31results about How to "Warpage suppression" patented technology

The invention relates to the technical field of photogrammetry, and discloses a photogrammetry space reconstruction method based on multi-source image fusion, which comprises the following steps: extracting an interior orientation element and an initial exterior orientation element, and establishing an image beam intersection constraint intensity model in an object space to calculate a constraint weight; monitoring a weight space change rate to identify a heterogeneous image connection area and extracting a high-weight image bundle as a geometric anchor point; a differential regularization item is applied to geometric anchor points to construct a stable geometric skeleton, a weight damping factor is utilized to restrain a low-weight image beam to execute conformal mapping correction, the image beam constraint strength is represented, the condition number of an adjustment method equation matrix is improved, numerical oscillation caused by difference of different-source sensors is restrained, geometric step of a fusion interface is eliminated, and the conformal mapping correction accuracy is improved. And geometric closing and seamless stitching of a multi-source image under a unified framework are realized.

The invention relates to a welding center and method for platform machining, and belongs to the technical field of welding equipment. The device comprises a rack, a gantry frame is slidably mounted on the upper surface of the rack, an air cylinder is slidably arranged at the bottom of a cross beam of the gantry frame, a mounting plate is fixed to the telescopic end of the air cylinder, and a welding head is mounted on the lower surface of the mounting plate; and fixing cylinders are further included, the two fixing cylinders are fixed to the left side and the right side of the lower surface of the mounting plate, and moving plates are slidably connected to the opposite faces of the two supporting vertical plates. According to the device, a single honeycomb platform is automatically clamped through a motor and a wedge block, a guide plate is matched for abutting, an elastic floating roller is matched for pressing, positioning is stable, a workpiece is not damaged, full-area cleaning and negative-pressure synchronous impurity removal are adopted before welding, welding defects are effectively avoided, initial pre-stretching is conducted in the welding process, and the welding efficiency is improved. And then the progressive secondary stretching is realized along with the linkage of the welding machine head, the stress is dynamically eliminated, the deformation is inhibited, and the flatness and the welding precision are greatly improved.

The utility model relates to the field of controller silica gel button, disclose silica gel button edge anti -warp reinforcing edge structure, including silica gel base plate, the top fixedly connected with silica gel button of silica gel base plate, the outside fixedly connected with anti -warp reinforcing mechanism of silica gel base plate, the outside fixedly connected with antiskid protection mechanism of silica gel button, the anti -warp reinforcing mechanism includes reinforcing tensile edge, the outside fixedly connected in the outside of silica gel base plate of reinforcing tensile edge, the outside of reinforcing tensile edge is equipped with metal protective cover edge. In the utility model, through fixing reinforcing tensile edge outside silica gel base plate, then the metal protective cover edge is connected with the inside of shell simultaneously, and the precise positioning and locking are realized by using anti -shift joint convex point, positioning recess, extension locking boss and fitting groove, form stable connection, in this way can effectively enhance silica gel base plate edge tensile strength, resist external collision scratch, restrain edge warping deformation.

This application relates to the field of functional polymer materials technology, and provides a photoresist, a photoresist-cured film, and a method for patterning the photoresist. The photoresist comprises a polyamic acid-polyamide ester resin, an alkaline catalyst, a crosslinking agent, a coupling agent, a photoresist, and a first organic solvent. The photoresist can simultaneously achieve imidization and curing of the polyimide resin therein at a relatively low temperature, and the cured photoresist-cured film exhibits warp resistance and high mechanical strength.

The application relates to the technical field of injection molds, and particularly discloses an automobile interior part injection mold with a cooling structure, which comprises an injection machine frame and an injection unit; the injection unit is arranged on the injection machine frame; the injection unit comprises a fixed mold plate, and further comprises a demolding unit and a receiving unit; the demolding unit comprises a fixed base and a movable mold plate; the fixed base is fixedly connected to the injection machine frame; a guide rod and a cylinder one are arranged on the fixed base; the output end of the cylinder one is connected to the movable mold plate; a pulse air cooling type global cooling system is constructed; cooling air is directly output to the product forming surface through the distributed air holes on the side wall of a mold groove and the surface of a convex mold; the bottleneck of the shape following property limited by the traditional water cooling is broken; the uneven cooling of a special-shaped cavity can be realized; the product temperature field distribution is effectively balanced; and the internal stress and warping deformation during the molding are inhibited.

