99 results about "Optical alignment" patented technology

The invention discloses an active optical alignment method based on a local lightweight language model, and particularly relates to the technical field of precision installation and adjustment, comprising the following steps: extracting image indexes and platform attitude information through image acquisition, constructing a unified input format, verifying and inputting the language model; generating a six-degree-of-freedom pose adjustment strategy and a credibility score; the strategy is executed by the platform control device after being verified by a preset criterion; scoring is performed again after execution, and whether a feature posture is recorded or error compensation is triggered is judged according to a scoring result, so that subsequent input and strategy generation are optimized, and alignment precision and stability are improved; according to the method, the data consistency is guaranteed through a unified input format and a verification mechanism, the alignment precision is improved in combination with a dynamic scoring strategy, and the stability and fault tolerance of the system are enhanced by introducing a feature attitude recording and error back-filling mechanism, so that a strategy generation and execution process with high reliability, high adaptation and high robustness in an active optical alignment task is realized.

An example test system includes a probe card configured to contact a device under test (DUT); a module including a first optical connector configured to contact a second optical connector on the DUT, with the first optical connector being for a fiber optic cable; and a motion system configured to move into, and out of, contact with the module. When the motion system is in contact with the module, the motion system is configured to move the module relative to the DUT in order to align the first optical connector to the second optical connector.

The application provides a batch precise chip pasting method, comprising: pasting an integral piece of to-be-pasted chips on a base film, the base film being provided with a boss structure, and the top surface of the boss structure being provided with a first alignment mark; cutting the to-be-pasted chips based on the chip layout on a target wafer to form a plurality of independent chips on the base film; aligning the cut to-be-pasted chips with the target wafer, wherein the alignment is achieved by aligning the first alignment mark on the top surface of the boss structure of the base film with a second alignment mark on the target wafer; pasting the plurality of chips on the base film on the target wafer; and removing the base film. The application realizes super-high-precision optical alignment and solves the technical problem of direct alignment between thick chip wafers.

The utility model relates to an optical alignment assembly for an exposure machine. The optical alignment assembly comprises two optical alignment devices and a double-sided reflecting mirror, the double-sided reflecting mirror is vertically arranged on a position to be aligned of a working platform and is provided with a first vertical reflecting surface and a second vertical reflecting surface opposite to the first vertical reflecting surface, and the first vertical reflecting surface and the second vertical reflecting surface are respectively and optically coupled with the semi-transparent mirror. The double-sided reflector is provided with at least one preset pattern for imaging to an image acquisition assembly, and the preset pattern is used as a positioning reference of the to-be-aligned light.

The conductive light shield for a probe station of the present invention for cable connection pin clips includes a conductive shield body and a light-absorbing layer. The conductive shield body covers the outside of the pin clip on the probe station. The conductive shield body includes a top wall and side walls extending downwards from the edge of the top wall, with one end of the side wall away from the top wall contacting the probe station. The conductive shield body provides electrostatic shielding and optical protection, ensuring that the pin clip is protected from electrostatic discharge and stray light interference during testing, thereby improving testing accuracy and stability. Cable openings are provided on the side walls to accommodate the cable layout between the pin clip and the testing machine, ensuring that the cable can pass smoothly and maintain a normal connection with the testing system. The light-absorbing layer is disposed on the surface of the conductive shield body. The organic carbon black coating has good light absorption properties and can effectively absorb stray light from the environment, reducing interference from light reflection on the optical alignment system.

The application relates to a high-precision optical alignment assembly method of a scanning mirror, and belongs to the technical field of laser radar manufacturing equipment, and solves the technical problems of insufficient precision, no compensation for glue shrinkage, low efficiency and high cost of special equipment in the existing scanning mirror assembly. Based on the light reflection principle, the method characterizes the included angle between the scanning mirror and the motor shaft through light path amplification offset, constructs an optical alignment system by using point laser, mirror group and scale receiving plate, completes coarse adjustment and fine adjustment by cooperating with the scanning mirror adjustment jig, makes the positions of the laser spots on the scale receiving plate coincide after the motor rotates 180 degrees, and then completes UV glue curing through the light curing device, and realizes high-precision assembly by combining the glue shrinkage compensation mechanism and the quantitative verification standard. Through the optical alignment method of light path amplification offset, the quantitative adjustment, the verification standard and the glue shrinkage compensation mechanism are combined, high-precision assembly of the scanning mirror and the motor shaft is realized, the glue shrinkage preset offset compensation scheme is established, and the angle offset problem of UV glue curing shrinkage is avoided.

