This invention discloses
polyimide, its preparation method, and
polyester electronic
adhesive. This invention provides a
polyimide whose polymerizing monomers include dianhydride monomers and
diamine monomers, wherein the dianhydride
monomer is selected from one or more of 4,4'-(4,4'-isopropyldiphenoxy)bis(
phthalic anhydride), 3,3',4,4'-
benzophenone tetracarboxylic dianhydride, 4,4'-oxybis(
phthalic anhydride), and 2,3,3',4'-biphenyltetracarboxylic dianhydride; and the
diamine monomer is selected from one or more of aminophenyl
sulfone, 1,3-bis(4'-aminophenoxy)
benzene, 2,2'-bis[4-(4-aminophenoxyphenyl)]
propane, 4,4'-bis(3-aminophenoxy)
diphenyl sulfone, 1,3-cyclohexanedimethylamine, 4,4'-
diaminodiphenyl ether, dimericadiamine, and trimericadiamine. The
polyimide of this invention can modify
polyester or
epoxy systems, significantly improving
flame retardancy and
adhesive peel strength. The
coating process involves
evaporation at relatively low temperatures, and the
solvent in the
system has a low
boiling point, meeting the requirements of existing processes.