371 results about "Feedthrough" patented technology

Systems and apparatus are provided for a high-power microwave sensor using an unmanned aerial vehicle. The unmanned aerial vehicle may include a central body, at least one electric motor, and a barometric pressure feedthrough. The central body may include a first enclosure housing a plurality of low voltage components, a voltage feedthrough connector, and a second enclosure housing a plurality of high voltage components. The low voltage components may include a first signal processing system, a first radio transceiver, a flight controller, a second signal processing system, a second radio transceiver, and a navigation system. The high voltage components may include a plurality of electronic speed controllers, a power distribution module, an input power interface, and a plurality of high power filters. The components of each enclosure may be segregated such that the high voltage components do not create electromagnetic interference with the low voltage components.

A radio frequency (RF) feedthrough component having an impedance greater than 20 ohms is disclosed. The feedthrough includes a ceramic body having a flexible non-ferrous conductor adhered to its outer peripheral surface and to an inner peripheral surface of an aperture through the ceramic body. A non-ferrous conductive lead is disposed through the aperture and protrudes from at least one side thereof. A non-ferrous hermetic seal is formed between a portion of the non-ferrous conductive lead disposed in the aperture and the non-ferrous conductor adhered to the surface of the aperture. The RF feedthrough can be assembled in an opening of a conductive housing to form an electromagnetically shielded package for an electrical circuit.

In general, in one aspect, embodiments relate to an electrical contact that includes a contact plate, a support plate, and three or more bends disposed between the contact plate and the support plate to counteract a force applied to the contact plate when engaged by a contact pin, where the electrical contact is configured to convey a detonating signal through an electrical feedthrough extending through at least a bulkhead of two or more perforating guns.

An electrode stack can include a plurality of anode assemblies, each anode assembly including at least one anode layer attached to an anode tab; a plurality of cathode assemblies, each cathode assembly including at least one cathode layer attached to a cathode tab; a plurality of separators; an anode feedthrough bridge arranged to engage each anode tab of each of the plurality of anode assemblies; a cathode feedthrough bridge arranged to engage each cathode tab of each of the plurality of cathode assemblies; an anode feedthrough terminal coupled to the anode feedthrough bridge; and a cathode feedthrough terminal coupled to the cathode feedthrough bridge, wherein the plurality of anode assemblies and the plurality of cathode assemblies are alternately arranged and separated by the plurality of separators to form an electrode stack. A battery is also presented.

An electrical feedthrough includes a base body with a sealing region, at least one opening and an electrical conductor fed through the opening, wherein the conductor is held in the opening by a fixing material and the fixing material seals the opening. The edges which surround the opening are designed to be sharp and all edges of an outer contour of the base body are provided with a chamfer or a rounding, which has a size or a radius r in the range of 0.3 mm to 2 mm.

The utility model relates to the technical field of vacuum feed-through, and discloses a vacuum hollow magnetic coupling feed-through device used for a magnetron sputtering coating machine, which comprises an isolation cover, a magnetic coupling feed-through device and a magnetic coupling feed-through device, the first end of the hollow main shaft extends into the isolation hood; the outer magnetic rotor surrounds the outer side of the isolation cover; the inner magnetic rotor is connected to the outer side of the first end of the hollow main shaft; the input wheel is connected with the outer magnetic rotor and is used for being connected with external driving equipment; according to the utility model, the hollow main shaft is adopted, while magnetic coupling torque transmission is realized, the hollow main shaft rotates in the vacuum chamber, and devices which do not need to be rotated, such as wiring and installation of manipulators, can be accommodated in the hollow main shaft, so that the feed-through structure is endowed with more functional richness, flexibility and various possibilities; flanges at two ends of the isolation cover facilitate connection of an external device outside the vacuum chamber.

Systems and apparatus are provided for a high-power microwave sensor using an unmanned aerial vehicle. The unmanned aerial vehicle may include a central body, at least one electric motor, and a barometric pressure feedthrough. The central body may include a first enclosure housing a plurality of low voltage components, a voltage feedthrough connector, and a second enclosure housing a plurality of high voltage components. The low voltage components may include a first signal processing system, a first radio transceiver, a flight controller, a second signal processing system, a second radio transceiver, and a navigation system. The high voltage components may include a plurality of electronic speed controllers, a power distribution module, an input power interface, and a plurality of high power filters. The components of each enclosure may be segregated such that the high voltage components do not create electromagnetic interference with the low voltage components.

