40 results about "Wire width" patented technology

To provide a wiring body and a display device capable of reducing sheet resistance, while improving the flatness of the wiring body.SOLUTION: According to a wiring body 200, a mesh-like conductor layer 5 provided on a light-transmissive substrate 1 is covered with a multilayer resin layer 9 composed of a first resin layer 7 and a second resin layer 8. As a result, any unevenness that may occur on the surface of the wiring body 200 due to the conductor layer 5 can be absorbed by the resin layer 9. Therefore, the flatness of the surface of the wiring body 200 can be improved. In the embodiment, an upper surface 8a of the second resin layer 8 constitutes the surface of the wiring body 200. Furthermore, the conductor layer 5 penetrates the first resin layer 7 on the light-transmissive substrate 1 side. As a result, it is possible to ensure the volume of the conductor while suppressing the thickness of conductor lines 50 of the conductor layer 5. Therefore, the sheet resistance of the wiring body 200 can be reduced. Thus, the flatness of the wiring body 200 can be improved while reducing the sheet resistance.SELECTED DRAWING: Figure 6

The application relates to the field of sheathed wires, in particular to a sheathed wire processing equipment, which comprises a feeding assembly, a processing assembly, a gluing assembly and a conveying mechanism, clamping grooves for mounting sheathed wires are arranged on the feeding assembly, the processing assembly, the gluing assembly and the conveying mechanism, the width of the clamping grooves is equal to the width of the sheathed wires, the feeding assembly comprises a flattening mechanism, the flattening mechanism comprises a material loading plate and a compression roller, the first clamping groove is arranged on the material loading plate, and the compression roller is rotationally arranged and abuts against the end face of the first clamping groove arranged on the material loading plate; the flattening mechanism is arranged in the feeding assembly, the states of the sheathed wires in the first clamping groove are consistent, the width of the clamping groove on each tooling position is equal to the width of the sheathed wires, the consistency of the sheathed wires during processing and conveying is ensured, and the processing consistency of the equipment for the sheathed wires is improved.

The utility model provides a multi-specification steel wire width adaptation mechanism and winding disc, including a plurality of mounting parts that sink step by step on the drive disc, the diameter radians of the plurality of mounting parts decrease step by step, along the radian of each stage of mounting part is connected with a support frame, and the support frame is connected with the drive disc. A base plate is overlaid between the front side of the supporting frame and the limiting plate according to the width of a steel wire to be wound, and a groove allowing the steel wire to be wound is formed between the inner wall of the supporting frame and the inner wall of the limiting plate. The winding disc comprises a base plate and a supporting seat which are concentrically arranged, the positions of grooves in the same stage on each group of driving discs correspond to each other, the plurality of groups of grooves which surround each other are in a circular ring shape, and the driving discs slide on the base plate along the supporting seat. Production of different specifications can be met by changing and combining the diameter and the width, production of steel wire rings of different specifications can be completed at the same time, and meanwhile the production cost is reduced.

The invention discloses a coreless transformer coil which comprises a coil body, the wire width of each turn of the coil body is different, and the distance between every two adjacent turns is determined through simulation, so that the self-inductance loss of the coil body is minimum. The invention also discloses an optimal design method of the coreless transformer coil, which at least comprises the following steps: step 1, constructing a first coil with equal line width and equal spacing, the first coil being a coreless transformer coil; 2, Maxwell simulation software is used for simulating the first coil, under the condition that the magnetic field intensity of the first coil is kept unchanged, the optimal line width value is found out, the optimal line width value refers to the line width when the winding loss of the first coil is minimum, and a second coil with the equal line width and the equal interval is constructed with the optimal line width value as the line width; and step 3, keeping the inner diameter and the outer diameter of the second coil unchanged, setting the wire width of each turn of the second coil to be different values, and performing simulation to obtain a third coil. The high-frequency loss of the coreless transformer coil can be effectively reduced.

