154results about "Transit-tube leading-in arrangements" patented technology

A magnetron comprising an anode portion having an anode cylinder and vanes, a cathode portion having a coil-shaped filament, magnetic poles disposed at the upper and lower ends of the filament, ring-shaped permanent magnets made of a Sr ferrite magnet containing La—Co, an input portion and an output portion. The diameter φa of the inscribed circle at the ends of the vanes constituting the anode portion is in the range of 7.5 to 8.5 mm, and the outside diameter φc of the coil-shaped filament 1 constituting the cathode portion is in the range of 3.4 to 3.6 mm.

A ceramic part for magnetrons which has a metallic layer having improved adhesion strength. The ceramic part for magnetrons comprises a ceramic main body part (1) comprising an alumina sinter and Mo-Mn metallic layers (9 and 10) disposed by metallization on the surface of part of the ceramic main body part, wherein the ceramic main body part is an alumina sinter having an Mn-containing grain boundary phase and has an Mn-rich phase at the interface between the ceramic main body part and the Mo-Mn metallic layers.

A magnetron for microwave ovens including a second insulator interposed between a connection part and a bottom of a yoke to form a relatively lengthened insulation distance, or a molded insulating plate attached to a bottom of the filter box to reduce a distance between the connection part and a bottom of the filter box. In the magnetron, an entire height of the magnetron is reduced, so that a miniaturization of the magnetron can be implemented and a design of a product including the magnetron, such as a microwave oven, can be freely carried out, thus allowing an appearance of the product to be variously designed.

Anode with a 2450 MHz resonance frequency, and magnetron therewith, the anode including a cylindrical anode body with an inside diameter in a range of 32.5 to 34.0 mm, a total of ten vanes fitted to an inside circumferential surface of the anode body in a radial direction, and an inner strap and an outer strap provided to both of an upper surface and a lower surface of each vane, a distance of the inner strap and the outer strap being in a range of 0.8 to 1.2 mm, and each of the inner strap and outer strap being in contact with every second vanes for electrical connection of the vanes alternately. The anode body and the vanes are formed as one unit for simplification of a fabrication process.

A magnetron is provided including a yoke having an internal space, a first magnet provided at one end of the internal space, a second magnet provided at a second end of the internal space, the second magnet being axially spaced from the first magnet. Further, an anode cylinder that generates radio frequency energy may be provided axially between the first and second magnets, a first pole piece and a second pole piece may be provided proximate first and second openings of the anode cylinder, respectively. Additionally, the magnetron may also include a seal that intercepts external leakage, the seal may have an inward protrusion extending axially towards the anode cylinder; and a choke filter that intercepts external leakage provided proximate the seal.

A magnetron is configured so that an antenna lead 17 connected to a desired position of an anode segment 2 passes through a magnetic pole piece 7 and a metal cylinder 8 so as not to make contact therewith and is connected to the output portion of the magnetron, and so that the electrical length L1 of this antenna lead 17 between the opening end of a third harmonic restraint choke 15 and the connection portion of the anode segment 2 is 1/2 of the wavelength (λ) of the third harmonic, thereby restraining the third harmonic and the side bands of the third harmonic.

The invention relates to a miniaturized power gain balancer, which comprises a micro-strip layer, a first medium layer, a first metal layer, a second medium layer, a second metal layer, a third medium layer and a third metal layer sequentially stacked from top to bottom. A first metalized through hole penetrates through a first via hole to be connected with a first metalized counter bore to form a probe structure, and the top of the probe structure is connected with a first metal connecting plate. A third metalized through hole penetrates through a third via hole to be connected with a second metalized counter bore to form a probe structure, and the top of the probe structure is connected with a third metal connecting plate. A second metalized through hole penetrates through a first via hole to be connected with a metalized through hole and then penetrates through a via hole to be connected with a metalized counter bore to form a probe structure, and the top of the probe structure is connected with a first metal connecting plate. The miniaturized power gain balancer has the advantages that a resonant cavity is embedded in a multi-layer medium substrate by the low-temperature co-fired ceramic technique, occupied planar space is reduced by a stereo staggered layer arrangement way, and miniaturization is realized.

