105results about How to "Prevent peeling" patented technology

To provide a method for manufacturing a semiconductor device including a transfer step that is capable of controlling the adhesiveness of a substrate and an element-formed layer in the case of separating the element-formed layer including a semiconductor element or an integrated circuit formed over the substrate from the substrate and bonding it to another substrate. An adhesive agent made of a good adhesiveness material is formed between the semiconductor element or the integrated circuit comprising plural semiconductor elements formed over the substrate (a first substrate) and the substrate, and thus it is possible to prevent a semiconductor element from peeling off a substrate in manufacturing the semiconductor element, and further, to make it easier to separate the semiconductor element from the substrate by removing the adhesive agent after forming the semiconductor element.

A case of a portable equipment for communication to an external system comprises a body portion and an operation portion acting as a function member. At least a portion of the case is provided with a decorative film having a resin film having transparency and a print layer printed on a back surface of the resin film in a predetermined pattern, and a resin base member formed on a back surface of the decorative film so as to contact the print layer. The front surface of the decorative layer is exposed as a most outside surface of the case.

A pixel structure disposed on a substrate including a thin film transistor (TFT), a bottom capacitor electrode, a dielectric layer, an upper capacitor electrode, a passivation layer, and a pixel electrode is provided. The TFT having a source/drain and the bottom capacitor electrode are disposed on the substrate. The dielectric layer is disposed on the bottom capacitor electrode. The upper capacitor electrode has a semiconductor layer, a barrier layer, and a metal layer. The semiconductor layer is disposed on the dielectric layer above the bottom capacitor electrode. The barrier layer is disposed on the semiconductor layer. The metal layer whose material includes copper, a copper alloy, or a combination thereof is disposed on the barrier layer. The passivation layer covers the TFT and the upper capacitor electrode and has a first opening exposing the source/drain. The pixel electrode is electrically connected to the TFT through the first opening.

Disclosed is a semiconductor light-emitting element including a substrate; a laminated semiconductor layer in which an n-type semiconductor layer, a light-emitting layer and a p-type semiconductor layer are laminated on the substrate in this order; one electrode joined with the p-type semiconductor layer; and another electrode joined with the n-type semiconductor layer, wherein one or both of the one and other electrodes has a structure such that an ohmic contact layer, a metal reflection layer, a first anti-diffusion layer and a first adhesion layer are laminated in this order, and the first adhesion layer has an outer peripheral portion which extends so as to be in contact with the laminated semiconductor layer, so as to completely cover the first anti-diffusion layer.

The present invention provides a colored photosensitive resin composition, a color filter, a method for producing the same, and an image display device, the colored photosensitive resin composition comprising: (A) a colorant, (B) an alkali-soluble resin, (C) a photopolymerizable compound, (D) a photopolymerization initiator, (E) one or more compounds selected from the group consisting of a polyfunctional thiol compound and an organosilicon compound, and (F) a solvent. The colorant (A) contains one or more of Pigment Green 59, 62 and 63 selected from C.I. and one or more selected from pigments and dyes.

The patch agent of the present invention is a patch agent comprising a support made of a synthetic fiber and an adhesive layer mounted on the support, and having a bending resistance of 10 to 30 mm and a probe tack value of 0.25 to 1.2 N. The patch agent of the present invention can fully be prevented from peeling off at the time of application and can fully suppress the rash of skin and the pain upon peeling.

The invention relates to a method for depositing a coating on the wall of a metal container. According to said method, the coating is deposited using a plasma at a pressure close to atmospheric pressure. The metallic container can be an aerosol dispenser can and the resulting coating advantageously replaces the internal layer of varnish usually deposited in containers of this type.

A stator includes a stator coil formed of electric wires which include a joined pair of first and second electric wires. The first electric wire has a lead portion led out from the radially inner periphery of a first slot of a stator core and including a crossover part. The crossover part crosses over an axial end face of an end part of the stator coil from the radially inside to the radially outside of the axial end face; the end part protrudes from an axial end face of the stator core. The second electric wire has a lead portion led out from the radially outer periphery of a second slot of the stator core. The lead portions of the electric wires are joined together with a joint formed therebetween. The joint is positioned closer to the axial end face of the stator core than the crossover part is.

