935 results about "Feedthrough" patented technology

An apparatus (100) and method are provided for thermally processing substrates (108) held in a carrier (106). The apparatus (100) includes a vessel (101) having a top (134), side (136) and bottom (138), and a heat source (110) with heating elements (112-1, 112-2, 112-3) proximal thereto. The vessel (101) is sized to enclose a volume substantially no larger than necessary to accommodate the carrier (106), and to provide an isothermal process zone (128) extending throughout. In one embodiment, the bottom wall (138) includes a movable pedestal (140) with a bottom heating element therein (112-1), and the pedestal can be lowered and raised to insert the carrier (106) into the vessel (101). The apparatus (100) can include a movable shield (146) that is inserted between the pedestal (140) and the carrier (106) to shield the substrates (108) from the heating element (112-1) and to maintain pedestal temperature. A magnetically coupled repositioning system (162) repositions the carrier (106) during processing of the substrates (108) without use of a movable feedthrough into the volume enclosed by the vessel (101), and without moving the bottom heating element (112-1) in the pedestal (140).

The invention provides a deposition system and methods of depositing materials onto substrates. In one aspect, a modular processing chamber is provided which includes a chamber body defining a processing region. The chamber body includes a removable gas feedthrough, an electrical feedthrough, a gas distribution assembly mounted on a chamber lid and a microwave applicator for generating reactive gases remote from the processing region.

Field programmable gate arrays (FPGA's) may be structured in accordance with the disclosure to have a register-intensive architecture that provides, for each of plural function-spawning LookUp Tables (e.g. a 4-input, base LUT's) within a logic block, a plurality of in-block accessible registers. A register-feeding multiplexer means may be provided for allowing each of the plural registers to equivalently capture and store a result signal output by the corresponding, base LUT of the plural registers. Registerable, primary and secondary feedthroughs may be provided for each base LUT so that locally-acquired input signals of the LUT may be fed-through to the corresponding, in-block registers for register-recovery purposes without fully consuming (wasting) the lookup resources of the associated, base LUT. A multi-stage, input switch matrix (ISM) may be further provided for acquiring and routing input signals from adjacent, block-interconnect lines (AIL's) and/or block-intra-connect lines (e.g., FB's) to the base LUT's and/or their respective, registerable feedthroughs. Techniques are disclosed for utilizing the many in-block registers and/or the registerable feedthroughs and/or the multi-stage ISM's for efficiently implementing various circuit designs by appropriately configuring such register-intensive FPGA's.

A feedthrough terminal assembly for active implantable medical devices includes a structural wire bond pad for a convenient attachment of wires from either the circuitry inside the implantable medical device or wires external to the device. Direct attachment of wire bond pads to terminal pins enables thermal or ultrasonic bonding of lead wires, while shielding the capacitor or other delicate components from the forces applied to the assembly during attachment of the wires.

A logic circuit combines a plurality of pass-transistor logic trees and a multiple-input logic gate for receiving intermediate logic signals from the respective pass-transistor logic trees, and can express a complex logical operation while decreasing the number of stages in pass-transistor logic trees and improving operation speed. Even a logical operation that cannot be expressed efficiently by a known or conventional pass-transistor logic circuit can be expressed efficiently with performance higher than that of a known CMOS logic circuit. Furthermore, when a static feedthrough current of the multiple-input logic gate is suppressed, power consumption can be reduced. In some embodiments, since circuitry for suppressing a static feedthrough current of the multiple-input logic gate is arranged so that a probability of occurrence of logical collision with a preceding stage will decrease or will be nil, power consumption can further be reduced.

