductive medium (5) in the at least one channel portion, resulting in a pressure build-up that causes a desired volume flow of the electrically and thermally conductive medium (5) through the at least one channel (4) of the closed channel system (3). The volume flow of the electrically and thermally conductive medium (5) controls the temperature of the at least one object of which the temperature is to be controlled. The electrically and thermally conductive medium (5) transfers heat to the at least one object of which the temperature is to be controlled during a heating process or absorbs heat from the at least one object (9) of which the temperature is to be controlled during a cooling process.