181 results about "Feedthrough" patented technology

An electrode stack can include a plurality of anode assemblies, each anode assembly including at least one anode layer attached to an anode tab; a plurality of cathode assemblies, each cathode assembly including at least one cathode layer attached to a cathode tab; a plurality of separators; an anode feedthrough bridge arranged to engage each anode tab of each of the plurality of anode assemblies; a cathode feedthrough bridge arranged to engage each cathode tab of each of the plurality of cathode assemblies; an anode feedthrough terminal coupled to the anode feedthrough bridge; and a cathode feedthrough terminal coupled to the cathode feedthrough bridge, wherein the plurality of anode assemblies and the plurality of cathode assemblies are alternately arranged and separated by the plurality of separators to form an electrode stack. A battery is also presented.

An electrical feedthrough includes a base body with a sealing region, at least one opening and an electrical conductor fed through the opening, wherein the conductor is held in the opening by a fixing material and the fixing material seals the opening. The edges which surround the opening are designed to be sharp and all edges of an outer contour of the base body are provided with a chamfer or a rounding, which has a size or a radius r in the range of 0.3 mm to 2 mm.

The utility model relates to the technical field of vacuum feed-through, and discloses a vacuum hollow magnetic coupling feed-through device used for a magnetron sputtering coating machine, which comprises an isolation cover, a magnetic coupling feed-through device and a magnetic coupling feed-through device, the first end of the hollow main shaft extends into the isolation hood; the outer magnetic rotor surrounds the outer side of the isolation cover; the inner magnetic rotor is connected to the outer side of the first end of the hollow main shaft; the input wheel is connected with the outer magnetic rotor and is used for being connected with external driving equipment; according to the utility model, the hollow main shaft is adopted, while magnetic coupling torque transmission is realized, the hollow main shaft rotates in the vacuum chamber, and devices which do not need to be rotated, such as wiring and installation of manipulators, can be accommodated in the hollow main shaft, so that the feed-through structure is endowed with more functional richness, flexibility and various possibilities; flanges at two ends of the isolation cover facilitate connection of an external device outside the vacuum chamber.

Systems and apparatus are provided for a high-power microwave sensor using an unmanned aerial vehicle. The unmanned aerial vehicle may include a central body, at least one electric motor, and a barometric pressure feedthrough. The central body may include a first enclosure housing a plurality of low voltage components, a voltage feedthrough connector, and a second enclosure housing a plurality of high voltage components. The low voltage components may include a first signal processing system, a first radio transceiver, a flight controller, a second signal processing system, a second radio transceiver, and a navigation system. The high voltage components may include a plurality of electronic speed controllers, a power distribution module, an input power interface, and a plurality of high power filters. The components of each enclosure may be segregated such that the high voltage components do not create electromagnetic interference with the low voltage components.

Circuitry is provided that includes a matching circuit, a first mixer coupled to the matching circuit and configured to receive a signal with an oscillation frequency, a second mixer coupled to the matching circuit, a first transmission line path coupled between the matching circuit and an input of the first mixer, and one or more capacitors coupled to the input of the first mixer and configured to reject signals at a harmonic frequency of the oscillation frequency. The wireless circuitry can further include a second transmission line path coupled between the matching circuit and an input of the second mixer. The transmission line path can include a first transmission line for conveying signals between the matching circuit and the first mixer, a second transmission line for conveying signals between the matching circuit and the first mixer, and a floating transmission line interposed between the first and second transmission lines.

A device produces and seals a line feedthrough directly beneath a ceiling and has a feedthrough box to be fastened to the ceiling, with two opposite open end faces and side walls extending between them, which are open towards the ceiling and are to be closed off by the ceiling, such that the side walls in a state of the box mounted on the ceiling, together with the ceiling, form an axial passage channel which is closed in the circumferential direction. The device also has one or more support frame elements, wherein each support frame element is integrally formed or fixed on the side walls of the box on the outside thereof, and extends radially outwards in such a way that it forms an essentially planar bearing surface for supporting a wall panel, when a vertical wall is being produced or closed off around the box.

An electrical feedthrough is provided, including a base body having at least one opening , through which an electrical conductor is fed and is held in the opening by a fixing material , wherein the fixing material seals the opening and wherein the base body has an elongated form and has a reinforcing structure at least on the edges of the long sides. The reinforcing structure is designed as a raised edge region, which is offset vertically with respect to a base plane of the base body .

