181 results about "Ultrasonic bonding" patented technology

The invention belongs to the technical field of bonding chopper and preparation thereof, and particularly relates to a ceramic chopper, a preparation method thereof and application of the ceramic chopper in thermal ultrasonic bonding packaging of a semiconductor integrated circuit. The ceramic chopper provided by the invention is prepared by taking aluminum oxide as a matrix and matching silicon carbide nanofiber, magnesium oxide and yttrium oxide in a certain proportion through ball milling, granulation, molding and high-temperature sintering processes, has the broadband ultrasonic transmission capability of 20-135kHz, and has the maximum amplitude of 3.8 mu m. Experiments show that the chopper can shorten the bonding time by 25%, increase the qualified rate to 99%, increase the shear strength by 20%, and significantly improve the bonding efficiency and reliability. The ceramic chopper disclosed by the invention can well meet the requirements of thermal ultrasonic bonding packaging of a semiconductor integrated circuit on high energy efficiency and high precision bonding, and has a wide industrial application prospect.

The utility model discloses an environment-friendly paper cup ultrasonic bonding device which comprises a working table, an electric sliding rail is installed above the working table, a sliding block is installed above the electric sliding rail, a supporting block is fixed above the sliding block, a forming cylinder is fixed to one side of the supporting block, a supporting frame is fixed to one side above the working table, and the supporting frame is fixed to the other side above the working table. A hydraulic cylinder is installed above the supporting frame, and a hydraulic rod is installed below the hydraulic cylinder. According to the ultrasonic bonding device for the environment-friendly paper cups, through cooperative use of a hydraulic cylinder, a hydraulic rod, a telescopic rod, a spring and a machine head, during production and processing of the device, the machine head is driven by the hydraulic cylinder to descend, so that the environment-friendly paper cups can be bonded, and meanwhile in the bonding process, after the machine head makes contact with the surfaces of paper cup raw materials, the paper cup raw materials are bonded; and by arranging the springs and the telescopic rods, a certain buffering effect can be achieved, paper cup raw materials are prevented from being damaged due to the fact that direct contact impact force is too large, and the yield of environment-friendly paper cup production and processing is effectively improved.

A device for heating and determining the actual temperature of a bonding tool of an ultrasonic bonder, comprising the bending tool, which has a first end face, a second end face, a lateral surface, which connects the first end face to the second end face, and an absorption region, comprising a temperature measuring unit for determining an actual temperature of the bonding tool at a temperature measuring point, which is provided on the lateral surface of the bonding tool and preferably at a tip of the bonding tool, and comprising a laser generator, a laser beam being provided with the aid of the laser generator, and the laser beam striking the bonding tool in the absorption region, and the bonding tool being heated as a result of the absorption of the laser beam.

An ultrasonic bonding method for electrical contacting a plurality of battery cells of a battery block. A first connection point is produced in that a bonding tool is heated directly, and a first connection contact surface of a first battery cell and / or a connection conductor is / are heated locally and indirectly by a laser beam directed toward the bonding tool. The connection conductor is pressed against the first connection contact surface of the first battery cell. The bonding tool is excited to vibrate ultrasonically, the ultrasonic vibrations being transferred from the bonding tool to the connection conductor. A second connection point is produced in that the connection conductor is pressed against a second connection contact surface of a second battery cell of the battery block or a common connection contact of the battery block by the bonding tool and excited to vibrate ultrasonically.

The invention relates to an ultrasonic bonding process and a bonding process reliability evaluation method, and belongs to the technical field of semiconductor device packaging. The invention relates to an ultrasonic bonding process, which comprises the following steps of: 1, before bonding, carrying out plasma cleaning on a metal ceramic shell to remove surface contamination and an oxide layer; step 2, enabling the aluminum wire to penetrate into a chopper of a bonding machine, enabling the aluminum wire to be in contact with the surface of the gold-plated layer at the bonding pressure of 250cN-280cN by adopting the chopper, and enabling the aluminum wire to be in contact with the surface gold-plated layer of the bonding area in a low-pressure mode; and step 3, the bonding machine applies ultrasonic power of 10.5-12.3 W for 400-500 ms, the aluminum wire begins to rub and destroy the gold-plated layer on the surface of the bonding area under the action of the ultrasonic power, and after the gold-plated layer is destroyed, the aluminum wire penetrates through the gold-plated layer and forms an atomic-scale mutual diffusion interface with the nickel-plated layer. Reliable combination of gold, aluminum and nickel is achieved, meanwhile, a reliability evaluation method is provided, and therefore it is guaranteed that devices, circuits and the like adopting the ultrasonic bonding technology work reliably in the life cycle.

