77 results about "Ultrasonic bonding" patented technology

The invention relates to an ultrasonic bonding process and a bonding process reliability evaluation method, and belongs to the technical field of semiconductor device packaging. The invention relates to an ultrasonic bonding process, which comprises the following steps of: 1, before bonding, carrying out plasma cleaning on a metal ceramic shell to remove surface contamination and an oxide layer; step 2, enabling the aluminum wire to penetrate into a chopper of a bonding machine, enabling the aluminum wire to be in contact with the surface of the gold-plated layer at the bonding pressure of 250cN-280cN by adopting the chopper, and enabling the aluminum wire to be in contact with the surface gold-plated layer of the bonding area in a low-pressure mode; and step 3, the bonding machine applies ultrasonic power of 10.5-12.3 W for 400-500 ms, the aluminum wire begins to rub and destroy the gold-plated layer on the surface of the bonding area under the action of the ultrasonic power, and after the gold-plated layer is destroyed, the aluminum wire penetrates through the gold-plated layer and forms an atomic-scale mutual diffusion interface with the nickel-plated layer. Reliable combination of gold, aluminum and nickel is achieved, meanwhile, a reliability evaluation method is provided, and therefore it is guaranteed that devices, circuits and the like adopting the ultrasonic bonding technology work reliably in the life cycle.

The invention provides self-adaptive pressurizing ultrasonic bonding strengthening equipment for a curved surface component and a bonding process. Comprising a horizontal linear motor, two moving mechanisms are slidably connected to the horizontal linear motor, each moving mechanism comprises two rotors and a connecting disc, the connecting discs are rotatably connected with the rotors through connecting arms, and a plurality of suckers are arranged at the lower ends of the connecting discs. A plurality of upper displacement sliding rails which are transversely distributed are arranged on the two sides of the horizontal linear motor and connected with an upper displacement sliding block which is driven by an upper displacement motor to slide, an upper vertical telescopic motor is downwards arranged on the upper displacement sliding block, and an ultrasonic vibrator is arranged at the lower end of the upper displacement sliding block. A lower displacement sliding rail is arranged below the upper displacement sliding rail and connected with a lower displacement sliding block driven by a lower displacement motor to slide, and the lower displacement sliding block is upwards provided with a lower vertical telescopic motor. The lower end of the ultrasonic vibrator and the upper end of the lower vertical telescopic motor are connected with a pressurizing module which is provided with a plurality of piston holes, and pressurizing shafts capable of extending out are arranged in the piston holes. The ultrasonic pressurizing device can adapt to curvature changes of curved surface parts, and uniform ultrasonic pressurizing is achieved.

The invention relates to the technical field of ultrasonic bonding, in particular to an ultrasonic adjusting method of a bonding system, which comprises the following steps of: acquiring voltage and displacement waveforms, analyzing a power trend, shielding a main window if a rising proportion is high and displacement exceeds a limit, extracting a maximum displacement point frequency to divide a standby window, and generating standby configuration by combining an impedance library. And monitoring peak time difference fluctuation and offset, calling configuration and matching a displacement time sequence generation instruction, monitoring displacement stability to be matched with pressure, setting a standby window as a main window if the condition is met, and generating a reconstruction mark. According to the method, the driving voltage and the transducer displacement waveform are continuously monitored, the power trend and the displacement fluctuation are analyzed in real time, the peak time difference fluctuation is synchronously monitored, the abnormal working conditions are screened to trigger the driving strategy switching, and the main frequency band is reconstructed according to the steady-state displacement characteristics. Pseudo soldering and material damage are avoided, the vibration energy utilization rate is improved, and the bonding pressure control precision and the connection strength are guaranteed.

An ultrasonic bonding device includes an anvil and a horn. The application surface has an application surface main body part, and an application surface end inclined part located at an end part of a side toward which an electric wire extends, and that is formed in a concave curved surface that separates from the mounting surface along an up-and-down direction toward an end. The mounting surface has a mounting surface main body part, and a mounting surface end inclined part located at an end part of a side toward which the electric wire extends and that faces the application surface end inclined part along the up-and-down direction, and that is formed in a convex curved surface that approaches the application surface side along the up-and-down direction toward an end.

