537 results about "Diaminodiphenyl ether" patented technology

A benzoxazine polymer having improved thermal properties. The properties are improved by inserting aromatic polyamines into the monomer, such as phenylenediamine, methylenedianiline, oxydianiline, diaminodiphenylsulfone, 2,2-bis(4-[aminophenoxy]phenyl)propane, 4,4'-oxydianiline, 4,4'-diaminodiphenyl sulfone, and diaminobenzanilide, to introduce internal benzoxazine groups that are crosslinking sites. The improved polymers can be converted into molding compounds, towpregs, and prepregs by being compounded with reinforcing fibers.

The present invention relates to a binder resin composition for an electrode, including a polyamic acid and a solvent, wherein the polyamic acid is (i) a polyamic acid which includes a tetracarboxylic acid component including 10 to 100 mol % of 4,4′-oxydiphthalic acid and 90 to 0 mol % of 3,3′,4,4′-biphenyltetracarboxylic acid and/or pyromellitic acid and a diamine component including an aromatic diamine having 1 to 4 aromatic rings, (ii) a polyamic acid which includes a tetracarboxylic acid component including 3,3′,4,4′-biphenyltetracarboxylic acid dianhydride and a diamine component including 10 to 90 mol % of p-phenylene diamine and 90 to 10 mol % of 4,4′-diaminodiphenyl ether, or (iii) a polyamic acid which includes a tetracarboxylic acid component including 3,3′,4,4′-biphenyltetracarboxylic acid dianhydride and a diamine component including 40 mol % or more of a bis[4-(4-aminophenoxy)phenyl] compound.

The invention discloses a dimensionally-stable polyimide film and a preparation method thereof. According to the weight percentage, the polyimide film is manufactured by evenly mixing 40 to 80 percent of component A, 0 to 60 percent of component B and 0 to 60 percent of component C and then conducting slobbering and imidization according to a conventional process, wherein the component A is polyamide acid resin solutions obtained after 2-(4-aminophenyl)-5-amido-benzimidazole reacts with pyromellitic dianhydride (PMDA) or biphenyltetracarboxylic acid dianhydride (BPDA); the component B is polyamide acid resin solutions obtained after p-phenylenediamine (PDA) reacts with the PMDA; and the component C is polyamide acid resin solutions obtained after 4,4'-diaminodiphenyl ether (ODA) reacts with the BPDA and the PMDA. The polyimide film provided by the invention has the advantages of lower thermal shrinkage rate, lower thermal expansion coefficient, higher elastic modulus and higher tensile strength and reflects better dimensional stability. The whole preparation method is simple and is easy to operate.

The invention provides a polyimide fiber comprising a polymer with a structure shown in a formula (I) in the specification, wherein m is the proportion of a repeat unit with a structure shown in a formula (II), in the structure of the polymer, and is more than and equal to 0.8 and less than and equal to 0.95. The invention also provides a preparation method of the polyimide fiber, comprising the following steps of: mixing p-phenylenediamine, 4,4'-diaminodiphenyl ether and 3,3',4,4-biphenyltetracarboxylic dianhydride in an organic solvent to carry out condensation polymerization so as to obtain a polyamic acid spinning solution, wherein proportion of the mole number of the p-phenylenediamine to the total mole number of the p-phenylenediamine and the 4,4'-diaminodiphenyl ether is 0.8-0.95; spinning to obtain polyamic acid protofilaments by using the polyamic acid spinning solution; carrying out imidization processing on the polyamic acid protofilaments to obtain polyimide nascent fibers; and carrying out hot stretching processing on the polyimide nascent fibers to obtain the polyimide fiber.

The invention discloses a graphene modified polyimide-based composite which is characterized in that the graphene modified polyimide-based composite comprises the following components in parts by weight: 95-105 parts of 4,4'-diaminodiphenyl ether, 110-120 parts of pyromellitic dianhydride and 1-25 parts of graphene. A preparation method comprises the steps of weighing ODA (octyl decyl adipate) and the graphene in proportion, measuring a DMAC (dimethylacetamide) solvent, adding the ODA, the graphene and the DMAC solvent to a reaction vessel, using ultrasonic till the ODA is dissolved sufficiently and the graphene is dispersed completely in the DMAC to obtain a graphene suspension, adding PMDA (pyromellitic dianhydride) in batches under high-speed stirring conditions till weak pole climbing appears, continuing to stir to allow diamine to react with dianhydride completely, and flattening an obtained graphene/PAA (poly acrylic acid) complex to obtain a composite film with uniform thickness so as to obtain a graphene polyimide composite film. The composite is 0.5 g/cm<3>-1.5 g/cm<3> in density and 60-170 KJ/m<2> in tensile strength.