The invention provides self-adaptive pressurizing ultrasonic bonding strengthening equipment for a curved surface component and a bonding process. Comprising a horizontal linear motor, two moving mechanisms are slidably connected to the horizontal linear motor, each moving mechanism comprises two rotors and a connecting disc, the connecting discs are rotatably connected with the rotors through connecting arms, and a plurality of suckers are arranged at the lower ends of the connecting discs. A plurality of upper displacement sliding rails which are transversely distributed are arranged on the two sides of the horizontal linear motor and connected with an upper displacement sliding block which is driven by an upper displacement motor to slide, an upper vertical telescopic motor is downwards arranged on the upper displacement sliding block, and an ultrasonic vibrator is arranged at the lower end of the upper displacement sliding block. A lower displacement sliding rail is arranged below the upper displacement sliding rail and connected with a lower displacement sliding block driven by a lower displacement motor to slide, and the lower displacement sliding block is upwards provided with a lower vertical telescopic motor. The lower end of the ultrasonic vibrator and the upper end of the lower vertical telescopic motor are connected with a pressurizing module which is provided with a plurality of piston holes, and pressurizing shafts capable of extending out are arranged in the piston holes. The ultrasonic pressurizing device can adapt to curvature changes of curved surface parts, and uniform ultrasonic pressurizing is achieved.

The invention relates to the technical field of ultrasonic bonding, in particular to an ultrasonic adjusting method of a bonding system, which comprises the following steps of: acquiring voltage and displacement waveforms, analyzing a power trend, shielding a main window if a rising proportion is high and displacement exceeds a limit, extracting a maximum displacement point frequency to divide a standby window, and generating standby configuration by combining an impedance library. And monitoring peak time difference fluctuation and offset, calling configuration and matching a displacement time sequence generation instruction, monitoring displacement stability to be matched with pressure, setting a standby window as a main window if the condition is met, and generating a reconstruction mark. According to the method, the driving voltage and the transducer displacement waveform are continuously monitored, the power trend and the displacement fluctuation are analyzed in real time, the peak time difference fluctuation is synchronously monitored, the abnormal working conditions are screened to trigger the driving strategy switching, and the main frequency band is reconstructed according to the steady-state displacement characteristics. Pseudo soldering and material damage are avoided, the vibration energy utilization rate is improved, and the bonding pressure control precision and the connection strength are guaranteed.

The invention provides an ultrasonic compound vibration device which is formed by connecting a plurality of vibration elements and can improve the stability of the connection state. The first vibration element (11) and the intermediate vibration element (10) are coaxially connected at one specified connection site at the midsection of the ultrasonic compound vibration device (1), the specified connection site is included in a range of a phase angle of 0.05 [pi] or less with respect to an antinode A (M1) of a standing wave (M1) of the longitudinal vibration and a range of a phase angle of 0.22 [pi] or less with respect to a node N (M2) of a standing wave (M2) of the torsional vibration. Similarly, the intermediate vibration element (10) and the second vibration element (12) are coaxially connected by a mechanical connection mechanism at the other designated connection part.

An ultrasonic bonding device includes an anvil and a horn. The application surface has an application surface main body part, and an application surface end inclined part located at an end part of a side toward which an electric wire extends, and that is formed in a concave curved surface that separates from the mounting surface along an up-and-down direction toward an end. The mounting surface has a mounting surface main body part, and a mounting surface end inclined part located at an end part of a side toward which the electric wire extends and that faces the application surface end inclined part along the up-and-down direction, and that is formed in a convex curved surface that approaches the application surface side along the up-and-down direction toward an end.