This invention provides an ultrasonic bonding apparatus that can improve the quality of bonding multiple workpieces by reducing the probability of slippage between chips and workpieces, and between workpieces. [Solution] The amplitude Q is the initial amplitude Q int An amplitude instruction Q that maintains this value. cmd Accordingly, the excitation operation of the ultrasonic composite vibration element 10 is controlled. At this time, the pressure P is set to the initial pressure P int From final pressure P end The translational motion of the ultrasonic bonding tip 40 is controlled to intermittently or continuously decrease the amplitude Q to the initial amplitude Q. int An amplitude instruction Q that reduces the value from to 0. cmd Accordingly, the excitation operation of the ultrasonic composite vibration element 10 is controlled. At this time, the pressure P is set to the final pressure P end The translational movement of the ultrasonic bonding tip 40 is controlled to decrease from 0 to 0.

To securely join workpieces while suppressing structural complexity. [Solution] An ultrasonic bonding apparatus comprising a horn 1 and an anvil 2 that clamps a plurality of workpieces 3, 4 in a first direction, wherein the horn 1 vibrates in a second direction perpendicular to the first direction, and the anvil 2 comprises a support 10 and an oscillating body 11 that abuts against the workpiece 4 and is supported by the support 10 so as to be rotatable about a pivot axis 16 along a third direction perpendicular to the first and second directions, and vibrates at the same frequency as the horn 1 but with a different phase.

The present invention provides a system that can reduce the probability of cracking occurring in laminated metal foil when joining laminated metal foil and metal materials. [Solution] The laminated metal foil W1 is ultrasonically bonded using ultrasonic vibration, resulting in a recess T as an ultrasonic bonding mark. ij A recess T is formed in the designated area of ​​the laminated metal foil W1. Furthermore, the recess T of the laminated metal foil W1 is placed on top of the metal material W2. ij When laser light LB is irradiated onto the material, the laminated metal foil W1 and the metal material W2 are joined together.

The invention relates to a current collector and a battery. The current collector includes an insulating support layer, a conductive support layer, a first conductive layer, and a tab portion. The insulating support layer is configured from a resin composition having electrical insulating properties. The conductive support layer is adjacent to the insulating support layer. The first conductive layer is laminated on both the insulating support layer and the conductive support layer. The tab portion is arranged in parallel with the conductive support layer with the first conductive layer interposed therebetween, and is bonded to the first conductive layer by ultrasonic bonding.

The utility model provides an ultrasonic welding and bonding mechanism and a bag opening machine, and the ultrasonic welding and bonding mechanism comprises a fixed support, an ultrasonic welding and bonding mechanism and an ultrasonic welding and bonding mechanism, a sliding connection seat; the ultrasonic welding machine is fixed to the sliding connecting base and provided with a welding head which is arranged in the vertical direction and extends to the position below the sliding connecting base; the welding driving part is used for driving the sliding connecting seat to move up and down so as to enable the welding heads to be in contact with the cutting piece, and the welding driving part drives the sliding connecting seat to move downwards before bag opening processing so as to enable the welding heads to carry out welding and bonding treatment on the two sides of the preset bag opening position respectively so as to form bonding lines. During bag opening processing, a cutting piece is firstly transferred to an ultrasonic bonding mechanism, an ultrasonic welding machine is started to weld and bond the cutting piece, bonding lines are formed on the two sides of a preset bag opening position, and pre-fixation can be formed in the short edge direction of the bag opening in advance through the bonding lines, so that filler is prevented from leaking from the two ends of the bag opening, and normal processing is guaranteed; and the production applicability is improved.

The utility model discloses an edgefold bonding device for a raincoat making machine, which comprises a machine frame, an ultrasonic bonding device, a turning edgefold device and a cutting device are sequentially arranged on the machine frame, the ultrasonic bonding device comprises a fixed base and an ultrasonic generator located above the fixed base, and the cutting device is arranged on the fixed base. The ultrasonic generator is driven by an air cylinder to slide and abut against the fixed base to form ultrasonic bonding, the turnover edge folding device comprises two rotating discs arranged on the two sides of the rack correspondingly, a turnover swing arm is fixed between the two rotating discs, and the rotating discs can rotate to drive the turnover swing arm to turn over to the position above the fixed base to be attached. The cutting device comprises a lower fixed cutter and an upper fixed cutter located above the lower fixed cutter, and the upper fixed cutter is driven by an air cylinder to slide towards the lower fixed cutter to form cutting. According to the folding and bonding device, rapid folding and bonding of the bottom of the raincoat can be achieved, time and labor are saved, and the production efficiency is improved.

