8results about How to "Increase the inductance value" patented technology

An inductor component includes a blank, a second interlayer insulating layer (33), and an inductor wiring (50). The blank has a first main surface and contains a magnetic material. The second interlayer insulating layer (33) extends in parallel with the first main surface within the blank and is flat. The inductor wiring (50) is in contact with a surface in the second interlayer insulating layer (33) that is parallel with the first main surface. A direction from the inductor wiring (50) side toward the second interlayer insulating layer (33) side in a direction orthogonal to the first main surface is defined as a first positive direction (X1), and a direction opposite to the first positive direction (X1) is defined as a first negative direction (X2). A surface of an outer surface of the second interlayer insulating layer (33) that faces a direction parallel with the first main surface is defined as an end surface (ED). In a certain cross section orthogonal to a center line of the inductor wiring (50), the entire end surface (ED) is an inclined surface that faces the direction parallel with the first main surface and the first negative direction (X2), or the entire end surface (ED) is an inclined surface that faces the direction parallel with the first main surface and the first positive direction (X1).

This invention relates to a DC circuit breaker that adaptively adjusts the current-limiting inductor based on fault current. It includes at least two parallel branches, each branch consisting of a first current limiter, a variable inductor, and a second current limiter connected in series. A switch control circuit is connected in parallel to the first and second current limiters. One end of multiple first current limiters and one end of multiple second current limiters are connected in parallel. The anode of a thyristor is connected between the variable inductor and the second current limiter in the previous branch of the two adjacent branches, and the cathode of the thyristor is connected between the first current limiter and the variable inductor in the next branch of the two adjacent branches. This invention also discloses a current-limiting method for the DC circuit breaker that adaptively adjusts the current-limiting inductor based on fault current. This invention adaptively suppresses the current rise rate, current magnitude, and fault clearance based on the magnitude and rise rate of the fault current in the distribution line, effectively improving fault handling efficiency and the operational safety of the distribution line.

This invention provides a rod-shaped magnetic core and its preparation method, an inductor and its preparation method, and their applications, belonging to the field of non-destructive testing technology for inductor devices. The invention provides a method for preparing a rod-shaped magnetic core, comprising the following steps: filling a mold hole with nanocrystalline alloy wire along the extension direction of the mold hole; then infiltrating the gaps between the nanocrystalline alloy wire with epoxy resin for curing to obtain the rod-shaped magnetic core; the diameter of the nanocrystalline alloy wire is 0.05–0.2 mm; the diameter of the mold hole is 0.3–0.5 mm. The preparation method of this invention can prepare rod-shaped magnetic cores with a diameter of 0.2 mm or more, and the epoxy resin in this invention enhances the strength of the rod-shaped magnetic core, preventing it from breaking when wound with a coil. Furthermore, the rod-shaped magnetic core of this invention does not have the problems of uneven surface and burn-out layer, and does not reduce the relative permeability of the magnetic core.

This application relates to the field of transformer technology, specifically to a chip transformer and power module, including a ceramic substrate; the ceramic substrate includes a plurality of stacked ceramic diaphragms; conductive posts are provided on the ceramic diaphragms, the conductive posts extending perpendicularly to the ceramic diaphragms; helical coils are provided on the surface of the ceramic diaphragms, and the ends of adjacent helical coils are connected through the conductive posts; at least two helical coils are connected through the conductive posts to form a coil winding. The embodiments of this application can significantly increase the number of turns in the winding by using planar helical coils, effectively improving the inductance value and enhancing the coupling coefficient between the primary and secondary coils while achieving a miniaturized integrated design.

The invention discloses an iron-silicon-chromium soft magnetic powder material which comprises the following raw materials in percentage by mass: 2-7% of silicon, 2-10% of chromium, 0-5% of nickel and cobalt and the balance of iron, the use amount of nickel and cobalt is greater than 0, and the sum of the use amount of silicon, chromium, nickel, cobalt and iron is 100%. The iron-silicon-chromium soft magnetic powder material is high in powder apparent density and tap density, low in powder oxygen content and high in inductance value and magnetic conductivity, and can meet the high-performance requirements of electronic components on metal soft magnetic alloy powder.

This invention relates to coil components. The invention provides a coil component capable of ensuring mode-switching characteristics and improving inductance. The coil component comprises: a core having a wound core portion; and a coil wound along the axis of the wound core portion, including a plurality of wires, the coil having a winding region wound around the wound core portion, the winding region having a stranded portion formed by twisting the plurality of wires together, and a parallel portion in which the plurality of wires are not twisted together and run parallel to each other.

The invention relates to the technical field of semiconductor packaging, in particular to a glass substrate with a built-in inductor, a packaging structure and a preparation method of the packaging structure. The glass substrate with the built-in inductor comprises the glass core layer and the inductor arranged in the glass core layer, three-dimensional integration of the inductor in the vertical direction is achieved, the thickness of a packaged product is greatly reduced, meanwhile, a spiral conductor structure in the inductor is wrapped, fixed and protected by the glass core layer, and the packaging quality is improved. The mechanical shock resistance, the vibration resistance and the bending resistance of the glass substrate are far better than those of a packaging process of a surface-mounted substrate surface, and the strength of the glass substrate with the built-in inductor is improved. Furthermore, a plurality of layers of glass substrates with built-in inductors are bonded to obtain a multi-turn inductor, and under the constraint of miniaturization, a high inductance value is realized, so that the utilization efficiency of the packaging structure on a magnetic field is higher, and the energy transfer or energy storage capability is stronger. And the glass substrate with the built-in inductor only needs to be produced on a traditional glass substrate, so that the risk, time and cost of process development are greatly reduced.