4331results about "Drying solid materials with heat" patented technology

In one of the many embodiments, a method for processing a substrate is provided which includes generating a first fluid meniscus and a second fluid meniscus on a surface of the substrate where the first fluid meniscus being substantially adjacent to the second fluid meniscus. The meniscus also includes substantially separating the first fluid meniscus and the second fluid meniscus with a barrier.

An ultraviolet (UV) cure chamber enables curing a dielectric material disposed on a substrate and in situ cleaning thereof. A tandem process chamber provides two separate and adjacent process regions defined by a body covered with a lid having windows aligned respectively above each process region. One or more UV bulbs per process region that are covered by housings coupled to the lid emit UV light directed through the windows onto substrates located within the process regions. The UV bulbs can be an array of light emitting diodes or bulbs utilizing a source such as microwave or radio frequency. The UV light can be pulsed during a cure process. Using oxygen radical/ozone generated remotely and/or in-situ accomplishes cleaning of the chamber. Use of lamp arrays, relative motion of the substrate and lamp head, and real-time modification of lamp reflector shape and/or position can enhance uniformity of substrate illumination.

An apparatus for heating a substrate of a semiconductor device includes a hot plate, on which a semiconductor substrate is placed, and a heater for heating the hot plate. The hot plate is preferably a composite plate including a plurality of plates having different thermal conductivities from each other. For example, a first plate adjacent to the heater can be made of aluminum, which has a relatively high thermal conductivity. A second plate, laminated on top of the first plate, can be made of titanium or stainless steel, which both have a thermal conductivity lower than aluminum. A composite hot plate as disclosed herein is better able to maintain a constant temperature and a uniform temperature distribution in order to more uniformly heat a substrate and to reduce an amount of energy required for the heating process. In addition, the reliability and productivity of the semiconductor device manufactured by the apparatus can be improved.

A reactor defines a reaction chamber for processing a substrate. The reactor comprises a first inlet for providing a first reactant and to the reaction chamber and a second inlet for a second reactant to the reaction chamber. A first exhaust outlet removes gases from the reaction chamber. A second exhaust outlet removes gases from the reaction chamber. A flow control system is configured to alternately constrict flow through the first and second exhaust outlets. The reactor chamber is configured to for a diffusion barrier within the reaction chamber.

[Problems] To prevent both slips caused by damage from projections, and slips caused by adhesive force occurring due to excessive smoothing.

[Means for Solving the Problems] The heat treating apparatus includes a processing chamber for heat treating wafers and a boat for supporting the wafers in the processing chamber. The boat further includes a wafer holder in contact with the wafer and a main body for supporting the wafer holder. The wafer holder diameter is 63 to 73 percent of the wafer diameter, and the surface roughness Ra of the portion of the wafer holder in contact with the wafer is set from 1 μm to 1,000 μm. The wafer can be supported so that the amount of wafer displacement is minimal and both slips due to damage from projections on the wafer holder surface, and slips due to the adhesive force occurring because of excessive smoothing can be prevented in that state.

A susceptor is formed with a cavity having a tapered surface and a receiving surface. The gradient α of the tapered surface with respect to the receiving surface is set to at least 5° and less than 30°, so that a semiconductor wafer received by the susceptor can be located on the receiving surface through the tapered surface while the semiconductor wafer can be protected against excess stress also when the surface of the wafer abruptly thermally expands due to flashlight irradiation and can be prevented from cracking in thermal processing. Thus provided are a thermal processing susceptor and a thermal processing apparatus capable of preventing a substrate from cracking in thermal processing.

A radiant shield and a furnace employing a radiant shield for controlled heating and treatment of material using infrared radiation. The furnace is capable of improved temperature control where material treated by the furnace may interfere with the quality of a measured temperature signal and temperature control based on that signal.

A method and apparatus for thermally processing a substrate is described. The apparatus includes a substrate support configured to move linearly and/or rotationally by a magnetic drive. The substrate support is also configured to receive a radiant heat source to provide heating region in a portion of the chamber. An active cooling region comprising a cooling plate is disposed opposite the heating region. The substrate may move between the two regions to facilitate rapidly controlled heating and cooling of the substrate.

