16 results about "Wire width" patented technology

The application relates to the field of sheathed wires, in particular to a sheathed wire processing equipment, which comprises a feeding assembly, a processing assembly, a gluing assembly and a conveying mechanism, clamping grooves for mounting sheathed wires are arranged on the feeding assembly, the processing assembly, the gluing assembly and the conveying mechanism, the width of the clamping grooves is equal to the width of the sheathed wires, the feeding assembly comprises a flattening mechanism, the flattening mechanism comprises a material loading plate and a compression roller, the first clamping groove is arranged on the material loading plate, and the compression roller is rotationally arranged and abuts against the end face of the first clamping groove arranged on the material loading plate; the flattening mechanism is arranged in the feeding assembly, the states of the sheathed wires in the first clamping groove are consistent, the width of the clamping groove on each tooling position is equal to the width of the sheathed wires, the consistency of the sheathed wires during processing and conveying is ensured, and the processing consistency of the equipment for the sheathed wires is improved.

The application provides a metal wire and a manufacturing method thereof. The manufacturing method comprises the following steps: forming a metal strip on a substrate; forming a mask above the metal strip, wherein the width of the mask is smaller than the width of the metal strip, and the orthographic projection of the mask on the substrate is located in the orthographic projection of the metal strip on the substrate; and wet etching the metal strip to a saturation state under the protection of the mask to form a metal wire, wherein the width of the metal wire is smaller than the width of the mask. The manufacturing method can form a metal wire with high thickness and narrow line width.

Embodiments of the present application disclose a kind of for encapsulating rewire layer preparation modular mold and its application;The modular mold of the present application embodiment can have greater than single processing field of view splicing pattern area, splicing pattern area is formed by multiple sub-molds with array arrangement, the pattern of splicing pattern area corresponds to the via-wiring interconnection structure of integrated circuit rewire layer, the pattern surface of sub-mold includes: high-density interconnection area, contains the microcircuit pattern for forming chip internal high-density signal wiring;Peripheral interconnection area is arranged in the side of high-density interconnection area, contains the widened wire pattern for forming electrical interconnection with adjacent sub-mold, widened wire pattern extends to the boundary of sub-mold, for forming lap joint interconnection with the corresponding wire pattern of adjacent sub-mold;Wherein, the line width of widened wire pattern of peripheral interconnection area is greater than the line width of microcircuit pattern.Thereby, the present application embodiment improves packaging efficiency and yield.

The invention discloses a precision circuit board with high board thickness and high copper thickness and a processing method thereof, and the processing method comprises the steps: providing a processing board, the processing board is provided with two outer copper layers which are oppositely arranged, and the thickness of the two outer copper layers does not exceed 4 microns; respectively arranging a removable resin layer on the two outer copper layers to obtain a first intermediate plate; sequentially performing drilling, copper deposition electroplating, resin hole plugging and grinding treatment on the first intermediate plate to obtain a second intermediate plate with an interlayer conduction structure; after the resin layer is removed, an mSAP technology is used for manufacturing an outer layer circuit, and the outer layer circuit with the line width being 25 micrometers + / -5 micrometers, the line distance being 25 micrometers + / -5 micrometers and the copper thickness being not smaller than 35 micrometers is manufactured. The processing method is simple and reasonable, the obtained precise circuit board has the characteristics of high board thickness, high copper thickness, fine / precise circuit, good interlayer conduction performance and the like, and the market requirements of products such as tire pressure sensors and the like are met.

A phase shifter and a wireless communication device are provided. The phase shifter includes a first substrate, a radio frequency transmission line arranged on a side of the first substrate, and a bias line connected to the radio frequency transmission line. The bias line includes a first wire and a second wire. A sheet resistance of the second wire is greater than a sheet resistance of the radio frequency transmission line. The first wire and the radio frequency transmission line are connected and form an integrated structure. A line width of the first wire is less than a line width of the radio frequency transmission line. The second wire and the first wire form a lapping region in an extension direction of the first wire. In the lapping region, the second wire is arranged on a side of the first wire away from the first substrate.

