77results about How to "Warpage suppression" patented technology

The utility model provides a tray assembly, a bearing device and semiconductor process equipment. The tray assembly comprises a tray and a pressing ring. The compression ring covers the tray, the orthographic projection of the compression ring on the top surface of the tray coincides with the circumferential edge area of the top surface of the tray, and the inner circumferential surface of the compression ring and the upper surface of the tray jointly define a mounting space; a plurality of supporting convex parts are convexly arranged on the upper surface of the tray, all the supporting convex parts are arranged in the mounting space, all the supporting convex parts are arranged in at least one circle on the upper surface of the tray, the center of each circle of supporting convex part is located on the central axis of the pressing ring, and at least one circle of supporting convex part is used for supporting a wafer; and each supporting convex part is configured to be a cambered surface in contact with the wafer. When semiconductor process equipment adopts the tray assembly provided by the utility model, the heating modes of the central area and the edge area of the wafer are consistent in the buckling deformation process of the wafer, and the temperature uniformity of the surface of the wafer is effectively improved, so that the uniformity of a film is improved.

The invention relates to the technical field of photogrammetry, and discloses a photogrammetry space reconstruction method based on multi-source image fusion, which comprises the following steps: extracting an interior orientation element and an initial exterior orientation element, and establishing an image beam intersection constraint intensity model in an object space to calculate a constraint weight; monitoring a weight space change rate to identify a heterogeneous image connection area and extracting a high-weight image bundle as a geometric anchor point; a differential regularization item is applied to geometric anchor points to construct a stable geometric skeleton, a weight damping factor is utilized to restrain a low-weight image beam to execute conformal mapping correction, the image beam constraint strength is represented, the condition number of an adjustment method equation matrix is improved, numerical oscillation caused by difference of different-source sensors is restrained, geometric step of a fusion interface is eliminated, and the conformal mapping correction accuracy is improved. And geometric closing and seamless stitching of a multi-source image under a unified framework are realized.

The invention relates to a welding center and method for platform machining, and belongs to the technical field of welding equipment. The device comprises a rack, a gantry frame is slidably mounted on the upper surface of the rack, an air cylinder is slidably arranged at the bottom of a cross beam of the gantry frame, a mounting plate is fixed to the telescopic end of the air cylinder, and a welding head is mounted on the lower surface of the mounting plate; and fixing cylinders are further included, the two fixing cylinders are fixed to the left side and the right side of the lower surface of the mounting plate, and moving plates are slidably connected to the opposite faces of the two supporting vertical plates. According to the device, a single honeycomb platform is automatically clamped through a motor and a wedge block, a guide plate is matched for abutting, an elastic floating roller is matched for pressing, positioning is stable, a workpiece is not damaged, full-area cleaning and negative-pressure synchronous impurity removal are adopted before welding, welding defects are effectively avoided, initial pre-stretching is conducted in the welding process, and the welding efficiency is improved. And then the progressive secondary stretching is realized along with the linkage of the welding machine head, the stress is dynamically eliminated, the deformation is inhibited, and the flatness and the welding precision are greatly improved.

The application provides a semiconductor laser chip and a preparation method thereof. The chip comprises an electrode structure arranged on the surface of an epitaxial structure of the chip; the electrode structure comprises a contact layer, a stress dissipation layer, a gradient transition layer, and a metal structure; the stress dissipation layer is a metal film and has a periodic continuous undulating waveform structure on at least one side surface in the epitaxial direction; the gradient transition layer has a thermal expansion coefficient that changes in a gradient along the thickness direction of the gradient transition layer, and the thermal expansion coefficient of the side of the gradient transition layer close to the epitaxial structure matches the thermal expansion coefficient of the epitaxial structure, and the thermal expansion coefficient of the side of the gradient transition layer away from the epitaxial structure matches the thermal expansion coefficient of the metal structure electrically connected with the chip. The application solves the packaging stress problem caused by the mismatch of the thermal expansion coefficients between the epitaxial structure of the chip and the metal layer and / or the solder layer in the prior art, thereby improving the mechanical reliability, electrical stability and optical performance of the device.