This invention relates to the field of vehicle electric drive assembly technology, specifically to a device and method for assembling the inner and outer housings of a motor, comprising a planar motion mechanism, a pressing mechanism, a controller, and a first positioning fixture and a second positioning fixture arranged sequentially from top to bottom; the first positioning fixture is used to position and clamp the rear end cover of the motor, thereby completing the axial positioning of the inner housing of the motor; the second positioning fixture is used to support and position the rear housing of the gearbox, thereby completing the axial positioning of the outer housing of the motor; the first positioning fixture is provided with a first optical alignment device, and the second positioning fixture is provided with a second optical alignment device; the controller first uses the first and second optical alignment devices to control the planar motion mechanism to drive the first positioning fixture to complete the coaxial positioning of the outer housing of the motor and the inner housing of the motor; the controller then controls the pressing mechanism to drive the first positioning fixture to move linearly in the vertical direction, completing the assembly of the outer housing of the motor and the inner housing of the motor.

An on-board optical coupling apparatus, used between two data processing devices, includes an optical waveguide including a plurality of alignment path units and waveguide paths. A first photonic device includes a plurality of first return paths and first optical channels. A second photonic device includes a plurality of second return paths and second optical channels. The first optical channels and the second optical channels are optically aligned with respective waveguide paths simultaneously with passive optical alignment of the first return paths, the second return paths, and the alignment path units in a one-time alignment process.

The invention belongs to the technical field of precision test of numerical control machine tools, and discloses a split inertia measurement device and method for linear axis error detection of a machine tool. The split inertial measurement device is mainly composed of a bottom substrate, an orthogonal three-axis zero-point positioner, a single-axis inertial sensor and an integrated data acquisition module. The single-axis inertial sensors are sequentially assembled to X-direction, Y-direction and Z-direction datum planes, static calibration and standard movement track measurement are combined, multiple sets of inertial data are obtained, coordinate registration and pose calculation are achieved through data fusion, and therefore the positioning error, the straightness error and the angle deviation of the linear axis of the machine tool are obtained. The split inertial measurement device adopts a split structure and sensor multiplexing design, avoids complex optical alignment and multi-sensor configuration, and is compact in structure and convenient to mount; in cooperation with wireless data acquisition and magnetic attraction fixing modes, six-dimensional geometric error detection can be efficiently completed on a machine tool site, hardware investment is reduced, and measurement applicability and popularization value are improved.

An operating method of a space laser communication device is provided. The operating method includes a step of performing optical alignment so that one of optical systems performs optical multiple input multiple output (MIMO)-based full-duplex communication with another space laser communication device, based on motion control by a motion control device and a step of performing optical alignment so that the other optical system of the optical systems performs optical MIMO-based relay communication with another space laser communication device, based on motion control by the motion control device.

The application relates to the field of quantum information technology, in particular to a ball array packaging method for a low-temperature superconducting quantum chip. Tin-indium-gold-silver multi-element solder is adopted, which still has good toughness and superconducting characteristics in a low-temperature environment. A specific arrangement of pad arrays is arranged in the chip wiring area, a plurality of ground pads are arranged around each signal pad, a coaxial electromagnetic shielding structure is formed, and high-frequency crosstalk is significantly inhibited. A composite metal lining plate with a thermal expansion coefficient matched with the chip substrate is used, and the PCB is combined through high-thermal-conductivity adhesive material, so that the problem of thermal stress mismatch is effectively solved. The packaging supports single-layer, double-layer and three-dimensional stacked superconducting chips, and is suitable for large-scale quantum bit integration. Through optical alignment and a two-step low-temperature reflow soldering process, the welding temperature and atmosphere are accurately controlled, and thermal damage to sensitive elements such as Josephson junctions is avoided. The method solves the technical problems of high-density interconnection, electromagnetic compatibility, low-temperature reliability and the like of the superconducting quantum chip.