The utility model relates to the technical field of mine screens, and particularly discloses a novel wear-resistant mine screen which comprises a screen body, the screen body is composed of a plurality of screen wire frameworks, the section of each screen wire framework is in a solid U shape, and a wear-resistant layer is arranged on the top of each screen wire framework in a surfacing mode. The upper end and the lower end of the cross section are arc-shaped, and the middle part and the two sides of the cross section are vertical. According to the novel wear-resistant mine screen, the section of the screen wire framework is changed into the solid U shape, and the wear-resistant layer is overlaid on the top, so that on the premise of not changing the mesh number of the screen and the width of the screen wire, the longitudinal thickness of the screen wire is increased, the longitudinal shearing force of the screen main body is effectively improved, and the overall bearing capacity is enhanced; and high-strength impact in the mine screening operation can be better adapted. And the wear-resistant layer is only overlaid on the top of the screen wire framework without being completely wrapped in the circumferential direction, so that the wear-resistant property of key parts in contact with ores is ensured, the use amount of wear-resistant materials is reduced, and the production cost is effectively saved.

The utility model discloses a circuit board structure for ensuring the through-flow of a primary line of a network port in the field of circuit board design, which comprises a network port connector and a transformer which are arranged on a circuit board, the network port connector is connected with the transformer through a line group, each line group comprises two lines, and the line width of each line is 10-20 mil. According to the utility model, the problem of poor through-flow effect of the existing network port primary signal line is solved, the impedance of the line does not need to be controlled, the through-flow of the network port primary line can be ensured by increasing the line width of the routing, the wider routing can bear larger current, the stable transmission of the current is ensured, the energy loss caused by impedance mismatching is reduced, and the service life of the network port primary signal line is prolonged. The current transmission efficiency is improved, the stable transmission of the current can be ensured, the problems of line overheating or damage and the like caused by overlarge current are avoided, the voltage drop when the current passes through is reduced, the risk of local overheating is reduced, and then the stability and the reliability of the circuit are ensured.

The application discloses a flexible printed circuit board wiring optimization method based on laminar flow closing sequence, and is oriented to the same layer high-density parallel wiring scene after layering. The method constructs a wireable domain based on the plate shape boundary and the forbidden wiring area, extracts a skeleton channel network, and quantifies the available width on both sides of the channel to form a channel graph with capacity constraints. The same layer line group is expanded into a wiring instance according to the number of parallel roots, a wiring sorting algorithm based on the laminar flow closing sequence is proposed, and the wiring priority of the wiring instance is determined through the 'close first and open later' stack matching rule of the clockwise scanning of the port. Then, the incremental wiring is performed under the capacity constraint according to the sequence, a geometric path meeting the line width, line spacing, safety margin and minimum bending radius is generated, and space occupation update and conflict avoidance are realized through area write-back. The method can reduce the risk of shared channel crossing and crossing, improve the success rate of automatic wiring and manufacturability. At the same time, the manufacturability and regularity of the wiring result are optimized.

This invention belongs to the field of printed circuit board technology and discloses a method and product for improving the burrs on gold-plated leads during rigid-flex PCB forming. In the gold fingers connecting the gold fingers to the board edge within the unit, the gold finger leads are symmetrically reduced to the left and right based on the center line of the forming line, and the left and right lengths and widths of the reduced lines between the gold fingers and the gold finger leads are adjusted. Based on the adjustment results of the left and right lengths and widths of the reduced lines, a router is used to form the board. Based on the formed board results, a rigid-flex PCB product is manufactured. In this invention, the gold finger leads are designed with a length of 0.3mm and a line width of 0.1mm, based on the center line of the forming line. Reducing the line width can improve the burrs on the leads caused by the router during forming, thereby improving the surface scratches caused by the burrs.

The application discloses a control method for CAF failure of a circuit board, and the control method is as follows: S1, the fiberglass looseness and fiberglass hollow of an insulating cloth layer are detected through a microscope, wherein the cloth layer with fiberglass hollow greater than 30ppm is rejected; S2, the line width compensation of a copper foil is increased, and the etching rate of the copper foil is improved, so that copper teeth are avoided on the copper foil; S3, the circuit board is drilled through drilling equipment; S4, defects of the circuit board are monitored through image detection, and the circuit board is repaired; and S5, the circuit board is detected under the environment of 85 DEG C / 85%RH, and good circuit boards without CAF failure are selected. The application comprehensively considers three factors of material, process and environment, constructs a multi-dimensional control model, effectively inhibits the possibility of CAF failure of the circuit board, reduces economic losses caused by CAF failure, and improves long-term reliability of the circuit board.