Disclosed are an electrical feedthrough connector, a substrate support assembly, and a method for feeding electrical signals to a processing chamber. The electrical feedthrough connector includes a first receptacle including a first electrical socket; an interface body, and a second receptacle including a second electrical socket. The interface body includes a first side, a second side, and a solid part disposed between the first side and the second side. The first side is coupled with the first receptacle, and the second receptacle is coupled with the second side. The solid part includes a conductive path embedded in a plurality of dielectric layers; and the conductive path is configured to provide an electrical connection between the first electrical socket and the second electrical socket. The substrate support assembly includes the electrical feedthrough connector. The method utilizes the electrical feedthrough connector to provide electrical signals to electrodes of an electrostatic chuck.

A connecting joint assembly, wherein the connecting joint assembly has a ball pin with a ball head and a ball socket unit, wherein the ball socket unit has a ball socket with a radially inner cavity for receiving the ball head and with a plurality of feedthroughs leading from the outside into the cavity, wherein a securing clip has a bracket section and locking tongues which are connected thereto and, in the mounted state, extend from the bracket section through a respectively assigned one of the feedthroughs into the cavity, wherein the locking tongues engage behind the ball head in the mounted state on its side facing the pin shaft, wherein the securing clip is displaceable from a securing position, in which the securing clip holds the ball head in the ball socket, into a removal position, in which the ball pin is releasable from the ball socket unit.

An electrical feedthrough is providing that includes a base body, an insulating material, an electrical conductor, a creepage distance extension, and a sealing member. The base body has a through opening extending therethrough. The insulating material is in the through opening. The electrical conductor extends through the insulating material such that a portion of the electrical conductor protrudes from the insulating material. The creepage distance extension surrounds at least a section of the portion. The sealing member is between the insulating material and the creepage distance extension. The sealing member is a seal material that is at least partially mineral and crystalline.

Circuitry is provided that includes a matching circuit, a first mixer coupled to the matching circuit and configured to receive a signal with an oscillation frequency, a second mixer coupled to the matching circuit, a first transmission line path coupled between the matching circuit and an input of the first mixer, and one or more capacitors coupled to the input of the first mixer and configured to reject signals at a harmonic frequency of the oscillation frequency. The wireless circuitry can further include a second transmission line path coupled between the matching circuit and an input of the second mixer. The transmission line path can include a first transmission line for conveying signals between the matching circuit and the first mixer, a second transmission line for conveying signals between the matching circuit and the first mixer, and a floating transmission line interposed between the first and second transmission lines.

A device produces and seals a line feedthrough directly beneath a ceiling and has a feedthrough box to be fastened to the ceiling, with two opposite open end faces and side walls extending between them, which are open towards the ceiling and are to be closed off by the ceiling, such that the side walls in a state of the box mounted on the ceiling, together with the ceiling, form an axial passage channel which is closed in the circumferential direction. The device also has one or more support frame elements, wherein each support frame element is integrally formed or fixed on the side walls of the box on the outside thereof, and extends radially outwards in such a way that it forms an essentially planar bearing surface for supporting a wall panel, when a vertical wall is being produced or closed off around the box.

A sealed cable feedthrough of a plug connector includes a housing having an opening receiving a cable, a cover partially covering the opening, the cover having a through hole receiving the cable along an insertion direction, and a seal member sealing an interface between the housing and the cover. The seal member has a tubular member with a through hole receiving the cable along the insertion direction. The tubular member is arranged within the through hole of the cover and extends along a direction parallel to the insertion direction. The tubular member seals an interface between the cover and the cable.

Various embodiments of a feedthrough ferrule and a feedthrough assembly that includes such ferrule are disclosed. The ferrule includes an outer surface and an inner surface, at least one via defined by the ferrule extending between the outer surface and the inner surface of the ferrule along a via axis that is substantially orthogonal to the outer surface of the ferrule, and a retainer disposed on the inner surface of the ferrule adjacent the at least one via such that the retainer is electrically connected to the ferrule. The retainer is configured to retain at least a portion of a solder wire.

