Batch processing chamber with diffuser plate and injector assembly

Abstract

An apparatus for batch processing of a wafer is disclosed. In one embodiment the batch processing apparatus includes a bell jar furnace having a diffuser disposed between gas inlets and the substrate positioned within the furnace to direct flows within the chamber around the perimeter of the substrate.

Description

technical field [0001] Embodiments of the invention relate to a batch processing chamber. Background technique [0002] The efficiency of a substrate manufacturing process is usually measured by two related and important factors, device yield and cost of ownership (COO). These factors are important because they directly affect the cost of producing electronic devices, which in turn affects the competitiveness of device manufacturers in the marketplace. While there are many factors that affect COO, COO is primarily affected by the number of substrates processed per hour and the cost of the materials processed. Batching has been introduced to reduce COO, and batching is very efficient. Batch chambers are often complex, for example equipped with heating systems, gas delivery systems, exhaust systems and pumping systems. [0003] figure 1 and figure 2 A known batch chamber is shown. refer to figure 1 , which shows the batch processing chamber 100 under processing conditi...

AI Technical Summary

Problems solved by technology

First, because the substrate is circular, the processing space in the box-shaped chamber is not efficiently utilized

Thus, process gas is wasted, and the residence time of the reactive gas (the average time for one gas molecule to travel from the point of injection to exit on the opposite side of the chamber) is prolonged

Second, since the injection and discharge components are not temperature controlled, they are prone to condensation and decomposition due to excessively high or low temperatures

Third, the heating system is complex and difficult to maintain and clean

Fourth, the use of many pressure insulating seals increases system complexity and is prone to leaks

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