The utility model relates to the technical field of PCB (printed circuit board) design, and discloses a pin wire outlet structure for improving a tombstone effect of a 0603 packaging device, which comprises a 0603 packaging main body applied to a substrate, the 0603 packaging main body comprises a first bonding pad and a second bonding pad, a first wire and a second wire are led out of the first bonding pad in opposite directions, and the first wire and the second wire are arranged in parallel. A third wire and a fourth wire which are opposite in direction are led out from the second bonding pad, the wire width of the first wire is the same as the wire width of the third wire, and the wire width of the second wire is the same as the wire width of the fourth wire. According to the utility model, the wires are led out from the upper and lower sides of the first bonding pad and the second bonding pad at the same time, and the widths of the wires in the corresponding directions of the first bonding pad and the second bonding pad are consistent, so that the uniform distribution of heat in the welding process is ensured, the stress tolerance is increased, the occurrence of the tombstone effect is reduced, and the welding firmness of 0603 devices is ensured.

The invention discloses a method for keeping the line width consistency of a circuit board, which is characterized by comprising an online control system, and the keeping method comprises the following steps: S1, obtaining the copper thickness of each point of a copper wire on the circuit board; s2, the liquid level of a VCP wire groove and the height of a floating plate are adjusted; s3, the line width design value is adjusted according to the copper thickness; s4, adjusting the etching line speed range according to the copper thickness; s5, monitoring the copper ion concentration in real time; and S6, determining an adjustment means according to the copper ion concentration in the etching process. The copper thickness on the circuit board is obtained in real time, and the liquid level of the VCP wire groove and the height of the floating plate are fed back and adjusted according to the difference between the copper thickness and the preset copper thickness, so that the copper thickness is accurately controlled, the subsequent etching difficulty is reduced, and the consistency of the line width of the circuit board is kept. And through an accurate dynamic compensation mode, the consistency of the finally formed line width can be maintained. According to the technical means, the stability of the forming method of the circuit on the circuit board is improved, and the CPK standard reaching rate of the circuit width of the circuit on the circuit board can be 100%.

The application provides a metal wire and a manufacturing method thereof. The manufacturing method comprises the following steps: forming a metal strip on a substrate; forming a mask above the metal strip, wherein the width of the mask is smaller than the width of the metal strip, and the orthographic projection of the mask on the substrate is located in the orthographic projection of the metal strip on the substrate; and wet etching the metal strip to a saturation state under the protection of the mask to form a metal wire, wherein the width of the metal wire is smaller than the width of the mask. The manufacturing method can form a metal wire with high thickness and narrow line width.

Embodiments of the present application disclose a kind of for encapsulating rewire layer preparation modular mold and its application;The modular mold of the present application embodiment can have greater than single processing field of view splicing pattern area, splicing pattern area is formed by multiple sub-molds with array arrangement, the pattern of splicing pattern area corresponds to the via-wiring interconnection structure of integrated circuit rewire layer, the pattern surface of sub-mold includes: high-density interconnection area, contains the microcircuit pattern for forming chip internal high-density signal wiring;Peripheral interconnection area is arranged in the side of high-density interconnection area, contains the widened wire pattern for forming electrical interconnection with adjacent sub-mold, widened wire pattern extends to the boundary of sub-mold, for forming lap joint interconnection with the corresponding wire pattern of adjacent sub-mold;Wherein, the line width of widened wire pattern of peripheral interconnection area is greater than the line width of microcircuit pattern.Thereby, the present application embodiment improves packaging efficiency and yield.