An electrical feedthrough assembly is disclosed having a base body with at least one opening for a conductor embedded in a fixation material that is fed into each of the respective openings and sealing the respective opening. The electrical feedthrough assembly further includes an insulation element made from a material having a first glass-transition temperature tg1, wherein the insulation element is affixed by an adhesive material arranged between the insulation element and the fixation material.

An electrical feedthrough is provided, including a base body having at least one opening , through which an electrical conductor is fed and is held in the opening by a fixing material , wherein the fixing material seals the opening and wherein the base body has an elongated form and has a reinforcing structure at least on the edges of the long sides. The reinforcing structure is designed as a raised edge region, which is offset vertically with respect to a base plane of the base body .

One aspect of the present disclosure pertains to a method. The method includes receiving a first circuit structure having semiconductor devices, an interconnect structure, first feedthrough vias, top metal lines, redistribution vias, and bond pads. The method includes dicing the first circuit structure to form a top die having a top semiconductor device. The method includes forming a stacked integrated circuit (IC) structure by bonding the top die to a second circuit structure, the second circuit structure having second semiconductor devices, a second interconnect structure, second redistribution vias, and second bond pads. The method includes forming IC top metal lines over the first feedthrough vias, forming an IC passivation layer over the IC top metal lines, forming metal-insulator-metal (MIM) capacitor structures in the IC passivation layer, and forming IC redistribution vias penetrating through the MIM capacitor structures and the IC passivation layer to land on the IC top metal lines.

Blow molding machine for the production of a plastic container (23), comprising a treatment station (20) with a compressed air supply (21) for the expanding forming of plastic preforms (22) into the plastic container (23) in a hollow mold (24), wherein the treatment station (20) is arranged on a rotating rotary unit (27) which has a rotary feedthrough with a sealing arrangement comprising a housing (9) and a shaft (8) arranged in the housing (9) and a dynamic seal for sealing a component rotating about an axis of rotation (10) against a stationary component comprising a first sealing ring (1) and a second sealing ring (2), each of which slides against an opposing sealing surface (3) at a relative rotational speed and encloses a leakage chamber (4) between them, in which a plurality of leakage bores (5.1, 5.2) opens, comprising, wherein the components are formed by the shaft (8) and the housing (9), the sealing surface (3) is formed by an outer surface of the shaft (8) and the sealing rings (1, 2) are held in the housing (9), and a leakage channel (11) extending around the axis of rotation (10) is provided in a surface of the housing (9) opposite the shaft (8) and / or the outer surface of the shaft (8), which forms at least part of the leakage chamber (4) and in which the leakage bores (5.1, 5.2) open; wherein the shaft (8) rotates about the axis of rotation (10) and the housing (9) is stationary, or wherein the housing (9) rotates about the axis of rotation (10) and the shaft is stationary, with at least one medium-carrying channel (13) connected to the compressed air supply (21), which extends in a sealed manner into the housing (9) and the shaft (8), with at least one medium supply (14) and / or one medium discharge (15) on the housing (9), which is connected to the medium-carrying channel (13) via an interface (16) between the shaft (8) and the housing (9), wherein the interface (16) is sealed on one or both sides in the direction of the axis of rotation (10) with the dynamic seal, wherein a compressed air supply (6) is connected to at least one first leakage bore (5.1) and at least one second leakage bore (5.2) has a compressed air outlet (7) trains.

The application provides a lower electrode feed-in device and a semiconductor processing equipment, the device comprises a radio frequency feed-in assembly, one end of the radio frequency feed-in assembly is used for electrically connecting with a radio frequency source, and the other end is used for electrically connecting with a chuck assembly; the radio frequency feed-in assembly comprises at least two radio frequency feed-in pipes and at least one radio frequency adapter pipe; wherein, each two adjacent radio frequency feed-in pipes are provided with a first matching part, the radio frequency adapter pipe is provided with two second matching parts, and the two second matching parts are matched with the first matching parts of the two adjacent radio frequency feed-in pipes respectively, so that the radio frequency adapter pipe is detachably connected with the two adjacent radio frequency feed-in pipes and electrically connected. The scheme can not only more conveniently disassemble and assemble the radio frequency feed-in pipe, but also better ensure the assembly consistency of each machine, and can select a solid-state medium, so that the problem that the solid-state medium is not easy to disassemble and assemble does not exist, thereby the occupied space of the lower electrode feed-in device can be reduced, so that more space can be used for optimizing other lower electrode components.

