29 results about "Wire width" patented technology

To provide a wiring body and a display device capable of reducing sheet resistance, while improving the flatness of the wiring body.SOLUTION: According to a wiring body 200, a mesh-like conductor layer 5 provided on a light-transmissive substrate 1 is covered with a multilayer resin layer 9 composed of a first resin layer 7 and a second resin layer 8. As a result, any unevenness that may occur on the surface of the wiring body 200 due to the conductor layer 5 can be absorbed by the resin layer 9. Therefore, the flatness of the surface of the wiring body 200 can be improved. In the embodiment, an upper surface 8a of the second resin layer 8 constitutes the surface of the wiring body 200. Furthermore, the conductor layer 5 penetrates the first resin layer 7 on the light-transmissive substrate 1 side. As a result, it is possible to ensure the volume of the conductor while suppressing the thickness of conductor lines 50 of the conductor layer 5. Therefore, the sheet resistance of the wiring body 200 can be reduced. Thus, the flatness of the wiring body 200 can be improved while reducing the sheet resistance.SELECTED DRAWING: Figure 6

The application relates to the field of sheathed wires, in particular to a sheathed wire processing equipment, which comprises a feeding assembly, a processing assembly, a gluing assembly and a conveying mechanism, clamping grooves for mounting sheathed wires are arranged on the feeding assembly, the processing assembly, the gluing assembly and the conveying mechanism, the width of the clamping grooves is equal to the width of the sheathed wires, the feeding assembly comprises a flattening mechanism, the flattening mechanism comprises a material loading plate and a compression roller, the first clamping groove is arranged on the material loading plate, and the compression roller is rotationally arranged and abuts against the end face of the first clamping groove arranged on the material loading plate; the flattening mechanism is arranged in the feeding assembly, the states of the sheathed wires in the first clamping groove are consistent, the width of the clamping groove on each tooling position is equal to the width of the sheathed wires, the consistency of the sheathed wires during processing and conveying is ensured, and the processing consistency of the equipment for the sheathed wires is improved.

The utility model provides a multi-specification steel wire width adaptation mechanism and winding disc, including a plurality of mounting parts that sink step by step on the drive disc, the diameter radians of the plurality of mounting parts decrease step by step, along the radian of each stage of mounting part is connected with a support frame, and the support frame is connected with the drive disc. A base plate is overlaid between the front side of the supporting frame and the limiting plate according to the width of a steel wire to be wound, and a groove allowing the steel wire to be wound is formed between the inner wall of the supporting frame and the inner wall of the limiting plate. The winding disc comprises a base plate and a supporting seat which are concentrically arranged, the positions of grooves in the same stage on each group of driving discs correspond to each other, the plurality of groups of grooves which surround each other are in a circular ring shape, and the driving discs slide on the base plate along the supporting seat. Production of different specifications can be met by changing and combining the diameter and the width, production of steel wire rings of different specifications can be completed at the same time, and meanwhile the production cost is reduced.

The invention discloses a coreless transformer coil which comprises a coil body, the wire width of each turn of the coil body is different, and the distance between every two adjacent turns is determined through simulation, so that the self-inductance loss of the coil body is minimum. The invention also discloses an optimal design method of the coreless transformer coil, which at least comprises the following steps: step 1, constructing a first coil with equal line width and equal spacing, the first coil being a coreless transformer coil; 2, Maxwell simulation software is used for simulating the first coil, under the condition that the magnetic field intensity of the first coil is kept unchanged, the optimal line width value is found out, the optimal line width value refers to the line width when the winding loss of the first coil is minimum, and a second coil with the equal line width and the equal interval is constructed with the optimal line width value as the line width; and step 3, keeping the inner diameter and the outer diameter of the second coil unchanged, setting the wire width of each turn of the second coil to be different values, and performing simulation to obtain a third coil. The high-frequency loss of the coreless transformer coil can be effectively reduced.

