59 results about "Wire width" patented technology

The invention discloses a design method of an inner-layer circuit board. The design method comprises the following steps: optimizing the design of the minimum distance from a hole to copper; hole ring design: a welding ring is greater than or equal to 4mil before compensation of a copper thick circuit of 1oz and below, local cutting is performed at least 3.5 mil after compensation, and teardrop design is added to all inner-layer circuit hole rings; wire design: the wire width of the functional connection wire is greater than or equal to the finished product wire width of the minimum bottom copper design; designing a non-functional bonding pad, wherein a single-side welding ring is greater than or equal to 8mil, and a slotted hole is greater than or equal to 10mil; fine gaps are designed, wherein non-functional fine gaps smaller than or equal to 5 mil are subjected to copper filling treatment; the gaps with the isolated copper spacing smaller than 10 mil are filled with copper; a heat dissipation welding ring is larger than or equal to 6 mil, a heat dissipation copper bridge is larger than or equal to 6 mil, and a copper bridge base material ring finished product is larger than or equal to 5 mil; when the heat dissipation pad intersects the isolation pad, the integrity of the isolation pad is preferentially satisfied. According to the design method of the inner-layer circuit board provided by the invention, the long-term reliability of the circuit board can be improved.

The invention discloses a primary impedance qualification design method for a PCB (Printed Circuit Board) process, which comprises the following steps of: measuring a medium thickness gradient, slicing a sample on a laminated PCB, measuring the thickness of a medium layer at each point by adopting a metallographic microscope, recording a board edge region, importing measured data into CAM (Computer Aided Manufacturing) software to generate a medium thickness distribution cloud picture, and dividing a compensation region; surface copper is measured, a thickness gauge is used for measuring the thickness of copper on the plate edge and in the plate after the ceramic plate is ground, and a comparison table of the copper thickness difference value and the line width deviation is established; compensation area division: dividing a board edge area, a transition area and an in-board area on the surface of the PCB by laser engraving; length compensation is carried out, 0.1 mi and 0.3 mi of medium thickness compensation and copper thickness compensation are carried out on the plate edge area, 0.05 mi and 0.15 mi of medium thickness compensation and copper thickness compensation are carried out on the transition area, and the total compensation amount of the plate edge area and the total compensation amount of the transition area are kept to be 0.4 mi and 0.2 mi respectively. The problems that in the prior art, a traditional PCB uniformization compensation design cannot adapt to regional process differences in actual production and multi-impedance-line cooperative regulation and control cannot be achieved are solved.

To provide a wiring body and a display device capable of reducing sheet resistance, while improving the flatness of the wiring body.SOLUTION: According to a wiring body 200, a mesh-like conductor layer 5 provided on a light-transmissive substrate 1 is covered with a multilayer resin layer 9 composed of a first resin layer 7 and a second resin layer 8. As a result, any unevenness that may occur on the surface of the wiring body 200 due to the conductor layer 5 can be absorbed by the resin layer 9. Therefore, the flatness of the surface of the wiring body 200 can be improved. In the embodiment, an upper surface 8a of the second resin layer 8 constitutes the surface of the wiring body 200. Furthermore, the conductor layer 5 penetrates the first resin layer 7 on the light-transmissive substrate 1 side. As a result, it is possible to ensure the volume of the conductor while suppressing the thickness of conductor lines 50 of the conductor layer 5. Therefore, the sheet resistance of the wiring body 200 can be reduced. Thus, the flatness of the wiring body 200 can be improved while reducing the sheet resistance.SELECTED DRAWING: Figure 6

The application relates to the field of sheathed wires, in particular to a sheathed wire processing equipment, which comprises a feeding assembly, a processing assembly, a gluing assembly and a conveying mechanism, clamping grooves for mounting sheathed wires are arranged on the feeding assembly, the processing assembly, the gluing assembly and the conveying mechanism, the width of the clamping grooves is equal to the width of the sheathed wires, the feeding assembly comprises a flattening mechanism, the flattening mechanism comprises a material loading plate and a compression roller, the first clamping groove is arranged on the material loading plate, and the compression roller is rotationally arranged and abuts against the end face of the first clamping groove arranged on the material loading plate; the flattening mechanism is arranged in the feeding assembly, the states of the sheathed wires in the first clamping groove are consistent, the width of the clamping groove on each tooling position is equal to the width of the sheathed wires, the consistency of the sheathed wires during processing and conveying is ensured, and the processing consistency of the equipment for the sheathed wires is improved.