An on-line monitoring method for the blockage of a circular shear, belonging to the field of monitoring. It arranges diffuse reflection photoelectric switches at the top of the bin; collects the signal of whether the circular shear is working from L1 and obtains relevant production data from L2; when the circular shear starts to work, the on-line monitoring and early warning function is activated; decides whether to start the on-line monitoring and early warning function for the edge wire width of thick high-strength steel according to whether the incoming material is thick high-strength steel; if no edge wire is detected to stay, or the edge wire stays but the staying time does not exceed the set alarm duration, it is determined that the circular shear is working normally; otherwise, it is determined that the edge wire inside the bin has been blocked, and the corresponding bin blockage alarm module outputs sound and light alarm signals; when the incoming material is thick high-strength steel, the real-time actual width is compared with the target width after shearing: if it is greater than the edge wire over-width warning value, an early warning signal is sent through the on-line monitoring software; when the edge wire over-width warning signal is sent, check the video monitoring. If there is a trend of bin blockage, deal with it immediately.

The invention discloses a precision circuit board with high board thickness and high copper thickness and a processing method thereof, and the processing method comprises the steps: providing a processing board, the processing board is provided with two outer copper layers which are oppositely arranged, and the thickness of the two outer copper layers does not exceed 4 microns; respectively arranging a removable resin layer on the two outer copper layers to obtain a first intermediate plate; sequentially performing drilling, copper deposition electroplating, resin hole plugging and grinding treatment on the first intermediate plate to obtain a second intermediate plate with an interlayer conduction structure; after the resin layer is removed, an mSAP technology is used for manufacturing an outer layer circuit, and the outer layer circuit with the line width being 25 micrometers + / -5 micrometers, the line distance being 25 micrometers + / -5 micrometers and the copper thickness being not smaller than 35 micrometers is manufactured. The processing method is simple and reasonable, the obtained precise circuit board has the characteristics of high board thickness, high copper thickness, fine / precise circuit, good interlayer conduction performance and the like, and the market requirements of products such as tire pressure sensors and the like are met.

The utility model provides a common-mode inductor mold and common-mode inductor equipment. The common-mode inductor mold comprises a fixing rod, an end forming block and a wire passing replacement part. The end forming block is detachably connected to the fixing rod, and the wire passing replacement part penetrates through the fixing rod and the end forming block. The wire passing replacement part and the end forming block are both in split type design with the fixing rod. The wire passing replacement part is provided with a wire passing groove, and the wire passing groove is used for allowing a wire to penetrate. The wire passing groove is located in the through hole and the forming hole, so that the end forming block can be connected with or separated from the fixing rod, the wire passing replacement part can be replaced along with separation of the end forming block relative to the fixing rod so as to be compatible with dies of multiple wire specifications, and die replacement can be completed only by replacing the middle internal wire passing groove from large to small. And the width of the wire rod from large wire diameter to small wire diameter can be universally used for all wire rod specifications only by replacing the end part forming block, so that the phenomenon that the end part forming block cannot be disassembled relative to the fixed rod is avoided, and the universality of the common-mode inductor mold is improved.

A phase shifter and a wireless communication device are provided. The phase shifter includes a first substrate, a radio frequency transmission line arranged on a side of the first substrate, and a bias line connected to the radio frequency transmission line. The bias line includes a first wire and a second wire. A sheet resistance of the second wire is greater than a sheet resistance of the radio frequency transmission line. The first wire and the radio frequency transmission line are connected and form an integrated structure. A line width of the first wire is less than a line width of the radio frequency transmission line. The second wire and the first wire form a lapping region in an extension direction of the first wire. In the lapping region, the second wire is arranged on a side of the first wire away from the first substrate.

The utility model discloses a novel gold-plated lead structure, which comprises a printed board substrate, four first gold-plated leads, two second gold-plated leads and a bonding pad, the two second gold-plated leads are crosswise fixed in the center of the printed board substrate, the width of the first gold-plated leads is larger than that of the second gold-plated leads, and the bonding pad is arranged between the first gold-plated leads and the second gold-plated leads. The four first gold-plated wires are respectively fixed at one ends of the second gold-plated wires, and the bonding pads are fixed at the other ends of the first gold-plated wires. When the pattern transfer film exposure negative film is manufactured, the width of the wire at the intersection of the two gold-plated wires is reduced, so that the etching area at the intersection of the wires can be effectively reduced in the subsequent etching process, incomplete etching caused by overlarge etching area is avoided, the etching at the intersection of the wires is ensured to be clean, and the etching quality of the wires is improved. The printed circuit board improves the aesthetic property of the printed circuit board and the stability of signal transmission, and through the design of reducing the width of the gold-plated lead, the etching speed at the crossing part of the lead is relatively consistent with that at other parts, so that the etching speed is accelerated.

