1262 results about "Aromatic diamine" patented technology

Disclosed are compositions for an organic electroluminescent device favorably used for forming a hole injection layer and a hole transport layer of the organic electroluminescent device by a wet film forming method. The compositions for the organic electroluminescent device, which are composite solutions prepared by dissolving hole transport materials such as aromatic diamine compounds and an electron acceptor such as tri(pentafluorophenyl)boron in a solvent that contains an ether solvent and/or an ester solvent whose water solubility at 25° C. is 1 weight % or less in the solvent, with a concentration of 10 weight % or higher in the compositions.

The invention discloses a colorless highly-transparent polyimide film as well as a preparation method and an application thereof. The film is prepared from semi-aromatic polyimide resin of which the structural formula is shown as formula I, wherein Al is an alicyclic structure, R1 is an aromatic diamine structure containing fluorine and sulfone, R2 is another aromatic diamine structure, and n:m=(0-400):1. The film has excellent optical transparency, colorless transparency of the film with great thickness (greater than or equal to 100 mu m) can be realized, the initial light-transmitting wavelength is below 300nm, and the light transmittance in a visible region is greater than or equal to 90%; and meanwhile, the film shows excellent heat resistance and mechanical property, and has important application values in the manufacturing of the photoelectric devices such as a solar battery, a display, an electronic book, an electronic label, a photoelectric sensor and the like.

This invention discloses a method for preparing phenolic hydroxyl-containing polyimide adhesive. The method comprises: (1) reacting phenolic hydroxyl-containing aromatic diamine, or its mixture with other aromatic diamines, with aromatic dianhydride at a mol ratio of 1:1 in strongly polar non-proton organic solvent at 0-10 deg.C for 4-8 h to obtain uniform, transparent and viscose polyhydroxyamic acid solution; (2) adding azeotropic dehydrator in nitrogen atmosphere, heating, performing imidization reaction under refluxing and dehydration at 120-160 deg.C for 1-6 h, and cooling to room temperature to obtain phenolic hydroxyl-containing polyimide adhesive. The volume ratio of azeotropic dehydrator to strongly polar non-proton organic solvent is 1 :( 1-5). The method has such advantages as easy operation, no special requirement for equipment, and high product quality. The phenolic hydroxyl-containing polyimide adhesive has such advantages as short adhesion and curing time, low energy consumption, and high adhesiveness to copper foil and polyimide thin film, and can be used to produce bi-layer flexible printed circuit boards.

The invention relates a novel high temperature resistant polyimide foam and the preparation process thereof is as follows: (1) firstly, 2, 3, 3', 4'-biphenyl tetracarboxylic dianhydride or 2, 3, 3', 4'-biphenyl tetracarboxylic dianhydride and another type of aromatic dianhydride are heated and refluxed in a fatty alcohol solution so as to change the tetracarboxylic dianhydride into diacid diester; (2) in accordance with a certain proportion, the obtained diacid diester is synthesized into a precursor solution with one type or more of aromatic diamine and a blocking agent of acetylenyl benzene and a certain quantity of foam stabilizer is added into the solution; (3) the solution is heated to remove tiny molecule volatile matter and obtain a polymide precursor powder; and (4) the precursor powder is filled into a mould to be frothed at high temperature and carries out imidization so as to obtain the polyimide foam. The density of the novel high temperature resistant polyimide foam is 10 kg/m<3> to 500 kg/m<3> and the vitrified transformation temperature is over 350 DEG C; and the foam is characterized by excellent high temperature resistance, low temperature resistance, mechanical properties and functions of anti flaming, heat insulation or noise reduction.

The invention discloses an aromatic diamine containing o-phthalonitrile side group. The structure formula of the aromatic diamine is shown as the right formula. The invention also discloses a method for preparing the aromatic diamine and polyimide and daiamid which are prepared by taking the aromatic diamine containing the o-phthalonitrile side group as one of raw materials. The o-phthalonitrile side group in the aromatic diamine is positioned on the side chain, thereby adjusting the degree of crosslinking with adjusting the polymer molecular weight and widening the application of the polyimide and the daiamid in a thick-wall composite material or a composite material element with a complicated shape and the fields of membrane material and fiber.

