Ribbon bonding tool and process

Abstract

An ultrasonic bond is formed using a bond tool foot having a waffle shape of thin protrusions and gaps between the protrusions. The tool is brought in contact with the ribbon to a depth to create depressions in a ribbon approximately 150 μm or less from the underlying bonding surface. The tool is then brought down further into the ribbon to contact the portions of the ribbon between the depressions, such as an additional 25 to 50 μm. The result is lightly bonded regions underneath the groove portions and highly bonded regions underneath the protrusions and around the perimeter of the bond. In another embodiment, an ultrasonic bond is formed along a partial width of a ribbon.

Description

BACKGROUND [0001] 1. Field of the Invention [0002] The present invention relates to bonding of semiconductor devices, and in particular, to tools and processes for ultrasonic ribbon bonding. [0003] 2. Related Art [0004] In the manufacture of semiconductor devices, active elements in a semiconductor device, such as drain and / or source regions in a semiconductor die, are electrically connected to other devices or electronic components, such as on a printed circuit board. Typically, the connection is made by bonding, e.g., ultrasonically bonding, a conductive wire between the two portions. The wire can be made from gold, aluminum, or copper, with typical diameters from 12 μm to 500 μm. Examples of electrical connections which can be made using wire bonding techniques include connections between the contact surfaces of discrete or integrated chips and the contact leads of their packages, and, in the case of hybrid circuits, the connections between inserted monolithic elements and the fi...

AI Technical Summary

Benefits of technology

[0015] According to one aspect of the present invention, a method for ultrasonic bonding includes first applying bond force and ultrasonic vibration to the ribbon (or wire) only to specific areas of the ribbon to quickly deform and create bonded spots at those depressed areas. The bonding then continues by pushing or driving the tool further into the ribbon such that

Problems solved by technology

However, for the round wire's geometry, the surface extension is much more extensive with limited bond parameters (e.g., force and power) than for bonding rectangular ribbon.

This failure mode transition may occur because under thermal or power cycling the bond interface degrades quicker than

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