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757results about How to "Reduce bond strength" patented technology

Substrate transfer mechanism and subtrate transfer apparatus including same, particle removal method for the subtrate transfer mechanism and apparatus, program for executing the method, and storage medium for storing the program

A substrate transfer mechanism for transferring a substrate includes a mounting table on which the substrate is mounted; an arm member connected to the mounting table and moving it. The substrate transfer mechanism further includes a temperature control unit for controlling temperature of the mounting table, wherein the temperature control unit forms a temperature gradient in the mounting table. The temperature control unit includes a detector for detecting temperature in an environment or a chamber in which the substrate transfer mechanism is installed a heater for heating the mounting table and a controller for controlling an operation of the heater based on the temperature in the environment or the chamber detected by the detector.
Owner:TOKYO ELECTRON LTD

Intermediate film for laminated glass and laminated glass

The object of the present invention is to provide an interlayer film for laminated glass which exerts excellent heat insulation or electromagnetic wave transmittance and which is suitable for producing a laminated glass having excellent fundamental performance characteristics required for the laminated glass, such as transparency, especially good haze, appropriate bond strength between an interlayer film and glass, penetration resistance, impact absorption, weather resistance, and so on. Also, the object of the present invention is to provide a laminated glass produced by using the above-mentioned interlayer film. These objects are realized by the interlayer film for laminated glass comprising an adhesive resin, wherein the average particle diameter of tin-doped indium oxide and / or antimony-doped tin oxide is ranging from 0 to 80 nm, and the number of the tin-doped indium oxide or antimony-doped tin oxide particles with a particle diameter of not less than 100 nm are dispersed not more than 1 per 1 mum<2>, and also, by a laminated glass produced by interposing said interlayer film for laminated glass between at least a pair of glass sheets having a visible light transmittance rate (Tv) of not less than 65% in the light rays of 380 to 780 nm, a solar radiation transmittance rate (Ts) in the light rays of 300 to 2500 nm of not more than 80% of the mentioned visible light transmittance rate (Tv), the haze value (H) of up to 1.0% and electromagnetic wave shield (DeltadB) of not more than 11 dB in the wavelength of 10 to 2000 MHz.
Owner:SEKISUI CHEM CO LTD

Integral PSIR door for an instrument panel and method for making same

An air bag cover assembly comprises a flexible plastic air bag door closing an air bag deployment opening in a hard plastic retainer. A door outer edge abuts and is mechanically locked to an inner edge of the opening. The interlock comprises a protrusion in the door outer edge, which mates with a complementary recess in the inner edge of the opening. The interlock blocks outward and inward air bag door movement. The door and retainer are made of plastics, which generally do not adhere easily to one another. Silicone may be sprayed on the door outer edge to further reduce adhesion or where plastics, which generally adhere to one another, are used. Preferably, the exterior and interior surfaces of the door and retainer lie flush with one another. The door includes a flexible hinge flange that extends from an interior door surface and attaches the door to the vehicle structure. The hinge flange allows the door to swing outward upon air bag deployment while retaining the door to the vehicle structure. A steel door insert may be included to add rigidity, strength or dimensional stability to the door. The assembly is constructed by molding molten retainer material in a mold cavity that contains the door so that the retainer material flows around the door to form the mechanical interlock.
Owner:TEXTRON AUTOMOTIVE +1

Microcapsules adapted to rupture in a magnetic field to enable easy removal of one substrate from another for enhanced reworkability

An enhanced thermal interface material (TIM) gap filler for filling a gap between two substrates (e.g., between a coldplate and an electronics module) includes microcapsules adapted to rupture in a magnetic field. The microcapsules, which are distributed in a TIM gap filler, each have a shell that encapsulates a solvent. One or more organosilane-coated magnetic nanoparticles is / are covalently bound into the shell of each microcapsule. In one embodiment, (3-aminopropyl) trimethylsilane-coated magnetite nanoparticles are incorporated into the shell of a urea-formaldehyde (UF) microcapsule during in situ polymerization. To enable easy removal of one substrate affixed to another substrate by the enhanced TIM gap filler, the substrates are positioned within a magnetic field sufficient to rupture the microcapsule shells through magnetic stimulation of the organosilane-coated magnetic nanoparticles. The ruptured microcapsule shells release the solvent, which dissolves and / or swells the TIM gap filler, thereby reducing the bond strength between the substrates.
Owner:IBM CORP

Dental compositions including radiation-to-heat converters, and the use thereof

Hardenable and hardened dental compositions that include radiation-to-heat converters, and articles including such hardenable and hardened compositions, are provided. Upon irradiating, the hardened compositions increase in temperature, which can be useful for reducing the bond strengths of orthodontic appliances adhered to tooth structures with the hardened compositions.
Owner:3M INNOVATIVE PROPERTIES CO