In various examples, an implantable medical device includes an enclosure including an enclosure wall. A feedthrough is sealingly disposed within an opening of the enclosure wall. A backfill feature includes a backfilling channel open to an exterior of the implantable medical device. A welding protection channel is fluidly coupled to the backfilling channel and extends from the backfilling channel to an interior of the enclosure. The backfilling channel and the welding protection channel fluidly couple the exterior of the implantable medical device and the interior of the enclosure for fluid backfilling of the interior of the enclosure. The backfilling channel is configured to be sealed with welding of the backfilling channel after fluid backfilling of the interior of the enclosure. The welding protection channel is configured to catch metallic projections from the welding of the backfilling channel to inhibit the metallic projections from entering the interior of the enclosure.

According to various embodiments, a signal transmission device comprises: a carrier (102) having a first side and a second side opposite the first side; a coupling device (108) for coupling a bearing device, by means of which a rotation axis is provided to the carrier; a plurality of coils (112, 114), of which at least one first coil is arranged facing the first side and / or of which at least one second coil is arranged facing the second side; an electrical feedthrough (116) which penetrates the carrier (102) from the first side to the second side and is electrically conductively coupled to the plurality of coils.

A gas feedthrough for a chromatograph device includes a hub configured to receive a fluid sample and interface with a fluid receiver, the hub including a first surface; and a plurality of fluid channels including a fluid sample channel configured to carry the fluid sample, a vent channel configured to carry a vented fluid, and a carrier channel configured to carry a carrier fluid. Each of the plurality of fluid channels terminate at a respective interface point on the first surface. The respective interface points of the plurality of fluid channels are arranged on the first surface in at least one arc.

The utility model provides a radio frequency feed-in device for a PECVD (plasma enhanced chemical vapor deposition) reaction cavity and PECVD equipment. The radio frequency feed-in device for the PECVD reaction cavity penetrates through a vacuum cavity wall from an atmosphere side to enter a vacuum side, sequentially comprises a conductive core shaft, an insulating layer and a shielding layer which are coaxially arranged from inside to outside, and further comprises a corrugated pipe arranged on the outer side of the shielding layer, the first end of the corrugated pipe is fixed on the lower side of the top end of the shielding layer, and the second end is fixed on the wall of the vacuum cavity from the atmosphere side. According to the utility model, the structure dislocation of the radio frequency feed-in device and the vacuum damage of the PECVD reaction cavity caused by high-temperature thermal expansion can be avoided, and the sparking discharge caused by the pressure change of the outer cavity can be avoided.

The invention belongs to the technical field of electronic circuit boards, and discloses a ceramic circuit board integrated packaging structure, which comprises a ceramic circuit board, a titanium metal coaming, a titanium metal cover plate and a brazing material, the titanium metal coaming and the peripheral edge metal of the ceramic circuit board form braze welding sealing in a braze welding mode through braze welding materials, and the titanium metal cover plate and the edge of the titanium metal coaming form braze welding sealing in a braze welding mode through braze welding materials. According to the scheme, a traditional epoxy resin circuit board is replaced by the ceramic circuit board, a ceramic feed-through is omitted, and the titanium metal coaming is directly used for sealing with the ceramic circuit board in a brazing mode, so that the heat dissipation performance, the mechanical strength and the electrical insulation performance of the circuit board can be improved, and meanwhile the welding process of the epoxy resin circuit board and the ceramic feed-through is omitted; and undesirable phenomena such as pseudo soldering, missing soldering and offset are avoided.