The utility model provides a multi-specification steel wire width adaptation mechanism and winding disc, including a plurality of mounting parts that sink step by step on the drive disc, the diameter radians of the plurality of mounting parts decrease step by step, along the radian of each stage of mounting part is connected with a support frame, and the support frame is connected with the drive disc. A base plate is overlaid between the front side of the supporting frame and the limiting plate according to the width of a steel wire to be wound, and a groove allowing the steel wire to be wound is formed between the inner wall of the supporting frame and the inner wall of the limiting plate. The winding disc comprises a base plate and a supporting seat which are concentrically arranged, the positions of grooves in the same stage on each group of driving discs correspond to each other, the plurality of groups of grooves which surround each other are in a circular ring shape, and the driving discs slide on the base plate along the supporting seat. Production of different specifications can be met by changing and combining the diameter and the width, production of steel wire rings of different specifications can be completed at the same time, and meanwhile the production cost is reduced.

The invention discloses a coreless transformer coil which comprises a coil body, the wire width of each turn of the coil body is different, and the distance between every two adjacent turns is determined through simulation, so that the self-inductance loss of the coil body is minimum. The invention also discloses an optimal design method of the coreless transformer coil, which at least comprises the following steps: step 1, constructing a first coil with equal line width and equal spacing, the first coil being a coreless transformer coil; 2, Maxwell simulation software is used for simulating the first coil, under the condition that the magnetic field intensity of the first coil is kept unchanged, the optimal line width value is found out, the optimal line width value refers to the line width when the winding loss of the first coil is minimum, and a second coil with the equal line width and the equal interval is constructed with the optimal line width value as the line width; and step 3, keeping the inner diameter and the outer diameter of the second coil unchanged, setting the wire width of each turn of the second coil to be different values, and performing simulation to obtain a third coil. The high-frequency loss of the coreless transformer coil can be effectively reduced.

The present invention relates to the field of electronic information engineering technology, and discloses a PCB planar transformer DC resistance design method, including the following steps: S1 calculates the winding DC resistance through a formula based on conventional resistance; S2 calculates the conductor cross-sectional area S and etching factor of the PCB product through a formula; S3 derives the PCB DC resistance through a formula; S4 determines the DCR design range; S5 determines whether the winding DCR of the above design meets the requirements; S6 calculates the line width and copper thickness design values ​​using a reverse calculation formula; S7 develops DCR design calculation software through the above derivation steps. In the present invention, based on the resistance calculation formula, combined with the process copper thickness tolerance, line width tolerance, etching factor manufacturing capability and PCB conductor specification shape, an effective calculation formula for the PCB planar transformer DC resistance (DCR) is output, the control range of copper thickness and line width, the influencing factors related to DC resistance, is accurately defined, and the DCR design calculation software is developed using this derivation formula to improve accuracy and work efficiency.

The utility model relates to the technical field of PCB (printed circuit board) design, and discloses a pin wire outlet structure for improving a tombstone effect of a 0603 packaging device, which comprises a 0603 packaging main body applied to a substrate, the 0603 packaging main body comprises a first bonding pad and a second bonding pad, a first wire and a second wire are led out of the first bonding pad in opposite directions, and the first wire and the second wire are arranged in parallel. A third wire and a fourth wire which are opposite in direction are led out from the second bonding pad, the wire width of the first wire is the same as the wire width of the third wire, and the wire width of the second wire is the same as the wire width of the fourth wire. According to the utility model, the wires are led out from the upper and lower sides of the first bonding pad and the second bonding pad at the same time, and the widths of the wires in the corresponding directions of the first bonding pad and the second bonding pad are consistent, so that the uniform distribution of heat in the welding process is ensured, the stress tolerance is increased, the occurrence of the tombstone effect is reduced, and the welding firmness of 0603 devices is ensured.