The invention discloses a method for keeping the line width consistency of a circuit board, which is characterized by comprising an online control system, and the keeping method comprises the following steps: S1, obtaining the copper thickness of each point of a copper wire on the circuit board; s2, the liquid level of a VCP wire groove and the height of a floating plate are adjusted; s3, the line width design value is adjusted according to the copper thickness; s4, adjusting the etching line speed range according to the copper thickness; s5, monitoring the copper ion concentration in real time; and S6, determining an adjustment means according to the copper ion concentration in the etching process. The copper thickness on the circuit board is obtained in real time, and the liquid level of the VCP wire groove and the height of the floating plate are fed back and adjusted according to the difference between the copper thickness and the preset copper thickness, so that the copper thickness is accurately controlled, the subsequent etching difficulty is reduced, and the consistency of the line width of the circuit board is kept. And through an accurate dynamic compensation mode, the consistency of the finally formed line width can be maintained. According to the technical means, the stability of the forming method of the circuit on the circuit board is improved, and the CPK standard reaching rate of the circuit width of the circuit on the circuit board can be 100%.

The application provides a metal wire and a manufacturing method thereof. The manufacturing method comprises the following steps: forming a metal strip on a substrate; forming a mask above the metal strip, wherein the width of the mask is smaller than the width of the metal strip, and the orthographic projection of the mask on the substrate is located in the orthographic projection of the metal strip on the substrate; and wet etching the metal strip to a saturation state under the protection of the mask to form a metal wire, wherein the width of the metal wire is smaller than the width of the mask. The manufacturing method can form a metal wire with high thickness and narrow line width.

Embodiments of the present application disclose a kind of for encapsulating rewire layer preparation modular mold and its application;The modular mold of the present application embodiment can have greater than single processing field of view splicing pattern area, splicing pattern area is formed by multiple sub-molds with array arrangement, the pattern of splicing pattern area corresponds to the via-wiring interconnection structure of integrated circuit rewire layer, the pattern surface of sub-mold includes: high-density interconnection area, contains the microcircuit pattern for forming chip internal high-density signal wiring;Peripheral interconnection area is arranged in the side of high-density interconnection area, contains the widened wire pattern for forming electrical interconnection with adjacent sub-mold, widened wire pattern extends to the boundary of sub-mold, for forming lap joint interconnection with the corresponding wire pattern of adjacent sub-mold;Wherein, the line width of widened wire pattern of peripheral interconnection area is greater than the line width of microcircuit pattern.Thereby, the present application embodiment improves packaging efficiency and yield.

The invention discloses a precision circuit board with high board thickness and high copper thickness and a processing method thereof, and the processing method comprises the steps: providing a processing board, the processing board is provided with two outer copper layers which are oppositely arranged, and the thickness of the two outer copper layers does not exceed 4 microns; respectively arranging a removable resin layer on the two outer copper layers to obtain a first intermediate plate; sequentially performing drilling, copper deposition electroplating, resin hole plugging and grinding treatment on the first intermediate plate to obtain a second intermediate plate with an interlayer conduction structure; after the resin layer is removed, an mSAP technology is used for manufacturing an outer layer circuit, and the outer layer circuit with the line width being 25 micrometers + / -5 micrometers, the line distance being 25 micrometers + / -5 micrometers and the copper thickness being not smaller than 35 micrometers is manufactured. The processing method is simple and reasonable, the obtained precise circuit board has the characteristics of high board thickness, high copper thickness, fine / precise circuit, good interlayer conduction performance and the like, and the market requirements of products such as tire pressure sensors and the like are met.

A phase shifter and a wireless communication device are provided. The phase shifter includes a first substrate, a radio frequency transmission line arranged on a side of the first substrate, and a bias line connected to the radio frequency transmission line. The bias line includes a first wire and a second wire. A sheet resistance of the second wire is greater than a sheet resistance of the radio frequency transmission line. The first wire and the radio frequency transmission line are connected and form an integrated structure. A line width of the first wire is less than a line width of the radio frequency transmission line. The second wire and the first wire form a lapping region in an extension direction of the first wire. In the lapping region, the second wire is arranged on a side of the first wire away from the first substrate.