The invention relates to a corona-resistant polyimide film containing high-concentration nano metal oxide, which comprises the following main components: benzenetetracarboxylic anhydride, 4, 4'-diamino diphenyl ether and nano-scale aluminum oxide, wherein the particle size of the nano-scale metal oxide is in the range from 30nm to 50nm. The film provided by the invention has the following outstanding advantages that a novel coupling agent is synthesized and is compounded with titanate coupling agent NDZ-130 to conduct surface modification on prepared alpha-Al2O3, thus the modified nano-particles can be steadily and uniformly dispersed in the substrate polyimide film with relatively high mass percentage (can reach 30wt%). By adoption of the above novel technical scheme of the invention, the technical problem that high-concentration nano-metal oxide is very difficultly doped uniformly in the corona resistant polyimide film according to the prior art is solved well, and meanwhile the mechanical strength of the film is kept from dropping.

The present invention relates to a corona-resisting insulated wire enamel for adjustable frequency motor and its preparation process. Said insulated wire enamel is formed from two portions of polyesterimine paint containing isocyanurate (THEIC) and nano material for quantum screening, and it is characterized by that its composition includes (by 100 portions) 10-20 portions of dimethyl terephthalate, 4-10 portions of glycerin, 5-20 portions of ethanediol, 5-12 portions of THEIC, 0.1-0.2 portion of catalyst, 5-15 portions of metabenzene diformic anhydride, 4-8 portions of 4,4-diaminodiphenyl ether, 0.2-0.3 portion of solidifying agent, 4-10 portions of screening agent, 0.5-2 portions of compounding agent, 15-40 portions of solvent, 10-35 portions of diluting agent and 0.5-1.5 portions of adjuvant.

A process of preparing 3ú¼4'-diamino diphenyl ether. It comprises: taking nitrodiphenyl ether as the raw material, hydrazine hydrate as the reducing agent, reducing in the presence of a catalyst, obtaining 3ú¼4'-diamino diphenyl ether at a low pressure. The invention overcomes unsafe factors in the method of high-pressure hydrogenation, avoid the step of highpressure distillation, and has mild reactive conditions. The product has good purity. So the invention is suitable for industrial production.

The present invention discloses a kind of polyimide fiber and its preparation process. The preparation process includes the following steps: 1. reacting 4, 4í»-diamino diphenyl ether and pyromellitic dianhydride in the weight ratio of 1 to 1.02 with N, N-dimethyl acetylamide solution of 15-20 % concentration at 0-5 deg.c to obtain polyamic acid solution; 2. wet spinning the polyamic acid solution and imidation reaction of the polyamic acid fiber to obtain polyimide fiber through dewatering and cyclization; and 3. mixing the polyimide fiber with acetic anhydride and triethylamide, flushing with acetone, soaking and drying to obtain the polyimide fiber. The present invention has positive effects of optimized synthesis condition of spinning solution, prolonged solidification period of initially formed fiber in the solidification bath, and fiber with ideal mechanical performance.

The invention discloses an epoxy resin curing agent, an epoxy resin pouring sealant as well as the relevant preparation methods. The epoxy resin curing agent comprises 10 to 60 diaminodiphenylmethane, 20 to 70 diaminodiphenyl ether or diaminodiphenylsulfone, and 10 to 40 multi-amine curing agent, all calculated in pbw (part by weight). The preparation method for the curing agent comprises the following steps: mixing and heating the substances, raising the temperature to 90-110 DEG C, then stirring for 1 to 3 hours in thermal insulation state, and finally simply cooling the mixture to room temperature. The curing agent is liquid under normal temperature, and mixes well with the epoxy resin. The epoxy resin pouring sealant comprises 100 pbw epoxy resin which has at least two epoxy groups and is liquid under normal temperature, and 10 to 40 pbw epoxy resin curing agent; the preparation method for the pouring sealant comprises the following steps: adding the epoxy resin curing agent into the epoxy resin, mixing for 10 to 30 minutes, then debubble in vacuum state for 10 to 30 minutes, and finally simply removing the vacuum state. The transition temperature of vitrification for the pouring sealant thus acquired is pretty high, and the compound of epoxy resin cured is excellent in electromechanical and thermal performance.