This invention provides an ultrasonic bonding apparatus that can improve the quality of bonding multiple workpieces by reducing the probability of slippage between chips and workpieces, and between workpieces. [Solution] The amplitude Q is the initial amplitude Q int An amplitude instruction Q that maintains this value. cmd Accordingly, the excitation operation of the ultrasonic composite vibration element 10 is controlled. At this time, the pressure P is set to the initial pressure P int From final pressure P end The translational motion of the ultrasonic bonding tip 40 is controlled to intermittently or continuously decrease the amplitude Q to the initial amplitude Q. int An amplitude instruction Q that reduces the value from to 0. cmd Accordingly, the excitation operation of the ultrasonic composite vibration element 10 is controlled. At this time, the pressure P is set to the final pressure P end The translational movement of the ultrasonic bonding tip 40 is controlled to decrease from 0 to 0.

The invention provides a preparation method of a degradable spunlace non-woven fabric capable of being bonded through ultrasonic waves, and relates to the technical field of non-woven fabric preparation.The method comprises the steps that low-melting-point poly (butylene succinate) is taken to be evenly mixed with polyphosphate and tributyl citrate, and a material A is obtained; respectively melting and spinning the material A and high-melting-point polylactic acid by two screws of a double-component spinning machine to obtain sheath-core PLA / PBS composite fibers, drying the sheath-core PLA / PBS composite fibers, and shearing the sheath-core PLA / PBS composite fibers into sheath-core PLA / PBS composite short fibers; mixing the obtained composite short fibers with cellulosic fibers, forming a web by using a web forming machine to obtain a fiber web, treating the obtained fiber web by using a high-pressure spunlace machine to obtain a spunlace fiber web, and drying to obtain the degradable spunlace non-woven fabric. By adopting the skin-core PLA / PBS composite fibers and utilizing the characteristic of ultrasonic bonding of the skin-core PLA / PBS composite fibers, the cellulose fibers and the bio-based fibers can be effectively bonded together, and the novel non-woven fabric which is high in strength, low in labor cost and capable of being subjected to ultrasonic bonding is formed.

To securely join workpieces while suppressing structural complexity. [Solution] An ultrasonic bonding apparatus comprising a horn 1 and an anvil 2 that clamps a plurality of workpieces 3, 4 in a first direction, wherein the horn 1 vibrates in a second direction perpendicular to the first direction, and the anvil 2 comprises a support 10 and an oscillating body 11 that abuts against the workpiece 4 and is supported by the support 10 so as to be rotatable about a pivot axis 16 along a third direction perpendicular to the first and second directions, and vibrates at the same frequency as the horn 1 but with a different phase.

The present invention provides a system that can reduce the probability of cracking occurring in laminated metal foil when joining laminated metal foil and metal materials. [Solution] The laminated metal foil W1 is ultrasonically bonded using ultrasonic vibration, resulting in a recess T as an ultrasonic bonding mark. ij A recess T is formed in the designated area of ​​the laminated metal foil W1. Furthermore, the recess T of the laminated metal foil W1 is placed on top of the metal material W2. ij When laser light LB is irradiated onto the material, the laminated metal foil W1 and the metal material W2 are joined together.

The invention relates to a current collector and a battery. The current collector includes an insulating support layer, a conductive support layer, a first conductive layer, and a tab portion. The insulating support layer is configured from a resin composition having electrical insulating properties. The conductive support layer is adjacent to the insulating support layer. The first conductive layer is laminated on both the insulating support layer and the conductive support layer. The tab portion is arranged in parallel with the conductive support layer with the first conductive layer interposed therebetween, and is bonded to the first conductive layer by ultrasonic bonding.

To provide a method capable of manufacturing a battery terminal with improved strength reliability.SOLUTION: A method for manufacturing a battery terminal NS by joining a first member 26 made of a first metallic material and a second member 31 made of a second metallic material includes a crimping step of forming two crimping portions 28, 29 by crimping to fix the first member 26 and the second member 31 together, a heating step of heating the first member 26 and the second member 31 to a predetermined heating temperature after the crimping step, and an ultrasonic bonding step of ultrasonically bonding the interface between the first member 26 and the second member 31 at one of the crimping portions 28 of the first member 26 and the second member 31 heated to the heating temperature, thereby bonding the first member 26 and the second member 31 together.SELECTED DRAWING: Figure 8