The utility model relates to the field of controller silica gel button, disclose silica gel button edge anti -warp reinforcing edge structure, including silica gel base plate, the top fixedly connected with silica gel button of silica gel base plate, the outside fixedly connected with anti -warp reinforcing mechanism of silica gel base plate, the outside fixedly connected with antiskid protection mechanism of silica gel button, the anti -warp reinforcing mechanism includes reinforcing tensile edge, the outside fixedly connected in the outside of silica gel base plate of reinforcing tensile edge, the outside of reinforcing tensile edge is equipped with metal protective cover edge. In the utility model, through fixing reinforcing tensile edge outside silica gel base plate, then the metal protective cover edge is connected with the inside of shell simultaneously, and the precise positioning and locking are realized by using anti -shift joint convex point, positioning recess, extension locking boss and fitting groove, form stable connection, in this way can effectively enhance silica gel base plate edge tensile strength, resist external collision scratch, restrain edge warping deformation.

This application relates to the field of functional polymer materials technology, and provides a photoresist, a photoresist-cured film, and a method for patterning the photoresist. The photoresist comprises a polyamic acid-polyamide ester resin, an alkaline catalyst, a crosslinking agent, a coupling agent, a photoresist, and a first organic solvent. The photoresist can simultaneously achieve imidization and curing of the polyimide resin therein at a relatively low temperature, and the cured photoresist-cured film exhibits warp resistance and high mechanical strength.

A molded article obtained from the polyamide resin composition has improved mechanical properties including a tensile strength, a tensile modulus, a flexural strength, and a flexural modulus, and improved suppression of warpage. The polyamide resin composition of the present invention is a polyamide resin composition comprising an aliphatic polyamide resin (A) and a fibrous reinforcing filler (B), wherein the aliphatic polyamide resin (A) has a number average molecular weight of less than 22,000, and wherein the ratio of a median of the fiber length of the fibrous reinforcing filler (B) to an average of the fiber length of the fibrous reinforcing filler (B) is 0.50 to less than 0.90.

The application relates to the technical field of injection molds, and particularly discloses an automobile interior part injection mold with a cooling structure, which comprises an injection machine frame and an injection unit; the injection unit is arranged on the injection machine frame; the injection unit comprises a fixed mold plate, and further comprises a demolding unit and a receiving unit; the demolding unit comprises a fixed base and a movable mold plate; the fixed base is fixedly connected to the injection machine frame; a guide rod and a cylinder one are arranged on the fixed base; the output end of the cylinder one is connected to the movable mold plate; a pulse air cooling type global cooling system is constructed; cooling air is directly output to the product forming surface through the distributed air holes on the side wall of a mold groove and the surface of a convex mold; the bottleneck of the shape following property limited by the traditional water cooling is broken; the uneven cooling of a special-shaped cavity can be realized; the product temperature field distribution is effectively balanced; and the internal stress and warping deformation during the molding are inhibited.

This application discloses a metal electrode grinding machine, relating to the field of surface treatment equipment technology, including a base; a milling mechanism located in the middle of the base along its length; a flipping loading and unloading mechanism located on one side of the base along its length; clamping members located on both sides of the flipping frame along its width; and a positioning member located on the side of the flipping frame near the flipping axis. This application places the metal electrode on the flipping frame and utilizes its tilting posture adjustment to a vertical working position. Multiple clamping members form a multi-point uniform clamping of the electrode, limiting in-plane displacement and suppressing warping deformation. Simultaneously, the positioning member extends and abuts against the end of the flipping frame away from the axis when it rotates to the vertical position, locking and fixing the flipping frame in place. This improves the constraint rigidity and positioning stability of the overall structure, suppresses vibration or displacement of the electrode during high-speed grinding, thereby improving the uniformity of grinding depth and reducing the risk of damage to the flow channel structure.