One aspect of the present disclosure pertains to a method. The method includes receiving a first circuit structure having semiconductor devices, an interconnect structure, first feedthrough vias, top metal lines, redistribution vias, and bond pads. The method includes dicing the first circuit structure to form a top die having a top semiconductor device. The method includes forming a stacked integrated circuit (IC) structure by bonding the top die to a second circuit structure, the second circuit structure having second semiconductor devices, a second interconnect structure, second redistribution vias, and second bond pads. The method includes forming IC top metal lines over the first feedthrough vias, forming an IC passivation layer over the IC top metal lines, forming metal-insulator-metal (MIM) capacitor structures in the IC passivation layer, and forming IC redistribution vias penetrating through the MIM capacitor structures and the IC passivation layer to land on the IC top metal lines.

Blow molding machine for the production of a plastic container (23), comprising a treatment station (20) with a compressed air supply (21) for the expanding forming of plastic preforms (22) into the plastic container (23) in a hollow mold (24), wherein the treatment station (20) is arranged on a rotating rotary unit (27) which has a rotary feedthrough with a sealing arrangement comprising a housing (9) and a shaft (8) arranged in the housing (9) and a dynamic seal for sealing a component rotating about an axis of rotation (10) against a stationary component comprising a first sealing ring (1) and a second sealing ring (2), each of which slides against an opposing sealing surface (3) at a relative rotational speed and encloses a leakage chamber (4) between them, in which a plurality of leakage bores (5.1, 5.2) opens, comprising, wherein the components are formed by the shaft (8) and the housing (9), the sealing surface (3) is formed by an outer surface of the shaft (8) and the sealing rings (1, 2) are held in the housing (9), and a leakage channel (11) extending around the axis of rotation (10) is provided in a surface of the housing (9) opposite the shaft (8) and / or the outer surface of the shaft (8), which forms at least part of the leakage chamber (4) and in which the leakage bores (5.1, 5.2) open; wherein the shaft (8) rotates about the axis of rotation (10) and the housing (9) is stationary, or wherein the housing (9) rotates about the axis of rotation (10) and the shaft is stationary, with at least one medium-carrying channel (13) connected to the compressed air supply (21), which extends in a sealed manner into the housing (9) and the shaft (8), with at least one medium supply (14) and / or one medium discharge (15) on the housing (9), which is connected to the medium-carrying channel (13) via an interface (16) between the shaft (8) and the housing (9), wherein the interface (16) is sealed on one or both sides in the direction of the axis of rotation (10) with the dynamic seal, wherein a compressed air supply (6) is connected to at least one first leakage bore (5.1) and at least one second leakage bore (5.2) has a compressed air outlet (7) trains.

The application provides a lower electrode feed-in device and a semiconductor processing equipment, the device comprises a radio frequency feed-in assembly, one end of the radio frequency feed-in assembly is used for electrically connecting with a radio frequency source, and the other end is used for electrically connecting with a chuck assembly; the radio frequency feed-in assembly comprises at least two radio frequency feed-in pipes and at least one radio frequency adapter pipe; wherein, each two adjacent radio frequency feed-in pipes are provided with a first matching part, the radio frequency adapter pipe is provided with two second matching parts, and the two second matching parts are matched with the first matching parts of the two adjacent radio frequency feed-in pipes respectively, so that the radio frequency adapter pipe is detachably connected with the two adjacent radio frequency feed-in pipes and electrically connected. The scheme can not only more conveniently disassemble and assemble the radio frequency feed-in pipe, but also better ensure the assembly consistency of each machine, and can select a solid-state medium, so that the problem that the solid-state medium is not easy to disassemble and assemble does not exist, thereby the occupied space of the lower electrode feed-in device can be reduced, so that more space can be used for optimizing other lower electrode components.

A gas feedthrough for a chromatograph device includes a hub configured to receive a fluid sample and interface with a fluid receiver, the hub including a first surface; and a plurality of fluid channels including a fluid sample channel configured to carry the fluid sample, a vent channel configured to carry a vented fluid, and a carrier channel configured to carry a carrier fluid. Each of the plurality of fluid channels terminate at a respective interface point on the first surface. The respective interface points of the plurality of fluid channels are arranged on the first surface in at least one arc.