The present invention discloses a line impedance calculation method, system, equipment and medium for a mesh shielding structure. The method first calculates the signal leakage ratio of the mesh shielding layer relative to the signal transmission ratio of the electric formation based on the conductor width and spacing of the mesh shielding layer, then equates the signal leakage of the mesh shielding layer to the increase in the dielectric thickness of the dielectric layer, calculates the equivalent dielectric thickness based on the leakage ratio and the dielectric thickness parameter, and then calculates the equivalent dielectric constant of the mesh shielding structure compared to the large copper surface shielding layer based on the equivalence principle of the transmission time of the electric formation loop network. Finally, the line impedance of the mesh shielding structure is calculated by combining the line width, copper thickness, equivalent dielectric thickness, equivalent dielectric constant and the classic characteristic impedance calculation formula of the large copper surface shielding layer. The method proposes a calculation theory and calculation model for the line impedance of the mesh shielding structure for the first time, greatly improving the accuracy of the line impedance calculation of the mesh shielding structure, and can be well applied to the impedance line design of the mesh shielding structure.

The invention provides a metal interconnection structure and method suitable for high-density fan-out packaging, and the method comprises the following steps: S1, adjusting the height of a metal bonding pad and / or a first metal wire layer on a functional multilayer structure, and enabling one end face, close to a functional chip, of the metal bonding pad and / or the first metal wire layer to reach the consistent height; s2, at least two first passivation layers and at least two metal wire layers are manufactured on the end face, close to the functional chip, of the metal bonding pad and / or the end face, close to the functional chip, of the first metal wire layer after adjustment in the step S1, so that a metal rewiring layer is formed, the line width of the metal wire layers is 1-4 microns, and the line distance is 1-4 microns; s3, completing metal interconnection between the metal rewiring layer and the organic substrate; therefore, the fluctuation of the surface of the metal bonding pad and / or the surface of the first metal wire layer is effectively avoided, the range and area of fine wiring of the metal rewiring layer are enlarged, the processing cost is reduced, and the current-carrying capacity and the overall performance of the packaging body are improved.

A wiring substrate includes a first build-up part including first insulating layers and conductor layers, a second build-up part laminated to the first part and including second insulating layers and conductor layers, and via conductors including first via conductors in the first insulating layers and second via conductors in the second insulating layers. The first part is positioned closer to first surface side of the substrate than the second part. The first conductor layers include wirings having wiring width and inter-wiring distance that are smaller than wiring width and inter-wiring distance of wirings in the second conductor layers. The first insulating layers include resin and inorganic particles including first particles forming inner wall surfaces in through holes and second particles embedded in the first insulating layers having different shapes from the first particles. Each first conductor layers and via conductors includes a metal film layer and a plating film layer.

The utility model discloses an enamelled wire hardness detection device, which relates to the hardness detection technology field, and comprises two support assemblies, a roll shaft assembly, fixing members and a clamping mechanism, the two support assemblies are arranged side by side, the upper end of each support assembly is provided with two fixing members, the roll shaft assembly is rotatably arranged between the two fixing members, and the clamping mechanism is arranged on the roll shaft assembly. The roll shaft assembly is provided with roll shaft grooves, the enameled wire is installed in the two roll shaft grooves, and the clamping mechanism is arranged between the two roll shaft grooves. According to the utility model, through the arrangement of the supporting assembly, the roll shaft assembly, the fixing piece and the clamping mechanism, enameled wires with different wire widths can be measured, the influence on the measurement precision caused by twisting of the enameled wires or friction of the roll shaft due to deformation can be prevented, the measurement error is small, the anti-interference capability is strong, and the application range is wider; and the method is particularly suitable for measuring the hardness of the enameled wire.

