154results about How to "Eliminate warping" patented technology

A process and apparatus for removing moisture from a material, without spoiling the processed product, through the implementation of microwave irradiation heating, drying, dehydration, curing, disinfection, pasteurization, sterilization or vaporization or any combination thereof. The process and apparatus provide for a controlled processing of planar material, a combination of materials organic or inorganic, in natural or processed form, in sheet leaf, granular, prepared or transportable planar form.

A chucking device is disclosed. The chucking device includes plural protruding portions that support the central portion of a semiconductor substrate and that are provided on a base portion. The chucking device also includes a cylindrical peripheral portion that supports the outer peripheral portion of the semiconductor substrate, plural suction holes that chuck the semiconductor substrate, and a vacuum source that vacuum draws the plural suction holes at differing timings. A plurality of mutually independent vacuum drawable suction holes are provided in at least one portion of the protruding portions.

The invention provides a rotary forging method for large disc type work pieces and a forging device. The method comprises preparing a forging die, preparing blanks, pre-forging a shunt slot, positioning the blanks and carrying out rotary forging in steps. Based on the method, the invention also provides a forging device which can realize relative rotation of an upper forging die and a lower die, and the local forming process for the disc type work pieces can be carried out through rotary forging of the upper forging die and the lower die. In order to control metal flow in the forging process, the procedure of pre-forging the shunt slot is added prior to the rotary forging. Moreover, the upper forging die with a special structure is adopted to overcome the warpage of the work pieces during rotary forging. The forming method has the advantages of low forming load, simple dies and low processing cost, and can greatly reduce the manufacturing cost of existing large disc type work pieces.

A semiconductor device includes a chip, a laminated wiring structure formed integrally with the chip, a frame disposed to surround the chip and made of a material having stiffness, and a sealing resin formed to bury therein the frame and at least the periphery of the side surface of the chip. The laminated wiring structure includes a required number of wiring layers, which are formed by patterning in such a manner that a wiring pattern directly routed from an electrode terminal of the chip is electrically connected to pad portions for bonding external connection terminals, the pad portions being provided, at a position directly below a mounting area of the chip and at a position directly below an area outside the mounting area, on a surface to which the external connection terminals are bonded.

PCT No. PCT/JP96/01924 Sec. 371 Date May 14, 1997 Sec. 102(e) Date May 14, 1997 PCT Filed Jul. 11, 1996 PCT Pub. No. WO97/03834 PCT Pub. Date Feb. 6, 1997A laminated ink-jet recording head is provided that has a strong joint between the diaphragm and the piezoelectric vibrating element and which can be driven on low voltage. The recording head is of such a design that a lower electrode is provided on the diaphragm in at lest a region that corresponds to said pressure generating chamber, the lower electrode being overlaid with the piezoelectric vibrating element formed by a hydrothermal method, said piezoelectric vibrating element in turn being overlaid with an upper electrode and having a film thickness of not less than 1 mu m but not more than 10 mu m. The invention further provides a process for producing this recording head, as well as an apparatus such as a printer that is equipped with this recording head.

The invention discloses a system suitable for metal powder melting material increasing manufacturing. The system is formed by compositing of a fiber laser galvanometer scanning mechanism and a high-speed grinding head. The fiber laser galvanometer scanning mechanism is provided with an XY workbench. The high-speed grinding head is arranged on a Y axis of the XY workbench through a Y axial sliding block. After multiple layers are manufactured on a workpiece, the high-speed grinding head slides along the Y axis of the XY workbench and carries out the feeding motion in the X axial direction at the same time, and high-speed grinding is carried out on the workpiece. The system suitable for the metal powder melting material increasing manufacturing has the advantages that after the high-speed grinding head is composited with the fiber laser galvanometer scanning mechanism, in the material increasing manufacturing process, scanning is carried out on a powder bed through the fiber laser galvanometer scanning mechanism, metal in a selected area is melted, a protrusion and a warpage in the partial workpiece can be removed by the high-speed grinding head, the upper surface of the workpiece can be maintained in smooth, the residual protruding peak on the surface of the workpiece and the plastic deformation degree can be effectively lowered, and the roughness on the surface of the workpiece is favorable to be lowered.

A packaging method comprises the steps of: providing a carrier plate, wherein the carrier plate comprises a plurality of chip regions and cutting regions arranged between the adjacent chip regions, the carrier plate further comprises a first surface, and a plurality of grooves are formed in the cutting regions in the first surface of the carrier plate; providing chips, wherein each chip comprises a functional surface and a non-functional side surface which are opposite to each other, the surface of each functional surface is provided with bumps, and the bumps protrude out of the functional surfaces; fixing the non-functional side surfaces of the chips with the first surface of the carrier plate in the chip regions; forming a plastic packaging layer on the first surface of the carrier plate and the surfaces of the chips, wherein the plastic packaging layer exposes top part surfaces of the bumps; removing the carrier plate after forming the plastic packaging layer; forming a rewiring structure on the surface of the plastic packaging layer and the functional surfaces of the chips; and cutting the plastic packaging layer and the rewiring structure, so that the plurality of chips are separated from one another, thereby forming an independent packaging structure. The yield and reliability of the formed packaging products are improved.

