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7190results about How to "Uniform temperature" patented technology

Process for PECVD of silicon oxide using TEOS decomposition

A high pressure, high throughput, single wafer, semiconductor processing reactor is disclosed which is capable of thermal CVD, plasma-enhanced CVD, plasma-assisted etchback, plasma self-cleaning, and deposition topography modification by sputtering, either separately or as part of in-situ multiple step processing. The reactor includes cooperating arrays of interdigitated susceptor and wafer support fingers which collectively remove the wafer from a robot transfer blade and position the wafer with variable, controlled, close parallel spacing between the wafer and the chamber gas inlet manifold, then return the wafer to the blade. A combined RF/gas feed-through device protects against process gas leaks and applies RF energy to the gas inlet manifold without internal breakdown or deposition of the gas. The gas inlet manifold is adapted for providing uniform gas flow over the wafer. Temperature-controlled internal and external manifold surfaces suppress condensation, premature reactions and decomposition and deposition on the external surface. The reactor also incorporates a uniform radial pumping gas system which enables uniform reactant gas flow across the wafer and directs purge gas flow downwardly and upwardly toward the periphery of the wafer for sweeping exhaust gases radially away from the wafer to prevent deposition outside the wafer and keep the chamber clean. The reactor provides uniform processing over a wide range of pressures including very high pressures. A low temperature CVD process for forming a highly conformal layer of silicon dioxide is also disclosed. The process uses very high chamber pressure and low temperature, and TEOS and ozone reactants. The low temperature CVD silicon dioxide deposition step is particularly useful for planarizing underlying stepped dielectric layers, either alone or in conjunction with a subsequent isotropic etch. A preferred in-situ multiple-step process for forming a planarized silicon dioxide layer uses (1) high rate silicon dioxide deposition at a low temperature and high pressure followed by (2) the deposition of the conformal silicon dioxide layer also at high pressure and low temperature, followed by (3) a high rate isotropic etch, preferably at low temperature and high pressure in the sane reactor used for the two oxide deposition steps. Various combinations of the steps are disclosed for different applications, as is a preferred reactor self-cleaning step.
Owner:APPLIED MATERIALS INC

Intelligent multi-loop electric automobile cooling system

The invention relates to an intelligent multi-loop electric automobile cooling system. The intelligent multi-loop electric automobile cooling system comprises a power battery pack, an armature module, a battery radiator, an armature radiator, electric water pumps, straightway valves, three-way valves, a PTC heater and a heat exchanger. The cooling system is provided with the two electric water pumps, the two straightway valves and the three three-way valves, and a plurality of loops are formed through pipeline connection. Compared with the prior art, the intelligent multi-loop electric automobile cooling system is provided with the multiple three-way valves and the straightway valves, pipelines are connected to form the loops meeting different cooling or heating needs, the loops are selectively opened or closed according to the characteristics and working states of the electric automobile power battery pack and the armature module, thus temperature balance of an electric automobile is ensured, efficient operation of the electric automobile is ensured, and system energy conservation is significant. Power battery pack cooling and armature module cooling are associated with each other, thus automobile endurance mileage becomes longer, and the power performance and economy of the automobile become better.
Owner:SHANGHAI COTECH AUTOMOTIVE ENG CORP LTD

Hot forming tool of titanium alloy thin-wall part and machining method of hot forming tool

ActiveCN102500675AViscoplastic deformation facilitatesAvoid lostShaping toolsTemperature controlProcess integration
The invention provides a hot forming tool of a titanium alloy thin-wall part, comprising five parts, namely stretching equipment, a mould device, a blank, a power supply system and a temperature control system, wherein the mould device is arranged on a central worktable of the stretching equipment; the blank passes through a side wall crack of the mould device; an insulating and heat-insulation cushion layer is used for insulating the blank, a clamp of the stretching equipment, the surface of a mould and a tool of the mould; the power supply system is switched on to electrify an electrode clamping plate and generate a current in the blank; the blank is heated and the temperature of the blank is measured and controlled by the temperature control system; and after the temperature of the blank reaches a target temperature, the part is formed on the surface on the mould by the blank in an adhered manner through carrying out hot forming processes successively including stretching, covering, stretching, heat preservation and creep deformation and the like on the stretching equipment. A machining method of the hot forming tool of the titanium alloy thin-wall part comprises eight steps. According to the invention, the heating efficiency, the process integration, the material formation and the formation precision of the titanium alloy thin-wall part in manufacture are greatly improved, so that the hot forming tool of the titanium alloy thin-wall part and the machining method of the hot forming tool have a practical value and a popularization value.
Owner:BEIHANG UNIV

LED (Light Emitting Diode) bulb lamp with driving power supply integrated in bulb shell