The present invention relates to a binder resin composition for an electrode, including a polyamic acid and a solvent, wherein the polyamic acid is (i) a polyamic acid which includes a tetracarboxylic acid component including 10 to 100 mol % of 4,4′-oxydiphthalic acid and 90 to 0 mol % of 3,3′,4,4′-biphenyltetracarboxylic acid and/or pyromellitic acid and a diamine component including an aromatic diamine having 1 to 4 aromatic rings, (ii) a polyamic acid which includes a tetracarboxylic acid component including 3,3′,4,4′-biphenyltetracarboxylic acid dianhydride and a diamine component including 10 to 90 mol % of p-phenylene diamine and 90 to 10 mol % of 4,4′-diaminodiphenyl ether, or (iii) a polyamic acid which includes a tetracarboxylic acid component including 3,3′,4,4′-biphenyltetracarboxylic acid dianhydride and a diamine component including 40 mol % or more of a bis[4-(4-aminophenoxy)phenyl] compound.

The present invention relates to reinforced polyamide molding materials with high notch impact strengths, comprising low viscous polyamides and flat glass fibers as a reinforcing medium, characterized in a polyamide matrix, comprising the following components: (A) 0 to 60 wt.-% of at least one aliphatic, partly crystalline polyamide with a solution viscosity, measured in m-cresol (0.5 wt-%), of η_rel less than 1.9, (B) 0 to 60 wt.-% of at least one amorphous or microcrystalline polyamide based on aliphatic, cycloaliphatic or aromatic diamines, dicarboxylic acids, lactams and/or aminocarboxylic acids, preferably with 6 to 36 carbon atoms, or a mixture of such homopolyamides and/or copolyamides, wherein the components (A) and (B) fulfill the condition: (A)+(B)=20 to 60 wt.-% and that, in the case of a mixture of components (A) and (B), at least 50 weight parts aliphatic blocks (A) are present in the mixture, and a filler component, comprising: (C) 40 to 80 wt.-% flat glass fibers with elongated shape, and the glass fibers have a non-circular cross-sectional area and a size ratio of the main cross-sectional axis to the secondary cross-sectional axis of between 2 to 5, particularly between 3 and 4, and (D) 0 to 40 wt.-% particle like or layer like fillers, with the prerequisite that carbon fibers are excluded, wherein the polyamide molding materials optionally comprise up to 5 wt.-% of further usual additives and auxiliary agents (E), and wherein the weight of the components (A) to (E) sums up to 100%.

The invention relates to a silicon-containing polyimide copper-clad plate and a preparation method thereof. The silicon-containing polyimide copper-clad plate is composed of a copper foil, an alkali-free glass cloth and silicon-containing polyimide resin. The preparation method comprises the steps of: putting organosilicon diamine and an organic solvent into a reaction kettle, conducting stirring dissolving, then adding aromatic dianhydride, adding an azeotropic dehydrating agent, carrying out heating reflux water diversion reaction to obtain a component A; putting aromatic diamine and a strong polar aprotic organic solvent into the reaction kettle, conducting stirring dissolving, adding aromatic dianhydride and maleic anhydride, and carrying out stirring reaction to obtain a component B; subjecting the component A and component B to stirring reaction at room temperature so as to obtain silicon-containing polyimide resin; using a gluing machine to dip silicon-containing polyimide resin, removing the solvent to obtain a prepreg, conducting cutting and lamination, laying copper foil, and carrying out heating pressurization curing, thus obtaining the silicon-containing polyimide copper-clad plate. The silicon-containing polyimide copper-clad plate has good electrical properties, mechanical properties, and high temperature resistance, etc. The operation process is simple, and the product has excellent comprehensive performance and has broad market prospects.