The utility model discloses a novel gold-plated lead structure, which comprises a printed board substrate, four first gold-plated leads, two second gold-plated leads and a bonding pad, the two second gold-plated leads are crosswise fixed in the center of the printed board substrate, the width of the first gold-plated leads is larger than that of the second gold-plated leads, and the bonding pad is arranged between the first gold-plated leads and the second gold-plated leads. The four first gold-plated wires are respectively fixed at one ends of the second gold-plated wires, and the bonding pads are fixed at the other ends of the first gold-plated wires. When the pattern transfer film exposure negative film is manufactured, the width of the wire at the intersection of the two gold-plated wires is reduced, so that the etching area at the intersection of the wires can be effectively reduced in the subsequent etching process, incomplete etching caused by overlarge etching area is avoided, the etching at the intersection of the wires is ensured to be clean, and the etching quality of the wires is improved. The printed circuit board improves the aesthetic property of the printed circuit board and the stability of signal transmission, and through the design of reducing the width of the gold-plated lead, the etching speed at the crossing part of the lead is relatively consistent with that at other parts, so that the etching speed is accelerated.

A wiring substrate includes a first build-up part including first insulating layers and conductor layers, a second build-up part laminated to the first part and including second insulating layers and conductor layers, and via conductors including first via conductors in the first insulating layers and second via conductors in the second insulating layers. The first part is positioned closer to first surface side of the substrate than the second part. The first conductor layers include wirings having wiring width and inter-wiring distance that are smaller than wiring width and inter-wiring distance of wirings in the second conductor layers. The first insulating layers include resin and inorganic particles including first particles forming inner wall surfaces in through holes and second particles embedded in the first insulating layers having different shapes from the first particles. Each first conductor layers and via conductors includes a metal film layer and a plating film layer.

The utility model relates to the technical field of mine screens, and particularly discloses a novel wear-resistant mine screen which comprises a screen body, the screen body is composed of a plurality of screen wire frameworks, the section of each screen wire framework is in a solid U shape, and a wear-resistant layer is arranged on the top of each screen wire framework in a surfacing mode. The upper end and the lower end of the cross section are arc-shaped, and the middle part and the two sides of the cross section are vertical. According to the novel wear-resistant mine screen, the section of the screen wire framework is changed into the solid U shape, and the wear-resistant layer is overlaid on the top, so that on the premise of not changing the mesh number of the screen and the width of the screen wire, the longitudinal thickness of the screen wire is increased, the longitudinal shearing force of the screen main body is effectively improved, and the overall bearing capacity is enhanced; and high-strength impact in the mine screening operation can be better adapted. And the wear-resistant layer is only overlaid on the top of the screen wire framework without being completely wrapped in the circumferential direction, so that the wear-resistant property of key parts in contact with ores is ensured, the use amount of wear-resistant materials is reduced, and the production cost is effectively saved.

The utility model discloses a circuit board structure for ensuring the through-flow of a primary line of a network port in the field of circuit board design, which comprises a network port connector and a transformer which are arranged on a circuit board, the network port connector is connected with the transformer through a line group, each line group comprises two lines, and the line width of each line is 10-20 mil. According to the utility model, the problem of poor through-flow effect of the existing network port primary signal line is solved, the impedance of the line does not need to be controlled, the through-flow of the network port primary line can be ensured by increasing the line width of the routing, the wider routing can bear larger current, the stable transmission of the current is ensured, the energy loss caused by impedance mismatching is reduced, and the service life of the network port primary signal line is prolonged. The current transmission efficiency is improved, the stable transmission of the current can be ensured, the problems of line overheating or damage and the like caused by overlarge current are avoided, the voltage drop when the current passes through is reduced, the risk of local overheating is reduced, and then the stability and the reliability of the circuit are ensured.