This application discloses a metal electrode grinding machine, relating to the field of surface treatment equipment technology, including a base; a milling mechanism located in the middle of the base along its length; a flipping loading and unloading mechanism located on one side of the base along its length; clamping members located on both sides of the flipping frame along its width; and a positioning member located on the side of the flipping frame near the flipping axis. This application places the metal electrode on the flipping frame and utilizes its tilting posture adjustment to a vertical working position. Multiple clamping members form a multi-point uniform clamping of the electrode, limiting in-plane displacement and suppressing warping deformation. Simultaneously, the positioning member extends and abuts against the end of the flipping frame away from the axis when it rotates to the vertical position, locking and fixing the flipping frame in place. This improves the constraint rigidity and positioning stability of the overall structure, suppresses vibration or displacement of the electrode during high-speed grinding, thereby improving the uniformity of grinding depth and reducing the risk of damage to the flow channel structure.

The utility model discloses an intelligent sensor's aluminium oxide base processing device related to sensor preparation technical field, and the middle part of sintering furnace inner chamber is equipped with the baffle, and the sintering furnace inner chamber is separated by left and right and is divided into a plurality of sintering cavities by the baffle, and a plurality of silicon molybdenum heating rods that are arranged on the inner wall of sintering cavity are arranged from top to bottom in the sintering cavity, and the sintering cavity is also equipped with the material frame for placing aluminium oxide base, and the material frame includes pivot, material tray, base and drive walking mechanism, and the pivot that is perpendicular to the base is rotatively driven and installed on the upper portion of base, and a plurality of material trays that are arranged along the pivot axial direction are arranged on the pivot axle body, and a plurality of installation grooves that are arranged in order and are used for vertically clamping and placing aluminium oxide base are arranged on the upper surface of material tray, and the bottom of base is equipped with drive walking mechanism, and the utility model not only can fully and evenly sinter and heat aluminium oxide base, but also can effectively reduce the deformation, warping or cracking of aluminium oxide base during the sintering process.

This application provides a semiconductor packaging structure and its fabrication method, as well as an electronic device. The fabrication method of the semiconductor packaging structure includes: providing a first glass temporary carrier; forming a plurality of conductive pillars on the first glass temporary carrier; placing at least one silicon bridge chip on the first glass temporary carrier, with the silicon bridge chip and the conductive pillars arranged at intervals; forming a first molding compound layer encapsulating the conductive pillars and the silicon bridge chip; forming a first redistribution layer on the side of the first molding compound layer away from the first glass temporary carrier, the first redistribution layer being electrically connected to the conductive pillars and the silicon bridge chip respectively; placing a plurality of functional chips on the side of the first redistribution layer away from the first glass temporary carrier, the functional chips being electrically connected to the first redistribution layer; and removing the first glass temporary carrier. This application suppresses overall warpage from the source by using a first glass temporary carrier with high flatness and by adopting a process sequence of first forming the molding compound interconnect core and then fabricating the redistribution layer.

The application discloses a GaAs-based low-capacitance high-bandwidth PIN photodiode and a preparation method thereof, and relates to the technical field of semiconductors.The PIN photodiode comprises a GaAs substrate, a deformation growth layer and an InP-based PIN functional layer.The deformation growth layer is used for realizing the lattice constant transition from the GaAs substrate to the InP-based PIN functional layer.The InP-based PIN functional layer comprises an n-type contact layer, a first intrinsic layer, an intrinsic absorption layer and a window layer, and the first intrinsic layer is provided with an ion implantation modification area, which is used for forming a high-resistance area to reduce the effective electrical junction area of the device.The application realizes the heterogeneous integration of the GaAs substrate and the InP-based PIN functional layer through the deformation growth layer, significantly reduces the device cost, realizes the physical decoupling of the photosensitive area and the electrical junction area through the ion implantation modification area, and significantly reduces the intrinsic junction capacitance while maintaining a large optical aperture, thereby systematically solving the inherent contradiction among the bandwidth, the responsivity and the cost in a high-speed PIN-PD.

