17results about How to "Eliminate warping" patented technology

The invention provides a method for controlling curing deformation of a composite stiffened wallboard. The method comprises the steps that a metal plate is arranged on the side face, away from a stringer, of the wallboard; composite material plates are laid on the side face, away from the stringers, of the metal plate to form the composite material structural part, the number of the composite material plates corresponds to the number of the stringers, the composite material plates directly face the attaching faces of the stringers and the wall plates one to one, materials and laying layers of the composite material plates are the same as those of the wall plates, and the laying layers of the composite material plates are symmetrical to the total laying layer of the stringers and the wall plates. The thickness of the composite plate is equal to the total thickness of the composite at the binding surface of the stringer and the wall plate, the heading width of the composite plate is consistent with the heading width of the binding surface, and the circumferential width of the composite plate is consistent with the circumferential width of the binding surface; and after the composite material structural parts are solidified together, the metal plate and the composite material plate are removed in a machining mode, and the complete composite material stiffened wall plate is obtained. The purpose of controlling solidification deformation of the composite material is achieved, and the manufacturing cost is saved.

The application provides a battery pack and an electric device. The battery pack comprises a battery module, an end plate, a binding belt and a heater. The battery module comprises a plurality of battery cells stacked along a first direction, so that the battery module comprises two end faces arranged opposite along the first direction and two side faces arranged opposite along a second direction. A plurality of battery modules are stacked along the second direction. The binding belt is wound on the plurality of battery modules, so that the binding belt compresses the plurality of battery modules along the first direction and the second direction. The heater is attached to the side face of the battery module. The heater comprises two contact faces arranged opposite along the second direction. Only one heater is arranged between two adjacent battery modules, so that one of the contact faces is attached to the side face of one of the battery modules, and the other contact face is attached to the side face of the other battery module. Two end plates are arranged at the two ends of the plurality of battery modules along the first direction, so that the warping phenomenon of the end plates is eliminated, the binding effect of the binding belt is improved, and the production efficiency of the battery pack is improved.

The application discloses a kind of with gradient buffer structure and surface microtexture enjoy floor and its preparation method.The floor includes surface microtexture layer, gradient solidification UV coating, gradient buffer structure, substrate layer and fast lock buckle system.Surface microtexture layer has double texture of pit array and microprojection array, realize wet / dry state antiskid, easy cleaning and scratch resistance.Gradient buffer structure is made of surface layer microresponse layer, core energy absorption layer and bottom stress dispersion layer, realize nonlinear impact response, give consideration to walking stability and fall protection.Through finite element simulation to buffer layer predeformation compensation, eliminate warping;Pit edge stress concentration activates buffer layer, shortens impact response time 15%-25%.The application first realizes the integration of old and pet friendly function, is applicable to home old and pet family, with excellent buffering, antiskid, durable, easy maintenance performance.

The utility model relates to positioning frock technical field, and disclose a kind of positioning frock for SMT tray patch component welding, including workbench, the workbench includes table body, the top of table body is evenly welded with locating block, the below of table body is evenly welded with support rod, the surface of table body is evenly provided with recess. The utility model places PCB board body in the inside of limiting groove, makes locating pin and locating hole to its simple positioning, then starts vacuum pump, is adsorbed to PCB board body by negative pressure, makes PCB board body and the bottom of limiting groove be in conformity with, compared with traditional positioning frock for SMT tray patch component welding, this SMT tray patch component welding positioning frock is positioned by vacuum adsorption, to effectively eliminate the warping caused by locating pin error, reduce the influence brought by error, make PCB board body and the surface of SMT tray body be flush, facilitate subsequent welding operation.

The utility model relates to the technical field of carton processing, and provides a paperboard flattening device for carton processing, which comprises a base, a conveying structure is arranged on one side of the top of the base, limiting plates are fixed on two sides of the top end of the base, and a heightening plate is fixed on one side, far away from the conveying structure, of the top end of the base. A support is fixed to the top end of the base on the outer side of the heightening plate, and a flattening structure is fixed to the inner wall of the top of the support. The flattening structure is arranged, the electric push rod provides controllable downward pressure, the heating box is combined to soften paperboard fibers and eliminate warpage, the electric heating wires are distributed in an S shape, heat can be evenly distributed, damage to paperboards due to local overheating is avoided, the guide rod ensures vertical movement of the flattening structure, and the paperboards are prevented from being crushed due to bias pressure. According to the paperboard flattening device for carton processing, the function that the paperboard can be conveniently and stably pressed down is achieved, and the working efficiency of the paperboard flattening device for carton processing in the using process is improved.