A piezoelectric device includes: a substrate; a first electrode which is layered over the substrate; a first piezoelectric film which is layered over the first electrode; a metal oxide film which is layered over the first piezoelectric film; a metal film which is layered over the metal oxide film; a second piezoelectric film which is layered over the metal film; and a second electrode which is layered over the second piezoelectric film, wherein a polarizing direction of the first piezoelectric film and a polarizing direction of the second piezoelectric film are different from each other.

The invention discloses a disc brake with a friction block return structure. The disc brake comprises a brake disc, friction blocks located at two sides of the brake disc, a clamp body bracket supporting the friction blocks, a clamp body pushing the friction block along the axial direction of the brake disc and a friction block pressing plate at one side of the friction blocks, and the middle part of the friction block pressing plate is provided with an elastic element which is inclined towards the axis of the brake disc and can deform elastically along the direction vertical to the axis of the brake disc. The disc brake enables the friction blocks to return to the original position in time after brake removal, and ensures that the radiation condition is improved and the delayed friction between the friction blocks and the brake disc can be avoided.

A peeling tap adhering method for adhering a peeling tape (4) to a surface protection film (11) adhered to the front surface of a wafer (20), comprises the steps of: supporting the wafer on a table (31) under the condition that the surface protection film is directed upward; adhering the peeling tape onto the surface protection film by pressing the peeling tape onto the surface protection film when a peeling tape adhering means (46) is lowered; detecting the pressure between the surface protection film of the wafer and the peeling tape adhering means; and stopping the peeling tape adhering means from lowering in the case where a pressure detection value (P) is not less than a predetermined value (P0). Due to the foregoing, it is possible to prevent the wafer from being cracked. Further, it is possible to prevent the peeling tape and the dicing tape from adhering to each other. When the distance (L) between the surface protection film of the wafer and the peeling tape adhering means becomes a value not more than a predetermined value (L0), the peeling tape sticking means may be stopped from lowering.

There is provided a liquid ejecting head including: a flow path formation substrate on which a pressure generation chamber communicating with nozzle openings for discharging liquid is provided; and a piezoelectric element which is provided on the flow path formation substrate and includes a piezoelectric layer, an electrode, and a wiring layer connected to the electrode, in which the wiring layer includes an adhesion layer which is provided on the electrode side and contains at least titanium and tungsten, and a conductive layer containing copper which is provided on a side of the adhesion layer opposite the electrode.

A method of manufacturing a liquid ejection head and a liquid ejection head capable of preventing corrosion of electrodes are provided. A method of manufacturing a liquid ejection head includes: a steps of forming porous silicon areas in portions of a silicon substrate where the liquid paths are to be formed; a steps of forming in layers in the porous silicon areas a protective layer, a heating resistor layer, an electrode layer and a heat accumulation layer; a steps of forming ink ejection openings in the silicon substrate; and a steps of removing the porous silicon areas.

The invention aims to provide a battery packaging laminate at a low cost, wherein the laminate can reduce reduction of the laminate strength between aluminum foil and a multilayer sealant film and interlayer peeling induced by electrolyte deterioration of a lithium ion battery and can produce a packaging container with a high yield. A substrate layer (11), aluminum foil (12), and a multilayer sealant film (17) formed by lamination of a metal-object heat-adhesive resin layer (16) and a polyolefin resin layer (13), are laminated in the battery packaging laminate (10). A corrosion-resistant coating layer (14) is formed at least on the surface of the aluminum foil (12) attached to the multilayer sealant film (17). The multilayer sealant film (17) is attached to the corrosion-resistant coating layer (14) through the metal-object heat-adhesive resin layer (16), the melting heat of which is smaller than 25 mJ/mg.

The invention provides a cam follower having an outer ring which is used in a state where the cam follower comes into sliding contact or rolling contact with a mating part. The outer ring is configured such that the hardness of a surface layer portion existing between the surface and at least 3 μm below the surface is Hv 780 to 900, and the hardness of an internal surface portion existing at a depth of 10 μm or more from the surface is lower than the hardness of the surface layer portion and less than Hv 780. Such hardness can be obtained by performing soft shot blasting or flow barrel processing on a surface layer portion of a base material to be the outer ring.