A pedestal for use in a high temperature vertical furnace for the processing of semiconductor wafers provides a closure and heat insulation for the lower end of the furnace and is a wafer boat support. The pedestal, comprising quartz-enveloped insulation material, supports a wafer boat at a boat support level and is provided with an upper section disposed above the boat support level. The upper section comprises enveloped insulating material. The envelope of the upper section is also formed of quartz and the insulating material in the upper section has a lower thermal conductance than the insulating material in a lower quartz enveloped section.

Particulate compositions are described comprising an intimate mixture of a coal and a gasification catalyst. The particulate compositions are gasified in the presence of steam to yield a plurality of gases including methane and at least one or more of hydrogen, carbon monoxide, carbon dioxide, hydrogen sulfide, ammonia and other higher hydrocarbons. Processes are also provided for the preparation of the particulate compositions and converting the particulate composition into a plurality of gaseous products.

Disclosed is a method for smoothing the surface of an object built from a polymeric or wax material using a layered manufacturing rapid prototyping technique. After the object is built it is exposed to a vaporized solvent such as in a vaporizer for an exposure time sufficient to reflow the object surface. A solvent is chosen based on its ability to transiently soften the material which forms the object, and thereafter evaporate off the object. The object is removed from the solvent and allowed to dry, producing a smooth finished part.

A system for direct injection of selected thermal-infrared (IR) wavelength radiation or energy into food items for a wide range of processing purposes is provided. These purposes may include heating, raising or maintaining the temperature of the food articles. The system is especially applicable to operations that require or benefit from the ability to irradiate at specifically selected wavelengths or to pulse or inject the radiation. The system is particularly advantageous when functioning at higher speeds and in a non-contact environment with the target.

A method for torrefaction of wood which includes providing a first endless conveyor belt; heating the first endless belt; and positioning a planar wood product on the first belt to heat the wood product by conduction to achieve torrefaction. Other forms provide a second endless belt that disposed in sandwich relation to wood to be torrefied. Some embodiments of the method provide a metal chamber having opposed planar sides dimensioned and configured for receiving a wood sheet with the respective opposed sides of the wood sheet in intimate thermal contact with respective opposed sides of the metal chamber. Other embodiments include the apparatus for torrefaction of an associated wood sheet.

Pulsed processing methods and systems for heating objects such as semiconductor substrates feature process control for multi-pulse processing of a single substrate, or single or multi-pulse processing of different substrates having different physical properties. Heat is applied a controllable way to the object during a background heating mode, thereby selectively heating the object to at least generally produce a temperature rise throughout the object during background heating. A first surface of the object is heated in a pulsed heating mode by subjecting it to at least a first pulse of energy. Background heating is controlled in timed relation to the first pulse. A first temperature response of the object to the first energy pulse may be sensed and used to establish at least a second set of pulse parameters for at least a second energy pulse to at least partially produce a target condition.

A drying apparatus including a conveying member configured to convey an item to be dried, a plurality of microwave irradiation portions disposed alternately at an upper side and a lower side of the conveying member, and a plurality of hot air blowing portions. The microwave irradiation portions are configured to irradiate the item to be dried with microwaves in an alternating manner from the upper side and the lower side. The hot air blowing portions are configured to apply hot air to the item to be dried in parallel with irradiation of the microwaves by the microwave irradiation portions.

The present invention provides a system and a method for the production of microparticles and nanoparticles of materials that can be dissolved. The system and method of the present invention provide quicker freezing times, which in turn produces a more uniform distribution of particle sizes, smaller particles, particles with increased porosity and a more intimate mixing of the particle components. The system and method of the present invention also produce particles with greater surface area than conventional methods. One form of the present invention provides a method for the preparation of particles. An effective ingredient is mixed with water, one or more solvents, or a combination thereof, and the resulting mixture is sprayed through an insulating nozzle located at or below the level of a cryogenic liquid. The spray generates frozen particles.