The invention relates to a carbon nanotube/poly Schiff base polymer, a preparation method thereof, and an application thereof. The invention relates to a composite material of carbon nanotube and poly Schiff base, a preparation method thereof, and an application thereof. With the polymer and the methods provided by the invention, problems of existing poly Schiff base of low photoelectrochromic response sensitivity and poor thermal stability are solved. According to the invention, aminated carbon nanotubes, aromatic diamine monomers, and dialdehyde compounds are subject to an in situ polymerization reaction, such that the product is obtained. First, aminated carbon nanotubes and part of dialdehyde compounds are mixed and heated until reflux liquid is generated; then aromatic diamine monomers and rest dialdehyde compounds are mixed and injected in batches, and the reaction is continued, such that the product is obtained. The polymer provided by the invention provides electrochromic, acidichromic, and photochromic performances, and has good thermal stability. Therefore, the polymer can be used in displays and acid-base sensors. The polymer has high electrochromic, acidichromic, and photochromic sensitivity, and provides reversible acidichromic and photochromic performances.

The invention provides a liquid crystal alignment agent for photo alignment, a liquid crystal alignment layer for photo alignment, and a liquid crystal display element. The liquid crystal alignment agent provided by the invention has a polyamide acid or a derivative thereof, the polyamide acid or the derivative thereof may be formed by reacting a mixer of cyclobutane tetracarboxylic dianhydride or tetracarboxylic dianhydride with specific aromatic diamine of an alkyl chain of a molecule with a carbon number larger than 4. With the adoption of the liquid crystal alignment agent, a liquid crystal alignment layer good in sensitivity of chemical change caused by light irradiation, excellent in alignment property of liquid molecule and high in optical transmittivity is formed. In addition, by applying the photo alignment layer to the liquid crystal display element, the liquid crystal display element with excellent display characteristics can be obtained.

Phenylethynyl containing imide-silanes were prepared from aminoalkyl and aminoaryl alkoxy silanes and 4-phenyletbynylphthalic anhydride in toluene to form the imide in one step or in N-methyl-2-pyrrolidinone (NMP) to form the amide acid intermediate. Controlled molecular weight pendent phenylethynyl amide acid oligomers terminated with aminoaryl alkoxy silanes were prepared in NMP from aromatic dianhydrides, aromatic diamines, diamines containing pendent phenylethynyl groups and aminoaryl alkoxy silanes. The phenylethynyl containing imide-silanes and controlled molecular weight pendent phenylethynyl amide acid oligomers terminated with aminoaryl alkoxy silanes were used to improve the adhesion between phenylethynyl containing imide adhesives and inorganic substrates (i.e. metal). Hydrolysis of the alkoxy silane moiety formed a silanol functionality which reacted with the metal surface to form a metal-oxygen-silicon (oxane) bond under the appropriate reaction conditions. Upon thermal cure, the phenylethynyl group of the coupling agent reacts with the phenylethynyl functionality of phenylethynyl containing imide adhesives and becomes chemically bonded to the matrix. The resultant adhesive bond is more durable (i.e. hot-wet environmental resistance) than adhesive bonds made without the use of the coupling agent due to covalent bond formation between the phenylethynyl containing imide-silane coupling agent or the controlled molecular weight pendent phenylethynyl amide acid oligomers terminated with aminoaryl alkoxy silanes and both the metal substrate and phenylethynyl containing imide adhesives.

The invention relates to an o-phthalodinitrile end-blocked soluble polyarylether resin with phthalazinone structure and a condensate and a preparation method thereof, belonging to the high polymer material synthesis field. By adopting 4-nitrophthalonitrile as blocking agent, o-phthalodinitrile end-blocked soluble polyarylether resin with phthalazinone structure is prepared by solution nucleophilic substitution reaction. The method has simple process and easy operation. The polyarylether resin shows good solubility in all the common solvents, has better curing activity, and can be shaped in various ways. The condensate with stable size and high thermostability of the o-phthalodinitrile end-blocked soluble polyarylether resin can be obtained by procuring at 150-300 DEG C and annealing at 350-400 DEG C in the present of aromatic diamine. The o-phthalodinitrile end-blocked soluble polyarylether resin of the invention can be used to prepare coatings, insulating varnish, adhesives, films and high-performance composite materials, thus having wide application prospect.