The utility model discloses an intelligent sensor's aluminium oxide base processing device related to sensor preparation technical field, and the middle part of sintering furnace inner chamber is equipped with the baffle, and the sintering furnace inner chamber is separated by left and right and is divided into a plurality of sintering cavities by the baffle, and a plurality of silicon molybdenum heating rods that are arranged on the inner wall of sintering cavity are arranged from top to bottom in the sintering cavity, and the sintering cavity is also equipped with the material frame for placing aluminium oxide base, and the material frame includes pivot, material tray, base and drive walking mechanism, and the pivot that is perpendicular to the base is rotatively driven and installed on the upper portion of base, and a plurality of material trays that are arranged along the pivot axial direction are arranged on the pivot axle body, and a plurality of installation grooves that are arranged in order and are used for vertically clamping and placing aluminium oxide base are arranged on the upper surface of material tray, and the bottom of base is equipped with drive walking mechanism, and the utility model not only can fully and evenly sinter and heat aluminium oxide base, but also can effectively reduce the deformation, warping or cracking of aluminium oxide base during the sintering process.

The present invention relates to a phosphor substrate, a light-emitting substrate, and a lighting device. The phosphor substrate of the present invention is a phosphor substrate with a plurality of light-emitting elements mounted on one side, and comprises: an insulating substrate; a first electrode group, which is arranged on one side of the insulating substrate and has a plurality of electrodes bonded to the plurality of light-emitting elements; and a phosphor layer, which is arranged on one side of the insulating substrate and comprises a phosphor whose peak wavelength of light emission when the light emission of the light-emitting elements is used as excitation light is in the visible light region, and the insulating substrate comprises bismaleimide resin and glass cloth.

This application provides a semiconductor packaging structure and its fabrication method, as well as an electronic device. The fabrication method of the semiconductor packaging structure includes: providing a first glass temporary carrier; forming a plurality of conductive pillars on the first glass temporary carrier; placing at least one silicon bridge chip on the first glass temporary carrier, with the silicon bridge chip and the conductive pillars arranged at intervals; forming a first molding compound layer encapsulating the conductive pillars and the silicon bridge chip; forming a first redistribution layer on the side of the first molding compound layer away from the first glass temporary carrier, the first redistribution layer being electrically connected to the conductive pillars and the silicon bridge chip respectively; placing a plurality of functional chips on the side of the first redistribution layer away from the first glass temporary carrier, the functional chips being electrically connected to the first redistribution layer; and removing the first glass temporary carrier. This application suppresses overall warpage from the source by using a first glass temporary carrier with high flatness and by adopting a process sequence of first forming the molding compound interconnect core and then fabricating the redistribution layer.

The invention discloses a gallium nitride epitaxial wafer using a buried layer type silicon substrate and a preparation method of the gallium nitride epitaxial wafer, and belongs to the technical field of semiconductor materials, the buried layer type silicon substrate sequentially comprises a surface layer, a buried layer and a base layer from top to bottom, the surface layer is made of silicon, and the thickness of the surface layer is 1-2000 nm; the buried layer is made of a silicon oxide insulating material, and the thickness of the buried layer is 1-50 microns; the base layer is made of silicon, the thickness of the base layer ranges from 50 micrometers to 1500 micrometers, and nitriding treatment is carried out on the surface layer before the aluminum nitride nucleating layer grows on the buried layer type silicon substrate. According to the invention, the problem that the operation loss of the silicon-based gallium nitride power device is obviously increased when the frequency is increased is avoided, the stress problem existing in the silicon-based gallium nitride heteroepitaxy process is improved, and the electric field voltage withstanding characteristic of the gallium nitride epitaxial structure is obviously improved.

The application discloses a GaAs-based low-capacitance high-bandwidth PIN photodiode and a preparation method thereof, and relates to the technical field of semiconductors.The PIN photodiode comprises a GaAs substrate, a deformation growth layer and an InP-based PIN functional layer.The deformation growth layer is used for realizing the lattice constant transition from the GaAs substrate to the InP-based PIN functional layer.The InP-based PIN functional layer comprises an n-type contact layer, a first intrinsic layer, an intrinsic absorption layer and a window layer, and the first intrinsic layer is provided with an ion implantation modification area, which is used for forming a high-resistance area to reduce the effective electrical junction area of the device.The application realizes the heterogeneous integration of the GaAs substrate and the InP-based PIN functional layer through the deformation growth layer, significantly reduces the device cost, realizes the physical decoupling of the photosensitive area and the electrical junction area through the ion implantation modification area, and significantly reduces the intrinsic junction capacitance while maintaining a large optical aperture, thereby systematically solving the inherent contradiction among the bandwidth, the responsivity and the cost in a high-speed PIN-PD.