The invention discloses a method for keeping the line width consistency of a circuit board, which is characterized by comprising an online control system, and the keeping method comprises the following steps: S1, obtaining the copper thickness of each point of a copper wire on the circuit board; s2, the liquid level of a VCP wire groove and the height of a floating plate are adjusted; s3, the line width design value is adjusted according to the copper thickness; s4, adjusting the etching line speed range according to the copper thickness; s5, monitoring the copper ion concentration in real time; and S6, determining an adjustment means according to the copper ion concentration in the etching process. The copper thickness on the circuit board is obtained in real time, and the liquid level of the VCP wire groove and the height of the floating plate are fed back and adjusted according to the difference between the copper thickness and the preset copper thickness, so that the copper thickness is accurately controlled, the subsequent etching difficulty is reduced, and the consistency of the line width of the circuit board is kept. And through an accurate dynamic compensation mode, the consistency of the finally formed line width can be maintained. According to the technical means, the stability of the forming method of the circuit on the circuit board is improved, and the CPK standard reaching rate of the circuit width of the circuit on the circuit board can be 100%.

The application provides a metal wire and a manufacturing method thereof. The manufacturing method comprises the following steps: forming a metal strip on a substrate; forming a mask above the metal strip, wherein the width of the mask is smaller than the width of the metal strip, and the orthographic projection of the mask on the substrate is located in the orthographic projection of the metal strip on the substrate; and wet etching the metal strip to a saturation state under the protection of the mask to form a metal wire, wherein the width of the metal wire is smaller than the width of the mask. The manufacturing method can form a metal wire with high thickness and narrow line width.

The method for measuring the characteristic of the material between the two wires comprises the steps that a first structure and a first parameter of the two wires are determined, the first structure comprises the two wires arranged on a first insulating layer, the material to be measured is arranged between the two wires, and the first parameter comprises the wire width W1 of the two wires; a second structure and a second parameter of the single wire are determined, the second structure comprises that the single wire is arranged on a second insulating layer, the second insulating layer and the first insulating layer are made of the same material, the second parameter comprises the wire width W2 of the single wire, and the wire width W2 is equal to the wire width W1; obtaining a dielectric constant and a loss factor of a material of the second insulating layer under the condition that signals with different frequencies are applied to a single wire; obtaining dielectric constants of the to-be-measured material under the condition that signals with different frequencies are applied to the two wires; and in combination with the dielectric constant and the loss factor of the material of the second insulating layer under the condition that the signals with different frequencies are applied to the single wire, obtaining the loss factor of the to-be-measured material under the condition that the signals with different frequencies are applied to the two wires.

Embodiments of the present application disclose a kind of for encapsulating rewire layer preparation modular mold and its application;The modular mold of the present application embodiment can have greater than single processing field of view splicing pattern area, splicing pattern area is formed by multiple sub-molds with array arrangement, the pattern of splicing pattern area corresponds to the via-wiring interconnection structure of integrated circuit rewire layer, the pattern surface of sub-mold includes: high-density interconnection area, contains the microcircuit pattern for forming chip internal high-density signal wiring;Peripheral interconnection area is arranged in the side of high-density interconnection area, contains the widened wire pattern for forming electrical interconnection with adjacent sub-mold, widened wire pattern extends to the boundary of sub-mold, for forming lap joint interconnection with the corresponding wire pattern of adjacent sub-mold;Wherein, the line width of widened wire pattern of peripheral interconnection area is greater than the line width of microcircuit pattern.Thereby, the present application embodiment improves packaging efficiency and yield.