The invention discloses a filtering structure of a magnetron. The structure is arranged on the lower part of the magnetron and comprises a filtering coil, a central guide rod, a side guide rod, a shielding box and a capacitor, wherein the central guide rod and the side guide rod are connected with filaments in the magnetron respectively; the shielding box encircles the filtering coil; a closed space is formed inside the shielding box; the lower end of a ceramic part of the magnetron passes through a through hole in the upper part of the shielding box and is fixed with the shielding box; the capacitor is arranged outside the shielding box and connected with the filtering coil; and a shielding layer which encircles the filtering coil is arranged in the space inside the shielding box. Microwaves which are guided from a cathode outgoing line can be diffused into a space which is formed by the shielding layer, and electromagnetic waves can be prevented from passing through mesh holes, which are less than one fourth of the wavelength of the microwaves, in the shielding layer, so the leaked microwaves have a loss in the shielding layer, high-frequency harmonic waves are avoided from being diffused from the cathode outgoing line to the outside, and a harmonic noise and a linearly-conducted noise which are generated during the operation of the magnetron can be well shielded.

The invention discloses the encapsulating field of electronic elements, and specifically relates to an encapsulating structure of a high-power electronic element. The electronic element comprises a heat producing component and a shell. A composite thermal conductive material is encapsulated between the heat producing component and the shell, and the composite thermal conductive material is aluminum particles coated with resin. Compared with the existing heat-dissipating mode, the encapsulating structure of the electronic element disclosed by the invention has the characteristics of high heat conductivity, low encapsulating temperature, easy molding and the like.

The invention discloses a connecting structure for cascading folded waveguide, and belongs to the field of microwave electron vacuum. The connecting structure is in a form of a bent rectangular waveguide and is characterized in that the bending angle of the bent rectangular waveguide is 90 degrees, and the outer folding angle of the bent part outwards extends to form a rectangular cavity; the connecting structure is a full-metal structure. The connecting structure has a good input/ output feature; the connection size of the cascading folded waveguide travelling wave tubes at all levels is reduced to some extent, and therefore, the travelling wave tubes are compact in structure and light in weight, and as a result, the applicable scope of a plurality of folded waveguide travelling wave tube bundles is expanded.

A self guiding cover assembly for a vacuum electron device (VED) enclosure has a cover, a pair of guide plates, and a pair of guide elements. The cover has a top, a sidewall, an inside and an outside, and at least one electrical connector disposed on the inside of the cover for mating with an electrical connector on a VED. The pair of guide plates is disposed on opposite sides of the outside of the sidewall of the cover. The guide plates each have a track. The guide elements are mounted on the enclosure on opposite sides of the cover. The pair of guide elements each mates with the track to guide the cover as it is lifted from the enclosure. The cover further comprises a breach lock mechanism for seating the VED into the VED enclosure having the cover and a base. The breach lock mechanism has guide elements mounted on the cover. A sleeve is mounted on the base and removably receives the cover with the VED. The sleeve rotates about the cover. The sleeve has tracks for mating with the guide elements. A rotation of the sleeve pulls the top into the base for seating the VED.

A noise filter for a high frequency generator maximizes a frequency band in which noise is attenuated by adjusting a spacing between winding turns of core inductors provided in the noise filter. The noise filter includes a choke coil having a first winding unit having a first spacing between turns thereof, a second winding unit having a second spacing between turns thereof and a third winding unit having a spacing the same as the first spacing between turns thereof. The first, second, and third winding units are connected in series to each other. The noise filter also includes a high-frequency energy absorbing member inserted into the choke coil. The high-frequency energy absorbing member is made of one of iron oxide, tin alloy and ferrite, and includes a sectional area to attenuate noise in a frequency band ranging from 30 MHZ to 1000MHz.

The invention discloses a miniature collector lead wire sealing method and seal structure. The sealing method is specifically characterized by carrying out processing on the outer surface of a collector ceramic to form platforms, the number of which is same with that of lead wires of a collector, and carrying out metallization processing on the surfaces of the platforms; carrying out processing on the collector ceramic to form lead wire through holes passing through the platforms, wherein the diameter of each lead wire through hole is larger than that of each lead wire; carrying out processing on the lead wires to form installation steps; putting collector electrodes into the collector ceramic; selecting metal rings, placing a solder piece to each of the two sides of each metal ring and then, putting the whole bodies onto the platforms of the collector ceramic; and enabling one end of each lead wire to pass through the lead wire through hole and insert into the collector electrode, and the installation steps on the other end of the lead wire to be placed on the metal ring and the solder piece at one side of the metal ring, and then, feeding the whole body into a hydrogen furnace for soldering, thereby realizing miniature collector lead wire sealing. The method can reduce the requirements for lead wire hole passing precision and metallization quality, and meanwhile, improves airtightness and reliability of seal between the collector ceramic and the metal lead wires.