This configuration allows for more precise definition of the relative position of the electrical feedthrough to the housing and facilitates the assembly of the electrical feedthrough. [Solution] An electrical feedthrough 1 is provided, comprising a base body 10 having at least one opening 12, through which an electrical conductor 30 is guided and held within the opening via a fixing material 20, the fixing material closing the opening, the base body having an elongated shape and having a reinforcing structure at least on the long edge, the reinforcing structure being formed as a raised edge region 16 offset perpendicularly to the base surface 11 of the base body.

This application discloses a broadband low-temperature low-noise amplifier with a step-suspended line, comprising: an input matching circuit having a step-suspended line input matching structure for receiving RF port input; the output terminal of the input matching circuit is connected to the input terminal of a first-stage transistor amplifier; the output terminal of the first-stage transistor amplifier is connected to the input terminal of a second-stage transistor amplifier through a first-stage inter-stage matching circuit; the output terminal of the second-stage transistor amplifier is connected to the input terminal of a third-stage transistor amplifier through a second-stage inter-stage matching circuit; the output terminal of the third-stage transistor amplifier is connected to the input terminal of an output matching circuit; and the output terminal of the output matching circuit is used to output an RF signal. The advantages of this invention include: innovatively introducing a step-suspended line structure to achieve ultra-wideband performance; achieving ultra-low noise based on the step-suspended line structure; DC power supply fed from the RF output port, avoiding additional DC feedthrough, and a simple and compact structure.

An electrical device includes: a housing part made of a metal and including a feedthrough therethrough, an opening of the feedthrough, a first region, and a second region, the opening receiving a conductive material or a conductor in a glass material or a glass-ceramic material, wherein: (i) the conductive material has a first coefficient of expansion α1, the glass material or the glass-ceramic material has a second coefficient of expansion α2, and the housing part has a third coefficient of expansion α3, the third coefficient of expansion α3 being always greater than the second coefficient of expansion α2; or (ii) the first region including a width W that is substantially perpendicular to the axis of the at least one opening, the width W of the first region being always greater than a thickness D2 and a thickness DE of the second region; or (iii) a combination of (i) and (ii).

A method includes providing a structure including a substrate and a fin-shaped structure protruding from the substrate, forming an isolation structure and a protecting layer thereon over the substrate and adjacent to a sidewall of the fin-shaped structure, growing a source / drain feature on a source / drain region of the fin-shaped structure, depositing a contact etch stop layer (CESL) over the source / drain feature, depositing a first interlayer dielectric (ILD) layer, a capping layer, and a second ILD layer over the CESL, forming a source / drain contact plug in the first ILD layer to electrically couple to the source / drain feature, forming a metal silicide layer between the source / drain feature and the source / drain contact plug, thinning down the substrate from a bottom of the structure, forming an opening exposing a bottom surface of the source / drain contact plug and a bottom surface of the protecting layer, and depositing a backside conductive feature in the opening.

Disclosed are an electrical feedthrough connector, a substrate support assembly, and a method for feeding electrical signals to a processing chamber. The electrical feedthrough connector includes a first receptacle including a first electrical socket; an interface body, and a second receptacle including a second electrical socket. The interface body includes a first side, a second side, and a solid part disposed between the first side and the second side. The first side is coupled with the first receptacle, and the second receptacle is coupled with the second side. The solid part includes a conductive path embedded in a plurality of dielectric layers; and the conductive path is configured to provide an electrical connection between the first electrical socket and the second electrical socket. The substrate support assembly includes the electrical feedthrough connector. The method utilizes the electrical feedthrough connector to provide electrical signals to electrodes of an electrostatic chuck.

The invention relates to a holding device (2) for holding a magnetizable substrate (8) during machining of at least one substrate surface, in particular of a magnetizable tool to be machined, comprising a magnetic holding unit (4) arranged at the end for fixing the substrate (8) at the end by forming a magnetic field, a receiving unit (6) arranged on the holding unit (4) for receiving the substrate (8), a replaceable adapter unit (10) arranged within the receiving unit (6) for guiding and shielding the substrate (8), the adapter unit (10) having at least one recess (12) for the feedthrough of the substrate (8), the substrate (8) being fixable within the holding device (2) in a laterally supported manner by means of the recess (12).

