The invention relates to a method for producing a fine line flexible circuit board with high racking strength, including the following steps: selecting a metal foil as the carrier, vacuum sputtering a layer of sputtering metal level, which can improve the racking strength of the thin copper and the carrier, on one side of the metal foil, then coiling the planting thin copper layer on the sputtering metal level; selecting a film matrix which is coated with B stage modified epoxy or B stage acrylics or polyester film of TPI resin or polyimide film or liquid crystal polymer film on one side or on double sides; placing the thin copper layer with metal foil, release paper layer, silicon rubber layer, Teflon layer, stainless steel layer on surface of one side or double sides of the matrix in sequence from inside out; and then pressing the thin copper layer with metal foil carrier on surface of one side of the matrix or on surfaces of the double sides of the matrix separately. Comparing with the prior art, the equality of the racking strength is effectively ensured at last, and the processing control is simple, the affinity between the matrix and the thin copper layer is good, the racking strength is high, the yield rate is high, and the cost for processing is low; the method is suitable for processing circuit boards with small-bore, and has high reliability; the electroplated layer is uniform and is suitable for producing a large amount of fine line products; the method can be used for producing flexible circuit boards with broad width, the utility ratio of the material is high and the efficiency is high.