The present invention discloses a method for manufacturing a high-roughness electronic copper foil for a ceramic-based high-frequency plate. The method comprises the procedures of crude foil, first roughening, second roughening, first curing, second curing, third curing, blackening, galvanizing, passivation, coupling agent spraying and drying. The copper foil rough surface roughness of the crude foil process of the invention is greatly improved, the contact area of the copper foil rough surface and resin is greatly increased, the problem of low peel strength caused by poor resin mobility is solved, the uniformity of a rough surface copper tooth of the copper foil produced by the production process is good, the consistency is high, a skin effect caused by a large copper tooth fluctuation is reduced, and the loss in the signal transmission process is reduced.