The present application relates to the field of high-precision manufacturing technology, and more particularly to an ultrasonic bonding process with ultrasonic energy and pressure synergistic coupling, comprising: presetting a bonding pressure target value and an ultrasonic power range based on the material matching of the lead; making the piezoelectric ceramic vibrate within the ultrasonic power range, transmitting the vibration to the wedge after amplification by the amplitude transformer; positioning the welding point coordinates according to the visual system, controlling the voice coil motor to drive the wedge to move to the target pad; measuring the bonding pressure applied value applied by the wedge in real time, and generating a driving force correction instruction for the piezoelectric ceramic according to the deviation between the bonding pressure applied value and the bonding pressure target value; executing the driving force correction instruction and generating a compensation displacement through the piezoelectric ceramic cooperating with the elastic amplification mechanism; in the moving and compensation process of the wedge, the magnetic rheological damper dynamically absorbs the kinetic impact energy until the bonding is completed. Through the present application, the problem of welding point microstructure defects caused by dynamic instability of the mechanical energy transmission link in the existing bonding technology is effectively solved.

A resin film according to the present invention includes a first surface that can be temporarily bonded to an adherend by ultrasonic bonding, wherein the first surface has an uneven structure on the surface thereof, and the uneven structure of the first surface has a bearing area ratio Smr(C), at C that satisfies the requirement of formula (1) below, of 2% to 8%.　C = Sdc (0.2%) - Spk - (Sk / 5) - 0.5 [μm] (1) (In formula (1), Sdc (0.2%) is the level height at a bearing area ratio of 0.2%, Spk is the height of a protruding peak, and Sk is a height of a core. Smr (C) is the bearing area ratio (%) when the level height is C.)

This invention discloses a method, substrate, and system for detecting laser beam-induced current in the PN junction region profile of an InGaAs photodetector, belonging to the field of semiconductor optoelectronic device characterization technology. The method includes: cleaving a chip with completed front-side processing along the natural cleavage surface of InP to obtain a smooth profile; fixing the chip with the profile facing upwards onto a composite sapphire bonding substrate, and extracting electrodes through conductive silver paste and ultrasonic bonding; performing a two-dimensional step-scan of the profile using a 900-1100nm laser, simultaneously acquiring photocurrent signals to obtain a two-dimensional photocurrent distribution map of the profile; and quantitatively extracting junction depth, lateral diffusion width, and uniformity parameters based on the photocurrent peak position. This invention can directly obtain the longitudinal two-dimensional electrical activity distribution of the PN junction region, effectively avoiding interference between the surface passivation layer and the InP cap layer, and achieving a visual assessment of junction depth, lateral diffusion, and defects, providing a realistic and efficient detection method for device process optimization.

The application provides a dust-free paper multilayer composite production device based on ultrasonic bonding, and relates to the technical field of dust-free paper production. The device comprises a rack and a top plate. The top plate is arranged above the rack, and a supporting plate is arranged below the top plate. Sliding rods are elastically and slidably arranged on both sides of the supporting plate, and the two groups of sliding rods are staggered and lifted. A bottom plate is arranged below the inner side of the rack, and a pressure maintaining plate is arranged on the bottom plate. The two groups of sliding rods are staggered and lifted, thereby driving the pressure seats on the two groups of pressure maintaining plates and the ultrasonic composite assembly to be synchronously and staggeredly lifted. The multilayer dust-free paper in the paper passing groove is continuously subjected to ultrasonic bonding operation. Thanks to the staggered pressing structure, the surface of the multilayer dust-free paper can be subjected to ultrasonic bonding at least twice during the conveying process, thereby effectively eliminating the pressing blind area caused by the traditional single-group pressing method, significantly improving the composite compactness of the multilayer dust-free paper, and enhancing the structural stability and use reliability of the product.

An article includes a body and an ultrasonic bonded layer deposited on the body. The ultrasonic bonded layer includes a first layer of a first material. The first material includes a metal or metal alloy, The ultrasonic bonded layer further includes a second layer of a second material bonded to the first layer. The second material includes a metal matrix composite material.