An on-line monitoring method for the blockage of a circular shear, belonging to the field of monitoring. It arranges diffuse reflection photoelectric switches at the top of the bin; collects the signal of whether the circular shear is working from L1 and obtains relevant production data from L2; when the circular shear starts to work, the on-line monitoring and early warning function is activated; decides whether to start the on-line monitoring and early warning function for the edge wire width of thick high-strength steel according to whether the incoming material is thick high-strength steel; if no edge wire is detected to stay, or the edge wire stays but the staying time does not exceed the set alarm duration, it is determined that the circular shear is working normally; otherwise, it is determined that the edge wire inside the bin has been blocked, and the corresponding bin blockage alarm module outputs sound and light alarm signals; when the incoming material is thick high-strength steel, the real-time actual width is compared with the target width after shearing: if it is greater than the edge wire over-width warning value, an early warning signal is sent through the on-line monitoring software; when the edge wire over-width warning signal is sent, check the video monitoring. If there is a trend of bin blockage, deal with it immediately.

The invention discloses a precision circuit board with high board thickness and high copper thickness and a processing method thereof, and the processing method comprises the steps: providing a processing board, the processing board is provided with two outer copper layers which are oppositely arranged, and the thickness of the two outer copper layers does not exceed 4 microns; respectively arranging a removable resin layer on the two outer copper layers to obtain a first intermediate plate; sequentially performing drilling, copper deposition electroplating, resin hole plugging and grinding treatment on the first intermediate plate to obtain a second intermediate plate with an interlayer conduction structure; after the resin layer is removed, an mSAP technology is used for manufacturing an outer layer circuit, and the outer layer circuit with the line width being 25 micrometers + / -5 micrometers, the line distance being 25 micrometers + / -5 micrometers and the copper thickness being not smaller than 35 micrometers is manufactured. The processing method is simple and reasonable, the obtained precise circuit board has the characteristics of high board thickness, high copper thickness, fine / precise circuit, good interlayer conduction performance and the like, and the market requirements of products such as tire pressure sensors and the like are met.

The utility model provides a common-mode inductor mold and common-mode inductor equipment. The common-mode inductor mold comprises a fixing rod, an end forming block and a wire passing replacement part. The end forming block is detachably connected to the fixing rod, and the wire passing replacement part penetrates through the fixing rod and the end forming block. The wire passing replacement part and the end forming block are both in split type design with the fixing rod. The wire passing replacement part is provided with a wire passing groove, and the wire passing groove is used for allowing a wire to penetrate. The wire passing groove is located in the through hole and the forming hole, so that the end forming block can be connected with or separated from the fixing rod, the wire passing replacement part can be replaced along with separation of the end forming block relative to the fixing rod so as to be compatible with dies of multiple wire specifications, and die replacement can be completed only by replacing the middle internal wire passing groove from large to small. And the width of the wire rod from large wire diameter to small wire diameter can be universally used for all wire rod specifications only by replacing the end part forming block, so that the phenomenon that the end part forming block cannot be disassembled relative to the fixed rod is avoided, and the universality of the common-mode inductor mold is improved.

A phase shifter and a wireless communication device are provided. The phase shifter includes a first substrate, a radio frequency transmission line arranged on a side of the first substrate, and a bias line connected to the radio frequency transmission line. The bias line includes a first wire and a second wire. A sheet resistance of the second wire is greater than a sheet resistance of the radio frequency transmission line. The first wire and the radio frequency transmission line are connected and form an integrated structure. A line width of the first wire is less than a line width of the radio frequency transmission line. The second wire and the first wire form a lapping region in an extension direction of the first wire. In the lapping region, the second wire is arranged on a side of the first wire away from the first substrate.

The utility model discloses a novel gold-plated lead structure, which comprises a printed board substrate, four first gold-plated leads, two second gold-plated leads and a bonding pad, the two second gold-plated leads are crosswise fixed in the center of the printed board substrate, the width of the first gold-plated leads is larger than that of the second gold-plated leads, and the bonding pad is arranged between the first gold-plated leads and the second gold-plated leads. The four first gold-plated wires are respectively fixed at one ends of the second gold-plated wires, and the bonding pads are fixed at the other ends of the first gold-plated wires. When the pattern transfer film exposure negative film is manufactured, the width of the wire at the intersection of the two gold-plated wires is reduced, so that the etching area at the intersection of the wires can be effectively reduced in the subsequent etching process, incomplete etching caused by overlarge etching area is avoided, the etching at the intersection of the wires is ensured to be clean, and the etching quality of the wires is improved. The printed circuit board improves the aesthetic property of the printed circuit board and the stability of signal transmission, and through the design of reducing the width of the gold-plated lead, the etching speed at the crossing part of the lead is relatively consistent with that at other parts, so that the etching speed is accelerated.

