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Preparation method for polymide film with low thermal expansion coefficient

A polyimide film, low thermal expansion coefficient technology, applied in the field of polyimide film preparation, can solve problems such as unfavorable dimensional stability, and achieve the effects of balanced performance, high stability, electrical strength, and high electrical strength

Active Publication Date: 2015-11-11
安徽统唯新材料科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Polyimides with traditional structures are mainly synthesized from dibasic anhydrides and dibasic amines. The source of raw materials is wide and the synthesis is relatively easy.
There are many kinds of dianhydrides and diamines, and polyimides with different properties can be obtained by different combinations. The CTE of polyimide films with traditional structures generally ranges from 40 to 65ppm / K. Compared with copper foil and silicon wafers, the CTE CTE16~17ppm / K is too high, which is not conducive to the dimensional stability of the laminated copper foil

Method used

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  • Preparation method for polymide film with low thermal expansion coefficient

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Comparison scheme
Effect test

Embodiment 1

[0019] The preparation method of low thermal expansion coefficient polyimide film comprises the following steps:

[0020] (1) under the normal pressure condition of being full of nitrogen in the still body of 45 ℃, place pyromellitic dianhydride and p-phenylenediamine in dimethylacetamide solvent to carry out polycondensation reaction, pyromellitic dianhydride and p-phenylenediamine The molar ratio of phenylenediamine is 1:1.005. When carrying out the polycondensation reaction, first dissolve p-phenylenediamine in dimethylacetamide solvent (stirring speed 70r / min, time not less than 2h), then add it in 4 times Pymellitic dianhydride (stirring speed 115r / min), and in the process of adding pyromellitic dianhydride, the time interval between two adjacent times is 60 minutes, and the amount of each addition in the first three times accounts for 54% of the remainder. %, after the addition of pyromellitic dianhydride, react for 180 minutes to obtain polyamic acid glue A with a solid...

Embodiment 2

[0025] The preparation method of low thermal expansion coefficient polyimide film comprises the following steps:

[0026] (1) Under the normal pressure condition of being full of nitrogen in the still body of 35 ℃, place pyromellitic dianhydride and p-phenylenediamine in dimethylacetamide solvent to carry out polycondensation reaction, pyromellitic dianhydride and p-phenylenediamine The molar ratio of phenylenediamine is 1:1.002. When carrying out the polycondensation reaction, first dissolve p-phenylenediamine in dimethylacetamide solvent (stirring speed is 70r / min, and the time is not less than 2h), and then add it in 4 times. Pyromellitic dianhydride (stirring speed 115r / min), and in the process of adding pyromellitic dianhydride, the time interval between two adjacent times is 40 minutes, and the amount of each addition in the first three times accounts for 45% of the remainder. %, after adding the pyromellitic dianhydride, react for 200 minutes to obtain polyamic acid glu...

Embodiment 3

[0031] The preparation method of low thermal expansion coefficient polyimide film comprises the following steps:

[0032] (1) under the normal pressure condition of being full of nitrogen in the still body of 55 ℃, place pyromellitic dianhydride and p-phenylenediamine in dimethylacetamide solvent to carry out polycondensation reaction, pyromellitic dianhydride and p-phenylenediamine The molar ratio of phenylenediamine is 1:1.008. When carrying out the polycondensation reaction, first dissolve p-phenylenediamine in dimethylacetamide solvent (stirring speed 70r / min, time not less than 2h), then add 4 times Pyromellitic dianhydride (stirring speed 115r / min), and in the process of adding pyromellitic dianhydride, the time interval between two adjacent times is 80 minutes, and the amount of each addition in the first three times accounts for the remaining wt. %, after the addition of pyromellitic dianhydride, the reaction was continued for 160 minutes to obtain polyamic acid glue A...

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Abstract

The invention provides a preparation method for a polymide film with the low thermal expansion coefficient. The method comprises the following steps that 1, pyromellitic anhydride and ursol are placed into a dimethylacetamide solvent for condensation polymerization to obtain a polyamide acid glue solution A; 2, 2, 3',3,4'- biphenyltetracarboxylic dianhydride and 4,4'-diaminodiphenyl ether are placed into the dimethylacetamide solvent for condensation polymerization to obtain a polyamide acid glue solution B; 3, the polyamide acid glue solution A and the polyamide acid glue solution B are mixed for a high-speed stirring reaction to obtain a polyamide acid glue solution C; 4, the tape casting technology is adopted on the polyamide acid glue solution C to obtain a film, and finally the film is fed into an imidization furnace to be processed to obtain the polymide film with the low thermal expansion coefficient. The CTE of the polymide film with the low thermal expansion coefficient is 15-17 ppm / K, and the polymide film further has the advantages of being high in strength, stability, electrical strength and the like.

Description

technical field [0001] The invention relates to the field of preparation of polyimide films, in particular to a preparation method of low thermal expansion coefficient polyimide films. Background technique [0002] Polyimide refers to a class of polymers containing an imide ring (-CO-NH-CO-) on the main chain. It is one of the organic polymer materials with the best comprehensive properties and has been widely used in aviation and aerospace. , microelectronics, nanometer, liquid crystal, separation membrane, laser and other fields. When polyimide is used as a base film on a flexible circuit board, the dimensional stability of the film is very high, so the coefficient of thermal expansion (CTE) is an important parameter to investigate the dimensional stability of the film. [0003] Polyimides with traditional structures are mainly synthesized from dibasic anhydrides and dibasic amines, which have a wide range of raw materials and are easy to synthesize. There are many varie...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J5/18C08L79/08C08G73/10
Inventor 王超
Owner 安徽统唯新材料科技股份有限公司
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