The present invention provides a heating element for an atomization core of an electronic cigarette, an atomization core and a manufacturing method therefor, and an electronic cigarette. The heating element comprises two contacts for energization and heating wires electrically connected to the two contacts; each heating wire has at least one wide portion and / or narrow portion, the wire width of the wide portion is greater than the wire width of the remaining portion of the heating wire, and the wire width of the narrow portion is less than the wire width of the remaining portion of the heating wire. The atomization core comprises the heating element, and the electronic cigarette comprises the atomization core. The heating element provided by the present invention can rapidly heat the e-liquid in an absorption body, and control the heating rate of each local area, so as to ensure that the temperature distribution of the absorption body is more uniform, thereby improving the atomization efficiency of the e-liquid.

The application discloses a flexible printed circuit board wiring optimization method based on laminar flow closing sequence, and is oriented to the same layer high-density parallel wiring scene after layering. The method constructs a wireable domain based on the plate shape boundary and the forbidden wiring area, extracts a skeleton channel network, and quantifies the available width on both sides of the channel to form a channel graph with capacity constraints. The same layer line group is expanded into a wiring instance according to the number of parallel roots, a wiring sorting algorithm based on the laminar flow closing sequence is proposed, and the wiring priority of the wiring instance is determined through the 'close first and open later' stack matching rule of the clockwise scanning of the port. Then, the incremental wiring is performed under the capacity constraint according to the sequence, a geometric path meeting the line width, line spacing, safety margin and minimum bending radius is generated, and space occupation update and conflict avoidance are realized through area write-back. The method can reduce the risk of shared channel crossing and crossing, improve the success rate of automatic wiring and manufacturability. At the same time, the manufacturability and regularity of the wiring result are optimized.

This invention belongs to the field of printed circuit board technology and discloses a method and product for improving the burrs on gold-plated leads during rigid-flex PCB forming. In the gold fingers connecting the gold fingers to the board edge within the unit, the gold finger leads are symmetrically reduced to the left and right based on the center line of the forming line, and the left and right lengths and widths of the reduced lines between the gold fingers and the gold finger leads are adjusted. Based on the adjustment results of the left and right lengths and widths of the reduced lines, a router is used to form the board. Based on the formed board results, a rigid-flex PCB product is manufactured. In this invention, the gold finger leads are designed with a length of 0.3mm and a line width of 0.1mm, based on the center line of the forming line. Reducing the line width can improve the burrs on the leads caused by the router during forming, thereby improving the surface scratches caused by the burrs.

The application discloses a control method for CAF failure of a circuit board, and the control method is as follows: S1, the fiberglass looseness and fiberglass hollow of an insulating cloth layer are detected through a microscope, wherein the cloth layer with fiberglass hollow greater than 30ppm is rejected; S2, the line width compensation of a copper foil is increased, and the etching rate of the copper foil is improved, so that copper teeth are avoided on the copper foil; S3, the circuit board is drilled through drilling equipment; S4, defects of the circuit board are monitored through image detection, and the circuit board is repaired; and S5, the circuit board is detected under the environment of 85 DEG C / 85%RH, and good circuit boards without CAF failure are selected. The application comprehensively considers three factors of material, process and environment, constructs a multi-dimensional control model, effectively inhibits the possibility of CAF failure of the circuit board, reduces economic losses caused by CAF failure, and improves long-term reliability of the circuit board.

The present application relates to the technical field of energy storage, and discloses a sampling assembly, an energy storage apparatus, and an energy storage system. The sampling assembly comprises: a flexible substrate, provided with isolation slots and connecting bridges, wherein the flexible substrate is divided into a body plate and fixing portions, and the connecting bridges connect the fixing portions and the body plate; a plurality of sampling wires, laid on the flexible substrate, wherein the line width of a first wire is greater than that of a second wire, and the first wire is located on the side of the second wire close to a side edge of the flexible substrate; and sampling terminals, connected to the sampling wires of the fixing portions. In the embodiments of the present application, the flexible substrate replaces connecting wires, thereby facilitating simplification of the connection between battery cells and a battery management system, and improving electrical safety. In addition, the isolation slots on the flexible substrate provide a certain buffering space between the fixing portions and the body plate, so that when the fixing portions are pulled due to thermal expansion of battery cells, tearing between the fixing portions and the body plate is avoided, thereby ensuring effective collection of operating parameters of the battery cells.

