3261results about How to "Improve connection reliability" patented technology

An object of the present invention is to provide a substrate for mounting an IC chip which is a component for optical communication having an IC chip and an optical component integrally provided thereon, which can ensure a short distance between the IC chip and the optical component, which is excellent in electric signal transmission reliability and which can transmit optical signal through an optical path for transmitting optical signal. The substrate for mounting an IC chip of the present invention is a substrate for mounting an IC chip comprising: a substrate and, as serially built up on both faces thereof, a conductor circuit and an interlaminar insulating layer in an alternate fashion and in repetition; a solder resist layer formed as an outermost layer; and an optical element mounted thereto, wherein an optical path for transmitting optical signal, which penetrates the substrate for mounting an IC chip, is disposed.

The semiconductor device 100 comprises a first semiconductor element 113 provided on a face on one side of a flat plate shaped interconnect component 101, an insulating resin 119 covering a face of a side where the first semiconductor element 113 of the interconnect component 101 is provided and a side face of the first semiconductor element 113, and a second semiconductor element 111 provided on a face on the other side of the interconnect component 101. The interconnect component 101 has a constitution where an interconnect layer 103, a silicon layer 105 and an insulating film 107 are sequentially formed. The interconnect layer 103 has a constitution where the interconnect layer 103 has a flat plate shaped insulating component and a conductive component extending through the insulating component. The first semiconductor element 113 is electrically connected with the second semiconductor element 111 through the conductive component.

Provided is a wireless communication system easily establishing a connection path in a sensor network collecting data from a number of sensor nodes. The wireless communication system comprises a base station communicating by a first wireless communication system, plural first nodes communicating by the first wireless communication system and a second wireless communication system, and plural second nodes communicating by the second wireless communication system. The first node transmits the number of hops in the first wireless communication system to the second node. The second node obtains a reception condition of at least one of a signal transmitted by the first node and a signal transmitted by the second node, and selects a upper stage node to connect based on the number of hops in the first wireless communication system, the number of hops in the second wireless communication system, and the obtained reception condition information.

The invention provides a system for connecting a teat cup to a teat, including a teat cup with an opening for receiving a teat, a robot arm for moving the teat cup, a teat cup positioning system with a 3D-sensor and a sensor device for measuring a control quantity, and for connecting the teat cup under the control of the 3D-camera and the control quantity. The sensor device includes at least two electrodes around the opening and a capacitive sensor configured to measure a quantity connected with the capacitance between the electrodes, in particular the capacitance between two electrodes. This system provides a reliable positioning with respect to a teat by, for example, maximization of the measured capacitance. The positioning system supports an optical 3D-sensor for the first, global positioning.

The present invention is directed to a power supply apparatus in which a battery and a circuit wiring board or boards are electrically connected by using lead terminals. The lead terminal (3) is adapted so that thickness of a welding portion (3a) is caused to be thinner than the thickness of a conductive portion (3b). Thus, current for welding flows to much degree in a thickness direction so that electric resistance of the welding portion becomes large, and heat based on the electric resistance also becomes large. From this fact, welding nugget (63) can be enlarged. As the result of the fact that large welding nugget is formed, the lead terminals are welded to terminal portions (37a) of the battery (2) with high reliability.

An intelligent elevator control system comprises an elevator controller, a central processing platform and a remote server. The central processing platform is installed in an elevator cage and connected with the elevator controller and the remote server. The central processing platform is used for providing an operation interface for an elevator riding user or directly recognizing the elevator riding authority of the elevator riding user. The central processing platform judges whether the user has the elevator riding authority according to the operation of the user or the automatic recognition result and through the combination of the identity information, stored in the remote server, of the elevator riding user and controls the elevator controller correspondingly. The elevator controller controls the elevator cage to run. The elevator riding authority of the user is managed, and the user can conveniently ride an elevator through wireless identity recognition measures; for the cloud service network information of the user, precise video advertisements can be automatically pushed to the user and property community public information can be automatically broadcasted to the user; the requirements for vision and information are met when the user rides the elevator.

A reflective TFT substrate which can be operated for a prolonged period of time due to the presence of a protective insulating film, is free from occurrence of crosstalk, and is capable of significantly reducing manufacturing cost by decreasing the production steps in the production process. A reflective TFT substrate 1 comprises a substrate 10; a gate electrode 23 and a gate wire 24; a gate insulating film 30; an n-type oxide semiconductor layer 40; a metal layer 60 formed with a channel part 41 interposed therebetween; and a protective insulating film 80 which covers the upper part of the glass substrate 10 on which a pixel electrode 67, a drain wire pad 68 and a gate wire pad 25 are exposed, wherein the metal layer 60 functions at least as a source wire 65, a drain wire 66, a source electrode 63, a drain electrode 64 and the pixel electrode 67.

A prepreg for a printed wiring board, comprising a cyanate ester resin having a specific structure, a non-halogen epoxy resin, a silicone rubber powder as a rubber elasticity powder, an inorganic filler and a base material, which prepreg retains heat resistance owing to a stiff resin skeleton structure, has high-degree flame retardancy without the use of a halogen compound or a phosphorus compound as a flame retardant, and has a small thermal expansion coefficient in plane direction without using a large amount of inorganic filler, and a laminate comprising the above prepreg.

An object of the invention is to propose a TFT substrate and a reflective TFT substrate which can be operated stably for a prolonged period of time, can be prevented from being suffering from crosstalk, and is capable of significantly reducing manufacturing cost by decreasing the number of production steps, as well as to propose the method for producing these substrates.

A TFT substrate 1001 comprises: a glass substrate 1010; a gate electrode 1023 and a gate wire 1024 insulated by having their top surfaces covered with a gate insulating film 1030 and by having their side surfaces covered with an interlayer insulating film 1050; an n-type oxide semiconductor layer 1040 formed on the gate insulating film 1030 above the gate electrode 1023; an oxide transparent conductor layer 1060 formed on the n-type oxide semiconductor layer 1040 with a channel part 1044 interposed therebetween; and a channel guard 1500 for protecting the channel part 1044.

A semiconductor package includes a base plate, at least one semiconductor constructing body which is formed on one surface of the base plate and has a plurality of external connection electrodes formed on a semiconductor substrate, an insulating layer which is formed on one surface of the base plate around the semiconductor constructing body, upper interconnections which are formed on the insulating layer and each includes at least one interconnection layer, at least some of the upper interconnections are connected to the external connection electrodes of the semiconductor constructing body, lower interconnections which are formed on the other surface of the base plate and each includes at least one interconnection layer, and at least some of the lower interconnections which are electrically connected to the upper interconnections.

To provide a multilayer wiring substrate in which the connection reliability of via conductors is enhanced, via holes are formed in a resin interlayer insulation layer which isolates a lower conductor layer from an upper conductor layer, and via conductors are formed in the via holes for connecting the lower conductor layer and the upper conductor layer. The surface of the resin interlayer insulation layer is a rough surface, and the via holes open at the rough surface of the resin interlayer insulation layer. Stepped portions are formed in opening verge regions around the via holes such that the stepped portions are recessed from peripheral regions around the opening verge regions. The stepped portions are higher in surface roughness than the peripheral regions.