Display device and manufacturing method thereof

Disclosed is a display device in which reliable bonding strength and high reparability are compatible when a panel-like member is bonded to a display panel.The display device comprises: a display panel; and a panel-like member bonded to the display panel with an adhesive made of an ultraviolet curable resin; wherein the adhesive includes a first adhesive portion and a second adhesive portion, the first adhesive portion being provided outside of a display area of the display panel and formed in a circular shape to surround the display area, the second adhesive portion prevailing in an area surrounded by the first adhesive portion, the first adhesive portion being different in a modulus of elasticity from the second adhesive portion, and wherein the modulus of elasticity of the second adhesive portion is smaller than the modulus of elasticity of the first adhesive portion.
Owner:PANASONIC LIQUID CRYSTAL DISPLAY CO LTD +1

Production method of strained silicon-SOI substrate and strained silicon-SOI substrate produced by same

A strained Si-SOI substrate is produced by a method comprising: growing a SiGe mixed crystal layer on an SOI substrate having a Si layer of not less than 5 nm in thickness and a buried oxide layer; forming a protective film on the SiGe mixed crystal layer; implanting light element ions into a vicinity of an interface between the silicon layer and the buried oxide layer; a first heat treatment for heat treating the substrate at a temperature of 400 to 1000° C. in an inert gas atmosphere; a second heat treatment for heat treating the substrate at a temperature not lower than 1050° C. in an oxidizing atmosphere containing chlorine; removing an oxide film from the surface of the substrate, and forming a strained silicon layer on the surface of the substrate.
Owner:SUMCO CORP +1

Optical module and optical communication system

An object of the disclosed technology is to realize, at low cost, an optical communication module capable of high-speed operation and having an excellent EMC property. A means for achieving the object is as follows. A main body of an optical module is formed of a ceramic multilayer structure, and a high-frequency line is provided. A surface of the main body is provided with an electrode pattern, which is electrically connected to a ground pin. A metal cap is secured to the electrode pattern using a conductive adhesive.
Owner:OCLARO JAPAN INC

Photocuring and thermocuring conductive adhesive and preparation method

The invention discloses a photocuring and thermocuring conductive adhesive, which is prepared by mixing photosensitive high polymer, diluent monomer, conducting particles, photoinitiator, polymerization inhibitor, epoxy resin, epoxy active diluting agent, latent curing agent and latent promoting agent, grinding the mixture, and stirring and dispersing in a planetary manner. The curing temperature of the product is low, and deep curing can be realized; after being cured, the adhesive has high adhesiveness and high solvent resistance; and the adhering strength is high, the resistivity is low, and the requirements of microelectronic packaging technique for LED chips, liquid crystal materials, glass substrates, thin film circuits, PCB circuit boards and the like can be met.
Owner:东莞市新懿电子材料技术有限公司

Photoelectric conversion device and method for manufacturing the same

A photoelectric conversion device with an excellent photoelectric conversion characteristic with a silicon semiconductor material effectively utilized. The photoelectric conversion device includes a first unit cell including a first electrode, a first impurity semiconductor layer, a single crystal semiconductor layer, and a second impurity semiconductor layer; and a second unit cell including a third impurity semiconductor layer, a non-single-crystal semiconductor layer, a fourth impurity semiconductor layer, and a second electrode. The second and third impurity semiconductor layers are in contact with each other so that the first and second unit cells are connected in series, and an insulating layer is provided for a surface of the first electrode and bonded to a supporting substrate.
Owner:SEMICON ENERGY LAB CO LTD

Highly conductive composites

InactiveUS20110214284A1Decreased percolation thresholdLow percolation thresholdConductive materialPretreated surfacesConductive polymerConducting pathway
Domain segregation of polymer blends or block copolymers in the presence of thermal conducting high aspect ratio nanocrystals leads to preferential placement of conductive filler either inside one domain, which promote the self-assembly of a thermal and / or electrical conducting pathway composed of high aspect ratio filler. The self-assembly of such thermal and / or electrical conducting pathway effectively enhances the thermal and / or electrical conductivity of the composite with significantly less amount of filler.
Owner:PIXELLIGENT TECH LLC