A cell region includes: a transistor-components layer including a first feedthrough via arrangement (FTA); a first metallization layer over the transistor-components layer and including first-front-side segments, the first front-side segments including first and second front-side power grid (FPG) segments, and one or more front-side routing (FRTE) segments including a first FRTE segment; and a first buried metallization layer under the transistor-components layer and including first back-side segments, the first back-side segments including first and second back-side power grid (BPG) segments, and one or more back-side routing (BRTE) segments including a first BRTE segment. The first FTA couples the first FRTE segment to the first BRTE segment. Relative to the first direction and a second direction perpendicular to the first direction, the first BPG segment having a first notch partially occupied by at least a first portion of the first BRTE segment.

A transmitter includes a modulator, a compensator, an up-converter, and a feedback path. The modulator generates a modulated signal at an intermediate frequency (fIF) including an in-phase component and a quadrature component. The compensator generates a local oscillator feedthrough (LOFT) and in-phase and quadrature mismatch (IQM) compensated signal at fIF based on the modulated signal and feedback. The up-converter generates a transmit signal at a transmit frequency (fTX) based on the LOFT and IQM compensated signal. The feedback path generates the feedback based on the transmit signal. The feedback path includes a quadrature bandpass analog-to-digital converter (ADC) to measure LOFT and IQM in the transmit signal.

An internally grounded filter feedthrough having a filter capacitor connected to a feedthrough is described. The feedthrough comprises an insulator having an active conductive pathway extending to its device and body fluid sides, and a ground conductive pathway extending part-way through the insulator thickness from the insulator device side. An undercut extending into the insulator sidewall communicates with the ground conductive pathway but does not extend to the insulator device or body fluid sides or to the active conductive pathway. A braze seals the insulator sidewall to the ferrule and extends into the undercut so that the braze contacts the ground conductive pathway. That way, the braze provides a ground electrical path from a capacitor ground via to the ground conductive pathway in the insulator connected to the braze sealed to the ferrule.

Electrical bushing (1) comprises a base body (10) with a sealing area, at least one opening (12), and an electrical conductor (30) passing through the opening (12), wherein the conductor (30) is held in the opening (12) by a fixing material (20), and the fixing material (20) seals the opening (12). The edges surrounding the opening (12) are sharply formed, and all edges of an outer contour of the base body (10) are provided with a chamfer or a rounding (18) having a size or radius r in the range of 0.3 mm to 2 mm.

Measuring device (1) with at least one sensor (3) and with at least one transmitter housing (4), wherein the transmitter housing (4) has at least one terminal compartment (5) and an electronics compartment (6) adjacent to the terminal compartment (5) and connected via a partition (29), wherein at least one first electronic device (8) for connecting supply and / or I / O lines (33) is arranged in the terminal compartment (5) and wherein at least one second electronic device (16) with electronics for controlling the sensor (3) is arranged in the electronics compartment (6), wherein the first electronic device (8) and the second electronic device (16) are electrically connected to each other via a contacting unit (12), wherein the contacting unit (12) is detachably inserted into a recess (30) of the partition (29), characterized by that the contacting unit (12) is permanently connected to the first electronic device (8), the connection being a permanent connection, so that the contacting unit and the electronic device can be handled as one component and that the contacting unit (12) is designed as an electrical feedthrough element, wherein the electrical feedthrough element is designed as a plug with glazed or plastic-encased contact elements (11).

Substrate-less diode, bipolar and feedthrough integrated circuit structures, and methods of fabricating substrate-less diode, bipolar and feedthrough integrated circuit structures, are described. For example, a substrate-less integrated circuit structure includes a semiconductor structure. A plurality of gate structures is over the semiconductor structure. A plurality of P-type epitaxial structures is over the semiconductor structure. A plurality of N-type epitaxial structures is over the semiconductor structure. One or more open locations is between corresponding ones of the plurality of gate structures. A backside contact is connected directly to one of the pluralities of P-type and N-type epitaxial structures.