A method of producing a multi-layer ceramic electronic component includes: preparing a multi-layer sheet including laminated ceramic sheets, and internal electrodes disposed between the ceramic sheets; cutting the multi-layer sheet to produce multi-layer chips each having side surfaces from which the internal electrodes are exposed; smoothing the side surfaces of the multi-layer chips; and providing side margins to the smoothed side surfaces of the multi-layer chips.

Methods are disclosed for manufacturing tuning-fork type piezoelectric vibrating devices. In an exemplary method a metal film is formed on both surfaces of a piezoelectric wafer, followed by application of photoresist. A first metal-film-etching step etches the metal film after removal of the photoresist layer outside the profile outline of the devices. A first piezoelectric-etching step etches the wafer surface but not through to the rear surface; thus, outside the profile outline the metal film is removed. A second metal-film-etching step etches the metal film after removal of the photoresist layer from first groove regions. A second piezoelectric-etching step etches outside the profile outline and the groove regions through to the rear surface.

An organic light emitting display device is disclosed which includes: an element substrate provided with a thin film transistor; an organic light emitting element electrically connected to the thin film transistor and formed on the element substrate; a protective layer formed on the organic light emitting element; an adhesive film configured to include a first adhesive layer and a second adhesive layer which are sequentially stacked on the protective layer, the first adhesive layer including a resin layer and the second adhesive layer including another resin layer and a filler; and a sealing substrate disposed on the second adhesive layer and combined with the element substrate, which is provided with the organic light emitting element, by the adhesive film. One of the resin layers of the first and second adhesive layers within the adhesive film is formed from a non-hardening resin layer.

A flat, solid counter electrode is formed on an organic passivation film. Before forming an interlayer insulating film on the counter electrode, plasma ashing is performed. A surface of the organic passivation film is trimmed by the plasma ashing, forming an overhang. The plasma ashing not only trims a surface of the organic passivation film but also roughens a surface of the counter electrode. This increases a contact area between the interlayer insulating film and the organic passivation film or counter electrode, increasing the adhesiveness therebetween. Further, the plasma ashing eliminates the remainder of a resist on the counter electrode, increasing the adhesiveness of the interlayer insulating film.

The liquid container has a spacer member provided in the liquid storage portion. When three directions orthogonal to each other are assumed to be a D direction, a T direction, and a W direction, in the D direction, a direction from a liquid outlet portion toward the other edge portion of the bag is assumed to be a +D direction, and the opposite direction to the +D direction is assumed to be a −D direction, and a direction in which the dimension of the outer shape of the liquid container is smallest is assumed to be the T direction, and the spacer member has, on the +D direction side, a face inclined such that the dimension in the T direction of the spacer member increases from the +D direction side toward the −D direction side.

The present invention relates to a pattern of a color filter array. The pattern includes a plurality of pixel arrays, which has four color filters arranged in an array. The color of the neighboring color filters is distinct to each other. Moreover, the pattern of the color filter array has enlarged color filters or extended edges in corners of the pattern. These enlarged color filters or extended edges increase the contact area between the pattern and a substrate that the pattern formed on. Therefore, the adhesion strength between the pattern and the substrate can be augmented to prevent peeling from the substrate. According to the invention, the yield of the product will be raised substantially.

An organic electroluminescent panel includes a plurality of pixels disposed on a substrate. The pixel comprises an organic electroluminescent device, at least one pixel-defining layer, and at least one separator. The organic electroluminescent device comprises, in sequence, a first electrode, at least one organic functional layer, and a second electrode. The first electrode is disposed on the substrate. The pixel-defining layer is disposed on the first electrode or on the substrate. The separator is disposed on the pixel-defining layer. The organic functional layer is disposed on the first electrode or on the separator. The second electrode is disposed on the organic functional layer. In this case, the pixel-defining layer and the separator are made of negative photoresist. Furthermore, a method for manufacturing the organic electroluminescent panel is disclosed.