A photosensitive resin composition comprising (A) a polyimide precursor, (B) a polymerizable monomer not containing a cyclic skeleton, (C) a photopolymerization initiator, and (D) a compound containing an anthracene structure, the content of a polymerizable monomer containing a cyclic skeleton being less than or equal to 20% by mass relative to the total amount of the (A) polyimide precursor.

Provided is a sealing sheet that can take into account both the suppression of surrounding contamination during sealing and the suppression of warping after sealing. The sealing sheet (1) is a sealing sheet for sealing an electronic component (51), and comprises, in order toward the upper side: a first layer (2) in contact with the electronic component (51) when the electronic component (51) is sealed, and a second layer (3) exposed to the outside, the first layer (2) and the second layer (3) each having thermosetting properties, the lower surface of the first layer (2) being harder than the upper surface of the second layer (3) at 90°C, and the elastic modulus of the second layer (3) after thermosetting being greater than the elastic modulus of the first layer (2) after thermosetting.

The application relates to the field of packaging materials, and particularly discloses a high-strength paperboard which comprises a core layer and a surface layer, the core layer comprises a core outer layer and a core inner layer, the core outer layer comprises the following components: unbleached kraft softwood pulp, cotton pulp, calcined kaolin, carboxymethyl cellulose and cationic polyacrylamide, and the core inner layer comprises the following components: hardwood pulp, mechanical pulp, microfibrillated cellulose and cationic starch. The double-layer differential structure design is adopted, the core outer layer is constructed with a high proportion of unbleached kraft softwood pulp and cotton pulp to form a long-fiber rigid skeleton, the calcined kaolin and the carboxymethyl cellulose are matched to fill the fiber gaps, a main bearing layer with high density and high rigidity is formed, the core inner layer is formed with the hardwood pulp, the mechanical pulp and the microfibrillated cellulose to form a buffer layer with low density and high elasticity, so that the paperboard has excellent compression resistance, bending resistance and impact buffering capacity under the same basis weight, and the warping deformation is inhibited, and the strength, toughness, dimensional stability and cost control are synergistically improved.

The invention discloses a mechanical arm for machining and welding automobile parts. The mechanical arm comprises a base; one end of the big arm is rotationally assembled on the upper end face of the base; the small arm is rotationally assembled at the other end of the large arm; one end of the wrist joint arm is rotationally connected to the end part of the small arm, and the other end of the wrist joint arm is rotationally connected with a connecting flange; the welding gun unit is mounted on the lower end face of the connecting flange; the edge pressing unit is assembled on the welding gun unit; the mechanical arm can continuously complete the action of pressing, bending and welding in one-time clamping and positioning, the time for workpiece transferring and repeated positioning is greatly shortened, and the production takt time and the overall machining efficiency are remarkably improved; and accurate and reliable clamping force can be applied to an area adjacent to a welding point, and micro-motion, warping and deformation of a thin plate part in the welding process are effectively restrained.

The manufacturing method of the semiconductor chip involved in the invention of the present application comprises: a first step of forming a gallium nitride growth layer divided into a plurality of small blocks on the upper surface of a silicon substrate; and a second step of filling the spaces between the plurality of small blocks with an insulating film, wherein the insulating film applies stress to the silicon substrate in the opposite direction to the stress applied by the gallium nitride growth layer to the silicon substrate.