An integrated circuit includes a first SRAM cell and a second SRAM cell, each including a plurality of field-effect transistors (FETs), a front metal line over the FETs and a back metal line below the FETs, and a middle strap area disposed between the first SRAM cell and the second SRAM cell. The middle strap area includes a plurality of gate stacks extending lengthwise along a direction, a gate isolation structure extending through a gate stack of the plurality of gate stacks, a feedthrough via (FTV) embedded in the gate isolation structure, a first dielectric gate disposed between the conductive structure and the first SRAM cell, and a second dielectric gate disposed between the conductive structure and the second SRAM cell. The FTV electrically couples the front metal line and the back metal line.

Some embodiments include an apparatus comprising: a partition; a feedthrough extending through the partition and hermetically sealed to the partition, the feedthrough having a longitudinal axis; a first wall extending from the partition in a first direction along the longitudinal axis; and a second wall extending from the partition in a second direction opposite the first direction along the longitudinal axis, the second wall forming a connector interface with the feedthrough; and a ratio of a length of the first wall to a thickness of the first wall greater than or equal to 3:1.

This invention discloses a ceramic encapsulation assembly, an electrical penetration component, and a method for manufacturing the same, relating to the field of electrical equipment technology. The ceramic encapsulation assembly includes a ceramic sheet, a metal housing, and at least one end guide pin. The metal housing is cylindrical and has an axially through mounting cavity. The ceramic sheet covers and seals one end of the metal housing. The end guide pin penetrates the ceramic sheet. Both the ceramic sheet and the metal housing, and the ceramic sheet and the end guide pin, are sealed connections. This invention utilizes ceramic material to seal the electrical penetration component, offering advantages such as high temperature resistance and high insulation.

A lamp bulb is disclosed which comprises a feedthrough (26) for accommodating electrical conductors (24) passing through a glass stem (23) of the lamp bulb (10). The lamp bulb (10) comprises a light engine (21) arranged within a sealed light-transmitting surface structure (22), a feedthrough sealed in a glass stem (23) supporting the light engine (21) and extending through the glass stem (23), a plurality of wires (24) electrically isolated from each other and extending through the feedthrough (26) and being hermetically sealed in the feedthrough (26), the wires (24) connecting the light engine (21) to at least one power and signal source.

electric motor (11), in particular an electric cooling fan motor of a motor vehicle, with a motor carrier (12) and with motor electronics (24), in particular in an electronics compartment (24) of the motor carrier (12), and with a plug connection (21) which is contacted or can be contacted with a circuit carrier (23) of the motor electronics (24), - wherein the plug connector (21) has a connector housing (27) and a number of contact elements (28) which have connection contacts (29) and plug contacts (30) assigned to the motor electronics (24), - wherein the connection contacts (29) assigned to the motor electronics (24) are guided via contact feedthroughs (31) of the circuit carrier (23), and - wherein at least one plastic dome (35) is formed on the connection housing (27) of the plug connector (21), which sits in a corresponding carrier opening (36) between connection contacts (29) of the plug connector (21) received by adjacent contact passages (31) of the circuit carrier (23).

A semiconductor device includes a first memory cell region, a second memory cell region adjacent to the first memory cell region, and an intermediate band region sandwiched between the first memory cell region and the second memory cell region. According to some embodiments, the intermediate band region includes a feed-through circuit electrically coupling a first metal layer of a front side of the semiconductor device to a second metal layer of a back side of the semiconductor device. According to some embodiments, a feed-through circuit includes a plurality of contact metal layers disposed over and electrically coupled to a feed-through via (FTV).

The method can include receiving a baseline signal curve, operating a thermal reactor, measuring a signal, optionally determining a state (e.g., state of health) of the thermal reactor, and controlling the thermal reactor based on the signal. The method can include receiving (e.g., determining, measuring, etc.) a resistance-temperature and / or resistance-time curve; operating a thermal reactor comprising resistively heating a porous catalytic element; measuring an electrical signal (e.g., resistance, current, voltage, etc.) of the thermal reactor; optionally inferring a temperature of the thermal reactor based on the electrical signal and the resistance-temperature; and controlling the thermal reactor based on the electrical signal. The system can include one or more of a reaction module (e.g., an electrical coupler or electrode and catalytic element, etc.), inlet and outlet valves, power source, electrical feedthroughs (e.g., leads, supports, etc.), sensors, and computing system (e.g. controller).