The invention relates to a bisphthalonitrile resin/aromatic amine organic montmorillonite nano composite material and a preparation method thereof, belonging to the technical field of thermosetting resin composite materials. The bisphthalonitrile resin/aromatic amine organic montmorillonite (p-BA-OMMT) nano composite material comprises the components in parts by mass: 100 parts of bisphthalonitrile monomer, 0.5-5 parts of p-BA-OMMT, and 3 parts of curing agent of 4,4'-Bisaminophenoxyphenylsulfone (p-BAPS). The method comprises the steps of montmorillonite organic treatment and composite material preparation. The bisphthalonitrile resin/p-BA-OMMT nano composite material, prepared by the preparation method, has excellent mechanical property and thermal stability, is lower in preparation cost, satisfies the application requirement of industrial production, and has broad application prospect in the fields, such as vehicles, mechanicals, aviation, aerospace and submarines.

The invention relates to a method for preparing polyimide multilayer complex films containing inorganic nanometer powder. Polyimide multilayer complex materials containing inorganic nanometer powder often reduce the mechanical property of films, and obviously reduce the property of the films especially when the nanometer powder is unevenly distributed. The method comprises the following steps of: (1) pre-processing the inorganic nanometer powder; (2) dissolving 4, 4'- diaminodiphenyl ether and pyromellitic dianhydride as raw material monomers into a solvent, and polymerizing to generate polyamic acid solution; (3) dispersing the pre-processed inorganic nanometer powder to the solvent through an ultrasound, and adding the solvent to the polyamic acid solution to prepare the polyamic acid solution containing the inorganic nanometer powder; (4) sequentially paving films on the polyamic acid solution containing the inorganic nanometer powder and the pure polyamic acid solution; and (5) putting the films in an oven for hot-imidization treatment at the temperature of 50 to 400 DEG C to obtain the polyimide hybrid multilayer complex films containing the inorganic nanometer powder. The invention is used for preparing the polyimide multilayer complex films containing the inorganic nanometer powder.

The present invention uses 4,4-diphenyl ether tetrahydric dianhydride and 4,4'-diaminodiphyl ether as polymerization monomer, and adopts the solution polycondensation method combining chemical imidation process and thermal imidation process to synthesize the high-temp.-resistant and solvent-resistant polyimide resin. Said invented polyimide resin possesses good working property, the polyimide plate material die-moulded by using said polyimide resin possesses high strength and fire resistance, its glas-stransition temperature is 267.7 deg.C, 5% thermal weight loss temperature is 543.1 deg.c, tensile strength is 145 MPa, impact strength is 192 KJ/sq.m, compressive strength is 1635 MP and oxygen index is 46.2.

Polyimides having a desired combination of high thermo-oxidative stability, low moisture absorption and excellent chemical and corrosion resistance are prepared by reacting a mixture of compounds including (a) 3,3',4,4'-benzophenonetetracarboxylic dianhydride (BTDA), (b) 3,4'-oxydianiline (3,4'-ODA), and (c) 5-norbornene-2,3-dicarboxylic anhydride (NA) in a high boiling, aprotic solvent to give 5 to 35% by weight of polyamic acid solution. The ratio of (a), (b), and (c) is selected to afford a family of polyimides having different molecular weights and properties. The mixture first forms a polyamic acid precursor. Upon heating at or above 300° C., the polyamic acids form polyimides, which are particularly suitable for use as a high temperature coating, adhesive, thin film, or composite matrix resin.

The invention discloses a single-component reactive thixotropic polyurethane waterproof paint which comprises the following components in parts by weight: 10-25 parts of isocyanate, 60-100 parts of polyether, 20-40 parts of plasticizer, 0.1-1 part of polymerization inhibitor, 0.1-1 part of amine reactant, 0.2-1 part of catalyst, 20-80 parts of pigment and filler, 5-20 parts of solvent and 0.1-1 part of high-performance assistant. The amine reactant is one or mixture of more of diaminodiphenyl ether, diamidodicyclohexyl methane, dialkylol amine and the like. The polyurethane waterproof paint has favorable thixotropic properties, and basically does not flow when being applied 2-3 times into a 1.5-2 mm coating in facade construction, thereby solving the problems of severe flow and difficulty in thickness increase in facade construction of the existing single-component polyurethane waterproof paint, effectively reducing the waste of materials and enhancing the operating efficiency and operating quality.