To provide an electric wire with a terminal in which bonding strength between the terminal and a core wire of the electric wire is improved by increasing an area where the core wire of the electric wire is in contact with the terminal, and to provide a bonding method thereof.SOLUTION: The wire with terminal 10 includes the wire 11 including the core 21 and the insulator covering portion 22 for covering the core 21 with a part of the core 21 exposed, and the terminal 12 including the wire connecting portion 32 to which the core 21 of the wire 11 is joined. A recessed serration 40 extending along the width direction of the terminal 12 is formed on the conductor bonding surface 35 of the wire connection portion 32, and the core wire 21 and the terminal 12 are bonded by ultrasonic bonding in a state where the core wire 21 is in contact with the serration 40. In the core wire 21, the joining mark 90 with which the convex portion 80 of the horn 61 of the ultrasonic joining machine has been in contact is formed on the side opposite to the side joined to the terminal 12, and the center of the serration 40 and the center of the joining mark 90 are arranged so as to be aligned on a straight line parallel to the height direction of the core wire 21.SELECTED DRAWING: Figure 1

A horn tip that can be easily and reliably attached to an ultrasonic bonding device and stably operates during bonding is provided. A horn tip 6 includes a bottom plate part 6a and a bonding part 6b, the bottom plate part 6a being provided with a plurality of through-holes 61 and 62 for attachment to an ultrasonic LT horn 4, the bonding part 6b protruding vertically from the bottom plate part 6a. A ratio h / w of a length h of the bonding part 6b from an upper surface side of the bottom plate part 6a to a thickness w of the bonding part 6b is equal to or smaller than 1.5.

An all-dimensional ultrasonic seam pressing machine relates to the technical field of sewing machines and structurally comprises a rack, a seam pressing machine head, a machine head fixing seat and an ultrasonic seam pressing mechanism, a table top is arranged at the top of the rack, the seam pressing machine head is mounted above the table top through the machine head fixing seat, the ultrasonic seam pressing mechanism is mounted below the table top, and the ultrasonic seam pressing mechanism is arranged below the table top. The ultrasonic seam pressing mechanism comprises an ultrasonic bonding pad, a bonding pad mounting seat, an amplitude-change pole, a rotating shaft body and an ultrasonic transducer which are arranged from top to bottom, and the rotating shaft body is used for driving other parts of the ultrasonic seam pressing mechanism located above the rotating shaft body to rotate in the horizontal direction. By improving the rotating shaft structure of the ultrasonic seam pressing mechanism, the function of processing cloth in the horizontal direction without dead angles is achieved, the direction of the cloth does not need to be manually adjusted during cloth processing, only the direction of the ultrasonic seam pressing mechanism needs to be adjusted, and cloth processing is simpler, more convenient and faster.

The invention relates to the technical field of power semiconductor packaging, in particular to a low-stress interconnection structure for power chip packaging and a structure manufacturing method. Comprising a power chip which is provided with at least one large-current output end face; the lead-free solder layer is arranged on the large current output end face of the power chip; the copper-molybdenum-copper composite metal sheet is welded and fixed on the large-current output end face of the power chip through a lead-free solder layer and serves as a current export path; and one end of the ultrasonic bonding copper wire is welded and connected to the copper-molybdenum-copper composite metal sheet, and the other end of the ultrasonic bonding copper wire is connected to the large-current leading-out terminal of the packaging shell. According to the structure, on the basis that lead-free solder is adopted, thermal stress concentration can be remarkably reduced, and the thermal fatigue resistance of welding spots is improved, so that the welding firmness of the power chip and the substrate in an extreme temperature difference sudden change environment is realized, and the working reliability of equipment applying the power chip is improved.

The utility model relates to the technical field of paper container production, in particular to an automatic forming device for a coated paper container. Comprising a feeding part, a forming part, a detection part, a discharging part, a waste material part, a feeding groove, a paper suction module, a paper feeding module, a forming rail, a forming mold, a bending module, an ultrasonic bonding module, a feeding module, a steering module, a feeding rotary disc, a bottom sealing module, a bottom sealing feeding module, a folding module, a knurling module, a hemming module, a detection transfer module, a detection rail, a detection bracket and a detection electric eye. The automatic forming device for the coated paper containers has the beneficial effects that the paper containers are detected through the detection electric eye, then leakage detection is conducted on the paper containers through the air pressure sealing detection module, the paper containers are automatically classified after detection is completed, the detection efficiency is improved, the labor intensity of workers is reduced, and the labor intensity of workers is reduced. The finished paper containers are counted and stacked, and the production control and production efficiency of the paper containers are improved.