The application provides a manufacturing method of a packaging substrate, which comprises the following steps: obtaining a pattern compensation value through trial production, modifying existing process parameters according to the obtained pattern compensation value, and manufacturing mass production packaging substrates based on the same electroplating production line, etching production line and plate placing rules as in the trial production. The improved process design of the application firstly carries out sample production before formal production, and during the sample production process, different exposure compensation values are selected for different patterns, the line width, pitch and copper thickness are measured, the copper thickness contour distribution data (distribution map) established after electroplating is matched, the etching topographic map is found out, the line width compensation value is revised according to the relationship between the electroplated copper thickness, the line width compensation value and the etching uniformity and the actual measurement results, and finally the etching is carried out according to the revised line width compensation value, which can greatly improve the consistency of the fine line manufacturing of the whole plate surface of the packaging substrate, reduce the scrap rate, and thus improve the economic benefits.

The utility model relates to a wire material cutting machine and braided wire welding equipment, and the wire material cutting machine comprises a cutting machine base, and a track device, a traction device and a cutter device which are sequentially arranged on the cutting machine base in the wire material feeding direction; the track device is used for placing a wire material, the traction device is used for pulling the wire material to the cutter device, and the cutter device is used for cutting the wire material; a rail sliding groove is formed in the cutting machine base. The rail device comprises an adjustable feeding rail, a rail limiting base and a rail limiting piece. The adjustable feeding rail is installed above the rail sliding groove, the extending direction of the adjustable feeding rail is perpendicular to the extending direction of the rail sliding groove, and the width of the adjustable feeding rail can be adjusted in the extending direction of the rail sliding groove. The rail limiting seat is fixed to the cutting machine base, and the rail limiting piece is installed on the rail limiting seat and used for locking the adjustable feeding rail after the width of the adjustable feeding rail is adjusted. Therefore, the cutting device can be used for placing the wire materials with different wire widths in a matched manner, so that the cutting of the wire materials with different wire widths is realized.

The invention discloses a processing method of a PCB (Printed Circuit Board). The processing method comprises the following steps: data preparation: providing a 2oz copper-clad plate; an outer layer dry film: continuously pasting two layers of dry films with the thickness of 2mil on the copper-clad plate to obtain a first substrate with the dry film thickness of 4mil; exposure and development: carrying out exposure and two-time development on the first substrate to obtain a second substrate; pattern electroplating: performing copper plating and tin plating on the second substrate twice to obtain a third substrate; and etching the outer layer: carrying out two times of film stripping, two times of etching and tin stripping on the third substrate to obtain the PCB of which the copper thickness is 6oz and the ratio of the line width to the copper thickness is 1: 1. According to the processing method of the PCB, the PCB with the copper thickness being 6 oz and the ratio of the line width to the copper thickness being 1: 1 can be produced, line throwing and deformation are avoided after lead-free tin spraying, the production requirement is met, and the production procedure is simple and easy to operate.

The invention provides a semiconductor test structure and a method for testing alignment offset between metal layers, and relates to the field of semiconductors. The test structure comprises a first to-be-tested metal wire and a second to-be-tested metal wire, the first to-be-tested metal wire and the second to-be-tested metal wire are distributed in a stacked manner, the conductive test structure comprises a first conductive test part and / or a second conductive test part, the first conductive test part and the first to-be-tested metal layer are distributed on the same layer, and the second conductive test part and the second to-be-tested metal layer are distributed on the same layer. The second conductive test part and the second to-be-tested metal layer are distributed on the same layer; each part of the first conductive test part is equal in line width, and each part of the second conductive test part is also equal in line width; the distances between the first conductive test part and the first metal wire to be tested are equal everywhere, and the distances between the second conductive test part and the second metal wire to be tested are equal everywhere; the first to-be-tested metal wire and the second to-be-tested metal wire are connected through a via hole; the first test pad is connected with the first conductive test part or the second conductive test part; and the second test pad is connected with the first to-be-tested metal wire or the second to-be-tested metal wire.