The invention relates to a shading adhesive tape attaching device, and aims to solve the problems of bubbles, wrinkles, uneven attaching and the like in the traditional attaching process. The device mainly comprises a transmission part, an air knife mechanism and an adsorption head module, the transmission part adopts the combined design of a tray and a conveying belt, stable and accurate transmission of products among different processing stations is ensured, the air knife mechanism is provided with a linear air outlet, and the shortest distance between the position of the air outlet and the surface of the product is accurately controlled to be equal. Uniformly distributed linear smoothing airflow is formed, and bubbles and wrinkles in the adhesive tape attaching process are effectively eliminated. Meanwhile, the working parameters of the air knife mechanism, such as air speed and air pressure, can be adjusted so as to meet the attaching requirements of products with different materials and shapes. According to the device, through modular design, flexible configuration and adjustment among the modules are achieved, and the adaptability and universality of a production line are improved. On the whole, the device improves the attaching quality and the production efficiency of the shading adhesive tape, and reduces the production cost and the labor intensity of workers.

The utility model provides a kind of battery shell and battery, wherein, battery shell includes shell body, the explosion vent hole being opened in shell body, and the explosion vent hole is sealed with the explosion vent hole cooperation and explosion vent piece, explosion vent piece is fixed in shell body by the welding layer formed by welding track, welding layer includes first track and second track, wherein first track is long side section, starting weld point is set on first track, can provide linear heat transfer path to avoid heat accumulation, heat two-way symmetrical diffusion can also significantly reduce thermal stress gradient, and provide enough power buffer space, starting weld point is also away from geometric mutation area to reduce stress concentration coefficient, by reconstructing starting weld point position, avoid the risk that explosion vent piece welding appears warping, welds and leaks, solve the structural failure problem of thin-walled shell explosion valve, synergistically realize power battery energy density promotion and safety performance promotion.

This invention relates to the field of home textile technology and provides a processing method for fiber-paper blended cooling mats, including biomimetic mineralization treatment of paper yarn, multi-level gradient blending, and in-situ hot-pressing composite. An infrared heating module with a wavelength of 2.5 μm is integrated into the reed seat of a rapier loom. During the weaving process, polycaprolactone microparticles with a particle size of 20 μm are sprayed onto the weft yarns. These microparticles are irradiated with infrared light at 120-130°C, causing them to melt and penetrate to the warp and weft yarn intersections. A three-layer integrated molding is achieved through dual-temperature zone pressure rollers. Simultaneously, polycaprolactone microparticles are sprayed onto the weft yarns, and infrared irradiation melts and penetrates them to the yarn intersections, forming "micro-welded nodes," which are discontinuous adhesive layers. Compared to traditional adhesive dots, this method reduces the coverage area and improves moisture permeability. It solves the problems of easy delamination and adhesive barrier to air permeability in traditional lamination processes. The fiber-paper blended cooling mat produced by the above method includes polycaprolactone-reinforced nodes at the weft yarn intersections.

Provided are a viewing angle control body and a method for manufacturing the same, which are capable of eliminating the risk of warping or deformation even if the viewing angle control body is thicker in order to reduce the viewing range or, for example, the setting environment of an image display device is at a high temperature, and a method for manufacturing the viewing angle control body. A sheet-shaped viewing angle control body (1) is provided with: a shutter layer (2) in which a plurality of light-transmitting tapes (3) and light-shielding tapes (4) are alternately arranged side by side; a pair of adhesive layers (5) that are respectively laminated on both surfaces of the shutter layer (2); and a pair of light-transmitting polycarbonate resin films (6) that are respectively laminated and adhered to the pair of adhesive layers (5). In order to control the viewing angle of an entertainment monitor mounted on the passenger seat side of the dashboard of an automobile, light-transmitting tapes (3) of a shutter layer (2) are formed from light-transmitting silicone rubber, light-shielding tapes (4) of the shutter layer (2) are formed from colored silicone rubber, and the light-shielding tape width of the light-shielding tapes (4) is 10-20 [mu] m (inclusive). The shutter layer 2 is made of silicone rubber, so that the risk of warpage or deformation caused by heat can be eliminated.

A kind of quick fixture for welding, including base plate, the base plate is provided with placing rack, for placing cross workpiece body, the front end of the placing rack is provided with baffle, the inside of the placing rack is provided with limiting slot with spring, the limiting slot is provided with clamping plate, the front and rear sides of the placing rack are provided with sliding slot, the sliding slot is provided with support frame, support frame is provided with chuck, for the center part of cross workpiece body is clamped, the base plate is provided with block, for the cross extension of cross workpiece body is supported, the block is provided with rotary down pressure cylinder, the rotary down pressure cylinder has chuck, for the cross extension of cross workpiece body is clamped;Through the coordinated action of linear cylinder, rotary cylinder and rotary down pressure cylinder, replace the mode of traditional artificial quick clamping one by one operation, greatly reduce the complexity of operation, in large quantities, improve work efficiency.

The present invention discloses a chip preparation method, which relates to the semiconductor field. The chip preparation method comprises: obtaining a flatness map of a wafer; forming a composite material layer on the back of the wafer; and imprinting a side of the composite material layer away from the wafer according to the flatness map to eliminate the stress of the wafer. The chip preparation method provided by the present invention can completely eliminate the stress of the wafer and improve the chip quality and yield rate.