The present invention is related to an UV LED curing apparatus, and more particularly, to an UV LED curing apparatus with improved housing and switch controller. The UV LED curing apparatus of the present invention is preferably provided for curing UV hardening gel applied onto the nails of multiple fingers or toes all at once and with automatic controls; the UV LED curing apparatus comprises a light reflective inner casing enclosing a curing chamber having a front opening, an outer casing detachably attached to the inner casing and an UV LED light source disposed on the inner casing and capable of providing an illumination covering a large space in the curing chamber. The automatic controls of the apparatus may be achieved by a switch controller having a photo interrupter, timer and current regulator such that the UV light from the UV LED light source is triggered to an on-state by the sensor of the photo interrupter and switched to an off-state by the timer and current regulator with reference to a preset curing time automatically. The UV LED light source is preferably to be of a wavelength between 360 nm and 460 nm. The light reflective inner casing is preferably provided as an effective UV light reflector and as a supporting substrate of the UV LED light source while being capable of transmitting heat from the UV LED light source away for further heat dissipation to the ambient by the outer casing. The outer casing is detachably attached to the inner casing and allows a greater user interaction for decorative and entertainment purposes while also being a protective and heat dissipation means.

An end-face heating apparatus of the present invention comprises: a heating tool that is placed almost in parallel with an end face of a honeycomb aggregated body in which a plurality of pillar-shaped honeycomb fired bodies are integrated with one another by interposing a sealing material paste layer formed on the side face of the honeycomb fired body; a heating tool translation device for translating said heating tool toward said honeycomb aggregated body; and a holding jig that holds said honeycomb aggregated body.

A dryer operable in close proximity to and in series with an inkjet printhead comprises a heat source and an air bearing structure on one side of the predetermined path and having a pressurized air inlet and an air outlet adjacent to the drying position of the receiver medium. Air flow from the air bearing structure outlet forms an air bearing for the receiver medium. A microporous filter positioned at the outlet and being adapted to convert the air flow from the outlet to a diffuse flow, the microporous filter being formed of an inner layer of very fine screen for optimum air diffusion and an outer layer of courser woven screen to add rigidity and protection from scuffing.

PCT No. PCT/JP97/00526 Sec. 371 Date Aug. 31, 1998 Sec. 102(e) Date Aug. 31, 1998 PCT Filed Feb. 25, 1997 PCT Pub. No. WO97/32339 PCT Pub. Date Sep. 4, 1997An heat-treating ring boat (20) for semiconductor wafers (W) has a top plate (21), a bottom plate (22), six columns (23-28), and 63 ring trays (31). The trays (31) are mounted in grooves (20a) of the columns (23-28). To fix the trays (31), a fixing rod (33) is detachably mounted between the top plate (21) and bottom plate (22). A through hole (21a) and a recessed portion (22a) to mount the fixing rod (33) therein are formed in the top plate (21) and bottom plate (22). Notches (34) to engage with the fixing rod (33) are formed in the trays (31). A notch (32) to engage with the fixing rod (33) is formed in the column (23). A projection (41) is formed on each tray (31) to abut against the side surface of the column (24).

A dishwasher with a novel drying cycle is provided. The dishwasher door includes a vent channel connecting the interior of the dishwasher to the outside and housing a condenser section that condenses water vapor from moisture laden air from the interior of the dishwasher and directs the condensed water back into the dishwasher. A vent valve covers the opening of the vent channel into the dishwasher and is opened and closed at appropriate times during the drying cycle. A heater adjacent a blower heats air entering the dishwasher. A temperature sensor in the dishwasher interior provides temperature measurements of the inside of the dishwasher that may be used to control the duration of the drying cycle. A controller interconnects the operating components of the dishwasher and provides the logic for the drying cycle.

Various processes for heating semiconductor wafers is disclosed. In particular, the present invention is directed to configuring light sources emitting light energy onto a wafer in order to optimize absorption of the energy by the wafer. Optimization is carried out by varying the angle of incidence of the light energy contacting the wafer, using multiple wavelengths of light, and configuring the light energy such that it contacts the wafer in a particular polarized state. In one embodiment, the light energy can be emitted by a laser that is scanned over the surface of the wafer.