A photosensitive resin composition comprising (A) a polyimide precursor, (B) a polymerizable monomer not containing a cyclic skeleton, (C) a photopolymerization initiator, and (D) a compound containing an anthracene structure, the content of a polymerizable monomer containing a cyclic skeleton being less than or equal to 20% by mass relative to the total amount of the (A) polyimide precursor.

The invention discloses a mechanical arm for machining and welding automobile parts. The mechanical arm comprises a base; one end of the big arm is rotationally assembled on the upper end face of the base; the small arm is rotationally assembled at the other end of the large arm; one end of the wrist joint arm is rotationally connected to the end part of the small arm, and the other end of the wrist joint arm is rotationally connected with a connecting flange; the welding gun unit is mounted on the lower end face of the connecting flange; the edge pressing unit is assembled on the welding gun unit; the mechanical arm can continuously complete the action of pressing, bending and welding in one-time clamping and positioning, the time for workpiece transferring and repeated positioning is greatly shortened, and the production takt time and the overall machining efficiency are remarkably improved; and accurate and reliable clamping force can be applied to an area adjacent to a welding point, and micro-motion, warping and deformation of a thin plate part in the welding process are effectively restrained.

This application relates to the technical field of automotive backlight modules, specifically providing an automotive backlight module and an automotive display device. The automotive backlight module includes a die-cast part with a die-cast base plate and die-cast side edges integrally formed on the periphery of the die-cast base plate. The die-cast side edges have a die-cast top surface facing away from the die-cast base plate and a die-cast inner surface. Several limiting structures are provided on the die-cast top surface. A central iron frame has an iron frame body and several mounting structures, all disposed on the iron frame body. The iron frame body is disposed on the die-cast inner surface. The several mounting structures and several limiting structures are matched one-to-one to prevent the iron frame body from detaching from the die-cast inner surface. By providing limiting structures on the die-cast top surface and matching them with the mounting structures of the central iron frame, the automotive backlight module suppresses the inward concavity and warping of the iron frame body, preventing the central iron frame from detaching from the die-cast part and improving the assembly reliability of the automotive backlight module.

The present invention provides an epoxy resin composition for sealing, the epoxy resin composition comprising an epoxy resin, a polyfunctional epoxy compound having a polyalkylene glycol chain, and an inorganic filler. The epoxy resin composition has the properties of low viscosity, high glass transition temperature and low elastic modulus, and can inhibit warping under the condition of sealing a large-area substrate.

The 3D printing platform comprises a platform mounting frame, a driving motor, a rotating disc, a middle plate and a printing plane, limiting holes which are evenly distributed are formed in the printing plane, the cross section of the lower part of the printing plane is larger than that of the upper part of the printing plane, mechanical locking is formed by increasing the material contact area, and a printed product is prevented from buckling deformation. The middle plate and the printing plane are detachably connected through screws and connecting nails, and modular replacement is supported. The heating module is embedded into the printing plane or the middle plate in a zoned mode, the temperature is accurately controlled through the electric heating resistance wire, and materials are softened so as to facilitate demolding. In addition, material leakage is reduced and manufacturing cost is reduced due to the design of blocking holes in the middle plate. The platform has the advantages of deformation prevention, temperature control demolding and flexible assembly, the 3D printing finished product quality and the operation efficiency are remarkably improved, and the platform is suitable for additive manufacturing of complex-structure and large-size products.

The present invention provides a wiring substrate capable of suppressing warpage even when reflow processing is performed, and also capable of suppressing the occurrence of cracks in a cured product layer provided so as to cover a portion of a wiring layer. A wiring substrate is provided with a substrate, a wiring layer provided on at least one main surface of the substrate, a cured product layer provided so as to cover a part of the wiring layer, and a reinforcing member provided on the cured product layer with an adhesive layer interposed therebetween, and is characterized in that: the thickness of the reinforcing member is less than the thickness of the wiring layer; the reinforcing member has a rectangular shape provided with an opening exposing a semiconductor element mounting region, and satisfies the following relationship: Mst > Msr > Mad, where Msr (MPa) is the elastic modulus of the cured product layer, Mad (MPa) is the elastic modulus of the adhesive layer, and Mst (MPa) is the elastic modulus of the reinforcing member under a temperature condition of 25 DEG C. The semiconductor device is characterized in that the reinforcing member has a rectangular shape provided with an opening exposing the semiconductor element mounting region, and when Msr (MPa) is the elastic modulus of the cured product layer, Mad (MPa) is the elastic modulus of the adhesive layer, and Mst (MPa) is the elastic modulus of the reinforcing member.