The application provides a complex amplitude SLM adaptive optical path alignment system and method for aligning a to-be-aligned light beam in a disturbed channel, wherein the to-be-aligned light beam in the disturbed channel is decomposed into target light and reference light after passing through a beam splitter; a wavefront sensor receives the reference light, acquires phase information of the reference light and inputs the phase information into a processor; the processor calculates a superimposed compensation amount of complex amplitude regulation according to an alignment position and generates a phase hologram, and inputs the phase hologram into a liquid crystal controller; the phase hologram comprises a plurality of concentric circles, and is used for simulating a ring-shaped blazed grating of focused light rays at a preset alignment position; a liquid crystal of a phase SLM receives the target light, the liquid crystal controller converts the phase hologram into a control voltage, and controls the liquid crystal to perform alignment output on the target light; and the application can continuously correct and align the light beam transmitted in the disturbed optical channel based on pure phase SLM complex amplitude regulation.

The utility model discloses an aircraft boarding bridge butt joint auxiliary device, the device includes longitudinal guide light source, sets up in the aircraft mouth below and sets up at least a group, is used for sending light and projects first alignment mark on the aircraft body surface, transverse guide light source, set up in the aircraft mouth top, is used for sending light and projects second alignment mark on the aircraft body surface, wherein, the aircraft mouth is provided with the reference point position corresponding with longitudinal guide light source position, longitudinal guide light source can move or set up multiple groups through drive part to adapt to different models, and the aircraft mouth is equipped with image acquisition module group. Through two -dimensional optical alignment of longitudinal and transverse light source, operator can complete once adjustment at 2m distance, realizes the accurate butt joint of boarding bridge and hatch, improves alignment efficiency and accuracy, enhances low energy visibility environment adaptability, is applicable to the quick butt joint scene of various aircraft boarding bridge.

A method for manufacturing a semiconductor-based LIDAR sensor system for a vehicle, includes: providing a semiconductor optical device in a first alignment position within the LIDAR sensor system; obtaining an interference pattern associated with a first light beam that passes through the semiconductor optical device at a first location and a second light beam that passes through the semiconductor optical device at a second location; determining a position of the first location relative to the second location based on the interference pattern; and aligning the semiconductor optical device in a second alignment position within the LIDAR sensor system, based on the position of the first location relative to the second location.

Trackable retractor systems, apparatuses, devices, and methods involving: retractor blades, each retractor blade having a proximal end and a distal end, the retractor blades having a blade axis defined by a midline therebetween or thereamong; actuation arms, each actuation arm having a proximal end and a distal end, each actuation arm distal end configured to correspondingly couple with each retractor blade proximal end, and each actuation arm configured to correspondingly actuate each retractor blade; a positioning arm configured to position each actuation arm; a movable clamp configured to movably couple with the positioning arm and one actuation arm and to move the one actuation arm relative to another actuation arm; and three distinct tracking features disposed in a tracking plane, two distinct tracking features configured to correspondingly couple with the retractor blade proximal ends, one other distinct tracking feature configured to couple with the movable clamp, and each distinct tracking feature having a distinct tracking token, whereby the blade axis is maintained in a position orthogonal to the tracking plane, and whereby optical alignment is maintained along the blade axis in relation to a desired focal depth.

A wearable electronic device can include a unibody optical enclosure for supporting a display and facilitating movement thereof for proper optical alignment with the eyes of the user. The optical enclosure can include a barrel with a tapered diameter and a coating formed thereon with a low reflectance to increase a relative contrast ratio of the display. The optical enclosure can further one or more hangers each defining a channel to receive a guide rod. The hangers can each provide an inner surface with a coating that has a low coefficient of friction to facilitate sliding against the guide rod.

The invention provides a gas detection method and a gas detection system, and belongs to the technical field of spectral measurement, and the method comprises the following steps: carrying out collimation processing on a laser beam through a collimating lens; the wavelength of the laser beam is matched with the A band of the target gas; after the collimated laser beam penetrates through the gas in the medicine bottle to be detected, focusing the emergent laser beam to a quartz tuning fork by using a focusing lens; the quartz tuning fork converts the received optical signal into an electric signal; the absorption spectrum of the target gas is obtained along with the change of the wavelength of the laser, and then the concentration of the target gas in the medicine bottle to be detected is determined. The intensity of a traditional transmission absorption measurement mechanism is improved through the photoacoustic effect, limitation of medicine bottle refraction and internal shielding on long optical path construction is avoided, the requirements of the system for optical alignment precision and spatial layout are greatly reduced, and miniaturization and engineering applicability of equipment are achieved while high sensitivity is guaranteed.