In various examples, a shaft for an elongate medical device extends along a shaft length. The shaft includes a shaft axis, an outer surface, and an inner surface. The inner surface defines an inner lumen. A liner forms the inner surface of the shaft. A coil is disposed around and outwardly from the liner. The coil is formed from a flat wire. The flat wire includes a wire width and a wire height, wherein the wire height is greater than the wire width. The wire height extends substantially radially with respect to the shaft and the wire width extends substantially longitudinally with respect to the shaft. A jacket is disposed around and outwardly from the coil. The jacket forms the outer surface of the shaft.

The invention belongs to the field of inductors, and particularly discloses an inductor and a preparation method thereof. The through hole conductor is designed to be of a structure protruding towards the inner side of the coil conductor, and the outer edge of the through hole conductor is tangent to the outer edge of the wire layer, so that inward turning of connection points in the inductor is achieved. According to the design, the problem of connection point exposure caused by cutting deviation can be effectively improved, and the risk of exposure of the inner electrode is remarkably reduced. Meanwhile, the available area of the coil conductor design is increased after the connection points are turned inwards, so that the inductance value design upper limit of the inductor product is improved, and the electrical performance and the reliability of the product are comprehensively improved; meanwhile, the diameter of the through hole conductor is larger than the line width of the wire layer, the connection point area can be increased, the connection effect is improved, resistance and open circuit risks are reduced, and the electrical performance and reliability of products are improved.

The application relates to the technical field of image processing, and discloses a surface defect visual detection method for a multi-layer composite shielding layer of a cable, which comprises the following steps: constructing a surface development image through equal-scale resampling and local uniformization, extracting a weaving direction, a weaving wire width and reliable track points, and reconstructing a theoretical weaving track and a cross topology; dividing detection units along the theoretical track, combining track support, width consistency, end connection and topology consistency to evaluate the upper-layer weaving integrity, simultaneously identifying lower-layer planar exposure and linear visual substitution, and correcting the detection result; further extracting a defect area through a defect threshold, region growing and sampling position refinement, calculating a defect area, a span, a track interruption and a topology damage condition, and finally outputting defect severity, reliability, imaging type and a physical position.

To reduce the line width of a thin line.SOLUTION: In the thin line structure 18, a bottomed concave groove portion 10 is provided in the sensor substrate 5. The recessed groove part 10 is provided with a pair of thin wires 1919 and composed of a conductive metal material. The pair of fine lines 19,19 are respectively formed at positions including the corner portions 13 of the recessed groove portion 10, and are arranged at an interval in the width direction of the bottom portion 12.SELECTED DRAWING: Figure 4

In some embodiments, the disclosure is directed to a wire screen system comprising one or more thick and thin wires arranged in an alternating configuration and coupled to supporting rods. In some embodiments, each of the thin wires is approximately 50% or less the thickness of the thick wires at their respective bases. The screen system may take on various forms, such as flat, curved, or cylindrical. In some embodiments, the cylindrical tube is separable into two halves. The thick, thin, and / or short wires may feature a wedge profile, narrowing toward the supporting rods, with the base oriented to face the direction of flow. In some embodiments, short wires, which may be approximately 50% or less the length of the thick and / or thin wires, may be interspersed. In cylindrical configurations, wire widths may taper inward toward the centerline, enhancing the ability of the screen to stay free of debris.