This invention discloses systems and methods for conversion of high moisture waste materials to dry or low moisture products for recycle or reuse. The equipment systems comprise a gas turbine generator unit (preferred heat source), a dryer vessel and a processing unit, wherein the connection between the gas turbine and the dryer vessel directs substantially all the gas turbine exhaust into the dryer vessel and substantially precludes the introduction of air into the dryer vessel and wherein the processing unit forms the dried material from the dryer vessel into granules, pellets or other desired form for the final product. Optionally, the systems and methods further provide for processing ventilation air from manufacturing facilities to reduce emissions therefrom.

To dry semiconductor substrates, especially silicon wafers subsequent to rinsing after etching, the substrate is exposed to the action of radiation which contains an IR portion and a UV portion, the IR portion being greater than the UV portion. The IR-UV radiation quickly dries the substrate and prevents contamination of the substrate with undesirable particles or limits it to a nondisruptive degree. To execute drying with IR-UV radiation, an arrangement is proposed in which the substrate is moved through directly from the treatment liquid (rinsing medium) between two rod-shaped radiators which emit IR-UV radiation.

Methods and apparatus are provided for making particles comprising: (a) spraying an emulsion, solution, or suspension, which comprises a solvent and a bulk material (e.g., a pharmaceutical agent), through an atomizer and into a primary drying chamber, having a drying gas flowing therethrough, to form droplets comprising the solvent and bulk material dispersed in the drying gas; (b) evaporating, in the primary drying chamber, at least a portion of the solvent into the drying gas to solidify the droplets and form particles dispersed in drying gas; and (c) flowing the particles and at least a portion of the drying gas through a jet mill to deagglomerate or grind the particles. By coupling spray drying with “in-line” jet milling, a single step process is created from two separate unit operations, and an additional collection step is advantageously eliminated. The one-step, in-line process has further advantages in time and cost of processing.

A device for treatment of wounds using reduced pressure, said device comprising

• • a pump
  • a reservoir connected to said pump for collecting exudate from a wound (1),
  • an inlet to the reservoir for connecting the reservoir with the wound so as to allow the pump to expose the wound to the reduced pressure, a wound pad to be arranged in the wound cavity and a sealing covering the wound and said wound pad.

The wound pad consist of an open-cell polyurethane foam which is fully impregnated with a soft hydrophobic silicone gel, and that the foam has a hardness of 1.0-6.0 kPa measured according to ISO 3386-1 at 40% compression. The invention also concerns such a wound pad to be used with an absorbent member. In addition the invention concerns a method for manufacturing the wound pad.

Apparatuses and processes for treating dielectric materials such as low k dielectric materials, premetal dielectric materials, barrier layers, and the like, generally comprise a radiation source module, a process chamber module coupled to the radiation source module; and a loadlock chamber module in operative communication with the process chamber and a wafer handler. The atmosphere of each one of the modules can be controlled as may be desired for different types of dielectric materials. The radiation source module includes a reflector, an ultraviolet radiation source, and a plate transmissive to the wavelengths of about 150 nm to about 300 nm, to define a sealed interior region, wherein the sealed interior region is in fluid communication with a fluid source.

A modified creping adhesive composition, comprising an adhesive component and at least one terpene modifier, and its use in the production of creped paper products by a process which includes the steps of adhering a paper web to the surface of a drying cylinder and separating the paper web from the drying cylinder with a creping blade.

Embodiments of the invention generally contemplate an apparatus and method for monitoring and controlling the temperature of a substrate during processing. One embodiment of the apparatus and method takes advantage of an infrared camera to obtain the temperature profile of multiple regions or the entire surface of the substrate and a system controller to calculate and coordinate in real time an optimized strategy for reducing any possible temperature non-uniformity found on the substrate during processing.

An apparatus, system, and method provide drying procedure information through a user interface. A monitoring device transmits drying procedure data measured by sensors within a structure undergoing the drying procedure to a server. In response to requests received through a communication network from a user interface, the server transmits the drying procedure information that is presented through the user interface. A variety of information and services related to the drying procedure may be provided through the user interface.