The present invention discloses a line impedance calculation method, system, equipment and medium for a mesh shielding structure. The method first calculates the signal leakage ratio of the mesh shielding layer relative to the signal transmission ratio of the electric formation based on the conductor width and spacing of the mesh shielding layer, then equates the signal leakage of the mesh shielding layer to the increase in the dielectric thickness of the dielectric layer, calculates the equivalent dielectric thickness based on the leakage ratio and the dielectric thickness parameter, and then calculates the equivalent dielectric constant of the mesh shielding structure compared to the large copper surface shielding layer based on the equivalence principle of the transmission time of the electric formation loop network. Finally, the line impedance of the mesh shielding structure is calculated by combining the line width, copper thickness, equivalent dielectric thickness, equivalent dielectric constant and the classic characteristic impedance calculation formula of the large copper surface shielding layer. The method proposes a calculation theory and calculation model for the line impedance of the mesh shielding structure for the first time, greatly improving the accuracy of the line impedance calculation of the mesh shielding structure, and can be well applied to the impedance line design of the mesh shielding structure.

The invention provides a metal interconnection structure and method suitable for high-density fan-out packaging, and the method comprises the following steps: S1, adjusting the height of a metal bonding pad and / or a first metal wire layer on a functional multilayer structure, and enabling one end face, close to a functional chip, of the metal bonding pad and / or the first metal wire layer to reach the consistent height; s2, at least two first passivation layers and at least two metal wire layers are manufactured on the end face, close to the functional chip, of the metal bonding pad and / or the end face, close to the functional chip, of the first metal wire layer after adjustment in the step S1, so that a metal rewiring layer is formed, the line width of the metal wire layers is 1-4 microns, and the line distance is 1-4 microns; s3, completing metal interconnection between the metal rewiring layer and the organic substrate; therefore, the fluctuation of the surface of the metal bonding pad and / or the surface of the first metal wire layer is effectively avoided, the range and area of fine wiring of the metal rewiring layer are enlarged, the processing cost is reduced, and the current-carrying capacity and the overall performance of the packaging body are improved.

A wiring substrate includes a first build-up part including first insulating layers and conductor layers, a second build-up part laminated to the first part and including second insulating layers and conductor layers, and via conductors including first via conductors in the first insulating layers and second via conductors in the second insulating layers. The first part is positioned closer to first surface side of the substrate than the second part. The first conductor layers include wirings having wiring width and inter-wiring distance that are smaller than wiring width and inter-wiring distance of wirings in the second conductor layers. The first insulating layers include resin and inorganic particles including first particles forming inner wall surfaces in through holes and second particles embedded in the first insulating layers having different shapes from the first particles. Each first conductor layers and via conductors includes a metal film layer and a plating film layer.

The utility model discloses an enamelled wire hardness detection device, which relates to the hardness detection technology field, and comprises two support assemblies, a roll shaft assembly, fixing members and a clamping mechanism, the two support assemblies are arranged side by side, the upper end of each support assembly is provided with two fixing members, the roll shaft assembly is rotatably arranged between the two fixing members, and the clamping mechanism is arranged on the roll shaft assembly. The roll shaft assembly is provided with roll shaft grooves, the enameled wire is installed in the two roll shaft grooves, and the clamping mechanism is arranged between the two roll shaft grooves. According to the utility model, through the arrangement of the supporting assembly, the roll shaft assembly, the fixing piece and the clamping mechanism, enameled wires with different wire widths can be measured, the influence on the measurement precision caused by twisting of the enameled wires or friction of the roll shaft due to deformation can be prevented, the measurement error is small, the anti-interference capability is strong, and the application range is wider; and the method is particularly suitable for measuring the hardness of the enameled wire.

