50results about How to "Occurrence can be prevented" patented technology

The carrier (10) for double-side polishing has a base material 10a the material of which is stainless steel (SUS) , for example, as is before, and the base material 10a is coated with a coating layer 10b of a material having a hardness higher than that of the base material 10a. The coating layer 10b is desirably coated uniformly without variations in thickness and not warped easily, and the material for the coating layer 10b of the double-side polishing carrier 10 is desirably any one selected from diamond-like carbon, a nitride film, a sapphire film and a titanium nitride film. For production of the double-side polishing carrier 10, a double-side polishing carrier 10′ having been used for polishing is prepared first. The used carrier 10′ is coated with the coating layer 10b. The invention can suppress the progress of abrasion of the double-side polishing carrier, and can provide satisfactory thickness accuracy, film thickness distribution accuracy, and surface roughness.

A multi-joint robot for loading/unloading a work into/from a cassette, which includes a hand part holding the work, an arm part rotatably holding the hand part, a link mechanism rotatably holding the base end side of the arm part and moving so that the moving route of the base end side of the arm part becomes linear in a direction roughly orthogonal to a direction for loading/unloading the work, and a driving device for moving the tip side of the arm part so as to linearly interpolate it in a direction for loading/unloading the work according to the movement of the link mechanism.

A nickel powder with a mean particle size of 0.05 to 1.0 μm, the nickel powder comprising a thin oxidized layer of nickel on a surface thereof and having an oxygen content of 0.3 to 3.0 wt. % and a carbon content of 100 ppm or less per specific surface area of 1 m²/g of the powder, in a weight proportion of carbon to the nickel powder of unit weight. When the powder is used for a conductive paste for forming inner electrode layers of a multilayer electronic component, it enables the decrease in the residual carbon amount after a binder removal process, thereby making it possible to obtain a multilayer ceramic electronic component with excellent electric characteristics and high reliability in which electrode layers excelling in continuity are formed without decreasing the strength and electric characteristics of the electronic component or creating structural defects.

A fabrication method of a nitride-based semiconductor device includes the steps of forming a stacked structure constituted of a nitride-based semiconductor on a support substrate, depositing a first bonding metal on the stacked structure, depositing a second bonding metal on a retention substrate, bonding the first bonding metal and the second bonding metal in a state where the first bonding metal and the second bonding metal face each other to unite the retention substrate and the stacked structure, wherein the first bonding metal and the second bonding metal constitute the bonding metal, and separating the support substrate from the stacked structure for removal. The area of the surface of the retention substrate is set smaller than the area of the surface of the support substrate. Accordingly, cracking, fracture, chipping, and the like at the retention substrate can be prevented.

A functional device free from cracking and having excellent functional characteristics, and a method of manufacturing the same are disclosed. A low-temperature softening layer (12) and a heat-resistant layer (13) are formed in this order on a substrate (11) made of an organic material such as polyethylene terephthalate, and a functional layer (14) made of polysilicon is formed thereon. The functional layer (14) is formed by crystallizing an amorphous silicon layer, which is a precursor layer, with laser beam irradiation. When a laser beam is applied, heat is transmitted to the substrate (11) and the substrate (11) tends to expand. However, a stress caused by a difference in a thermal expansion coefficient between the substrate (11) and the functional layer (14) is absorbed by the low-temperature softening layer (12), so that no cracks and peeling occurs in the functional layer (14). The low-temperature softening layer (12) is preferably made of a polymeric material containing an acrylic resin. By properly interposing a metal layer and a heat-resistant layer between the substrate (11) and the functional layer (14), a laser beam of higher intensity can be irradiated.

A display apparatus and a method for driving the display apparatus that are capable of suppressing image quality degradation resulting from delay in sampling pulses or from waveform rounding thereof and image quality degradation caused by coupling between the signal line and the common line and that between the signal line and the scan line even when the simultaneous sampling number is increased. The start pulse HST has a pulse width that includes a plurality of pulse widths of the clock pulses HCK and HCKX, for example, two pulse widths. The clock pulses DCK have four phases. Large margins α1 and α2 in the phase relationship between each of the clock pulses DCK1 to DCK4 and each of transfer pulses used for extracting the clock pulses DCK1 to DCK4 are assured. As a result, even if delay or waveform rounding occurs in the clock pulses DCK1 to DCK4, sampling pulses SP1 to SP6 with a constant pulse width equal to that of each of the clock pulses DCK1 to DCK4 can be generated without being affected by the delay or waveform rounding.

The invention provides a functional device having no cracks and capable of delivering good functional characteristics and a method of manufacturing the same. A functional layer (14) is formed by crystallizing an amorphous silicon layer as a precursor layer by laser beam irradiation. A laser beam irradiation conducts heat up to a substrate (11) to cause it to try to expand; a stress to be produced by the difference in thermal expansion coefficient between the substrate (11) and the functional layer (14) is shut off by an organic polymer layer (12) lower in thermal expansion coefficient than the substrate (ii), thereby causing no cracks nor separations in the functional layer (14). The organic polymer layer (12) is preferably made of an acrylic resin, an epoxy resin, or a polymer material containing these that is deformed by an optical or thermal process to undergo a three-dimensional condensation polymerization, for higher compactness and hardness. Inserting a metal layer and an inorganic heat resistant layer between the substrate (11) and the functional layer (14) will permit a more powerful laser irradiation.