An implantable connector electrically connects multi-conductor leads to an implantable medical device such as a neurostimulator. The connector is assembled directly into a hermetic feedthrough of the implantable device and utilizes the feedthrough housing as a sustaining structure for connector clamping. The receptacle contacts detachably connect proximal lead contacts to corresponding feedthrough pins, which provide pass-through connections to electronic circuitry contained in a hermetically sealed case. The receptacle contact has resilient contact tines designed to engage a corresponding lead contact in a sliding manner. The receptacle contact is integrated with a contact guard which protects the receptacle contact from inadvertent handling damage. The contact guard is substantially more rigid than the resilient contact to resist deformation. The contact guard protectively shields the receptacle contact tines and prevents unintended contact tine excursion. In one embodiment, the contact guard is pre-attached to the receptacle contact prior to joining to the feedthrough pin. In another embodiment, the contact guard is an integral part of the feedthrough pin. Numerous embodiments with contact preload are provided.

The present invention provides a temperature controlled energy transparent window or electrode used to advantage in a substrate processing system. The invention also provides methods associated with controlling lid temperature during processing and for controlling etching processes. In a preferred embodiment the invention provides a fluid supply system for the lid which allows the fluid to flow through a feedthrough and into and out of a channel formed in the window or electrode. The fluid supply system may also mount the window or electrode to a retaining ring which secures the window or electrode to the chamber. In another aspect the invention provides a bonded window or electrode having a first and second plate having a channel formed in the plates so that when the plates are bonded together they form a channel therein through which a temperature controlling fluid can be flowed. An external control system preferably regulates the temperature of the fluid.

EMI feedthrough filter terminal assembly includes a feedthrough filter capacitor having first and second sets of electrode plates, and a first passageway having a first termination surface conductively coupling the first set of electrode plates. At least one lead wire extends through the first passageway and is conductively attached to a first oxide resistant conductive pad. The first pad is conductively coupled to the first termination surface independently of the lead wire. The terminal assembly may also include a conductive ferrule through which the lead wire passes in non-conductive relation, and an insulator fixed to the ferrule for conductively isolating the lead wire from the ferrule. The ferrule and insulator form a pre-fabricated hermetic terminal pin sub-assembly. The capacitor may include a second passageway having a second termination surface conductively coupling the second set of electrode plates, and a conductive ground lead extending therethrough.

A method is disclosed for the fabrication of feedthrough devices that can transmit a single or plurality of electrical signal(s) to or from within a leak-tight (hermetic) chamber from or to the outside of said leak-tight (hermetic) chamber. The invention allows materials known to be well-tolerated within the human body such as alumina-oxide ceramic and platinum to be used as raw materials in the fabrication of body-compatible, single or multi-channel leak-tight (hermetic) feedthroughs.

A filter capacitor comprising a substrate of at least one layer of a low temperature co-fires ceramic (LTCC) tape supporting alternating active and ground electrode layers segregated by a dielectric layer is described. The substrate is preferably a laminate of three LTCC tapes pieces that are heated under pressure and at a relatively low temperature to become a laminate that maintains its shape and structure dimensions even after undergoing numerous sintering steps. Consequently, relatively thin active and ground electrode layers along with the intermediate dielectric layer can be laid down or deposited on the LTCC substrate by a screen-printing technique. A second laminate of LTCC tapes is positioned on top of the active/dielectric/ground layers to finish the capacitor. Consequently, a significant amount of space is saved in comparison to a comparably rated capacitor or, a capacitor of a higher rating can be provided in the same size as a conventional prior art capacitor.

An elevated feedthrough is attachable to a top or a side of an active implantable medical device. The feedthrough includes a conductive ferrule and a dielectric substrate. The dielectric substrate is defined as comprising a body fluid side and a device side disposed within the conductive ferrule. The dielectric substrate includes a body fluid side elevated portion generally raised above the conductive ferrule. At least one via hole is disposed through the dielectric substrate from the body fluid side to the device side. A conductive fill is disposed within the at least one via hole forming a hermetic seal and electrically conductive between the body fluid side and the device side. A leadwire connection feature is on the body fluid side electrically coupled to the conductive fill and disposed adjacent to the elevated portion of the dielectric substrate.