Method of manufacturing a semiconductor device

A semiconductor device improved in packaging reliability is disclosed. Each of leads used in the semiconductor device has a first surface positioned between a main surface of a resin sealing body and a back surface opposite to the main surface of the resin sealing body, a second surface positioned on the side opposite to the first surface and exposed from the back surface of the resin sealing body, a first end face positioned on a semiconductor chip side, a second end face positioned on the side opposite to the first end face and exposed from a side face of the resin sealing body, and a recessed portion depressed from the second surface to the first surface side and contiguous to the second end face, the second surface and an inner wall surface of the recessed portion being covered with a plating layer which is higher in solder wettability than the second end face of each of the leads.
Owner:RENESAS ELECTRONICS CORP

Protein containing serum albumin domain

A protein produced by gene recombinant technology, including at least one domain selected from domains I, II, and III of serum albumin but having a different structure from that of native albumin; and a method of producing the protein. The protein has an enhanced functional activity or activities selected from among various functional activities or serum albumin including antibacterial activity, antioxidative effect, inflammation inhibitory effect, in vivo substance transporting action, and enzymatic activity.
Owner:NIPRO CORP

Optical module and optical communication system

An object of the disclosed technology is to realize, at low cost, an optical communication module capable of high-speed operation and having an excellent EMC property. A means for achieving the object is as follows. A main body of an optical module is formed of a ceramic multilayer structure, and a high-frequency line is provided. A surface of the main body is provided with an electrode pattern, which is electrically connected to a ground pin. A metal cap is secured to the electrode pattern using a conductive adhesive.
Owner:OCLARO JAPAN INC

Electric catalyst with conducing high polymer modification one-dimensional nano carbon as carrier and producing process

An electro - catalyst uses one - dimensional nanocarbon modified by conduction high polymer in large Pi bond structure as carrier. Its preparing process includes preparing one - dimensional nanocarbon modified by conduction high polymer first and then loading Pt or Pt alloy on its surface. The average particle diameter of electro - catalyst is less than or equal to 5 nm and power density of single cell prepared by electro - catalyst is 0.40 - 0.47 W / cm2 under test condition as H2 / Air and Pt loading capacity in 0.20mg / sq cm and 600 mA / sq.cm.
Owner:WUHAN UNIV OF TECH

Container with easily removable membrane lid

A container such as a blow-molded plastic can has a flange encircling the top opening, and a flexible membrane lid sealed to the flange. The seal between the lid and the container does not have uniform bond strength all along its length. In particular, the seal has at least one portion having reduced width and hence lower bond strength than other portions of the seal. Consequently, initiation of peeling of the lid from the container can begin relatively easily at the lower-strength portion of the seal. Overall, however, the seal can be relatively strong to resist inadvertent detachment of the lid. Once the peeling of the lid is initiated, it becomes relatively easy to completely detach the lid.
Owner:SONOCO DEV INC

Bur for preparing metal substrates

A method and bur is described for preparing a surface of a metal substrate. The bur includes a shank portion and a cutting head. The cutting head includes a base portion connected to the shank portion, a tip portion opposite the base portion and a plurality of similar blades defined by equal size bur grooves formed along a longitudinal axis of the cutting head. Each of the blades including a plurality of spaced dentates defined by a helical groove spiraling from the base portion to the tip portion in a counterclockwise direction about the circumference of the cutting head at an angle departing from a line perpendicular to the longitudinal axis at an angle from about 5 to about 18 degrees.
Owner:SABOL DENISE V +1

Laser repair method for abraded centrifugal fan bearing block

The invention relates to a laser repair method of the mechanical repair field, in particular to a laser repair method for an abraded centrifugal fan bearing block. The laser repair method comprises the following steps of: cleaning a workpiece, detecting the dimensions of each part and determining a damaged part and the abrasion loss thereof; carrying out circular runout and end face runout detection on the workpiece; carrying out failure analysis and service life evaluation on the workpiece; removing the fatigue layer of the damaged part of the centrifugal fan bearing block and washing clean; detecting the hardness and the component of the parent material of the centrifugal fan bearing block; according to a detection result, preparing cladding powder, regulating the operating data of a laser device, setting a laser cladding technical parameters and carrying out laser cladding on the damaged part of the centrifugal fan bearing block by adopting a synchronous powder feeding mode; carrying out mechanical processing according to the requirement; carrying out surface colouration flaw detection on the processed workpiece, and detecting the processing precision of the centrifugal fan bearing block; and checking the centrifugal fan bearing block. The method has the advantages of high abrasion resistance, high hardness, high fusing rate of a cladding layer and the parent material of the bearing block, small deformation of the bearing block and the like.
Owner:河北瑞兆激光再制造技术股份有限公司

Steel sheet for dissimilar materials weldbonding to aluminum material and dissimilar materials bonded body