To provide an ultrasonic bonding chip capable of improving the quality of bonding of workpieces by ultrasonic composite vibration of a new form, and an ultrasonic bonding device using the same.SOLUTION: The ratio (E0 / E) of the Young modulus E0 (included in the range of 180-220 GPa) of a material constituting an adjustment member 400 to the Young modulus E (included in the range of 450-650 GPa) of a material constituting a first base portion 41 and a second base portion 42 of a horn chip 40, and a base portion constituted by the first base portion and the second base portion is included in the range of 0.28 to 0.49. When the ultrasonic composite vibration is applied to a first workpiece W1 and a second workpiece W2 in a direction (lateral direction) perpendicular to a pressing direction in a state where a distal end portion of the horn chip 40 (ultrasonic bonding chip) is pressed against the first workpiece W1, the adjustment member attached to the base portion so as to be sandwiched by the first base portion 41 and the second base portion 42 can be bent.SELECTED DRAWING: Figure 2

The invention relates to a copper wire bonding wire protection method. The method comprises the following steps: S1, sleeving a bonding chopper with a bonding wire protection device; s2, the copper wire extends out, the bonding wire protection device sprays protective gas to the center of the bonding chopper, and a protective gas atmosphere is formed around the copper wire; s3, igniting the head of the copper wire to melt the head into a ball shape; s4, moving the bonding chopper to a position above a chip welding spot; the bonding chopper descends and ultrasonic bonding is started, so that the copper wire and the chip welding spot are welded; s5, air injection is stopped, and the bonding chopper is lifted and moves towards the welding spot direction of the lead frame; s6, the bonding chopper is moved to the position above the welding spot of the lead frame, and the welding wire protection device sprays out protective gas; and the bonding chopper descends and ultrasonic bonding is started, so that the copper wire is welded with the welding spot of the lead frame to form a wire tail to finish bonding. According to the invention, oxidation protection can be carried out on the wire in the whole welding process of ignition ball burning, chip and lead frame in the bonding process, and the welding quality of the wire is improved.

An ultrasonically bonded permanent node comprises at least one feeder, a plurality of parallel conductors physically and electrically coupled to the feeder by ultrasonic bonding to form the node and an encasement positioned over the node to reduce and prevent electric flow outwardly from the node. The ultrasonic bonding allows physical and electrical coupling of the at least one feeder having a large size relative to the plurality of parallel conductors having a small size. A method for coupling the plurality of parallel conductors with the feeder comprises the steps of: removing the insulation of the feeder and each of the plurality of parallel conductors. Ultrasonically bonding the conductor of the feeder and the plurality of parallel conductors to create a node and positioning an encasement over the node to provide insulation to the exposed conductors.

Disclosed are an ultrasonic joining apparatus and a method for ultrasonic joining, the ultrasonic joining apparatus including: a platform having an upper surface on a plane defined by a first direction and a second direction intersecting the first direction; a head portion spaced apart from the platform in a third direction intersecting the first direction and the second direction; a first ultrasonic generator vibrating in a direction parallel to the second direction; and a second ultrasonic generator vibrating in a direction parallel to the third direction, wherein each of the first ultrasonic generator and the second ultrasonic generator can be coupled to the platform or the head portion.

The utility model relates to an ultrasonic bonding device for environment-friendly paper cups, which belongs to the technical field of environment-friendly paper cup processing and comprises a workbench and a top plate arranged at the top of the workbench, a support rod is fixedly connected between the top plate and the workbench, and a rapid forming mechanism capable of forming the paper cups is arranged at the top of the workbench. The rapid forming mechanism comprises a welding table fixedly mounted on the upper surface of the workbench, and an electric push rod extending into the welding table is fixedly mounted in the workbench. According to the ultrasonic bonding device for the environment-friendly paper cup, an electric push rod is arranged to drive a connecting plate to ascend and descend, so that the connecting plate can drive a mounting plate and a forming cylinder to ascend and descend at the same time, then a welding table and a forming groove are arranged, the forming cylinder can conduct extrusion forming treatment on paper sheets, and workers only need to place the paper sheets on the welding table; the working efficiency is improved, and meanwhile, the forming integrity of each paper cup can be guaranteed.