The optical film manufacturing method includes a coating procedure which coats a coating liquid containing the active energy ray curing resin on a substrate film to form a coated layer, a first curing procedure which irradiating the active energy ray to two end areas of the coated layer along the orthogonal direction of a transmission direction of the coated layer, a second curing procedure which irradiates the active energy ray to the coated layer from the substrate film under the condition that the surface of a casting model presses against the surface of the coated layer. According to the invention, the optical film manufacturing method can provide high quality and zero-defect optical film, and the production rate is high.

A piston ring includes a piston ring body and a surface coating film formed on at least one of upper and lower surfaces of the piston ring body. The surface coating film has a most outside surface layer including a heat-resistant resin and a metal powder contained in the heat-resistant resin and a base bottom layer formed nearest the piston ring body and including a heat-resistant resin. The base bottom layer may also include a metal powder.

A negative electrode (2) for a lithium secondary battery having a negative electrode current collector (21) having an arithmetical mean surface roughness Ra of 0.01 μm or greater and a negative electrode active material layer (22) formed on the negative electrode current collector (21). The negative electrode active material layer (22) contains a negative electrode active material (22a) including a material capable of alloying with lithium. A conductive layer (23) including a material not intercalating or deintercalating lithium is formed on the negative electrode active material layer.

The invention provides a cryogenic refrigerator, a cryopump, and a displacer, higher reliability can be maintained regardless of change of temperature. The cryogenic refrigerator is a two-stage GM cryogenic refrigerator making a motor (M) driving the displacer (13, 14) rotatable in a direction opposite to a rotation direction in cooling and capable of reversion temperature increasing, the second-stage displacer (14) is formed by a displacer cylinder (14A) and a resin film (14B) formed at the outer periphery, and a thickness of the resin (14B) is thinner on the high-temperature side (H) than on the low-temperature side (L).

The invention provides a printed circuit board before being formed and cut and a manufacturing method thereof. The circuit board comprises: a circuit board with a complete external-layer circuit, wherein the circuit board exposes a circuit connecting part; a plurality of connecting gold fingers which are connected with the circuit connecting part and provided with a main part and a protruding part; and a forming route which extends along the edge of the circuit board of the protruding part, wherein a certain distance of over 2 milli-inches is reserved between the forming route and the protruding part. Because of a certain distance reserved between the forming route and the protruding part, the problem of the connecting finger stripping caused during forming and cutting is solved.

A polyamide-based laminated film with a multi-layered structure including 5 or more layers, having (a) an aromatic polyamide layer, (b) an aliphatic polyamide layer and (c) a layer made of a mixture containing an aromatic polyamide and an aliphatic polyamide at a weight ratio of 5:95 to 20:80. Layer (c) disposed adjacent to layer (a) and/or (b), and said film having 5 or less pinholes per 497 cm². The polyamide-based laminated film in which at least one layer of the film is a polyamide-based resin layer containing a hindered phenol-based antioxidant in an amount of 0.01 to 0.5% by weight, and a thickness of the polyamide-based resin layer is 10% or more but less than 80% of a whole thickness of the film, the resultant laminated film is further excellent in hydrothermal resistance and adhesion to other plastic films and, therefore, can be suitably used as a packaging material for foods, medical products and drugs or chemicals which tend to be deteriorated in quality upon exposure to oxygen.

Disclosed are a backplane substrate, which achieves improved interface bonding characteristics via a recess configuration at the interface of an organic layer with an inorganic layer, thereby preventing peeling due to repeated folding, and a flexible display using the same. An organic layer is introduced into a recess provided in an inorganic layer so as to achieve improved interface bonding characteristics.

A method for cleaning a glass substrate after polishing, wherein a decrease in adhesion performance of a resin BM film formed on the cleaned glass substrate surface is suppressed and peeling of the resin BM film is prevented. A glass substrate cleaning method, characterized in that a glass substrate polished using a polishing agent containing cerium oxide particles is washed using an acidic aqueous cleaning liquid containing an organic acid and then washed using an alkaline aqueous cleaning liquid containing a base.