A rolling method for an iron-based high-temperature alloy flat wire comprises the following steps that (1) the diameter of a raw material iron-based high-temperature alloy round wire and the total rolling reduction from the round wire to the target flat wire are calculated according to the width and thickness of the target flat wire; (2) calculating the maximum rolling reduction of the rollers with different roller diameters according to the number of the rollers of the rolling mill and the different roller diameters; (3) according to the ratio of the sum of the maximum rolling reduction of all the rollers to the total rolling reduction, the rolling pass is determined; (4) according to the rolling passes, the actual rolling reduction of each roller in each pass and the rolling force of each roller are determined; (5) the total rolling reduction of each pass is calculated according to the actual rolling reduction of each roller in each pass, and the wire feeding speed of the rolling mill is set; 6) starting a rolling mill to perform pattern rolling on the iron-based high-temperature alloy round wire to obtain a pattern flat wire meeting the target flat wire thickness, and 7) calculating the tension of the flat wire according to the actual flat wire width of the pattern flat wire, and finely adjusting the width of the flat wire to obtain an iron-based high-temperature alloy finished product flat wire.

The application provides a PCB with a loss test area and a design method and use method thereof, and belongs to the technical field of signal integrity testing. The PCB has a main wiring area and a loss test area on the board surface. The main wiring area is arranged at the middle of the board surface of the PCB, and the loss test area is arranged at the peripheral edge of the main wiring area. The main wiring area of the PCB is provided with paired differential transmission lines. The line width of the paired two differential transmission lines is the same, and the line spacing is fixed. A preset number and a preset length of single-end test lines are arranged on the loss test area. The line width of the single-end test lines is the same as that of the differential transmission lines. Each single-end test line is provided with a via at both ends. The length difference of different single-end test lines is greater than a set length threshold. The application reduces the size of the loss test area and reduces the cost.

In various examples, a shaft for an elongate medical device extends along a shaft length. The shaft includes a shaft axis, an outer surface, and an inner surface. The inner surface defines an inner lumen. A liner forms the inner surface of the shaft. A coil is disposed around and outwardly from the liner. The coil is formed from a flat wire. The flat wire includes a wire width and a wire height, wherein the wire height is greater than the wire width. The wire height extends substantially radially with respect to the shaft and the wire width extends substantially longitudinally with respect to the shaft. A jacket is disposed around and outwardly from the coil. The jacket forms the outer surface of the shaft.

A wiring substrate includes a first build-up part includes first insulating layers, first conductor layers and first via conductors, and a second build-up part laminated to the first build-up part and including second insulating layers, second conductor layers and second via conductors. The first conductor layers in the first build-up part and the second conductor layers in the second build-up part include wirings such that a wiring width and an inter-wiring distance of the wirings in the first conductor layers are smaller than a wiring width and an inter-wiring distance of the wirings in the second conductor layers, an aspect ratio of the wirings in the first conductor layers is in the range of 2.0 to 4.0, the wiring width of the wirings in the first conductor layers is 3 μm or less, and the inter-wiring distance of the wirings in the first conductor layers is 3 μm or less.

The application discloses a conductive grid and electronic equipment, and relates to the technical field of electronic devices, wherein the conductive grid comprises a plurality of preset wires, the plurality of preset wires are connected and are configured to form a grid, a ratio of wire thickness and wire width of the preset wires is greater than or equal to 1, the conductive grid comprises a pin area and a main body area, and the main body area is provided with the plurality of preset wires. The technical scheme provided by the application aims to improve the wire strength of the main body area provided with the grid, so as to guarantee the structural strength of the conductive grid.

Improved connection quality of conductor layers using via conductors. [Solution] The wiring board 1 of the embodiment has a first surface 1F and a second surface opposite to the first surface 1F, and includes a first build-up section 10 which includes a plurality of laminated insulating layers 11 and a plurality of conductor layers 12, and a second build-up section 20 which includes a laminated insulating layer 21 and a conductor layer and is laminated on the second surface side of the first build-up section 10. The minimum wiring width of the wiring included in the conductor layer 12 of the first build-up section 10 is smaller than the minimum wiring width of the wiring included in the conductor layer of the second build-up section 20, and the first build-up section 10 includes single-layer through-via conductors 13a, 13b which penetrate only one insulating layer, and skip via conductors 131, 132 which continuously penetrate two or more adjacent insulating layers.