Miniature collector lead wire sealing method and seal structure

A collector and lead technology, which is applied in the field of miniaturized collector ceramic and metal lead sealing, can solve the problems of difficulty in ensuring accuracy, unreliable vacuum air tightness, and difficulty in matching ceramic and metal leads. Tightness and reliability, requirements for reduced accuracy and metallization quality, avoidance of effects of sealing stress

Inactive Publication Date: 2016-02-24
HUADONG PHOTOELECTRIC TECHN INST OF ANHUI PROVINCE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The cold processing of ceramics itself is very difficult, especially the small hole of ceramics is very difficult to ensure the accuracy after metallization, so it is also difficult to ensure the cooperation with ceramics and metal leads, which greatly affects the airtightness of ceramics and metal leads. sex and reliability
In particular, there are generally 3 to 4 lead wires for multi-stage step-down collectors, which means that there are 3 to 4 direct pin seals, and the vacuum airtightness of each direct pin seal is not very reliable, so The reliability of the entire collector is even more difficult to guarantee, so it is urgent to improve the lead sealing structure of this miniaturized multi-stage step-down collector

Method used

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  • Miniature collector lead wire sealing method and seal structure
  • Miniature collector lead wire sealing method and seal structure

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Embodiment Construction

[0026] The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and through the description of the preferred embodiments.

[0027] refer to figure 1 and figure 2 , the lead sealing method of the miniaturized collector, specifically:

[0028] On the outer surface of the collector ceramic 2, a platform 6 with an equal number of leads 1 of the collector is processed, and the surface of the platform 6 is metallized; the lead through hole 8 passing through the platform 6 is processed on the collector ceramic 2, and the hole diameter of the lead through hole 8 is larger than Lead 1; Process and install step 7 on lead 1;

[0029] The collector electrode 5 is loaded into the collector ceramic 2;

[0030] Select the metal ring 3, place a solder piece 4 on both sides of the metal ring 3 and place them on the platform 6 of the collector ceramic 2 together;

[0031] One end of the lead 1 is inserted into t...

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Abstract

The invention discloses a miniature collector lead wire sealing method and seal structure. The sealing method is specifically characterized by carrying out processing on the outer surface of a collector ceramic to form platforms, the number of which is same with that of lead wires of a collector, and carrying out metallization processing on the surfaces of the platforms; carrying out processing on the collector ceramic to form lead wire through holes passing through the platforms, wherein the diameter of each lead wire through hole is larger than that of each lead wire; carrying out processing on the lead wires to form installation steps; putting collector electrodes into the collector ceramic; selecting metal rings, placing a solder piece to each of the two sides of each metal ring and then, putting the whole bodies onto the platforms of the collector ceramic; and enabling one end of each lead wire to pass through the lead wire through hole and insert into the collector electrode, and the installation steps on the other end of the lead wire to be placed on the metal ring and the solder piece at one side of the metal ring, and then, feeding the whole body into a hydrogen furnace for soldering, thereby realizing miniature collector lead wire sealing. The method can reduce the requirements for lead wire hole passing precision and metallization quality, and meanwhile, improves airtightness and reliability of seal between the collector ceramic and the metal lead wires.

Description

technical field [0001] The invention relates to the technical field of sealing of miniaturized collector ceramics and metal leads of a traveling wave tube, in particular to a lead sealing method and a sealing structure of a miniaturized collector. Background technique [0002] Due to the development of vacuum device applications, high-quality and high-reliability vacuum devices are urgently needed, and a large number of ceramic parts are used in vacuum devices, and they need to be highly reliable vacuum-sealed with metals. Correct and reasonable sealing structure is the decisive factor for obtaining high-quality ceramic-metal sealing, which directly affects the firmness and reliability of ceramic and metal welds. Therefore, reasonable sealing structure design is the key to the manufacturing process of electric vacuum devices. where. [0003] At present, the collector leads of traveling wave tubes are generally drawn from the tail end, but more and more miniaturized tube typ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01J23/14
CPCH01J23/14H01J2223/14
Inventor 周秋俊吴磊马骏
Owner HUADONG PHOTOELECTRIC TECHN INST OF ANHUI PROVINCE
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