The utility model provides a heating element for electronic cigarette atomization core, atomization core, electronic cigarette, the heating element includes two contact for electrifying and with the heating wire of two contact electric connection, the heating wire has at least one wide part and / or narrow part, the line width of the wide part is greater than the line width of the rest part of the heating wire, and the width of the narrow part is greater than the line width of the other part of the heating wire. The line width of the narrow part is smaller than the line width of the rest part of the heating wire; the atomizing core comprises the heating body, and the electronic cigarette comprises the atomizing core. The heating body provided by the utility model can quickly heat the tobacco tar in the adsorption body and control the temperature rising speed of each local area so as to ensure that the temperature distribution of the adsorption body is more uniform, thereby improving the atomization efficiency of the tobacco tar.

The utility model relates to the technical field of mine screens, and particularly discloses a novel wear-resistant mine screen which comprises a screen body, the screen body is composed of a plurality of screen wire frameworks, the section of each screen wire framework is in a solid U shape, and a wear-resistant layer is arranged on the top of each screen wire framework in a surfacing mode. The upper end and the lower end of the cross section are arc-shaped, and the middle part and the two sides of the cross section are vertical. According to the novel wear-resistant mine screen, the section of the screen wire framework is changed into the solid U shape, and the wear-resistant layer is overlaid on the top, so that on the premise of not changing the mesh number of the screen and the width of the screen wire, the longitudinal thickness of the screen wire is increased, the longitudinal shearing force of the screen main body is effectively improved, and the overall bearing capacity is enhanced; and high-strength impact in the mine screening operation can be better adapted. And the wear-resistant layer is only overlaid on the top of the screen wire framework without being completely wrapped in the circumferential direction, so that the wear-resistant property of key parts in contact with ores is ensured, the use amount of wear-resistant materials is reduced, and the production cost is effectively saved.

The present invention provides a lamp drive system and an engine system. The lamp drive system is integrated within a chip and includes at least one lamp drive module. The wire width of each lamp drive module is less than 120 μm. Each lamp drive module includes: a lamp control unit that outputs a drive control signal based on a fault detection signal and a serial lamp drive control signal from an SPI module; a driver unit that controls the operating state of the corresponding LED lamp bead based on the drive control signal; and a fault detection module that detects faults in the lamp drive module. Thus, the present invention integrates multiple lamp drive modules within the chip, enabling the chip to independently drive and detect faults for each LED lamp bead. While reducing peripheral circuitry, the chip offers improved reliability, reduced complexity, and lowered operating costs.

The utility model discloses a circuit board structure for ensuring the through-flow of a primary line of a network port in the field of circuit board design, which comprises a network port connector and a transformer which are arranged on a circuit board, the network port connector is connected with the transformer through a line group, each line group comprises two lines, and the line width of each line is 10-20 mil. According to the utility model, the problem of poor through-flow effect of the existing network port primary signal line is solved, the impedance of the line does not need to be controlled, the through-flow of the network port primary line can be ensured by increasing the line width of the routing, the wider routing can bear larger current, the stable transmission of the current is ensured, the energy loss caused by impedance mismatching is reduced, and the service life of the network port primary signal line is prolonged. The current transmission efficiency is improved, the stable transmission of the current can be ensured, the problems of line overheating or damage and the like caused by overlarge current are avoided, the voltage drop when the current passes through is reduced, the risk of local overheating is reduced, and then the stability and the reliability of the circuit are ensured.