A method for manufacturing a semiconductor-based LIDAR sensor system for a vehicle, includes: providing a semiconductor optical device in a first alignment position within the LIDAR sensor system; obtaining an interference pattern associated with a first light beam that passes through the semiconductor optical device at a first location and a second light beam that passes through the semiconductor optical device at a second location; determining a position of the first location relative to the second location based on the interference pattern; and aligning the semiconductor optical device in a second alignment position within the LIDAR sensor system, based on the position of the first location relative to the second location.

This invention provides a method for dynamic resource allocation in radar systems for guiding electro-optical alignment systems, relating to the field of radar resource scheduling technology. It addresses the limitations of traditional radar scheduling methods, such as low resource utilization, weak parallel processing capabilities, and poor versatility. The method involves: acquiring target information for each target within the radar detection area in real time to determine the guidance priority of each target; dynamically dividing the detection area into multiple functional regions, each associated with at least one task type; constructing a resource allocation weight model based on the task requirements of each region, the total available system resources, and beam scanning loss parameters; dynamically allocating beam pointing resources, dwell time resources, and beam position arrangement resources to each functional region; coordinating the execution of tasks corresponding to each region; and outputting the generated target guidance information to the electro-optical alignment system. This invention effectively meets the guidance requirements of electro-optical alignment systems for high precision, high real-time performance, and high interception probability.

An optical assembly for demultiplexing wavelength channels includes a retro-reflecting Z-block of optically transmissive material having a port facing face and a back face. An optical port assembly including an array of channel ports and a common port is proximate to the port facing face. An array of optical filters is located along the port facing face in an optical alignment with respective optical ports. The filters are configured to selectively transmit light of corresponding wavelength channels. The back face of the retro-reflecting Z-block includes a main reflective surface between first and second angled reflective surfaces. The first and second angled reflective surfaces together form a retroreflector for light entering the retro-reflective Z-block via the common optical port.

The application provides a multi-ommatidium element alignment method, system, device, computer equipment and medium, and relates to the technical field of optical alignment. The method comprises the following steps: acquiring a parameter of a first light spot of a first ommatidium element in a multi-ommatidium element through which light collected by a photoelectric detector passes; acquiring a parameter of a second light spot of the multi-ommatidium element through which light collected by the photoelectric detector passes; determining whether the geometric centers of the light spots of the multi-ommatidium element are aligned according to the parameter of the first light spot and the parameter of the second light spot; if not, calculating an ommatidium eccentricity of a target ommatidium element according to a positional deviation of the first light spot and the second light spot and a preset corresponding relationship between the positional deviation and the ommatidium eccentricity; and adjusting the position of the target ommatidium element through a numerical control adjusting device according to the ommatidium eccentricity until the geometric centers of the light spots of the multi-ommatidium element are aligned. The application can ensure that the geometric centers of the light spots of the multi-ommatidium element are aligned, optimize the optical effect of the multi-ommatidium element, and improve the projection effect of a projection product.

Optical assemblies and methods of forming the same with light-curable adhesive are disclosed. An example method of assembling an optical assembly includes coupling a lens assembly with a lens assembly holder to form a lens sub-assembly, and applying a light-curable adhesive to a lens chassis fixedly mounted to a printed circuit board (PCB). The method may include optically aligning the lens sub-assembly with an image sensor fixedly mounted to the PCB. When optical alignment is complete, the method may include substantially curing the adhesive with light to fixedly mount the lens sub-assembly to the lens chassis to hold the lens assembly in a fixed optical alignment with the image sensor.

This invention relates to a method for rapid image finding during lens centering machining, comprising an image finding device. The device includes a machine tool spindle, with an autocollimator centering mechanism connected to the front end of the spindle via an optical alignment axis. A light tube extension tube passes through a shaft hole at the rear end of the spindle, and an autocollimator is connected to the rear end of the extension tube via a crosshair adjustment mechanism. The autocollimator is mounted on an adjustable tilting worktable via a spindle radial adjustment mechanism. The adjustable tilting worktable is mounted on the machine tool frame, and the autocollimator is driven by an electric mechanism to perform reciprocating translational adjustment along the axial direction. This rapid image finding method for lens centering machining involves pre-adjustment before lens processing. By adjusting the tilt of the adjustable tilting worktable to level the image and adjusting the autocollimator's spindle radially to make it coaxial with the machine tool spindle, multiple sets of spherical center images are quickly located along the machine tool spindle axis. Adjustment ensures the feedback crosshair image is displayed in the appropriate position. The structure is simple, operation is easy, and adjustment is convenient.