The present application relates to the technical field of energy storage, and discloses a sampling assembly, an energy storage apparatus, and an energy storage system. The sampling assembly comprises: a flexible substrate, provided with isolation slots and connecting bridges, wherein the flexible substrate is divided into a body plate and fixing portions, and the connecting bridges connect the fixing portions and the body plate; a plurality of sampling wires, laid on the flexible substrate, wherein the line width of a first wire is greater than that of a second wire, and the first wire is located on the side of the second wire close to a side edge of the flexible substrate; and sampling terminals, connected to the sampling wires of the fixing portions. In the embodiments of the present application, the flexible substrate replaces connecting wires, thereby facilitating simplification of the connection between battery cells and a battery management system, and improving electrical safety. In addition, the isolation slots on the flexible substrate provide a certain buffering space between the fixing portions and the body plate, so that when the fixing portions are pulled due to thermal expansion of battery cells, tearing between the fixing portions and the body plate is avoided, thereby ensuring effective collection of operating parameters of the battery cells.

In various examples, a shaft for an elongate medical device extends along a shaft length. The shaft includes a shaft axis, an outer surface, and an inner surface. The inner surface defines an inner lumen. A liner forms the inner surface of the shaft. A coil is disposed around and outwardly from the liner. The coil is formed from a flat wire. The flat wire includes a wire width and a wire height, wherein the wire height is greater than the wire width. The wire height extends substantially radially with respect to the shaft and the wire width extends substantially longitudinally with respect to the shaft. A jacket is disposed around and outwardly from the coil. The jacket forms the outer surface of the shaft.

The application provides a PCB with a loss test area and a design method and use method thereof, and belongs to the technical field of signal integrity testing. The PCB has a main wiring area and a loss test area on the board surface. The main wiring area is arranged at the middle of the board surface of the PCB, and the loss test area is arranged at the peripheral edge of the main wiring area. The main wiring area of the PCB is provided with paired differential transmission lines. The line width of the paired two differential transmission lines is the same, and the line spacing is fixed. A preset number and a preset length of single-end test lines are arranged on the loss test area. The line width of the single-end test lines is the same as that of the differential transmission lines. Each single-end test line is provided with a via at both ends. The length difference of different single-end test lines is greater than a set length threshold. The application reduces the size of the loss test area and reduces the cost.

A wiring substrate includes a first build-up part includes first insulating layers, first conductor layers and first via conductors, and a second build-up part laminated to the first build-up part and including second insulating layers, second conductor layers and second via conductors. The first conductor layers in the first build-up part and the second conductor layers in the second build-up part include wirings such that a wiring width and an inter-wiring distance of the wirings in the first conductor layers are smaller than a wiring width and an inter-wiring distance of the wirings in the second conductor layers, an aspect ratio of the wirings in the first conductor layers is in the range of 2.0 to 4.0, the wiring width of the wirings in the first conductor layers is 3 μm or less, and the inter-wiring distance of the wirings in the first conductor layers is 3 μm or less.

The application discloses a conductive grid and electronic equipment, and relates to the technical field of electronic devices, wherein the conductive grid comprises a plurality of preset wires, the plurality of preset wires are connected and are configured to form a grid, a ratio of wire thickness and wire width of the preset wires is greater than or equal to 1, the conductive grid comprises a pin area and a main body area, and the main body area is provided with the plurality of preset wires. The technical scheme provided by the application aims to improve the wire strength of the main body area provided with the grid, so as to guarantee the structural strength of the conductive grid.

Improved connection quality of conductor layers using via conductors. [Solution] The wiring board 1 of the embodiment has a first surface 1F and a second surface opposite to the first surface 1F, and includes a first build-up section 10 which includes a plurality of laminated insulating layers 11 and a plurality of conductor layers 12, and a second build-up section 20 which includes a laminated insulating layer 21 and a conductor layer and is laminated on the second surface side of the first build-up section 10. The minimum wiring width of the wiring included in the conductor layer 12 of the first build-up section 10 is smaller than the minimum wiring width of the wiring included in the conductor layer of the second build-up section 20, and the first build-up section 10 includes single-layer through-via conductors 13a, 13b which penetrate only one insulating layer, and skip via conductors 131, 132 which continuously penetrate two or more adjacent insulating layers.