Disclosed is a steel sheet for dissimilar materials weldbonding to an aluminum material, the steel sheet containing, in mass, C: 0.02 to 0.3%, Si: 0.2 to 5.0%, Mn: 0.2 to 2.0%, and Al: 0.002 to 0.1%, further one or more of Ti: 0.005 to 0.10%, Nb: 0.005 to 0.10%, Cr: 0.05 to 1.0%, and Mo: 0.01 to 1.0%, and the balance consisting of Fe and unavoidable impurities. In the steel sheet, (i) the proportion of the oxide containing Mn and Si by 1 at. % or more in total in the external oxide layer which is newly formed after an original oxide layer having already existed on the surface of the steel sheet is once removed and now exists on the surface of the base steel material of the steel sheet is 50 to 80% in terms of the average proportion of the total length of the oxide to 1 μm length of the interface between the base steel material and the external oxide layer nearly in the horizontal direction, (ii) the proportion of the internal oxide, including oxide at the grain boundary, which exists in the steel region up to the depth of 10 μm from the surface of said base steel material of said steel sheet and contains Mn and Si by 1 at. % or more in total is 3% or more to less than 10% in terms of the average area percentage of said internal oxide in the visual field of 10 μm2 of said steel region, (iii) the proportion of the internal oxide, including oxide at the grain boundary, which exists in the steel region exceeding 10 μm in depth from the surface of said base steel material of said steel sheet and contains Mn and Si by 1 at. % or more in total is 0.1% or less in terms of the average area percentage of said internal oxide in the visual field of 10 μm2 of said steel region.
Owner:KOBE STEEL LTD

Method of producing porous glass-particle-deposited body and burner for synthesizing glass particles

InactiveUS20040182114A1Efficiency of the deposition of the glass particles on the surface of the starting member isImprove efficiencyGlass shaping apparatusGlass deposition burnersCombustorGlass particle
A method of producing a porous glass-particle-deposited body by effectively depositing the glass particles synthesized by a burner for synthesizing glass particles on a starting member with increased bonding strength between the deposited glass particles and decreased possibility of developing cracks and other problems, and a burner to be used for the production method. In the method of producing the deposited body by depositing the glass particles synthesized by a burner on the surface of the starting member, the glass particle deposition surface has (a) a region that is hit by the center portion of the flame issuing from the burner and (b) another region that has a temperature higher than that of the region hit by the center portion of the flame and that is located at the outside of the region hit by the center portion of the flame.
Owner:SUMITOMO ELECTRIC IND LTD

Bonding method

A bonding layer 3 is formed over a piezoelectric material substrate, and the bonding layer 3 is made of or more material selected from the group consisting of silicon nitride, aluminum nitride, alumina, tantalum pentoxide, mullite, niobium pentoxide and titanium oxide. Neutralized beam A is irradiated onto a surface 4 of the bonding layer and a surface of a supporting body to activate the surface of the bonding layer and the surface of the supporting body. The surface of the bonding layer and the surface of the supporting body are bonded by direct bonding.
Owner:NGK INSULATORS LTD

Light emitting diode package with improved optical lens structure

An LED package includes a substrate, two electrodes, an LED die and a lens. The substrate includes a top surface, a bottom surface, a plurality of side surfaces interconnecting the top surface with the bottom surface, and two opposite notches depressed downward from lateral peripheral portions of the top surface. The two electrodes penetrate through the substrate, and each of the two electrodes is exposed at both the top surface and the bottom surface of the substrate. The LED die is arranged on the substrate and electrically connected to the two electrodes. The lens is arranged on the substrate and covers the LED die. The lens includes a contacting surface adjoining the top surface of the substrate, and two protrusions extending from lateral peripheral portions of the contacting surface and respectively embedded in the two notches.
Owner:ADVANCED OPTOELECTRONICS TECH

Method for manufacturing sealed battery and sealed battery manufactured thereby

A method for manufacturing a sealed battery according to one embodiment of this invention includes a first step of using an outer can 15 having an opening, and a sealing plate 16 having a flange provided with a groove 22 around or on a part of a fitting face of the sealing plate 16 with the outer can 15, and inserting the sealing plate 16 into the opening of the outer can 15 so that a top face of the outer can 15 is approximately flush with a top face of the flange of the sealing plate 16, and a second step of welding together the outer can 15 and the sealing plate 16 by radiating a high energy ray to the fitting portion therebetween. The invention thus makes it possible to provide a method for manufacturing a sealed battery in which a weld formed by welding a sealing plate fitted into an opening of an outer can of a battery with a laser or other high energy rays has a large breaking strength, and a sealed battery manufactured thereby.
Owner:SANYO ELECTRIC CO LTD
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