The utility model provides an ultrasonic welding and bonding mechanism and a bag opening machine, and the ultrasonic welding and bonding mechanism comprises a fixed support, an ultrasonic welding and bonding mechanism and an ultrasonic welding and bonding mechanism, a sliding connection seat; the ultrasonic welding machine is fixed to the sliding connecting base and provided with a welding head which is arranged in the vertical direction and extends to the position below the sliding connecting base; the welding driving part is used for driving the sliding connecting seat to move up and down so as to enable the welding heads to be in contact with the cutting piece, and the welding driving part drives the sliding connecting seat to move downwards before bag opening processing so as to enable the welding heads to carry out welding and bonding treatment on the two sides of the preset bag opening position respectively so as to form bonding lines. During bag opening processing, a cutting piece is firstly transferred to an ultrasonic bonding mechanism, an ultrasonic welding machine is started to weld and bond the cutting piece, bonding lines are formed on the two sides of a preset bag opening position, and pre-fixation can be formed in the short edge direction of the bag opening in advance through the bonding lines, so that filler is prevented from leaking from the two ends of the bag opening, and normal processing is guaranteed; and the production applicability is improved.

The utility model discloses an edgefold bonding device for a raincoat making machine, which comprises a machine frame, an ultrasonic bonding device, a turning edgefold device and a cutting device are sequentially arranged on the machine frame, the ultrasonic bonding device comprises a fixed base and an ultrasonic generator located above the fixed base, and the cutting device is arranged on the fixed base. The ultrasonic generator is driven by an air cylinder to slide and abut against the fixed base to form ultrasonic bonding, the turnover edge folding device comprises two rotating discs arranged on the two sides of the rack correspondingly, a turnover swing arm is fixed between the two rotating discs, and the rotating discs can rotate to drive the turnover swing arm to turn over to the position above the fixed base to be attached. The cutting device comprises a lower fixed cutter and an upper fixed cutter located above the lower fixed cutter, and the upper fixed cutter is driven by an air cylinder to slide towards the lower fixed cutter to form cutting. According to the folding and bonding device, rapid folding and bonding of the bottom of the raincoat can be achieved, time and labor are saved, and the production efficiency is improved.

The present application relates to the field of high-precision manufacturing technology, and more particularly to an ultrasonic bonding process with ultrasonic energy and pressure synergistic coupling, comprising: presetting a bonding pressure target value and an ultrasonic power range based on the material matching of the lead; making the piezoelectric ceramic vibrate within the ultrasonic power range, transmitting the vibration to the wedge after amplification by the amplitude transformer; positioning the welding point coordinates according to the visual system, controlling the voice coil motor to drive the wedge to move to the target pad; measuring the bonding pressure applied value applied by the wedge in real time, and generating a driving force correction instruction for the piezoelectric ceramic according to the deviation between the bonding pressure applied value and the bonding pressure target value; executing the driving force correction instruction and generating a compensation displacement through the piezoelectric ceramic cooperating with the elastic amplification mechanism; in the moving and compensation process of the wedge, the magnetic rheological damper dynamically absorbs the kinetic impact energy until the bonding is completed. Through the present application, the problem of welding point microstructure defects caused by dynamic instability of the mechanical energy transmission link in the existing bonding technology is effectively solved.

The invention discloses an ultrasonic bonding machine for traceless pants and a bonding process. According to the ultrasonic bonding machine for the traceless trousers, the bonding rotary disc and the disc type wind leveling device are arranged, the disc type wind leveling device can conduct wind leveling treatment on outer-layer cloth on the bonding rotary disc, airflow generated by the disc type wind leveling device can completely cover the outer-layer cloth, the airflow can rotate, and the flow speed can change evenly; therefore, the outer-layer cloth on the bonding rotary table can be rapidly flattened in a stress-free mode, the laying efficiency of the outer-layer cloth is greatly improved, the problem of local wrinkles cannot occur, and the yield of later welding is improved. According to the ultrasonic bonding process for the traceless trousers, the outer-layer cloth is cut into a round shape, then the inner-layer cloth is cut into an annular shape, and the annular inner-layer cloth is integrally placed on the round outer-layer cloth, so that a plurality of semi-finished products of the traceless trousers can be bonded and cut through one-time spreading; according to the technology, the production efficiency of the traceless trousers is greatly improved.

