2199results about "Drying machines" patented technology

A heating apparatus for heating a target object W is provided with a plurality of heating light sources, including LED elements for applying heating light having a wavelength within a range from 360 to 520 nm to the object. Thus, a temperature of only the shallow surface of the object, such as a semiconductor wafer, is increased / reduced at a high speed in uniform temperature distribution, irrespective of the film type.

A disc-type unit 10 adjusts temperature of a control face 14 by means of a heater 12 and coolant, with a hollow plate 11 to which the heater 12 is secured, a cavity 13 formed in the hollow plate 11 and a piping 20 for supplying the coolant to the cavity 13, the piping 20 opening in the cavity 13, and the coolant being jetted to a portion to which the heater 12 is secured or a portion in proximity thereto and which shows high temperature rise when energizing the heater 12.

A reactor chamber is positioned between a top array of LED heat lamps and a bottom array of LED heat lamps. The LED heat lamps forming the top and bottom arrays are individually or controllable in groups such that power output along each array of LED heat lamps can dynamically differ. The LED lamps can be controlled in response to, for example, feedback from chamber sensors, a desired temperature profile, and a failed LED lamp. In this way, the methods and systems described herein can dynamically compensate for operational characteristics of the reactor chamber. In one configuration, the LED heat lamps are arranged in a rectangular pattern. In some configurations, the LED heat lamps are arranged in a circular or a concentric pattern.

A thermal processing system has a processing vessel 4, a support post 30 stood on the bottom wall of the processing vessel 4, and a support table 32 internally provided with a heating means 38 and supported on the support post 30. A workpiece W is placed on the upper surface of the support table 32 and is subjected to a predetermined thermal process. The upper, the side and the lower surface of the support table 32 are covered with heat-resistant covering members 72, 74 and 76 to prevent the thermal diffusion of metal atoms causative of contamination from the support table 32. thus, various types of contamination, such as metal and organic contamination, can be prevented.

The present invention provides a method and apparatus for curing a coated fiber, comprising either two fiber coating curing stages separated by a cooling stage, or two fiber coating curing stages separated by a distinct time interval, or both. One of the two fiber coating curing stages responds to the coated fiber, and provides a partially cured fiber coating. The other of the two fiber coating curing stages responds to the partially cured coated fiber for further curing the coating of the fiber. In one embodiment of the invention, a cooling stage is placed between the two curing stages, while in the other the curing stages are placed a set distance apart such that polymerization of the coating initiated by the first curing stage has time to complete prior to the coating being irradiated by the second curing stage. The cooling stage is used to actively remove heat generated during the cure process from the fiber coating, while the time delay is used to allow complete polymerization to occur before subsequent irradiations. These embodiments of the present invention can be used separately or in combination to achieve optimal fiber coating cure.