There is provided an ultrasonic composite vibration device or the like that is configured by connecting a plurality of vibration elements so that stability of the connection state is improved. A first vibration element 11 and an intermediate vibration element 10 are co-axially connected at one designated connection location which, in a mid-section of an ultrasonic composite vibration device 1, is included in a range within a phase angle of 0.05 π based on antinodes A (M1) of a standing wave M1 of the longitudinal vibration, and is included in a range within a phase angle of 0.22 π based on nodes N (M2) of a standing wave M2 of the torsional vibration. Similarly, in the mid-section of the ultrasonic composite vibration device 1, the intermediate vibration element 10 and the second vibration element 12 are co-axially connected by a mechanical connection mechanism at another designated connection location.

The utility model discloses a fabric ultrasonic bonding device which comprises a supporting base used for supporting, four sets of leveling guide shafts are arranged on the upper end face of the supporting base, and fixing guide seats are fixedly connected to the upper end faces of the four sets of leveling guide shafts in a clamped mode. By arranging the transmission device and the bonding device, when the truck tarpaulin is subjected to ultrasonic bonding, the stepping motor can drive the first fixed rotating shaft to rotate circumferentially through the transmission turntable, so that the first fixed rotating shaft can synchronously drive the alignment guide seat to move up and down through the transmission guide plate; furthermore, the follow-up material pressing guide wheels can be conveniently lifted to provide enough material guiding space for bonding and feeding of the truck tarpaulin, so that the convenience of bonding and feeding of the truck tarpaulin by the equipment is effectively improved, and meanwhile, the truck tarpaulin is continuously pressed and guided by the material pressing guide wheels; and the efficiency and stability of the ultrasonic fabric bonding module for bonding the truck tarpaulin can be effectively improved.

To provide a wire with a terminal which can suppress cutting of wire strands even if the wire and the terminal are joined together by ultrasonic junction, a method for manufacturing the wire, and a wire with a connector.SOLUTION: In the wire with a terminal, an exposed conductor portion exposed from an insulating covering part of the wire including a conductor and the insulating covering part covering the outer periphery of the conductor is joined to the main body part of a terminal. When viewed in the longitudinal cross-section of the wire along the longitudinal direction of the conductor, the cross-section including the main body part, the tip end of the exposed conductor portion has a joining-surface portion that joins to the main body part and a non-joining-surface portion that faces the joining-surface portion and does not join to the main body part, and, in a direction parallel to the longitudinal direction of the conductor, a length L1 between the non-joining-surface portion and a tip edge portion of the insulating covering part on a non-joining-surface side is longer than a length L2 between the joining-surface portion and a tip edge portion of the insulating covering part on a joining-surface side.SELECTED DRAWING: Figure 1

The application provides a kind of bundle pocket automatic production flow line and production method, including successively arranged cloth feeding device, ultrasonic bonding device, cloth punching device, cloth edge folding device, first sewing device, cloth storage rack device, cloth cutting device, cloth positioning device, cloth transfer device and second sewing device;The upper between cloth feeding device and ultrasonic bonding device is successively provided with trademark tape feeding device, roll folding adhesive cutting device and transfer rotating device;The lower of cloth positioning device is provided with cloth folding device;The opposite side of cloth punching device is provided with pad printing marking device, first color mark sensor is arranged between cloth punching device and cloth edge folding device, second color mark sensor is arranged between cloth storage rack device and cloth cutting device.The advantages of the application: a large amount of human resources can be saved, thereby reducing production cost, while the speed of automatic production is fast, and the production efficiency can be effectively improved.

This invention provides an ultrasonic bonding apparatus that reduces the probability of slippage between chips and workpieces, and between workpieces, thereby improving the quality of bonding. [Solution] The excitation operation of the ultrasonic composite element is controlled according to an amplitude instruction Qcmd that maintains the amplitude Q at an initial amplitude Qint = 0th designated amplitude Q0, while the translational operation of the ultrasonic bonding tip is controlled so that the translational speed V decreases while maintaining the translational speed V at the ith designated speed Vi (0≦i≦n) from the 0th designated speed V0 to the nth designated speed Vn (n=1). The excitation operation of the ultrasonic composite element is controlled according to an amplitude instruction Qcmd that maintains the amplitude Q at an initial amplitude Qint = 0th designated amplitude Q0, while the translational operation of the ultrasonic bonding tip is controlled so that the translational speed V increases while maintaining the translational speed V at the jth designated speed Vi (n≦i≦m) from the nth designated speed Vn to the mth designated speed Vm (m=2) as the final speed Pend.