According to an aspect of the invention, an optical receptacle, comprising: a fiber stub including an optical fiber, a ferrule, and an elastic member, the optical fiber including cladding and a core conducting light, the ferrule having a through-hole fixing the optical fiber, the elastic member fixing the optical fiber in the ferrule; and a holder holding the fiber stub, the optical fiber being disposed inside the through-hole over an entire region of the optical fiber, the optical fiber including a portion, a core diameter and a fiber outer diameter in the portion decreasing gradually toward an end surface of the ferrule on a side opposite to a side to be optically connected to a plug ferrule, the elastic member being filled into a space between the optical fiber and an inner wall of the through-hole. By making the core small at the optical element side end surface of the optical fiber while contributing to shortening the optical module total length, the strength of the deformable portion of the optical fiber can be ensured; the occurrence of breaking and cracks can be prevented; and the decrease of the coupling efficiency can be prevented by suppressing the movement of the optical fiber when using the optical module.

It includes: an operation portion comprised of a ring-shaped conductive member, a rotational operation being performed on the operation portion; a rotary supporting member comprised of a ring-shaped non-conductive member and fixed onto a capacitive type touch panel, the rotary supporting member rotatably supporting the operation portion; a ring-shaped concave groove disposed in the rotary supporting member; and conductive conducting terminal portions electrically connected to the operation portion, the conductive conducting terminal portions being rotated inside the concave groove integrally with the operation portion, positions of the conducting terminal portions being detected by the touch panel, wherein the operation portion is divided into a plurality of areas electrically insulated from each other in a circumferential direction, and at least two of the conducting terminal portions are mounted to different areas of the plurality of areas.

A multipoint ignition device comprises: a head gasket (1) interposed between a cylinder head and a cylinder block of an engine, having an opening (3) in a position corresponding to a cylinder opening portion; and a plurality of intermediate members (6) connected respectively to a plurality of electrode pairs (2) and held in the head gasket (1). Respective heat values of the plurality of electrode pairs (2) are set individually by varying the contact area between the plurality of intermediate members (6) and the head gasket (1) according to the respective disposal positions of the plurality of intermediate members (6).

A semiconductor device includes a semiconductor substrate having electronic elements produced therein, and an insulating underlayer formed thereon, and a multi-layered wiring arrangement constructed on the insulating underlayer semiconductor substrate. The multi-layered wiring arrangement includes a first insulating interlayer structure formed on the insulating underlayer, a second insulating interlayer structure, and a third insulating interlayer structure formed on the first insulating interlayer structure. Each of the first, second and third insulating interlayer structures includes a low-k insulating layer, and has a reinforcing element formed therein. The second insulating interlayer structure has a joint plug formed therein. The reinforcing elements of the first and third insulating interlayer structures are connected to each other through the joint plug.

A semiconductor device includes: a mounted body in which a wiring pattern is formed on a first main surface; a semiconductor chip mounted on the surface of the mounted body on which the wiring pattern is formed; an underfill material which is filled between the mounted body and the semiconductor chip and forms a fillet on an outer peripheral part of the semiconductor chip; and an injection section which is disposed on the mounted body and on an outside of a side section, on which the fillet is formed to be longest, of four side sections defining a chip mount area on which the semiconductor chip is mounted, and guides the underfill material to between the mounted body and the semiconductor chip.

Disclosed is a reproduction method for a hologram recording medium on which information is recorded with interference fringes of signal light and reference light, including: generating, based on light from a first light source, the reference light and coherent light caused to have uniform amplitude and phase, and irradiating the hologram recording medium with the reference light and the coherent light, the hologram recording medium including a recording layer on which the information is recorded with the interference fringes of the signal light and the reference light, a first reflection film formed on a lower surface side of the recording layer, and a gap layer formed between the recording layer and the first reflection film; and receiving the coherent light and a reproduction image that corresponds to recording information and is obtained as reflection light from the hologram recording medium through light irradiation in the light irradiation step, and reproducing the information based on a result of the light received.

The present invention provides, by using a photo-alignment film, a liquid crystal display device in which a good voltage holding ratio is retained for a long period of time and occurrence of image sticking and stain in a display screen is prevented. The liquid crystal display device of the present invention includes an active matrix liquid crystal panel and a backlight. The liquid crystal panel includes a liquid crystal layer, a pair of substrates that sandwich the liquid crystal layer in between, and an alignment film disposed on a liquid crystal layer side surface of each of the substrates. The alignment films are photo-alignment films formed from a material that exhibits a photo-alignment characteristic, and contain carboxyl groups on the liquid crystal layer side. The liquid crystal layer contains a liquid crystal material and at least one kind of quinone derivative selected from the group consisting of benzoquinone derivatives and anthraquinone derivatives.

Respective heat values of a plurality of electrode pairs P1 to P8 are set individually such that the temperatures of all of the plurality of electrode pairs (P1 to P8) are kept within an appropriate temperature range in which a temperature no lower than a self-cleaning temperature is set as a lower limit temperature and a lower temperature than a pre-ignition temperature is set as an upper limit temperature.