The invention provides a printed circuit board having an embedded semiconductor chip, includes: a carrier board having a first and an opposing second surface and a through hole penetrating the first and second surfaces; a semiconductor chip disposed in the through hole and having an active surface and an inactive surface, wherein the active surface includes a plurality of electrode pads; at least one non photoimagable laminating layer formed on the first surface of the carrier board and with a through hole to expose the inactive surface of the semiconductor chip; a dielectric layer and a circuit layer formed on the second surface of the carrier board and the active surface of the semiconductor chip, wherein the circuit layer electrically connects to the electrode pads of the semiconductor chip, thereby preventing the carrier board from warpage due to temperature variations and an asymmetric structure during a single-side circuit formation process of the carrier board.

The invention belongs to the technical field of copper-clad plate manufacturing, and particularly relates to a preparation method of an aluminium nitride base ceramic copper-clad plate. The preparation method comprises the following steps: pretreating an oxygen-free red copper foil, then putting the pretreated oxygen-free red copper foil in molten sodium nitrate, and carrying out medium temperature chemical oxidation treatment; pretreating an aluminum nitride substrate, and then carrying out high-temperature oxidation treatment; and carrying out magnetron sputtering treatment on the aluminum nitride substrate subjected to high temperature oxidation, prepressing the treated oxygen-free red copper foil into a circular arc shape, stacking the circular arc-shaped oxygen-free red copper foil and the aluminum nitride substrate together, putting in a chained bonding furnace, carrying out high temperature dynamic continuous bonding, and then treating by adopting a sequential temperature difference alternative falling temperature method, thus obtaining the aluminium nitride base ceramic copper-clad plate. The preparation method is simple in production efficiency, stable in quality and low in cost. The prepared aluminium nitride base ceramic copper-clad plate has the characteristics of low void ratio, low coefficient of thermal expansion, low stress, high thermal conductivity, high peel strength and large bonding area.

The invention provides a molding method for casting and forging a structure piece of a wheelchair frame, which comprises the steps of: sawing and cutting an aluminum cast ingot with the outer circle of phi 200mm with a material trade mark of 6061 into blank with the length of 800mm; smelting; pouring; modeling; cutting a dead head; charging a casting blank, heating and fixing the temperature at 530 DEG C; forging and pressing the casting blank by a 5000-ton oil press and a forging mould; forging and pressing to obtain a forged piece; etching and washing; treating with solid solution; and manually correcting the specific deformation degree of the forged piece. The precast blank is cast and molded by the method, the shape of the blank is good in consistency, the shape of a curved surface iseasy to control, a casting material can be cyclically utilized, and the material utilization can be furthest improved; and the batch production practice proves that the finished forged piece producedby a casting and forging technological process has no forging defects, the thermal treatment performance meets the demand, and the final status of the forged piece completely accords with user demand.

A wiring board includes an external connection terminal of a cylindrical shape, in which an electrode terminal of the electronic component to be mounted is fitted. In one configuration, a portion of the external connection terminal is electrically connected to a pad portion formed on an electronic component mounting surface side of the wiring board, and the external connection terminal is curvedly formed in such a shape that the outer periphery of the electrode terminal comes into close contact with the inner periphery of the middle portion of the external connection terminal when the electrode terminal is inserted into the external connection terminal.

The invention discloses a glass fiber reinforced PBT (Poly Butylenes Terephthalate) combination special for a large thin-wall part and a preparation method thereof, the PBT combination comprises the following raw materials in percentage by weight: 60-90 percent of PBT, 0-25 percent of glass fiber, 1-5 percent of compatilizer, 0-20 percent of talcum powder, 0-20 percent of micro beads, 0.1-1 percent of antioxidant and 0.1-0.5 percent of lubricant. According to the invention, the problem of serious warping of the glass fiber reinforced PBT is solved by taking general PBT as a main raw material and adopting a method of double-modifying the PBT through adding minerals into the short glass fiber, and the prepared PBT combination has the advantages of low warping degree, high gloss, high flowability and excellent mechanical property, and is very suitable for the large thin-wall part.