This application relates to the technical field of automotive backlight modules, specifically providing an automotive backlight module and an automotive display device. The automotive backlight module includes a die-cast part with a die-cast base plate and die-cast side edges integrally formed on the periphery of the die-cast base plate. The die-cast side edges have a die-cast top surface facing away from the die-cast base plate and a die-cast inner surface. Several limiting structures are provided on the die-cast top surface. A central iron frame has an iron frame body and several mounting structures, all disposed on the iron frame body. The iron frame body is disposed on the die-cast inner surface. The several mounting structures and several limiting structures are matched one-to-one to prevent the iron frame body from detaching from the die-cast inner surface. By providing limiting structures on the die-cast top surface and matching them with the mounting structures of the central iron frame, the automotive backlight module suppresses the inward concavity and warping of the iron frame body, preventing the central iron frame from detaching from the die-cast part and improving the assembly reliability of the automotive backlight module.

The present invention provides an epoxy resin composition for sealing, the epoxy resin composition comprising an epoxy resin, a polyfunctional epoxy compound having a polyalkylene glycol chain, and an inorganic filler. The epoxy resin composition has the properties of low viscosity, high glass transition temperature and low elastic modulus, and can inhibit warping under the condition of sealing a large-area substrate.

The invention provides a packaging structure. The packaging structure comprises a substrate; a chip, wherein the chip is arranged on the substrate; the chip is arranged on the substrate, the heat dissipation assembly covers the chip, the heat dissipation assembly is provided with pins, and the pins are arranged on the substrate. In this way, the heat dissipation assembly is connected with the substrate through the pins, and the rigidity of the heat dissipation assembly can effectively restrain warping of the edge of the substrate.

When a multilayer bonded body is formed such as when a heat sink is bonded to an insulating circuit board, the heat sink and the insulating circuit board are bonded at a low temperature to suppress warpage. A multilayer bonded body is provided with: a ceramic substrate; a first aluminum plate bonded to one surface of the ceramic substrate and including aluminum or an aluminum alloy; a first intermediate metal layer that is bonded to the surface of the first aluminum plate on the opposite side from the ceramic substrate and contains any one of copper, nickel, silver and gold; a first copper sintered layer bonded to a surface of the first intermediate metal layer on the opposite side from the first aluminum plate; and a first metal member that is bonded to the surface of the first copper sintered layer on the opposite side from the first intermediate metal layer, and contains any one of aluminum, an aluminum alloy, copper, and a copper alloy.

The 3D printing platform comprises a platform mounting frame, a driving motor, a rotating disc, a middle plate and a printing plane, limiting holes which are evenly distributed are formed in the printing plane, the cross section of the lower part of the printing plane is larger than that of the upper part of the printing plane, mechanical locking is formed by increasing the material contact area, and a printed product is prevented from buckling deformation. The middle plate and the printing plane are detachably connected through screws and connecting nails, and modular replacement is supported. The heating module is embedded into the printing plane or the middle plate in a zoned mode, the temperature is accurately controlled through the electric heating resistance wire, and materials are softened so as to facilitate demolding. In addition, material leakage is reduced and manufacturing cost is reduced due to the design of blocking holes in the middle plate. The platform has the advantages of deformation prevention, temperature control demolding and flexible assembly, the 3D printing finished product quality and the operation efficiency are remarkably improved, and the platform is suitable for additive manufacturing of complex-structure and large-size products.

The present invention provides a wiring substrate capable of suppressing warpage even when reflow processing is performed, and also capable of suppressing the occurrence of cracks in a cured product layer provided so as to cover a portion of a wiring layer. A wiring substrate is provided with a substrate, a wiring layer provided on at least one main surface of the substrate, a cured product layer provided so as to cover a part of the wiring layer, and a reinforcing member provided on the cured product layer with an adhesive layer interposed therebetween, and is characterized in that: the thickness of the reinforcing member is less than the thickness of the wiring layer; the reinforcing member has a rectangular shape provided with an opening exposing a semiconductor element mounting region, and satisfies the following relationship: Mst > Msr > Mad, where Msr (MPa) is the elastic modulus of the cured product layer, Mad (MPa) is the elastic modulus of the adhesive layer, and Mst (MPa) is the elastic modulus of the reinforcing member under a temperature condition of 25 DEG C. The semiconductor device is characterized in that the reinforcing member has a rectangular shape provided with an opening exposing the semiconductor element mounting region, and when Msr (MPa) is the elastic modulus of the cured product layer, Mad (MPa) is the elastic modulus of the adhesive layer, and Mst (MPa) is the elastic modulus of the reinforcing member.