The present invention discloses a high-temperature superconducting current lead structure based on helium refrigeration and feeding through a coil box body, comprising a current lead, wherein superconducting slots are provided on both the front and rear sides of the current lead, a helium tube clamping slot is provided at one end of the top of the current lead, and a helium tube is clamped in the helium tube clamping slot. The present invention is applicable to the technical field of superconducting magnets. The superconducting slots of the current lead are fed through the coil box, and after the superconducting tape and the copper rod are brazed, the sealing performance requirements of the coil box body can be met; after the sealing copper tube and the current lead are brazed with indium tin solder, a sealing effect is achieved; the sealing copper tube and the sealing stainless steel tube are brazed with silver-based solder to achieve sealing; the sealing steel tube and the Dewar connecting flange are connected by an insulator, which not only achieves a sealing effect but also insulates the box body and the current lead; through the multi-pass sealing structure, the insulated feedthrough of the current lead is achieved, thereby achieving sealed current flow for the high-temperature superconducting magnet.

This configuration allows for more precise definition of the relative position of the electrical feedthrough to the housing and facilitates the assembly of the electrical feedthrough. [Solution] An electrical feedthrough 1 is provided, comprising a base body 10 having at least one opening 12, through which an electrical conductor 30 is guided and held within the opening via a fixing material 20, the fixing material closing the opening, the base body having an elongated shape and having a reinforcing structure at least on the long edge, the reinforcing structure being formed as a raised edge region 16 offset perpendicularly to the base surface 11 of the base body.

This application discloses a broadband low-temperature low-noise amplifier with a step-suspended line, comprising: an input matching circuit having a step-suspended line input matching structure for receiving RF port input; the output terminal of the input matching circuit is connected to the input terminal of a first-stage transistor amplifier; the output terminal of the first-stage transistor amplifier is connected to the input terminal of a second-stage transistor amplifier through a first-stage inter-stage matching circuit; the output terminal of the second-stage transistor amplifier is connected to the input terminal of a third-stage transistor amplifier through a second-stage inter-stage matching circuit; the output terminal of the third-stage transistor amplifier is connected to the input terminal of an output matching circuit; and the output terminal of the output matching circuit is used to output an RF signal. The advantages of this invention include: innovatively introducing a step-suspended line structure to achieve ultra-wideband performance; achieving ultra-low noise based on the step-suspended line structure; DC power supply fed from the RF output port, avoiding additional DC feedthrough, and a simple and compact structure.

An electrical device includes: a housing part made of a metal and including a feedthrough therethrough, an opening of the feedthrough, a first region, and a second region, the opening receiving a conductive material or a conductor in a glass material or a glass-ceramic material, wherein: (i) the conductive material has a first coefficient of expansion α1, the glass material or the glass-ceramic material has a second coefficient of expansion α2, and the housing part has a third coefficient of expansion α3, the third coefficient of expansion α3 being always greater than the second coefficient of expansion α2; or (ii) the first region including a width W that is substantially perpendicular to the axis of the at least one opening, the width W of the first region being always greater than a thickness D2 and a thickness DE of the second region; or (iii) a combination of (i) and (ii).

The utility model relates to a radio frequency feed-through component, a coaxial radio frequency feed-through component and a packaging piece for a radio frequency circuit. A radio frequency (RF) feedthrough component having an impedance greater than 20 ohms is disclosed. The radio frequency feedthrough component includes a ceramic body having a flexible non-ferrous conductor adhered to an outer peripheral surface of the ceramic body and to an inner peripheral surface of a hole passing through the ceramic body. A non-ferrous conductive lead is disposed through the aperture and projects from at least one side of the aperture. A non-ferrous hermetic seal is formed between a portion of the non-ferrous conductive lead disposed in the hole and a non-ferrous conductor adhered to an inner circumferential surface of the hole. The RF feedthrough component may be assembled in the opening of the conductive housing to form an electromagnetic shielding package for the circuit.

A processing device identifies a first clock tree topology for a circuit design, the first clock tree topology having a threshold feedthrough count and a first timing solution. The processing device further identifies one or more additional clock tree topologies for the circuit design, each of the one or more additional clock tree topologies having a different respective feedthrough count that is less than the threshold feedthrough count, and each of the one or more additional clock tree topologies comprising a respective timing solution. In addition, the processing device receives a selection of at least one of the first clock tree topology or the one or more additional clock tree topologies, and generates the circuit design according to the selection.