The invention discloses an IPN multi-element heat-conducting structural
adhesive resistant to high and low temperature
damp heat and a preparation method thereof, and belongs to the field of IPN multi-element structural adhesives. The structural
adhesive is prepared by matching a component A and a component B according to a volume ratio of 0.9: 1.1-1, the component A is prepared from the following raw materials in parts by weight: 10 to 20 parts of
silane modified polyether resin A, 10 to 20 parts of
silane modified polyether resin B, 2 to 5 parts of amino-containing
silane coupling agent, 0.1 to 0.5 part of catalyst, 1 to 2 parts of
epoxy curing agent A, 0.5 to 1 part of self-made
epoxy curing agent B, 0.1 to 1 part of catalyst, 1 to 3 parts of
first aid, 0.01 to 0.03 part of color paste and 50 to 70 parts of first heat-conducting filler; the component B is prepared from the following raw materials: 10 to 20 parts of
epoxy resin A, 5 to 10 parts of self-made epoxy resin B, 5 to 10 parts of
reactive diluent, 50 to 70 parts of second heat-conducting filler, 0.1 to 1 part of second aid, 0.01 to 0.03 part of color paste and 1 to 1.5 parts of water. The
adhesive is environment-friendly in component, has excellent heat-conducting property and excellent operation performance, is smooth in construction, and can be used for firmly bonding a base material.