The invention discloses a heating and rolling method for a wide thick titanium-steel composite plate. The heating and rolling method comprises the heating step and the rolling step. In the heating step, a titanium-steel composite plate blank is heated under the atmosphere of micro positive pressure and weak oxidability; heat preservation is conducted for 1.0-1.5 h at the temperature of 650 DEG C-700 DEG C in the preheating section; then, the temperature is rapidly increased to 880 DEG C-900 DEG C with 1.0-2.0 h in the heating section, and heat preservation is conducted for 1.0-2.0 h; and finally, heat preservation is conducted for 4.0-5.0 h at the temperature of 900 DEG C-930 DEG C in the soaking section. According to the method, in the heating step, heating of the titanium-steel compositeplate is uniform, the phenomena of head tearing, head buckling, upwarping and edge part folding in the titanium-steel composite plate rolling process are eliminated, the rolled plate shape is good, the surface is clean and tidy, edge part folding and foreign matter pressing-in are avoided, the performance is excellent, and the yield and the production efficiency are improved. The titanium-steel composite plate rolled through the method is free of the tearing phenomenon, the performance meets the GB/T8547 requirement, the surface is clean and tidy, edge part folding and foreign matter pressing-in are avoided, and the plate shape is good.

A lead-free solder ball is provided which suppresses interfacial peeling in a bonding interface of a solder ball, fusion defects which develop between the solder ball and solder paste, and which can be used both with Ni electrodes plated with Au or the like and Cu electrodes having a water-soluble preflux applied atop Cu. The lead-free solder ball for electrodes of BGAs or CSPs consists of 1.6-2.9 mass % of Ag, 0.7-0.8 mass % of Cu, 0.05-0.08 mass % of Ni, and a remainder of Sn. It has excellent resistance to thermal fatigue and to drop impacts regardless of the type of electrodes of a printed circuit board to which it is bonded, which are Cu electrodes or Ni electrodes having Au plating or Au/Pd plating as surface treatment. The composition may include at least one element selected from Fe, Co, and Pt in a total amount of 0.003-0.1 mass % or at least one element selected from Bi, In, Sb, P, and Ge in a total emount of 0.003-0.1 mass %.

The invention relates to a method for preparing ceramic burnishing brick surface and the device, the process comprises surface working for brick blank floor, inverting brick for 180 degree and surface working the brick blank, the surface working for brick blank floor is dubbing the brick blank floor, the working for brick blank surface comprising butting, surface milling and grinding and polishing brick blank surface in sequence. The preparing device comprises conveying line for brick blank, bottom milling device for surface working of brick blank bottom, reversing device and surface treating device assembly, which are connected together through conveying line. The invention is characterized by increased working efficiency by 10-20%, reduced damage rate for brick blank preparation by 20-40 %, and increased surface plainness of ceramic polishing brick by 20-30%.

The invention discloses a wafer warping elimination method and a composite substrate. The method comprises steps that S1, a warped wafer (1) is selected; S2, a stress compensation film (2) internallyhaving the stress is deposited at a back surface of the wafer (1), and the internal stress of the stress compensation film (2) is made to offset the internal stress of the wafer (1) to acquire a flatcomposite substrate; and the wafer (1) is a silicon carbide based silicon carbide wafer or a silicon-based gallium nitride wafer; the composite substrate comprises the wafer (1) and the stress compensation film (2), wherein the stress compensation film (2) covers the back surface of the wafer (1), the internal stress of the stress compensation film (2) is made to offset the internal stress of thewafer (1), and the wafer (1) is the silicon carbide based silicon carbide wafer or the silicon-based gallium nitride wafer. The wafer warping elimination method is advantaged in that the stress compensation film internally having the stress is deposited at the back surface of the warped wafer, the internal stress of the stress compensation film (2) is made to offset the internal stress of the wafer (1), and the warping phenomenon is eliminated.

A semiconductor device can be formed with fewer voids in the solder bonding a laminate of a silicon chip, an insulator substrate, and a metal base, with a solder layer positioned between the layers. After placing the laminate in a furnace, it is evacuated and then pressurized with hydrogen gas, and then heated to melt the solder. While maintaining the heat, the furnace is again evacuated to remove voids in the solder, and then the furnace is positively pressurized again with hydrogen gas to prevent holes produced by the voids traveling in the solder, and to obtain a uniform solder fillet shape. Thereafter the laminate is rapidly cooled to obtain a finer grain solder to increase the rate of creep to quickly remove the warping of the laminate to the original state.

The invention discloses a method for eliminating a warping phenomenon in interactive prism grid generation. The method comprises the following steps: firstly, artificially interacting to generate a space propulsion grid of product surface grid boundary points; fairing components of propulsion normal vectors of boundary points of the object plane grid in X, Y and Z coordinate directions by using afairing algorithm, interpolating by using a radial basis function method to obtain a space propulsion grid of internal points of the object plane grid, and finally assembling to obtain a boundary layer prism grid for CFD calculation simulation; according to the method, an object plane grid boundary space propelling plane grid generated through manual interaction is optimized, the influence of thewarping phenomenon on the quality of the prism grid is eliminated through the technologies of normal vector fairing, radial basis function interpolation and the like, and the method has obvious technical advantages in the aspect of improving the generation efficiency of the prism grid and the universality of the method.