The invention discloses an LED (Light Emitting Diode) bulb lamp with a driving power supply integrated in a bulb shell. The LED bulb lamp comprises the bulb shell, a core column, a power supply drive, multiple LED luminous lamp filaments, heat conduction gas and a lamp holder, wherein the power supply drive is fixedly arranged on the core column; the LED luminous lamp filaments are connected with the power supply drive; the bulb shell is filled with the heat conduction gas; the lamp holder is connected with the bulb shell; each LED luminous lamp filament comprises a substrate; the surface of each substrate is provided with a metal circuit and a bottom adhesive layer; two ends of each substrate are provided with metal pins; each substrate is fixedly provided with an LED luminous unit; each LED luminous unit is provided with a sealing adhesive layer. According to the LED bulb lamp disclosed by the invention, the power supply drive is arranged in the bulb shell, an existing manual assembling link is avoided, large-scale automatic production can be realized, and the production cost is substantially reduced; the lamp filaments adopt an optimized chip arranging type, the temperature of each substrate in different positions is nearly uniform, the luminous flux maintenance rate and the long-term reliability of the whole LED bulb lamp are increased, and the service life of the LED bulb lamp is prolonged.
Owner:HANGZHOU HANGKE OPTOELECTRONICS

Composite energy field heating device

ActiveCN105666895AImprove performanceUniform and controllable heating and curing processMicrowave cavityAviation
The invention provides a composite energy field heating device. The composite energy field heating device comprises a microwave heating device and a hot-pressing tank, wherein the microwave heating device comprises a microwave generator, a microwave cavity and a microwave local shielding part; the microwave generator is used for sending microwaves into the microwave cavity; a wave absorbing material is arranged in the microwave cavity; the microwave local shielding part is positioned in the microwave cavity, and is used for covering the outer surface of the wave absorbing material; the microwave local shielding part is composed of a shielding microwave region and a transmission microwave region; the transmission microwave region comprises one or more seams, so that microwaves in the microwave cavity can enter the wave absorbing material through the seams for being absorbed; the microwave cavity is integrally arranged in the hot-pressing tank; a ventilating window or a ventilating wall which consists of one or more metal honeycomb plates is arranged on the microwave cavity; and the ventilating window or the ventilating wall can be used for enabling smooth air flow inside and outside the microwave cavity in the hot-pressing tank while shielding the microwaves. The composite energy field heating device can truly realize consistent temperature on all parts in the wave absorbing material, so that high-quality cured products are provided for the aviation and aerospace fields.
Owner:CENT SOUTH UNIV

Efficient burning furnace with rotary fluidization grate

The invention relates to an efficient burning furnace with a rotary fluidization grate. The burning furnace with the rotary fluidization grate consists of a feeding system, a burning system and a slagging system; moreover, a waste heat boiler and a flue gas treatment system are connected with the burning furnace to form a complete garbage burning and generating system. The feeding system consists of a feeding hopper, a pre-drying conveying device, an aggregate bin, a chute and a charge distributor. The feeding hopper is a receiving opening for feeding garbage into the burning furnace and is arranged in a garbage storage pit close to one side of the burning furnace. An outlet of the feeding hopper is connected with an inlet of the pre-drying conveying device. A material level switch is arranged in the feeding hopper, and gives an alarm to prompt an operator to feed materials when the material level is lower than a set value so as to ensure that the hopper is not empty. The outlet of the hopper can be selectively provided with a feeding device. The burning furnace has the advantages of high burning speed, high burning efficiency, high slag burning degree, easy control, lower energy consumption, low pollution, low cost and investment conservation, and is applicable to domestic garbage with low thermal value and high moisture; and the garbage does not need to be pretreated.
Owner:新乡锅炉制造有限公司

Device for controlling delivery and uniform distribution of reaction gases in MOCVD reaction chamber

The invention discloses a device for controlling the delivery and the uniform distribution of reaction gas in a MOCVD reaction chamber. By respectively controlling the flow of gas passages non-uniformly distributed radially on a front gas homogenizing plate and input passages at different positions, at least two reaction gases are respectively introduced into two paths which are radially and axially crossed on a spray header, and can be secondarily distributed by nozzles in different shapes, so the uniformly distributed boundary layer concentration, speed and temperature required are achieved on the surface of a rotary epitaxial wafer, the quality of massively produced epitaxial films and the finished product ratio of massively produced epitaxial wafers are improved, the consumption of expensive reaction gases can be effectively controlled and the epitaxial production cost is reduced. By properly increasing the distance between the surface of the spray header and the epitaxial wafer, deposits generated on the surface of the spray header and the nozzles in the epitaxial growth are reduced, the cleaning period is prolonged, and the production efficiency and system capacity are improved. The device also can reduce the processing difficulty and manufacturing cost of the nozzles of the spray header and cooling medium passages.
Owner:JIANGSU ZHONGSHENG SEMICON EQUIP
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