10 results about "Ultrasonic bonding" patented technology

This invention provides an ultrasonic bonding apparatus that can improve the quality of bonding multiple workpieces by reducing the probability of slippage between chips and workpieces, and between workpieces. [Solution] The amplitude Q is the initial amplitude Q int An amplitude instruction Q that maintains this value. cmd Accordingly, the excitation operation of the ultrasonic composite vibration element 10 is controlled. At this time, the pressure P is set to the initial pressure P int From final pressure P end The translational motion of the ultrasonic bonding tip 40 is controlled to intermittently or continuously decrease the amplitude Q to the initial amplitude Q. int An amplitude instruction Q that reduces the value from to 0. cmd Accordingly, the excitation operation of the ultrasonic composite vibration element 10 is controlled. At this time, the pressure P is set to the final pressure P end The translational movement of the ultrasonic bonding tip 40 is controlled to decrease from 0 to 0.

This invention discloses a method, substrate, and system for detecting laser beam-induced current in the PN junction region profile of an InGaAs photodetector, belonging to the field of semiconductor optoelectronic device characterization technology. The method includes: cleaving a chip with completed front-side processing along the natural cleavage surface of InP to obtain a smooth profile; fixing the chip with the profile facing upwards onto a composite sapphire bonding substrate, and extracting electrodes through conductive silver paste and ultrasonic bonding; performing a two-dimensional step-scan of the profile using a 900-1100nm laser, simultaneously acquiring photocurrent signals to obtain a two-dimensional photocurrent distribution map of the profile; and quantitatively extracting junction depth, lateral diffusion width, and uniformity parameters based on the photocurrent peak position. This invention can directly obtain the longitudinal two-dimensional electrical activity distribution of the PN junction region, effectively avoiding interference between the surface passivation layer and the InP cap layer, and achieving a visual assessment of junction depth, lateral diffusion, and defects, providing a realistic and efficient detection method for device process optimization.

The application provides a dust-free paper multilayer composite production device based on ultrasonic bonding, and relates to the technical field of dust-free paper production. The device comprises a rack and a top plate. The top plate is arranged above the rack, and a supporting plate is arranged below the top plate. Sliding rods are elastically and slidably arranged on both sides of the supporting plate, and the two groups of sliding rods are staggered and lifted. A bottom plate is arranged below the inner side of the rack, and a pressure maintaining plate is arranged on the bottom plate. The two groups of sliding rods are staggered and lifted, thereby driving the pressure seats on the two groups of pressure maintaining plates and the ultrasonic composite assembly to be synchronously and staggeredly lifted. The multilayer dust-free paper in the paper passing groove is continuously subjected to ultrasonic bonding operation. Thanks to the staggered pressing structure, the surface of the multilayer dust-free paper can be subjected to ultrasonic bonding at least twice during the conveying process, thereby effectively eliminating the pressing blind area caused by the traditional single-group pressing method, significantly improving the composite compactness of the multilayer dust-free paper, and enhancing the structural stability and use reliability of the product.

The application provides a kind of bundle pocket automatic production flow line and production method, including successively arranged cloth feeding device, ultrasonic bonding device, cloth punching device, cloth edge folding device, first sewing device, cloth storage rack device, cloth cutting device, cloth positioning device, cloth transfer device and second sewing device;The upper between cloth feeding device and ultrasonic bonding device is successively provided with trademark tape feeding device, roll folding adhesive cutting device and transfer rotating device;The lower of cloth positioning device is provided with cloth folding device;The opposite side of cloth punching device is provided with pad printing marking device, first color mark sensor is arranged between cloth punching device and cloth edge folding device, second color mark sensor is arranged between cloth storage rack device and cloth cutting device.The advantages of the application: a large amount of human resources can be saved, thereby reducing production cost, while the speed of automatic production is fast, and the production efficiency can be effectively improved.

This invention provides an ultrasonic bonding apparatus that reduces the probability of slippage between chips and workpieces, and between workpieces, thereby improving the quality of bonding. [Solution] The excitation operation of the ultrasonic composite element is controlled according to an amplitude instruction Qcmd that maintains the amplitude Q at an initial amplitude Qint = 0th designated amplitude Q0, while the translational operation of the ultrasonic bonding tip is controlled so that the translational speed V decreases while maintaining the translational speed V at the ith designated speed Vi (0≦i≦n) from the 0th designated speed V0 to the nth designated speed Vn (n=1). The excitation operation of the ultrasonic composite element is controlled according to an amplitude instruction Qcmd that maintains the amplitude Q at an initial amplitude Qint = 0th designated amplitude Q0, while the translational operation of the ultrasonic bonding tip is controlled so that the translational speed V increases while maintaining the translational speed V at the jth designated speed Vi (n≦i≦m) from the nth designated speed Vn to the mth designated speed Vm (m=2) as the final speed Pend.