The present invention consists of a frame for turn & tilt or projecting doors or windows, which achieves a minimalist exterior appearance with a central profile of 18mm, wherein the offset of the alignment of the external glass with the internal glass is now used, creating a common central outer profile of 18mm, and wherein the thermal and acoustic performance and the resistance to water, air and wind permeability are further improved. The frame, object of the present invention, is preferably made of aluminum with thermal break for the manufacture of doors and / or windows, it is applied in a door or window opening of a building and it consists essentially of at least one fixed rim (3) and at least one movable leaf (1) and at least one fixed leaf (4), wherein at least one movable leaf is glued to the glass (2) in all its perimeter.

The utility model discloses a kind of soft label printed matter high-speed product inspection device, it belongs to product inspection equipment technical field, including detection box and detection mechanism, the detection mechanism is fixedly connected on the middle end of detection box upper surface, the upper end of the detection box inner wall is fixedly connected with detection camera, the detection camera is connected with detection mechanism, the front of detection box is fixedly connected with feed frame, the upper end in the inside of feed frame is rotatably connected with driving roller by bearing, the lower end in the inside of feed frame is rotatably connected with driven roller.The utility model is through setting power component, initial deformation produced by printing due to curling, folding or storage is quickly eliminated, reduce the misjudgment risk caused by uneven surface, by setting adsorption component, eliminate small fluctuation or edge lifting in high-speed motion, ensure that printing is in detection box whole course adhering transmission surface, improve image acquisition definition, ensure the reliability of defect identification.

An edge banding machine and method for obliquely pressing and bonding the side of a disc-shaped sheet material, relating to the field of edge banding machine technology, includes a main frame; the main frame is equipped with a rotating support arm mechanism and an edge banding mechanism; it also includes an edge banding strip stretching mechanism and an oblique pressing mechanism, the edge banding mechanism further including a feeding pressure roller disposed above the disc-shaped sheet material. By pre-stretching the edge banding strip and setting the oblique pressing mechanism, precise pressing and bonding of the annular oblique side of the disc-shaped sheet material is achieved, thereby solving the problem of poor bonding. This effectively solves the problem of poor edge banding bonding of the annular oblique side of the disc-shaped sheet material, improving edge banding quality and product durability.

The invention discloses a method for generating a groove pattern on a wafer, and the method comprises the steps: providing a photomask which is provided with a first groove pattern arranged along a first direction; enabling the photomask to be in a first relative orientation, and exposing a first preset area on the surface of the wafer; then, enabling the photomask to be in a second relative orientation after relative rotation of a first rotation angle between the photomask and the wafer, and exposing a remaining second preset area on the surface of the wafer; and after developing, forming a second groove pattern corresponding to the first groove pattern on the surface of the wafer, so that a relative included angle corresponding to the first rotation angle is formed between the second groove pattern located in the first preset area and the second groove pattern located in the second preset area along the first trend. According to the invention, the stress brought by the groove can be mutually offset, the problems of wafer breaking and scratching caused by warping after the wafer is thinned are solved, the method can be applied to preparation of the groove type power MOSFET, and the rejection rate can be effectively reduced.

This utility model relates to the field of inspection fixture technology, specifically to an inspection fixture for reinforcing steel sheet misalignment. It includes a base and a support plate on the base. A placement groove is provided in the middle of the support plate. The fixture also includes a negative pressure generator located at the lower end of the support plate, with its adsorption end extending into the placement groove. The placement groove in the middle of the support plate is used to accommodate and prevent the reinforcing steel sheet to be inspected from being obstructed. Support bars are provided to lift the reinforcing steel sheet, ensuring that the flexible circuit board and its reinforcing steel sheet can be evenly flattened under the negative pressure adsorption effect of the negative pressure generator. Simultaneously, due to the different number of positioning posts on both sides, the operator can only position the reinforcing steel sheet to be inspected in the only correct direction, effectively avoiding mis-inspection and production waste caused by incorrect orientation. This fixture can achieve stable positioning while also eliminating warping or deformation that may occur due to the flexibility of the flexible circuit board, greatly improving the accuracy and consistency of inspection results.

The invention relates to an ultrathin and large-area high-power MOSFET (Metal-Oxide-Semiconductor Field Effect Transistor) chip, which comprises an active region, strip-shaped source electrode lead holes of the active region are arranged at intervals, the strip-shaped source electrode lead holes are arranged in a transverse and vertical alternating manner, the whole lead hole is divided into a plurality of shorter lead holes, dielectric layers are arranged between the multiple sections of lead holes, and the dielectric layers are arranged at intervals between the multiple sections of lead holes. After the lead hole is etched, the micro-warping effect of the wafer is obviously reduced, the stress is obviously reduced, the stress after the lead hole is etched can be mutually counteracted in the horizontal direction and the vertical direction, the warping problem is eliminated, the surface of the wafer is very smooth, the chip area can be larger, the problems of micro-warping and stress of the wafer cannot occur, the wafer can be thinned, and the yield of the wafer is improved. And the product is lower in on resistance, lower in thermal resistance and higher in power density.