The utility model provides a heating element for electronic cigarette atomization core, atomization core, electronic cigarette, the heating element includes two contact for electrifying and with the heating wire of two contact electric connection, the heating wire has at least one wide part and / or narrow part, the line width of the wide part is greater than the line width of the rest part of the heating wire, and the width of the narrow part is greater than the line width of the other part of the heating wire. The line width of the narrow part is smaller than the line width of the rest part of the heating wire; the atomizing core comprises the heating body, and the electronic cigarette comprises the atomizing core. The heating body provided by the utility model can quickly heat the tobacco tar in the adsorption body and control the temperature rising speed of each local area so as to ensure that the temperature distribution of the adsorption body is more uniform, thereby improving the atomization efficiency of the tobacco tar.

The utility model relates to the technical field of mine screens, and particularly discloses a novel wear-resistant mine screen which comprises a screen body, the screen body is composed of a plurality of screen wire frameworks, the section of each screen wire framework is in a solid U shape, and a wear-resistant layer is arranged on the top of each screen wire framework in a surfacing mode. The upper end and the lower end of the cross section are arc-shaped, and the middle part and the two sides of the cross section are vertical. According to the novel wear-resistant mine screen, the section of the screen wire framework is changed into the solid U shape, and the wear-resistant layer is overlaid on the top, so that on the premise of not changing the mesh number of the screen and the width of the screen wire, the longitudinal thickness of the screen wire is increased, the longitudinal shearing force of the screen main body is effectively improved, and the overall bearing capacity is enhanced; and high-strength impact in the mine screening operation can be better adapted. And the wear-resistant layer is only overlaid on the top of the screen wire framework without being completely wrapped in the circumferential direction, so that the wear-resistant property of key parts in contact with ores is ensured, the use amount of wear-resistant materials is reduced, and the production cost is effectively saved.

A coil component and a method for manufacturing the same are provided, and the coil component includes a body portion including a magnetic material, a support member disposed in the body portion, first and second conductor patterns disposed in both sides of the support member, opposing each other, a recess portion formed in a side surface of the support member, a via conductor disposed in the recess portion and connecting the first and second conductor patterns to each other, and a via pad disposed in an end portion of each of the first and second conductor patterns to connect the first and second conductor patterns to the via conductor, and having a line width greater than line widths of the first and second conductor patterns.

The present invention provides a lamp drive system and an engine system. The lamp drive system is integrated within a chip and includes at least one lamp drive module. The wire width of each lamp drive module is less than 120 μm. Each lamp drive module includes: a lamp control unit that outputs a drive control signal based on a fault detection signal and a serial lamp drive control signal from an SPI module; a driver unit that controls the operating state of the corresponding LED lamp bead based on the drive control signal; and a fault detection module that detects faults in the lamp drive module. Thus, the present invention integrates multiple lamp drive modules within the chip, enabling the chip to independently drive and detect faults for each LED lamp bead. While reducing peripheral circuitry, the chip offers improved reliability, reduced complexity, and lowered operating costs.

The utility model discloses a circuit board structure for ensuring the through-flow of a primary line of a network port in the field of circuit board design, which comprises a network port connector and a transformer which are arranged on a circuit board, the network port connector is connected with the transformer through a line group, each line group comprises two lines, and the line width of each line is 10-20 mil. According to the utility model, the problem of poor through-flow effect of the existing network port primary signal line is solved, the impedance of the line does not need to be controlled, the through-flow of the network port primary line can be ensured by increasing the line width of the routing, the wider routing can bear larger current, the stable transmission of the current is ensured, the energy loss caused by impedance mismatching is reduced, and the service life of the network port primary signal line is prolonged. The current transmission efficiency is improved, the stable transmission of the current can be ensured, the problems of line overheating or damage and the like caused by overlarge current are avoided, the voltage drop when the current passes through is reduced, the risk of local overheating is reduced, and then the stability and the reliability of the circuit are ensured.