The invention provides a dynamic component posture and position monitoring device for beam yard hoisting operation, and belongs to the technical field of precise instruments and thermal management. The dynamic component posture and position monitoring device is characterized in that an invar alloy inner ring is connected with a pre-embedded steel disc in a concrete base; the brass middle ring is coaxially nested on the outer surface of the invar alloy inner ring; the composite material outer ring coaxially coats the outer side of the brass middle ring; the heat exchange flow channel is filled with a vaporized heat-conducting medium, and the vaporized heat-conducting medium is converted from a liquid state to a vapor state after absorbing heat and moves from an evaporation end to a condensation end; the temperature-sensitive driving piece is connected with the condensation end of the heat exchange flow channel, and the length is changed according to the temperature of the condensation end. A rotating shaft of the displacement lever is arranged on the top surface of the invar alloy inner ring; the temperature-sensitive driving piece is connected with a power arm of the displacement lever; a guide rail is arranged on the bottom side of the top of the shell platform, the resisting arm end of the displacement lever slides along the guide rail to drive the shell platform to move in the vertical direction, and thermal expansion errors are counteracted. According to the invention, the ultra-high stability of the measurement basis is realized through a multi-cooperation mechanism.

A steel box girder segment comprises a top plate, a top plate connecting plate and a web plate, a top plate connecting plate connecting hole is formed in the top plate connecting plate, a web plate connecting hole is formed in the web plate, and the three-way angle type tool comprises a top plate bolting plate, a top plate connecting plate bolting plate and a web plate bolting plate. Any two of the two connecting rods are perpendicular to each other and are welded together respectively. A first bolting hole is formed in the top plate connecting plate bolting plate; second bolting holes which are distributed in rows and columns are formed in the top plate bolting plate; third bolting holes are formed in the positions, corresponding to the web connecting holes, of the web bolting plate. According to the three-way angle type tool, a standard right-angle geometrical relationship can be endowed to the top plate, the web plate and the top plate connecting plate of the steel box girder in a forced mode, so that the spatial position of the intersection point of the three plates can be locked in advance in the assembling stage of a steel box girder section, and it is ensured that the topological relationship of all the plates in a complex three-dimensional space is consistent with the height of a design model.

This utility model discloses an HDI circuit board. The HDI circuit board of this utility model includes a motherboard and HDI circuit layers, the HDI circuit layers being disposed on two opposite surfaces of the motherboard. The motherboard includes an insulating substrate of organic material and conductive lines disposed on the surface and inside the insulating substrate. A ceramic sheet with a thickness of 0.1mm to 0.5mm is disposed within the motherboard, extending to the outer edge of the motherboard in the direction of the HDI circuit board surface. By incorporating a ceramic sheet within the motherboard, this utility model not only effectively suppresses warping deformation of the circuit board but also enhances its heat dissipation performance.

A socket for semiconductor package which suppresses warping of an object to which a lid is joined. The socket for semiconductor package has a board, a frame which is located on the outer periphery side of the board in plan view and is joined to the board, and a lead terminal which is held in a state of being insulated from the board and the frame, the board projecting from the upper surface and the lower surface of the frame, and the amount of projection of the board from the upper surface and the amount of projection of the board from the lower surface being equal.

