The invention discloses a high-bonding-strength dual-waveband
ultraviolet curing hot-melt pressure-sensitive
adhesive tape capable of being reworked. The high-bonding-strength dual-waveband
ultraviolet curing hot-melt pressure-sensitive
adhesive tape sequentially comprises a conductive base material layer, a dual-waveband
UV curing pressure-sensitive
adhesive layer and a release layer from bottom to top, the dual-waveband
UV curing pressure-sensitive adhesive layer is prepared from the following raw materials in parts by weight: 50 to 100 parts of
ultraviolet curing
acrylate hot-melt pressure-sensitive adhesive, 30 to 80 parts of cationic
light curing resin, 0.2 to 5 parts of
coupling agent, 0.5 to 5 parts of ultraviolet curing cationic initiator, 5 to 15 parts of tackifying resin and 2 to 15 parts of electric repair additive; after the adhesive tape is formed, an adhesive layer has certain cohesive force and
pressure sensitivity, and room-temperature operation is convenient and fast; before the pressure-sensitive adhesive tape is applied and used, the adhesive surface is activated and cured by 254mm
wave band UV cations, and the cation light-cured
epoxy resin in the adhesive layer is subjected to cross-linking reaction, so that the
bonding strength of the pressure-sensitive adhesive tape is further improved; when repair is needed,
direct current is connected, the
bonding strength can be remarkably reduced, and easy repair is achieved.