The invention discloses a winding overlapping calculation method of a stator winding circuit board, which comprises the following steps of: decomposing a circuit board winding into a plurality of geometric units, defining a wire path, a wire width and an interlayer distance of each layer, then introducing a three-dimensional coordinate system, and marking a spatial position and a current direction of each unit; solving a Maxwell equation set by adopting a finite element method, and obtaining magnetic field intensity distribution of the overlapping region; calculating eddy-current loss and copper loss according to magnetic field distribution, and predicting a temperature field by combining a heat conduction equation; iteratively adjusting the width and the angle of the overlapping region by taking loss minimization and heat dissipation uniformization as targets; an overlapping coefficient # imgabs0 # is defined, wherein Aoverlapping is the overlapping area, and Atotal is the total lead area; and determining an optimal overlapping parameter according to a constraint condition that K belongs to [0.2, 0.5] and a temperature rise threshold value delta T is less than or equal to 15 DEG C. Through quantitative analysis of electromagnetic field and thermal field distribution, motor efficiency and reliability are improved, and the method is suitable for winding optimization design of precision motors such as permanent magnet motors and stepping motors.

The present invention provides a heating element for an atomization core of an electronic cigarette, an atomization core and a manufacturing method therefor, and an electronic cigarette. The heating element comprises two contacts for energization and heating wires electrically connected to the two contacts; each heating wire has at least one wide portion and / or narrow portion, the wire width of the wide portion is greater than the wire width of the remaining portion of the heating wire, and the wire width of the narrow portion is less than the wire width of the remaining portion of the heating wire. The atomization core comprises the heating element, and the electronic cigarette comprises the atomization core. The heating element provided by the present invention can rapidly heat the e-liquid in an absorption body, and control the heating rate of each local area, so as to ensure that the temperature distribution of the absorption body is more uniform, thereby improving the atomization efficiency of the e-liquid.

The application discloses a flexible printed circuit board wiring optimization method based on laminar flow closing sequence, and is oriented to the same layer high-density parallel wiring scene after layering. The method constructs a wireable domain based on the plate shape boundary and the forbidden wiring area, extracts a skeleton channel network, and quantifies the available width on both sides of the channel to form a channel graph with capacity constraints. The same layer line group is expanded into a wiring instance according to the number of parallel roots, a wiring sorting algorithm based on the laminar flow closing sequence is proposed, and the wiring priority of the wiring instance is determined through the 'close first and open later' stack matching rule of the clockwise scanning of the port. Then, the incremental wiring is performed under the capacity constraint according to the sequence, a geometric path meeting the line width, line spacing, safety margin and minimum bending radius is generated, and space occupation update and conflict avoidance are realized through area write-back. The method can reduce the risk of shared channel crossing and crossing, improve the success rate of automatic wiring and manufacturability. At the same time, the manufacturability and regularity of the wiring result are optimized.

This invention belongs to the field of printed circuit board technology and discloses a method and product for improving the burrs on gold-plated leads during rigid-flex PCB forming. In the gold fingers connecting the gold fingers to the board edge within the unit, the gold finger leads are symmetrically reduced to the left and right based on the center line of the forming line, and the left and right lengths and widths of the reduced lines between the gold fingers and the gold finger leads are adjusted. Based on the adjustment results of the left and right lengths and widths of the reduced lines, a router is used to form the board. Based on the formed board results, a rigid-flex PCB product is manufactured. In this invention, the gold finger leads are designed with a length of 0.3mm and a line width of 0.1mm, based on the center line of the forming line. Reducing the line width can improve the burrs on the leads caused by the router during forming, thereby improving the surface scratches caused by the burrs.