To provide a device and the like capable enhancing estimation accuracy of bonded states of a plurality of workpieces.SOLUTION: On the basis of a plurality of pieces of learning data, a learning model is trained to learn a correlation between input data for the learning and bonded states of a plurality of workpieces. The input data for the learning includes partial spectrogram data, which is a part of a spectrogram of a vibration signal generated upon one time of bonding processing of a plurality of workpieces W1 and W2 using an ultrasonic bonding device, and which represents the partial spectrogram a range of which is identified by a time domain. Partial spectrogram data of when the workpieces W1 and W2 with unknown bonded states are bonded is input to the trained learning model as input data for estimation. This obtains an estimation result of the bonded states of the plurality of workpieces as an output from the trained learning model.SELECTED DRAWING: Figure 2

The invention belongs to the field of semiconductor integrated circuit packaging, and discloses a bare copper carrier thermal ultrasonic bonding and chip packaging method and a chip, an oxide layer of a bare copper carrier bonding area is ground and broken through a chopper to form a clean grinding bonding area, chip / pin interconnection is achieved through direct thermal ultrasonic bonding in the grinding bonding area, then silver glue is dispensed to wrap welding spots, then curing is conducted, and the chip / pin is packaged. And finally, chip-pin bonding is completed. The oxidation layer is physically broken through grinding, so that the problem of bare copper bonding oxidation is fundamentally solved, and a traditional plating process is omitted; silver colloid wrapping not only can isolate secondary oxidation of the welding spots, but also enhances the bonding interface of the molding compound, and secondary bonding after curing ensures that the silver colloid does not interfere with lead bonding. A precious metal coating and an anti-oxidation gas protection system are thoroughly eliminated, and the frame material and equipment modification cost is greatly reduced; the bonding reliability is guaranteed through oxide layer breaking, the welding spot oxidation resistance and the packaging structure binding force are synchronously improved through elargol wrapping, and the dual purposes of high-reliability packaging and remarkable cost reduction are achieved on a bare copper carrier as a whole.

Provided are an ultrasonic bonding chip capable of improving the quality of bonding between workpieces, and an ultrasonic bonding method and an ultrasonic bonding device using the ultrasonic bonding chip. In a direction perpendicular to the axial direction of a substantially cylindrical rod section 44, the ratio (D1 / d1) of an axial-direction length D1 of the rod section 44 to a maximum distance d1 (radius of the substantially circular cross-section) from the center of the cross-section having the maximum cross-sectional area to the peripheral edge of the cross-section is 30 or more. On the other hand, in a direction perpendicular to the axial direction of the substantially cylindrical rod section 44, the ratio (D1 / d1) of the axial-direction length D1 of the rod section 44 to the maximum distance d1 from the center of the cross-section having the maximum cross-sectional area to the peripheral edge of the cross-section is 120 or less.

A resin film according to the present invention includes a first surface that can be temporarily bonded to an adherend by ultrasonic bonding, wherein the first surface has an uneven structure on the surface thereof, and the uneven structure of the first surface has a bearing area ratio Smr(C), at C that satisfies the requirement of formula (1) below, of 2% to 8%.　C = Sdc (0.2%) - Spk - (Sk / 5) - 0.5 [μm] (1) (In formula (1), Sdc (0.2%) is the level height at a bearing area ratio of 0.2%, Spk is the height of a protruding peak, and Sk is a height of a core. Smr (C) is the bearing area ratio (%) when the level height is C.)

The joining structure is formed by ultrasonically joining conductors of a plurality of electric wires to each other. In the conductors, a conductor (5a) that is relatively difficult to deform and a conductor (5b) that is relatively easy to deform are mixed. That is, two or more types of electric wires comprising conductors made of different materials are mixed. When viewed from the axial direction of the electric wire, the arrangement of the conductors (5a, 5b) made of different materials is substantially linear symmetric with respect to the center line (A) in the width direction, where the ultrasonic bonding direction is the vertical direction of the conductor bonding portion and the direction orthogonal to the vertical direction is the width direction of the conductor bonding portion.

This invention discloses a method, substrate, and system for detecting laser beam-induced current in the PN junction region profile of an InGaAs photodetector, belonging to the field of semiconductor optoelectronic device characterization technology. The method includes: cleaving a chip with completed front-side processing along the natural cleavage surface of InP to obtain a smooth profile; fixing the chip with the profile facing upwards onto a composite sapphire bonding substrate, and extracting electrodes through conductive silver paste and ultrasonic bonding; performing a two-dimensional step-scan of the profile using a 900-1100nm laser, simultaneously acquiring photocurrent signals to obtain a two-dimensional photocurrent distribution map of the profile; and quantitatively extracting junction depth, lateral diffusion width, and uniformity parameters based on the photocurrent peak position. This invention can directly obtain the longitudinal two-dimensional electrical activity distribution of the PN junction region, effectively avoiding interference between the surface passivation layer and the InP cap layer, and achieving a visual assessment of junction depth, lateral diffusion, and defects, providing a realistic and efficient detection method for device process optimization.