The invention relates to a polyimide nano-fiber and a preparation method thereof. The invention adopts the technical scheme that 4,4'-oxydianiline (ODA) and pyromellitic dianhydride (PMDA) are used as polycondensation monomers to synthesize a polyamic acid (PAA) solution; in the reaction process, europium oxide which is processed by a coupling agent and has fluorescent effect is added, and then, the PAA/europium oxide nano-fiber is prepared by using the electrostatic spinning technology, wherein the fiber diameter can be controlled to be between 50 and 200nm; and then, the PAA/europium oxide nano-fiber is put in an oven to be heated gradually for imidization to enable the PPA/europium oxide to carry out polycondensation, thereby generating the polyimide nano-fiber with the fluorescent effect. The application of the polyimide in the high-technology fields, such as anti-falsification certificates, bills, aerospace, microelectronics and the like is extended.

The invention relates to a biaxially oriented polyimide film for flexible printed circuit board base material and a preparation method of the biaxially oriented polyimide film. The method is characterized by mainly comprising the following steps of: (1) polymerizing: preparing a basic solution of polyimide acid according to the following proportions: 1-5% of p-phenylenediamine, 2-8% of biphenyltetracarboxylic dianhydride, 5-10% of diaminodiphenyl ether, 8-15% of pyromellitic dianhydride and 62-84% of dimethylacetylamide; (2) salivating the solution into a film; (3) longitudinally stretching the film according to the stretching ratio of 1:1.02-1.15; (4) transversely stretching the film according to the stretching ratio of 1:1.05-1.2 and carrying out imidization; (5) cutting the edge and rolling up the film; (6) postprocessing the film; and (7) cutting and packaging the film. The special biaxially oriented polyimide film material conforming to the flexible printed circuit board base material can be obtained by using the preparation method provided by the invention.

Disclosed is a biaxially oriented multilayer film comprising at least two layers A-B, wherein A and B represent separate layers at least one of which layers comprises a polyimide having a Tg of greater than about 200° C., wherein the film has a CTE of less than 35 ppm/° C., and wherein A comprises 60 wt. %-100 wt. % of amorphous polymer with 0 wt. %-40 wt. % of crystallizable polymer, and B comprises 60 wt. %-100 wt. % crystallizable polymer with 0 wt. %-40 wt. % amorphous polymer, the relative thicknesses of layer A to layer B are in a ratio in a range of between 1:5 and 1:100, and the thickness of the film is in a range of between 5 μm and 125 μm. Also disclosed is a biaxially oriented monolithic film comprising a polyimide with structural units formally derived from 3,4-diaminodiphenylether and 4,4-oxydiphthalic anhydride. Laminates comprising the films and methods for making film and laminate are also disclosed. Articles comprising a film or laminate of the invention are also disclosed.

The invention relates to a liquid crystal aligning agent, a liquid crystal aligning film and a liquid crystal display element. The invention provides a liquid crystal aligning agent which is provided with an excellent pretilt angle property by an optical alignment method, and can form a liquit crystal aligning film which does not result in poor display performance even when drived continuously for a long time. The liquit crystal aligning agent contains: (A) polyamide acid A, which is obtained by allowing tetracarboxylic dianhydride to react with diamines containing a diamine with a photoreactive structure; (B) polyamide acid B, which is obtained by allowing at least one tetracarboxylic dianhydride selected from a group composed of 1, 2, 3, 4-cyclobutane tetracarboxylic dianhydride, pyromellitic dianhydride to react with at least one diamine selected from a group composed of 2, 2'-dimethyl-4, 4'-diaminobiphenyl, p-phenylenediamine, 4, 4'-diaminodiphenylmethane, 4, 4'-diaminodiphenyl ether (with the polyamide acid A excluded).

The invention discloses a shape memory polyimide prepared by virtue of chemical imidization and a preparation method thereof. The preparation method is used for preparing the thermoplastic shape memory polyimide by synthesizing a polyamide acid prepolymer from reaction monomers 4,4'-diaminodiphenyl ether and bisphenol A dianhydride and then carrying out chemical imidization under the action of acetic anhydride, triethylamine and pyridine. The glass-transition temperature of the thermoplastic shape memory polyimide exceeds 220 DEG C, and therefore, the thermoplastic shape memory polyimide can be applied to the field of the high-temperature shape memory polymers; and the thermoplastic shape memory polyimide has excellent processability, thermal stability, mechanical properties and shape memory properties.