An ultrasonic bonding device includes a bonding head movable and / or positionable in a movement axis and rotatable and / or positionable about a rotational axis. The bonding head has a tool for ultrasonically bonding a bonding wire and a transducer module for exciting the tool to produce ultrasonic vibrations. The ultrasonic bonding device further includes: a stationary wire supply for the bonding wire; an elongated wire feed that is cylindrical in cross-section; a first wire guiding module having an inlet and outlet opening for the bonding wire, and being associated with the tool such that bonding wire emerging from the outlet opening is guided under the tool; and a second wire guiding module having an elongated guide channel for the bonding wire, the second guide channel having an inlet and outlet opening, the second wire guiding module being provided between the wire feed and the first wire guiding module.

This invention provides a method for temporarily fastening a wire harness assembly to improve the efficiency of wire harness routing work when attaching the wire harness assembly to the back door of a vehicle. [Solution] A method for temporarily fixing a wire harness assembly 20 to an inner panel 11c that constitutes the back door 10 of a vehicle 1, the assembly 21 having a wire harness 24 and two laminated members made of synthetic resin, each laminated while sandwiching a portion of the electric wires 25 of the wire harness 24, wherein the assembly 21 is placed on the surface of the inner panel 11c before routing the electric wires 25 exposed from the assembly 21 to the back door 10, and a portion of the assembly 21 is welded to the inner panel 11c by ultrasonic bonding to hold the assembly 21 to the inner panel 11c.

The application provides an ultrasonic bonding mechanism and a bonding machine. The ultrasonic bonding mechanism comprises a transducer, a variable amplitude rod, a bonding tool and a holding assembly. The variable amplitude rod is arranged along a first axis, the first end of the variable amplitude rod is connected with the transducer, and the second end of the variable amplitude rod is provided with a first through hole penetrating through the variable amplitude rod along a second axis. The holding assembly is fixedly connected with the variable amplitude rod, the holding assembly is provided with a locking groove opposite to the first through hole, the bonding tool is arranged along the second axis, the first end of the bonding tool is locked in the locking groove after penetrating through the first through hole, and the second end of the bonding tool is a bonding end. The ultrasonic bonding mechanism of the application can complete the installation of the bonding tool by sequentially inserting the bonding tool into the first through hole and the locking groove, and does not need to install the bonding tool through a special installation tool, thereby reducing the installation and debugging workload, and in the bonding process, the torque of the end of the transducer can be reduced by applying a static load to the holding assembly, and the bonding effect is improved.

This invention belongs to the field of wire bonding technology and discloses a bonding method and application of copper-based bonding wires. The bonding method includes the following steps: depositing a composite metal interlayer at the bonding location on the chip; contacting the bonding end of the copper-based bonding wire with the composite metal interlayer and performing ultrasonic bonding to complete the bonding of the copper-based bonding wire; wherein, in the ultrasonic bonding step, three sets of ultrasonic power and bonding pressure are applied sequentially, satisfying the following conditions: second ultrasonic power > third ultrasonic power > first ultrasonic power, and second bonding pressure ≥ third bonding pressure > first ultrasonic power. This invention effectively overcomes the technical bottlenecks of easy chip damage and easy formation of brittle intermetallic compounds at the bonding interface when copper-based bonding wires are applied to IGBT chips, through the synergistic effect of the composite metal interlayer and the multi-stage gradient ultrasonic bonding process. It achieves a high-strength, non-destructive connection between the copper-based bonding wire and the chip pad, significantly improving the long-term reliability and stability of the bonding interface.

The application discloses a kind of orthogonal ultrasonic precision bonding structures and methods for chip bump under different phase difference, the structure includes orthogonal ultrasonic vibration generation module, it is fixedly installed in the pressure head station of chip bonding equipment just above, inside is equipped with the orthogonal arrangement X axis and Y axis ultrasonic transducer, phase difference precision control unit, amplitude independent adjusting unit and vibration coupling head of conduction.The application is by X-Y double-axis independent controllable ultrasonic vibration, accurately controls double-axis vibration phase difference, and the adjusting range is 0°-90°, wherein 90° is formed elliptical trajectory to realize the uniform shear of bump interface global.Compared with traditional one-way ultrasonic bonding, the application can reduce the standard deviation of equivalent stress distribution by 40%, improve the uniformity of bump height change by 35%, increase the interface contact area by 25%, and increase the shear strength by more than 20%.It can be adapted to 20-100 μm diameter bump, and is suitable for high-density fine-pitch chip thermal ultrasonic bonding process.