An ultrasonic bonding device includes a bonding head movable and / or positionable in a movement axis and rotatable and / or positionable about a rotational axis. The bonding head has a tool for ultrasonically bonding a bonding wire and a transducer module for exciting the tool to produce ultrasonic vibrations. The ultrasonic bonding device further includes: a stationary wire supply for the bonding wire; an elongated wire feed that is cylindrical in cross-section; a first wire guiding module having an inlet and outlet opening for the bonding wire, and being associated with the tool such that bonding wire emerging from the outlet opening is guided under the tool; and a second wire guiding module having an elongated guide channel for the bonding wire, the second guide channel having an inlet and outlet opening, the second wire guiding module being provided between the wire feed and the first wire guiding module.

The present invention relates to a method for predicting the diffusion concentration of interface elements in ultrasonic bonding, which includes modifying the diffusion coefficient D value and the diffusion concentration C value in the atomic concentration distribution formula during the diffusion process of the ultrasonic Al-Au bonding interface diffusion couple according to the ultrasonic bonding process, and then establishing a quantitative correlation model between the atomic diffusion concentration, diffusion position at the ultrasonic Al-Au bonding interface and the ultrasonic bonding process condition parameters, so as to realize the prediction of the diffusion concentration of the bonding interface elements under the ultrasonic Al-Au bonding process parameter conditions; the correlation model of the present invention introduces ultrasonic bonding process parameters, which more accurately reflects the change law of atomic concentration during the ultrasonic bonding process, can accurately predict the distribution of atomic concentration during the ultrasonic bonding process, and uses the genetic algorithm to achieve the global optimal search of material parameters in ultrasonic bonding, thereby improving the accuracy of material parameters in the ultrasonic diffusion concentration prediction model of the ultrasonic bonding interface.

The application provides a dust-free paper multilayer composite production device based on ultrasonic bonding, and relates to the technical field of dust-free paper production. The device comprises a rack and a top plate. The top plate is arranged above the rack, and a supporting plate is arranged below the top plate. Sliding rods are elastically and slidably arranged on both sides of the supporting plate, and the two groups of sliding rods are staggered and lifted. A bottom plate is arranged below the inner side of the rack, and a pressure maintaining plate is arranged on the bottom plate. The two groups of sliding rods are staggered and lifted, thereby driving the pressure seats on the two groups of pressure maintaining plates and the ultrasonic composite assembly to be synchronously and staggeredly lifted. The multilayer dust-free paper in the paper passing groove is continuously subjected to ultrasonic bonding operation. Thanks to the staggered pressing structure, the surface of the multilayer dust-free paper can be subjected to ultrasonic bonding at least twice during the conveying process, thereby effectively eliminating the pressing blind area caused by the traditional single-group pressing method, significantly improving the composite compactness of the multilayer dust-free paper, and enhancing the structural stability and use reliability of the product.

An article includes a body and an ultrasonic bonded layer deposited on the body. The ultrasonic bonded layer includes a first layer of a first material. The first material includes a metal or metal alloy, The ultrasonic bonded layer further includes a second layer of a second material bonded to the first layer. The second material includes a metal matrix composite material.

The present disclosure provides a manufacturing method for a terminal (40) including a first conductive member (41) that is formed of a first metal and includes a concave part (41r) and a penetration hole (41h), a second conductive member (42) that is formed of a second metal and includes a part (42n) disposed in the concave part (41r), and an ultrasonic bonding part (45) where the first conductive member (41) and the second conductive member (42) are bonded to each other with ultrasonic waves in a periphery of the penetration hole (41h). This manufacturing method includes a disposing step of disposing a part of the second conductive member (42) in the concave part (41r) of the first conductive member (41), and a bonding step of bonding the periphery of the penetration hole (41h) of the first conductive member (41) to the second conductive member (42) with ultrasonic waves.