The application discloses a control method for CAF failure of a circuit board, and the control method is as follows: S1, the fiberglass looseness and fiberglass hollow of an insulating cloth layer are detected through a microscope, wherein the cloth layer with fiberglass hollow greater than 30ppm is rejected; S2, the line width compensation of a copper foil is increased, and the etching rate of the copper foil is improved, so that copper teeth are avoided on the copper foil; S3, the circuit board is drilled through drilling equipment; S4, defects of the circuit board are monitored through image detection, and the circuit board is repaired; and S5, the circuit board is detected under the environment of 85 DEG C / 85%RH, and good circuit boards without CAF failure are selected. The application comprehensively considers three factors of material, process and environment, constructs a multi-dimensional control model, effectively inhibits the possibility of CAF failure of the circuit board, reduces economic losses caused by CAF failure, and improves long-term reliability of the circuit board.

The present application relates to the technical field of energy storage, and discloses a sampling assembly, an energy storage apparatus, and an energy storage system. The sampling assembly comprises: a flexible substrate, provided with isolation slots and connecting bridges, wherein the flexible substrate is divided into a body plate and fixing portions, and the connecting bridges connect the fixing portions and the body plate; a plurality of sampling wires, laid on the flexible substrate, wherein the line width of a first wire is greater than that of a second wire, and the first wire is located on the side of the second wire close to a side edge of the flexible substrate; and sampling terminals, connected to the sampling wires of the fixing portions. In the embodiments of the present application, the flexible substrate replaces connecting wires, thereby facilitating simplification of the connection between battery cells and a battery management system, and improving electrical safety. In addition, the isolation slots on the flexible substrate provide a certain buffering space between the fixing portions and the body plate, so that when the fixing portions are pulled due to thermal expansion of battery cells, tearing between the fixing portions and the body plate is avoided, thereby ensuring effective collection of operating parameters of the battery cells.

In various examples, a shaft for an elongate medical device extends along a shaft length. The shaft includes a shaft axis, an outer surface, and an inner surface. The inner surface defines an inner lumen. A liner forms the inner surface of the shaft. A coil is disposed around and outwardly from the liner. The coil is formed from a flat wire. The flat wire includes a wire width and a wire height, wherein the wire height is greater than the wire width. The wire height extends substantially radially with respect to the shaft and the wire width extends substantially longitudinally with respect to the shaft. A jacket is disposed around and outwardly from the coil. The jacket forms the outer surface of the shaft.

The invention belongs to the field of inductors, and particularly discloses an inductor and a preparation method thereof. The through hole conductor is designed to be of a structure protruding towards the inner side of the coil conductor, and the outer edge of the through hole conductor is tangent to the outer edge of the wire layer, so that inward turning of connection points in the inductor is achieved. According to the design, the problem of connection point exposure caused by cutting deviation can be effectively improved, and the risk of exposure of the inner electrode is remarkably reduced. Meanwhile, the available area of the coil conductor design is increased after the connection points are turned inwards, so that the inductance value design upper limit of the inductor product is improved, and the electrical performance and the reliability of the product are comprehensively improved; meanwhile, the diameter of the through hole conductor is larger than the line width of the wire layer, the connection point area can be increased, the connection effect is improved, resistance and open circuit risks are reduced, and the electrical performance and reliability of products are improved.

The utility model discloses a circuit board wiring layout structure for reducing signal crosstalk, which relates to the technical field of circuit boards, and comprises a first circuit board and a second circuit board, the first circuit board is arranged above the second circuit board, the top of the first circuit board is provided with four groups of first welding spots, and the second circuit board is arranged above the first circuit board. The top outer wall of the first circuit board is provided with two groups of first welding spots, the two groups of first welding spots are fixedly connected with a first wire and a second wire respectively, the top outer wall of the second circuit board is provided with four groups of second welding spots, the two groups of second welding spots are fixedly connected with a third wire and a fourth wire respectively, and the center-to-center distance between the first wire and the second wire is larger than three times of the wire width of the first wire. According to the utility model, when the routing layout is carried out on a group of PCBs, the center-to-center distance between two groups of routing is greater than three times of the width of the routing, so that the crosstalk between the two routing on the circuit board can be effectively reduced.