A laser scanning method, device and storage medium for manufacturing three-dimensional objects, wherein the laser scanning method includes: slicing the workpiece to be printed to obtain the cross-sectional profile of each layer, wherein the cross-sectional profile is one or more closed polygons; setting a number of fill vectors inside each polygon; extracting all fill vectors connected to or close to the profile in a preset area, and controlling the direction of the fill vectors connected to or close to the profile so that the endpoints of all fill vectors connected to or close to the profile are the end points of the fill vectors, and the starting points of all fill vectors are far away from the profile; and performing laser scanning according to the direction of all the fill vectors finally obtained. The present invention can effectively avoid the fluctuation of the molten pool at the starting point of the scanned fill vector, that is, it can suppress local (especially the contour) warping during the printing process, thereby improving the printing success rate, that is, it can effectively improve the surface quality of the workpiece to be printed.

The present invention relates to a phosphor substrate, a light-emitting substrate and a lighting device. The phosphor substrate (30) of the present invention has a plurality of light-emitting elements (20) mounted on one side. The phosphor substrate (30) comprises: an insulating substrate (32); a first electrode group (34) arranged on one side of the insulating substrate (32) and having a plurality of electrodes connected to the plurality of light-emitting elements (20); a phosphor layer (36) arranged on one side of the insulating substrate (32) and comprising a phosphor whose peak wavelength of light emission when the light emission of the light-emitting element (20) is used as excitation light is in the visible light region; and a second electrode group (38) arranged on the other side of the insulating substrate (32) and having a plurality of electrodes.

The invention provides a dynamic component posture and position monitoring device for beam yard hoisting operation, and belongs to the technical field of precise instruments and thermal management. The dynamic component posture and position monitoring device is characterized in that an invar alloy inner ring is connected with a pre-embedded steel disc in a concrete base; the brass middle ring is coaxially nested on the outer surface of the invar alloy inner ring; the composite material outer ring coaxially coats the outer side of the brass middle ring; the heat exchange flow channel is filled with a vaporized heat-conducting medium, and the vaporized heat-conducting medium is converted from a liquid state to a vapor state after absorbing heat and moves from an evaporation end to a condensation end; the temperature-sensitive driving piece is connected with the condensation end of the heat exchange flow channel, and the length is changed according to the temperature of the condensation end. A rotating shaft of the displacement lever is arranged on the top surface of the invar alloy inner ring; the temperature-sensitive driving piece is connected with a power arm of the displacement lever; a guide rail is arranged on the bottom side of the top of the shell platform, the resisting arm end of the displacement lever slides along the guide rail to drive the shell platform to move in the vertical direction, and thermal expansion errors are counteracted. According to the invention, the ultra-high stability of the measurement basis is realized through a multi-cooperation mechanism.

Provided is a transparent heat-resistant laminated film that has a sufficiently smooth surface to be used as a substrate in a flexible device, and that has excellent handling properties and suppressed warping. A transparent heat-resistant laminated film characterized by having an (a) layer, a (b) layer, and a blending layer located at the interface between the (a) layer and the (b) layer, the thickness of the blending layer being 3 µm or greater. (a) layer: A layer that contains a polyimide composition. (b) layer: A layer that contains a polyimide composition and that has a higher inorganic filler content than the (a) layer.

The utility model discloses a device for conveying a panel product to pass through a reflow oven, and the device comprises a carrying platform which comprises an upper surface used for containing the panel product and a downward pressing part used for providing downward pressing force for the contained panel product; and the movable trolley is used for bearing the carrying table to move in the reflow oven at a variable speed. According to the technical scheme, at least warping of the panel during reflow soldering can be restrained, and the problem that impact and fragment are easily caused by shaking of the panel is solved.