Methods and systems are provided for a microscope system. In one example, a method for image-based detection of optical alignment for the microscope system comprises acquiring a plurality of contrast samples of a field of view of a subject, determining a contrast distribution for a plurality of divided sub-regions for the field of view based on the plurality of contrast samples, and generating an amount of angular discrepancy based on an in-focus position derived from the contrast distribution for each of the plurality of divided sub-regions. In one example, the method further comprises adjusting the microscope system based on the amount of angular discrepancy.

The invention provides a method for accurately mounting chips in batches, which comprises the following steps that: a whole chip to be mounted is pasted on a substrate film, the substrate film is provided with a boss structure, and the top surface of the boss structure is provided with a first alignment mark; cutting the to-be-mounted chip based on the chip layout on the target wafer to form a plurality of independent chips on the substrate film; aligning the cut to-be-mounted chip with a target wafer, wherein the alignment operation is realized by aligning a first alignment mark on the top surface of the boss structure of the substrate film with a second alignment mark on the target wafer; mounting the plurality of chips on the substrate film on a target wafer; and removing the base film. According to the invention, ultrahigh-precision optical alignment is realized, and the technical problem of direct alignment between thick chip wafers is solved.

An optical device (OD), a semiconductor wafer structure (SWS) and a method of making the same are provided. The OD has a first semiconductor member (FSM), a second semiconductor member (SSM) and an OD mount. The OD mount has an optical component whose function is to receive an optical beam (OB) from a source and provide the OB to a destination. A portion of the OD mount is held in a cavity defined by the FSM and the SSM. The OD mount is fixedly secured to the FSM and to the SSM. The FSM and the SSM are also fixedly secured to each other. The OD may be integrated in opto-electrical device. Having the support portion of the OD mount held in place in the cavity minimizes movement of OD mount during operation of the OE device, thereby minimizing movement of the optical beam. The SWS comprises multiples instances of the OD. Manufacturing the SWS is achieved using passive optical alignment.

In an ion analyser apparatus, a chamber is provided for receiving ions via an ion input port thereof and for outputting the received ions via an ion output port thereof. An ion optical assembly is configured to manipulate a flow of ions from the ion input port to the ion output port along an ion optical axis. A cartridge comprises the ion optical assembly. The chamber comprises a chassis into which the cartridge is removably mountable by insertion therein via an opening in the chamber to position the ion optical assembly in ion optical alignment with both the ion input port and the ion output port.

An optical sensor package includes an emitter die mounted to an upper surface of a package substrate. A sensor die is mounted to the upper surface of the package substrate using a film on die (FOD) adhesive layer that extends over the upper surface and encapsulates the emitter die. The sensor die is positioned in a stacked relationship with respect to the emitter die such that a light channel region which extends through the sensor die is optically aligned with the emitter die. Light emitted by the emitter die passes through the light channel region of the sensor die. The emitter die and the sensor die are each electrically coupled to the package substrate.

A multi-spectral optical sensor comprises a plurality of apertures, a plurality of lens arrangements, a plurality of optical filters and a monolithic semiconductor chip defining a plurality of sub-arrays of optical detector regions, each sub-array comprising the same number and relative spatial arrangement of optical detector regions and the optical detector regions of each sub-array being arranged on a predetermined pitch in a direction parallel to a surface of the of the semiconductor chip. The multi-spectral optical sensor is configured so that light from a scene incident on any one of the apertures along any given direction of incidence is transmitted through the corresponding lens arrangement and the corresponding optical filter to the corresponding sub-array of optical detector regions so as to form an out-of-focus image at a plane of the optical detector regions of the corresponding sub-array of optical detector regions.

Provided are an optical alignment apparatus and an optical alignment method. The apparatus includes a substrate mount configured to receive a mounting substrate, a transport apparatus configured to transport an optical device to be bonded to the mounting substrate, a camera provided on the substrate mount and configured to obtain an image signal of the optical device, a controller connected to the camera and configured to control a position of the optical device using the image signal, and an adhesive block portion bonded to an upper surface of the optical device and configured to provide the optical device on the mounting substrate and to be separated from optical device after bonding the mounting substrate and the optical device.