The invention relates to a method for manufacturing a nano enhanced wet
copper-based friction plate. The method mainly comprises the following steps of: 1, mixing materials; 2, performing ball-milling on
mixed materials; 3, profiling; 4, plating
copper on a core plate; 5, performing pressure
sintering; and 6,
processing an oil groove. The nano enhanced wet
copper-based friction plate comprises the following components in percentage by weight: 60 to 75 percent of Cu, 2 to 6 percent of Sn, 3 to 8 percent of Zn, 12 to 25 percent of C, 2 to 5 percent of SiO2, and 0.5 to 1.5 percent of nano SiO2; the materials are mixed; the step of performing ball-milling on the
mixed materials comprises the following substep of placing the mixed powdery materials and steel balls in a
ball mill, wherein the ratio of the steel balls to the material is 5 to 1 and the time of the ball-milling is 1.5 to 2.5 hours; the step of performing pressure
sintering comprises the substeps of stacking profiled
powder blank of a frictional layer and a copper-plated steel core plate in a
bell jar type pressure
sintering furnace and performing pressure sintering, wherein the sintering temperature is 750 to 850 DEG C; preserving heat for 2.5 to 3.5 hours, wherein the
atmosphere is
ammonia decomposition gas; and the step of plating copper on the core plate is to plate copper on the core plate by an
electroplating method and manufacturing the copper-plated core plate and comprises the following substeps of hanging the core plate on a
cathode, hanging a copper plate on an
anode, adding copper
ion-containing electroplate liquid into a plating bath, introducing
direct current and adjusting
electroplating time according to the thickness of a plating layer. The nano enhanced wet copper-based friction plate manufactured by the method has frictional wear performance and a
heat resistance coefficient which are obviously superior to those of the wet copper-based friction plate manufactured by the conventional method.