Patents
Literature
Eureka-AI is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Eureka AI

753 results about "Polyimide membrane" patented technology

Liquid crystal phase shift unit for reflected adjustable phase shifter

ActiveCN107394318ATurn fullySteer evenlyWaveguide type devicesPatch electrodeAuxiliary electrode
The invention discloses a liquid crystal phase shift unit for a reflected adjustable phase shifter. The liquid crystal phase shift unit comprises two upper and lower layers of medium substrates, a liquid crystal layer is injected in the gap between the two upper and lower layers of medium substrates, a metal microstrip patch electrode is arranged on the lower side of the upper layer medium substrate, a metal total reflection ground electrode is arranged on the upper side of the lower layer medium substrate, and polyimide film coating is respectively arranged on upper and lower surfaces of the liquid crystal layer; the metal microstrip patch electrode comprises two identical dipole patches, an offset voltage loading line and an auxiliary electrode, the two dipole patches are arranged in parallel, the offset voltage loading line is connected with the two dipole patches orthogonally to form a patch unit, the auxiliary electrode is a quadrilateral metal frame, and the quadrilateral metal frame surrounds the whole patch unit and is connected with the offset voltage loading line. The auxiliary electrode has a simple main body structure, educes the saturation bias voltage, and can be used in the field of liquid crystal reflected phase shifters and phase control antennas within microwave, millimeter wave and terahertz frequency bands.
Owner:HEFEI UNIV OF TECH

Flexible display panel and preparation method thereof

The present invention provides a flexible display panel. The flexible display panel comprises a display area and a non-display area. The non-display area comprises a substrate, an insulation layer arranged on the substrate, a planarization layer arranged on the insulation layer, a chip bonding area arranged on the planarization layer and an outer edge. An ACF (Anisotropic Conductive Film) excessive glue blocking portion is formed between the chip bonding area and the outer edge, and the ACF excessive glue blocking portion is extended along the extension direction of the outer edge. The ACF excessive glue blocking portion can avoid ACF overflowing to avoid a phenomenon that glass and a polyimide film cannot be separated. The present invention further provides a preparation method of a flexible display panel. The method comprise the steps of: providing the display substrate, wherein the display substrate comprises a plurality of panel areas, each panel area comprises a display area and anon-display area, and each non-display area comprises the substrate, the insulation layer, the planarization layer, the chip bonding area and a cutting area; forming the ACF excessive glue blocking portion at a position between the chip bonding area and the cutting area through adoption of patterning processing; and cutting the display substrate along the cutting area, and obtaining the flexibledisplay panel.
Owner:WUHAN CHINA STAR OPTOELECTRONICS TECH CO LTD

Method for preparing fine line flexible circuit board with high peeling strength

The invention relates to a method for producing a fine line flexible circuit board with high racking strength, including the following steps: selecting a metal foil as the carrier, vacuum sputtering a layer of sputtering metal level, which can improve the racking strength of the thin copper and the carrier, on one side of the metal foil, then coiling the planting thin copper layer on the sputtering metal level; selecting a film matrix which is coated with B stage modified epoxy or B stage acrylics or polyester film of TPI resin or polyimide film or liquid crystal polymer film on one side or on double sides; placing the thin copper layer with metal foil, release paper layer, silicon rubber layer, Teflon layer, stainless steel layer on surface of one side or double sides of the matrix in sequence from inside out; and then pressing the thin copper layer with metal foil carrier on surface of one side of the matrix or on surfaces of the double sides of the matrix separately. Comparing with the prior art, the equality of the racking strength is effectively ensured at last, and the processing control is simple, the affinity between the matrix and the thin copper layer is good, the racking strength is high, the yield rate is high, and the cost for processing is low; the method is suitable for processing circuit boards with small-bore, and has high reliability; the electroplated layer is uniform and is suitable for producing a large amount of fine line products; the method can be used for producing flexible circuit boards with broad width, the utility ratio of the material is high and the efficiency is high.
Owner:GUANGZHOU FANGBANG ELECTRONICS

Soft support bridge type silicon micro-piezoelectric ultrasonic transducer chip and prepration method thereof

The invention relates to a soft support bridge type silicon micro-piezoelectric ultrasonic transducer chip which comprises a silicon substrate with a square conical hole which is small at the top andbig at the bottom in the center; a silicon layer and a first oxidation layer are sequentially covered on the front surface of the silicon substrate, and a second oxidation layer is covered on the backsurface; the corresponding silicon layer and the first oxidation layer above the square hole of the front surface of the silicon substrate constitute a square vibration membrane, one pair of oppositesides of the square vibration membrane respectively etch a vertical narrow slot, and the vertical projection of each narrow slot is positioned on the inner side of the hole edge above the front surface of the silicon substrate; a lower electrode, a piezoelectric membrane and an upper electrode are sequentially deposited on the square vibration membrane; a polyimide membrane is deposited on various parts on the front surface of the silicon substrate; and the square vibration membrane which is etched with the vertical narrow slots and the polyimide membrane commonly constitute a soft support anti-sound leakage bridge type vibration membrane. The anti-sound leakage bridge type structure is used on the vibration membrane of the transducer; in order to avoid sound leakage through the narrow slots, the soft polyimide membrane is deposited on the narrow slots, which has little effect on vibration of the vibration membrane and can still keep high sensitivity.
Owner:INST OF ACOUSTICS CHINESE ACAD OF SCI
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products