The application belongs to the field of co-fired body materials, and discloses a double-ferrite three-layer hetero co-fired body material and a preparation method thereof. The double-ferrite three-layer hetero co-fired body material comprises an intermediate layer ferrite and upper and lower two layers of ferrite. The intermediate layer ferrite is a YIG system microwave ferrite, and the upper and lower two layers of ferrite are both NiZn system ferrites doped with Bi2O3. The three layers of ferrite are combined by co-firing. The application further provides a preparation method and application of the double-ferrite three-layer hetero co-fired body material. The application solves the technical problems that the NiZn system ferrite and the YIG system microwave ferrite of the plane contact type are not matched in sintering temperature and shrinkage characteristics, the layered hetero co-fired body is prone to co-firing mismatch, and the combination interface is not tight, ion diffusion at the interface and electromagnetic performance degradation of the material.

According to the present invention, a stator core capable of suppressing warpage of a metal plate when a bolt is fastened is provided. A stator core according to the present invention is a stator core formed by laminating a plurality of annular metal plates, and is provided with: a cylindrical base part; a protruding part which protrudes from the outer peripheral surface of the base part and in which an insertion hole through which a bolt is inserted is formed; and a welded part that fixes at least a first metal plate that is provided on the outer periphery of the protruding part and that is in contact with the head of the bolt when the bolt is fastened, and a second metal plate that is adjacent to the first metal plate.

The laminate (101) comprises: a multilayer polyimide film (1) having thermoplastic polyimide layers (11, 12) on both sides of a core layer (10) which is a non-thermoplastic polyimide film; and a surface layer (2) in contact with a thermoplastic polyimide layer (12) on one side of the multilayer polyimide film. The surface layer is preferably an inorganic layer with a thickness of 1 to 200 nm or a resin layer with a thickness of 0.1 to 5 μm. A single-sided metal-coated laminate (105) is formed by laminating a metal layer (5) onto the thermoplastic resin layer (11) on the non-forming side of the surface layer of the laminate.

This utility model provides a deformation-resistant injection-molded mobile phone back cover, relating to the field of mobile phone back cover technology. It includes a mobile phone back cover body, with a honeycomb grid layer embedded in the inner non-exterior area of ​​the body. Ribs are provided below the honeycomb grid layer, and a reinforcing frame is embedded at the edge of the body. A guide groove is provided on the inner side of the back cover near the screw post. The composite support structure of the honeycomb grid layer and radially gradient ribs is used. The honeycomb structure evenly disperses local stress, and the ribs are distributed along the principal stress line, significantly improving the overall bending stiffness. With only a 5% increase in weight, the deformation resistance is increased by 40%, effectively suppressing warping problems during manufacturing and use. Furthermore, micro-posts interlacedly connect the honeycomb and ribs, further enhancing structural stability and avoiding localized deformation caused by stress concentration.

This invention relates to the field of charger manufacturing technology, and provides a manual soldering station clamping device for charger production, including a clamping station and a motor; a positioning groove is formed in the middle of the top of the clamping station, and a charger circuit board is placed inside the positioning groove; a clamping structure is provided at the top of the clamping station; the clamping structure includes a mounting plate, which is mounted on the top of the clamping station; a clamping block is mounted on one side of the mounting plate; a guide rod is mounted at the middle position of the mounting plate and the clamping block; telescopic springs are mounted on both sides at the middle position of the guide rod and the clamping block; a heat sink is mounted on one side of the clamping block; and angled extrusion brackets are mounted on both sides of the top of the clamping block; mounting grooves are formed on the four sides inside the positioning groove. This invention, by adopting a four-sided clamping structure, can form a uniform and comprehensive constraint on the charger circuit board compared to traditional two-sided clamping, effectively improving the overall flatness of the circuit board and fundamentally resisting thermal deformation, warping, and twisting phenomena generated during the soldering process.

The application discloses a ceramic material based on cellulose nanocrystals and a preparation method thereof, and belongs to the technical field of ceramic material preparation. The aldehyde group of cellulose nanocrystals can be subjected to Schiff base reaction with the amino group in modified expanded graphite to form a three-dimensional reinforced composite network structure, so that ceramic particle sedimentation can be prevented, slurry uniformity can be ensured, viscosity can be rapidly reduced in the wet grinding process, good fluidity can be shown, high-energy mechanical shear stress generated in the grinding process can be effectively buffered and dissipated and structural integrity can be retained, the mechanical strength and fracture toughness of the green body are improved, in the high-temperature sintering stage, the cellulose nanocrystals fixed by chemical bonds can be uniformly lost, and uniform micropores are generated, local agglomeration combustion and the resulting stress concentration are avoided, warping and cracking in the sintering process are effectively inhibited, and the mechanical strength of the ceramic material is improved.