An assembly for providing a weatherproof feedthrough for data communications cables into a structure. The assembly includes a unique housing having a cavity for removably receiving a connector attached to a terminal end of a cable in a fixed orientation. The cable attached to the connector in the cavity exits the assembly into a protected side of the structure. A cable from the unprotected side of the structure enters the assembly such that a connector disposed on its terminal end may be connected to the connector in the cavity. The assembly is particularly suited to allow off the shelf connectors to be used within the housing. The assembly may include strain relief devices for protecting the cables attached to the connectors.

The invention provides a liquid cell for an atomic force microscope. The liquid cell includes a liquid cell housing with an internal cavity to contain a fluid, a plurality of conductive feedthroughs traversing the liquid cell housing between the internal cavity and a dry side of the liquid cell, a cantilevered probe coupled to the liquid cell housing, and a piezoelectric drive element disposed on the cantilevered probe. The cantilevered probe is actuated when a drive voltage is applied to the piezoelectric drive element through at least one of the conductive feedthroughs. A method of imaging an object in a liquid medium and a method of sensing a target species with the liquid cell are also disclosed.

Disclosed herein is an EMI filtered feedthru for an implantable pulse generator. The EMI filtered feedthru may include a filter assembly, which has a chip capacitor and a body. The body may include a cavity in which the chip capacitor resides.

Packaging techniques for a non-transvenous implantable cardioverter/defibrillator include a housing and a frame within the housing for holding electronic components. A header is disposed on the housing and includes at least one feedthrough extending through the housing for providing electrical communication to and from the electronic components within the housing.

A new hermetically-sealed contact feedthrough for cardiac pacemakers and defibrillators for the connection between internal device electronics and external components, a flat ceramic disk (1) being used as an insulating main carrier, in which openings (3) are situated, into which various electrode embodiments (4, 5, 6, 7) may be inserted as through contacts. Using a metal flange or metal-plated vapor deposition zone (2), the ceramic disk may be soldered directly onto the implant housing (11). In addition, active and passive auxiliary components (8) may be applied directly to the ceramic. The main carrier may be implemented as a multilayer ceramic (9), so that rewiring levels and shielding components (10) may be integrated in the feedthrough. The feedthrough according to the present invention allows novel construction variants, above all things having orientation to multipolar systems, through use of standardized ceramic semifinished products.

An insulative shield is co-bonded to the top of a ceramic capacitor in a feedthrough terminal assembly on an active implantable medical device. The insulative shield is a thin substrate that provides protection against damage and degradation of the feedthrough capacitor and/or its conformal coating from heat, splatter or debris resulting from the electromechanical connection of components during construction of the assembly. Laser welding, thermal or ultrasonic bonding, soldering, brazing or related lead attachment techniques can create such heat, splatter or debris. In a preferred embodiment, the insulative shield is co-bonded using the capacitor's own conformal coating.

An electromagnetically coupled hermetic chamber includes a body defining a hermetic chamber. A first conductive structure is disposed within the hermetic chamber, and a second conductive structure is attached to the body outside of the hermetic chamber. The first conductive structure is electromagnetically coupled to the second conductive structure without direct electrical paths connecting the first and second conductive structures. Thus the first conductive structure can be coupled to external electronics without the need for electrical feedthroughs or vias that could compromise the integrity of the hermetic chamber.

An implantable biocompatible component (10) integrating an active element of the type of a sensor for the measurement of a physiologic parameter, a micro-electromechanical system and an integrated electronic circuit. This component (10) has a substrate (12) and a lid (22) in silicon or quartz. The substrate (12) integrates the active element (14) and biocompatible metallic pads (16), electrically connected to the active element. The lid (22) encompasses and peripherally closes the substrate in a hermetic manner, level with the face integrating the active element. This component is void of metallic case for insulation between the active element and outside environment, and of insulative feedthrough for electrical connection to the active element. The substrate and lid can be directly welded to each other through their faces in vis-à-vis, or by interpositioning a sealing ring made of a biocompatible material.