The present application obtains the following air flow measuring device: when the air flow measuring element is attached to the lead frame and the resin sealing package that seals the air flow measuring element and the lead frame is formed, the thin film part will not be warped, and the flow of air can be accurately measured. The chip package (300) has: a lead frame (302); an element (301) attached to the lead frame (302), having a detection part; and a structure that seals the lead frame and the element (301) in a way that at least the detection part is exposed. Moreover, the air flow measuring device is characterized in that the radius of curvature (p) of the exposed part of the element (301) exposed from the sealing resin member (303) is 2.13 or less.

This disclosure relates to a packaging structure, electrical device, and electronic device. The packaging structure includes a substrate, a chip, and a reinforcing ring. The substrate includes a core layer; the chip is disposed on the substrate; and the reinforcing ring surrounds the chip circumferentially and is fixedly connected to the core layer. With this arrangement, the reinforcing ring disposed circumferentially on the chip is directly fixedly connected to the core layer of the substrate. Since the core layer is typically rigid or nearly rigid, when the temperature changes, the force exerted by the reinforcing ring on the substrate acts directly on the rigid region of the substrate, which, compared to related technologies, can more effectively counteract substrate warping.

This invention relates to the field of hydraulic support manufacturing technology, and more particularly to a manufacturing method and tooling assembly for a hydraulic support sidewall. The method includes the following steps: placing the top plates of two sidewalls against each other and fixing the outer edges of the top plates along the extension direction of the main reinforcement bars; positioning the main reinforcement bars to ensure that the hinge holes of each main reinforcement bar are coaxial; and welding the main reinforcement bars to the top plates sequentially from both sides towards the center. By fixing the outer edges of the top plates of the two sidewalls against each other before welding the main reinforcement bars, the overall deformation of the top plate during the welding process can be effectively reduced. The method of welding the main reinforcement bars sequentially from both sides towards the center ensures a symmetrical distribution of welding stress, reduces the concentration of welding heat input to the edge of the top plate, and further suppresses warping deformation of the top plate.

Provided is a semiconductor device capable of suppressing warping of a semiconductor module. A semiconductor device is configured in such a manner that a semiconductor module (1) has a heat dissipation plate (3), a conductive plate (4) bonded to the upper surface (S1) of the heat dissipation plate (3) by means of a first resin sheet (7), and a semiconductor chip (5) bonded to the upper surface of the conductive plate (4) by means of a bonding material (10). Furthermore, a cooler (2) is joined to the lower surface (S6) of the semiconductor module (1) via a second resin sheet (12). Furthermore, a resin sheet having a higher insulating property than that of the second resin sheet (12) is used as the first resin sheet (7), and a resin sheet having a higher thermal conductivity than that of the first resin sheet (7) is used as the second resin sheet (12).

The invention relates to the technical field of reinforcing steel bar cutting machines, in particular to a reinforcing steel bar cutting machine based on building construction, which comprises a cutting base, a fixed chassis and a cutting mechanism, the top of the cutting base is fixedly connected with the bottom of the fixed chassis, and the cutting mechanism is arranged on the rear side of the top of the fixed chassis; a bidirectional driving mechanism is arranged in the driving shell, and an arc-shaped clamping ring is arranged at the top of the driving shell. The movable sliding base can freely slide on the guide sliding rod, rapid positioning and self-locking are achieved by extruding a ball mechanism, the wedge-shaped clamping block can always move to the position near a cutting point to provide bottom supporting, the cantilever beam effect is eliminated, the first clamping fork plate and the second clamping fork plate are matched for pressing, fixed-point pressing can be conducted on the top of a reinforcing steel bar, and the clamping effect is good. And meanwhile, the filling layer capable of being inserted between the ribs of the reinforcing steel bars is matched, so that the reinforcing steel bars are flexibly and firmly fixed, and warping and vibration during cutting are effectively restrained.